KR100812737B1 - Nitride semiconductor light emitting device for flip-chip - Google Patents

Abstract

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a nitride based light emitting device for flip chip, and more particularly, to a nitride based semiconductor light emitting device flip-bonded through bump balls on a lead pattern of a submount, the substrate being formed on the substrate, wherein the first region is formed. An n-type nitride semiconductor layer divided into a second region, an active layer formed on the first region of the n-type nitride semiconductor layer, a p-type nitride semiconductor layer formed on the active layer, and the p-type nitride semiconductor layer A p-type electrode formed on the p-type electrode and formed on a plurality of p-type electrode pads and the second region of the n-type nitride semiconductor layer that are uniformly spaced at equal intervals from each other, and the p-type electrode Provided are a nitride-based semiconductor light emitting device for flip chip including a plurality of n-type electrode pads uniformly spaced at equal intervals from a pad.

Flip-chip, light emitting diodes (LEDs), electrode pads, light emitting surfaces, resistors

Description

Nitride-based light emitting device for flip chip {NITRIDE SEMICONDUCTOR LIGHT EMITTING DEVICE FOR FLIP-CHIP}

1 is a plan view showing the structure of a nitride-based semiconductor light emