KR100826451B1 - Seperate type substrate and light emitting device using the same - Google Patents

Abstract

A separate type substrate and a light emitting device using the same are provided to exchange only a bad substrate segment part by forming a preliminary wiring pattern in a substrate segment part. A plurality of substrate segment parts(22) is connected through at least one connective part to a substrate body(21). The substrate segment parts include connective elements(23) to mount at least one LED package. The substrate segment parts are formed in an inner region of the substrate body. A partial region of the substrate segment parts is cut out to distinguish the substrate segment parts from the substrate body. One or more first wiring pattern(24) is formed from the substrate body through the connective part to connect the connective elements with external circuits. A first electrode(26) is connected to the first wiring pattern of the substrate body. One or more second electrode(25) is connected to the connective elements and is formed at the substrate segment parts. A second electrode(27) is connected to an open end of a second wiring pattern. The substrate segment part is separated from the substrate body by cutting the connective part to be exchanged with another substrate segment part. In the exchanging process, the connective element of the exchanged substrate segment part is electrically connected to the external circuit by connecting the first and second electrodes.

Description

Separation type substrate and light emitting device using the same {SEPERATE TYPE SUBSTRATE AND LIGHT EMITTING DEVICE USING THE SAME}

1 is a structure in which a plurality of LED packages are mounted on a substrate according to the prior art.

2 is a structural diagram of a part of a light emitting device according to a preferred embodiment of the present invention.

3 is a plan view of a light emitting device in which a plurality of substrate segment portions are arranged in an inner region of a substrate main body portion according to an exemplary embodiment of the present invention.

4A through 4D are diagrams illustrating a process of replacing a substrate segment part according to an exemplary embodiment of the present invention.

FIG. 5 is a diagram illustrating a connection structure and a wiring pattern of a substrate segment replaced according to another exemplary embodiment of the present invention. FIG.

<Description of the symbols for the main parts of the drawings>

21 substrate body 22 substrate segment

22a: connecting portion 23: connecting element

23a: LED package 24: the first wiring pattern

25: second wiring pattern 26: first electrode

27: second electrode 48: jumper

The present invention relates to a substrate, and more particularly, to a substrate capable of removing and replacing a portion of the substrate and a light emitting device using the substrate.

As the electronics industry develops, various display devices are being developed that are small and have low energy consumption, and imaging devices, computers, and mobile communication terminals using the same are being developed. The liquid crystal display (LCD), which has appeared to reflect this trend, is currently in the spotlight as a display device for a monitor and a mobile communication terminal.

Recently, a backlight unit using a light emitting diode (hereinafter, referred to as 'LED') has been proposed. An LED is a light emitting device that generates light by using a light emission phenomenon generated when a voltage is applied to a semiconductor. Such LEDs have advantages in that they are smaller than conventional light sources, have a long lifetime, and have high energy efficiency and low operating voltages because electrical energy are directly converted into light energy. Therefore, LED having such an advantage is used as a light source of the LCD backlight module.

As a method of mounting such an LED in a backlight unit, the backlight is configured through a complicated process in which the LED is assembled in a package and the package is assembled on a substrate. However, this method has many limitations due to many assembly times and high raw material costs.

While many solutions have been devised, the package on board (COB) type has been suggested as one method. 'Package on board' refers to a method of electrically connecting a package or circuit component directly onto a circuit board without any other device. The 'package on board' method may be more useful in a case where a large number of identical devices are arranged, such as a BLU for forming an LED in a uniform array, than when several types of devices are mounted on a substrate.

1 shows a structure in which an LED according to the prior art is mounted on a substrate.

Referring to FIG. 1, a plurality of connecting elements 13 having an LED package 13a mounted thereon are arranged on a PCB substrate 11, and the connecting elements 13 are connected to a wiring pattern 14 formed on a PCB. Are connected by.

In such a typical COB structure, since the LED package package is directly mounted on the substrate, there is an easy side during the assembly process.

However, if one of the plurality of packages is defective, it affects the entire light emitting device, and if a failure occurs in one package and repair or replacement is inevitable, the jumper 16 or the LED package LED package 13 directly. Since the iron must be in contact, there is a problem in that heat and electrical losses are to be taken.

In order to solve the above problems, the present invention provides a substrate having a structure capable of removing only some of the package package in which a failure occurs and replace it with another normal package if a failure occurs in part, and a light emitting device using the substrate. For the purpose of

According to the present invention, a plurality of substrate segment parts having a substrate main body having a plurality of slots and connected to the substrate main body through at least one connection part and for connecting at least one LED package to be mounted thereon (the substrate segment The part is formed in the inner region of the substrate main body portion, and a partial region around the segment portion is cut out to be distinguished from the substrate main body portion, and the connecting element on the substrate segment portion is electrically connected to an external circuit. At least one first wiring pattern formed through the connecting portion from the substrate body portion, a first electrode formed on the substrate body portion and connected to the first wiring pattern on the substrate body portion, one end is At least one second wiring pattern connected to a connecting element, the other end being formed on the substrate segment part in an open state; A second electrode connected to an open end of the second wiring pattern, wherein the substrate segment part is detachable from the substrate body part by cutting the connection part and can be replaced with another substrate segment part, and the first electrode is replaced And a connecting element on the replaced substrate segment part by connecting the second electrode is electrically connected to an external circuit.

The substrate main body may have an internal area for arranging the plurality of substrate segment parts in a matrix.

Preferably, the connection part may be formed above and below each of the substrate segment parts.

The first electrode and the second electrode may be formed on the surface of the substrate body portion and the substrate segment portion, respectively.

The connection portion may be engraved with a cutting guide groove to facilitate separation of the segment substrate from the substrate body portion.

In addition, the present invention provides a plurality of substrate segment parts having a substrate body part having a plurality of slots, and connected to the substrate body part through at least one connection part, and having a connection element for mounting at least one LED package. The substrate segment part is formed in an inner region of the substrate main body part, and a partial region of the two segments of the segment part is cut out to be distinguished from the substrate main body part, and at least one LED package mounted on the connection element. And at least one first wiring pattern formed through the connection portion from the substrate body portion to electrically connect the connection element with an external circuit, and first wiring formed on the substrate body portion and formed on the substrate body portion. A first electrode connected to the pattern, one end is connected to the connecting element, the other end is formed on the substrate segment portion in an open state At least one second wiring pattern, and a second electrode connected to an open end of the second wiring pattern, wherein the substrate segment part is detachable from the substrate body part by cutting the connection part and replaced with another substrate segment part. The LED package mounted on the connecting element on the replaced substrate segment may be electrically connected to an external circuit by connecting the first electrode and the second electrode during the replacement.

The at least one LED package may be formed of a red (R), green (G) and blue (B) LED package.

Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

2 is a structural diagram of a part of a light emitting device according to a preferred embodiment of the present invention.

Referring to FIG. 2, the detachable substrate according to the present embodiment includes a substrate main body portion 21, a substrate segment portion 22, a first wiring pattern 24, and a second wiring pattern 25.

The substrate main body 21 may be a PCB substrate. In addition, the substrate main body may be a multilayer ceramic substrate manufactured by the LTCC process. When the substrate main body 21 is a PCB substrate, the wiring pattern formed on the substrate can be printed on the surface of the substrate using a conductive paste. When the substrate main body 21 is a laminated ceramic substrate, a wiring pattern formed on the substrate may be formed inside the laminated substrate.

The substrate segment portion 22 is formed in the inner region of the substrate body portion 21 and is connected to the substrate body portion 21 through the connecting portion 22a.

The substrate segment 22 has a connection element 23 formed thereon so that the LED package 23a can be mounted. The LED package 23a mounted on the substrate segment 22 may be at least one LED device. Preferably, it may be a combination of LEDs of red (R), green (G), and blue (B).

The substrate segment portion 22 may be separated from the substrate body portion 21 by cutting the connection portion 22a.

When the LED package 23a becomes defective, only the substrate segment portion on which the defective package is mounted can be removed, so that there is no need to replace the entire light emitting device substrate.

In order to facilitate the process of removing the substrate segment portion 22, a cutting guide groove is formed in the connecting portion 22a. The cutting guide groove may be formed to a degree that does not affect the wiring passing through the connecting portion 22a. The process of removing the substrate segment portion 22 may use cutting.

A first wiring pattern 24 is formed to connect the LED package mounted on the substrate segment 22 with an external circuit.

The first wiring pattern 24 is connected to the connection element 23 on which the LED package 23a is mounted, passing through the connection portion 22a from the substrate main body 21.

The LED package mounted on the connection element 23 may be one, or a combination of a plurality of LED packages.

When the substrate is a multilayer ceramic substrate, the first wiring pattern may be formed in the substrate 21. The wiring pattern may be printed on the surface of the substrate.

The first wiring pattern 24 electrically connects an external circuit and the LED package when a normal LED package is mounted on the substrate, so that the LED package can operate. However, when the LED package is defective and the substrate segment portion on which the defective LED package is removed is removed, the connection part 22a is cut and the first wiring line is also cut.

Since the replacement substrate segment part is not completely in contact with the connection part and a predetermined space is spaced apart, the first wiring pattern is not connected even after the replacement.

The first wiring pattern 24 is connected to the first electrode 26 in the substrate main body 21 region. A conductive via hole may be used to connect the first wiring pattern 24 and the first electrode 26. The first electrode 26 connects the first wiring pattern 24 on the substrate main body 21 and the second wiring pattern 25 on the replaced substrate segment when the substrate segment 22 is replaced. Used for.

One end is connected to the connection element 23 on which the LED package 23a is mounted on the substrate segment 22, and a second wiring pattern 25 having an open state at the other end thereof is formed. The second electrode 27 is connected to an open end of the second wiring pattern 25.

The second wiring pattern 25 is not used for electrical connection because the second wiring pattern 25 is open when the LED package 23a is normally operated.

However, when a defect occurs in the LED package and the substrate segment portion is replaced, the second electrode connected to one end of the second wiring pattern of the replaced substrate segment portion and the substrate main body portion 21 are formed on the first wiring pattern 24. Connect the first electrode 26 connected to. By connecting the first electrode 26 and the second electrode on the replaced substrate segment, the LED package on the replaced substrate segment may be connected to an external circuit.

After forming only the second wiring pattern 25 without forming the first wiring pattern 24 passing through the connecting portion 22a, the substrate main body 21 and the substrate segment 22 are spaced apart from each other. If the part is connected by a connecting means called a jumper, the number of jumpers increases as the number of LED packages mounted on one substrate increases, which may complicate the initial manufacturing process.

By forming the first wiring pattern 24 and the preliminary second wiring pattern 25 passing through the connecting portion 22a and the preliminary second wiring pattern 25 on the substrate as in this embodiment, the jumper is used only for the substrate segment to be replaced. Since the connection work is performed, the manufacturing process of the initial substrate is easy and inexpensive.

When the LED package 23a mounted on the substrate segment part 22 normally operates, a path through which a current flows on the substrate includes an external circuit, a first wiring pattern 24, an LED package 23a, and a first path. The wiring pattern 24 flows in the order of the external circuit. In order to replace the substrate segment part 22, the connection part 22a needs to be cut so that the current flowing through the first wiring pattern formed on the connection part 22a is cut off.

3 is a structural diagram of a light emitting device in which a plurality of substrate segment portions are arranged on a substrate main body portion according to an embodiment of the present invention.

Referring to FIG. 3, a plurality of substrate segment portions 32 are arranged in the inner region of the PCB substrate main body portion 31. A connection element 33 is formed on the substrate segment 32, and an LED package 33a is mounted on the connection element 33.

As shown in FIG. 2, a first wiring pattern and a second wiring pattern connecting each substrate segment part are formed on the substrate (not shown), and the first electrode 36 connected to the first wiring pattern and A second electrode 37 connected to the second wiring pattern is formed.

In this embodiment, the substrate segment portions are arranged in a line, but the arrangement may be freely implemented according to the shape of the light emitting device to be manufactured, and the wiring pattern may be varied according to the arrangement of the substrate segment portion and the number of LED packages mounted on the substrate segment portion. May be implemented in various ways.

4A to 4D are views illustrating a process of replacing a substrate segment part according to an embodiment of the present invention.

Referring to FIG. 4A, the substrate segment 42 and the substrate main body 41 are connected through the connecting portion 42a. The LED package 43a is mounted on the connection element 43 formed on the substrate segment 42. The connection element 43 in which the LED package is mounted is connected to an external circuit by a first wiring pattern (not shown) passing through the connection portion 42a.

A first electrode 46 connected to a first wiring pattern (not shown) is formed on the substrate body part 41, and the connection is formed on the substrate segment part 42 by a second wiring pattern (not shown). The second electrode 47 connected to the element 43 is formed.

Fig. 4B is a view of removing the substrate segment portion on which the defective LED package is mounted.

The substrate segment portion 42 is removed from the substrate body portion 41 by cutting the connecting portion 42a connecting the substrate segment portion 42 and the substrate body portion 41.

At this time, it is possible to facilitate the cutting by forming a cutting guide groove in the connecting portion (42a). After the connection part 42a is cut, the connection part extending from the substrate main body part 41 may be polished to make a flat surface.

4C is a plan view of the substrate segment portion to be replaced.

The substrate segment portion 42 ′ to be replaced may have the same size and shape as the removed substrate segment portion 42. A second wiring pattern having one end connected to the connection element 43 'on which the LED package 43a' is mounted, and the other end connected to the second electrode 47 'inside the substrate segment 42' to be replaced. (Not shown) is formed.

The substrate segment 42 'to be replaced is positioned in a space formed in the substrate main body 41, and the first electrode 46 and the second electrode 47' are connected by soldering.

4D is a structure in which the replacement substrate segment 42 'of FIG. 4C is connected to the substrate main body 41 by soldering.

The replaced substrate segment 42 'is spaced apart from the connecting portion 42a of the substrate main body 41 by a predetermined distance, and a jumper 48 may be used for soldering.

If the separate type substrate is manufactured with a structure in which additional soldering is performed on the entire board segment part, the additional soldering is unnecessary for the board segment part which does not cause defects. By forming the substrate, the main wiring pattern can be used as it is for the defective board segment portion and the preliminary wiring pattern is used only for the defective substrate segment portion, thereby simplifying the initial substrate manufacturing process and lowering the manufacturing cost. have.

Fig. 5 shows the structure and wiring connection structure after the substrate segment portion shown in Fig. 4D is replaced.

After the substrate segment portion 52 is replaced, the substrate body portion 51 and the substrate segment portion 52 are not connected by the connecting portion, but are connected through the jumper 58.

That is, the first electrode 56 connected to the first wiring pattern 54 of the substrate main body 51 and the second electrode connected to the second wiring pattern 55 formed on the replaced substrate segment 52 ( 57 is connected by jumpers 58 to connect the LED package mounted on the replaced substrate segment 52 with an external circuit.

In this case, the path through which the current flows includes the first wiring pattern 54, the first electrode 56, the jumper 58, the second electrode 57, the second wiring pattern 55, the connection element 53, and the LED package. (53a) flows to the external circuit in the order of the connecting element, the second wiring pattern, the second electrode, the jumper, the first electrode, the first wiring pattern connected to the opposite side.

As such, the present invention is not limited by the above-described embodiment and the accompanying drawings. That is, the shape of the cutting guide groove loop formed on the mother substrate, the shape of the cutting guide groove of the connecting portion, and the shape of the cell substrate to be replaced may be variously implemented. It is intended that the scope of the invention be limited by the claims appended hereto, and that various forms of permutation, modification, and alteration are possible without departing from the spirit and scope of the invention as set forth in the claims. Will be self-evident.

According to the present invention, it is possible to obtain a substrate capable of removing and replacing only a portion of a portion of a substrate in which a defect occurs without replacing all of the regions when a portion is defective, and a light emitting device using the substrate.

Further, according to the present invention, there is an advantage of using an additional connection tool only for the defective substrate segment part by forming a preliminary wiring pattern in the replaced substrate segment part.

Claims (11)

A substrate main body; A plurality of substrate segment parts connected to the substrate body part through at least one connection part and having a connection element for mounting at least one LED package, wherein the substrate segment part is formed in an inner region of the substrate body part and A partial region around the segment portion is cut out to be distinguished from the segment; At least one first wiring pattern formed through the connection part from the substrate main body part to electrically connect the connection element on the substrate segment part with an external circuit; A first electrode formed on the substrate main body and connected to a first wiring pattern on the substrate main body; At least one second wiring pattern having one end connected to the connection element and the other end formed on the substrate segment part in an open state; And A second electrode connected to an open end of the second wiring pattern; The substrate segment portion is detachable from the substrate body portion by cutting the connection portion and can be replaced with another substrate segment portion, and the connecting element on the substrate segment portion replaced by connecting the first electrode and the second electrode at the time of replacement is external. A detachable substrate, characterized in that it is electrically connected to the circuit. The method of claim 1, The substrate main body portion, And a plurality of substrate segment portions having an inner region for arranging in a matrix. The method of claim 2, The connecting portion, Separation substrate, characterized in that formed on the upper and lower portions of each substrate segment. The method of claim 1, And the first electrode and the second electrode are formed on surfaces of the substrate body portion and the substrate segment portion, respectively. The method of claim 1, The connecting portion, And a cutting guide groove engraved to facilitate separation of the segment substrate from the substrate main body. A substrate main body; A plurality of substrate segment parts connected to the substrate body part through at least one connection part and having a connection element for mounting at least one LED package, wherein the substrate segment part is formed in an inner region of the substrate body part and A partial region around the segment portion is cut out to be distinguished from the segment; At least one LED package mounted on the connection element; At least one first wiring pattern formed through the connection part from the substrate main body part to electrically connect the connection element with an external circuit; A first electrode formed on the substrate main body and connected to a first wiring pattern on the substrate main body; At least one second wiring pattern having one end connected to the connection element and the other end formed on the substrate segment part in an open state; And A second electrode connected to an open end of the second wiring pattern; The substrate segment portion is detachable from the substrate body portion by cutting the connection portion and can be replaced with another substrate segment portion, and is mounted on the connecting element on the substrate segment portion replaced by connecting the first electrode and the second electrode at the time of replacement. Light emitting device, characterized in that the LED package is electrically connected to an external circuit. The method of claim 6, The substrate main body portion, And a plurality of substrate segment portions having an inner space for arranging in a matrix. The method of claim 6, The connecting portion, And a light emitting device formed above and below each of the segment substrates. The method of claim 6, And the first electrode and the second electrode are formed on surfaces of the substrate body portion and the substrate segment portion, respectively. The method of claim 6, The connecting portion, And a cutting guide groove engraved to facilitate separation of the segment substrate from the substrate main body. The method of claim 6, The at least one LED package, A light emitting device comprising red (R), green (G) and blue (B) LED packages.

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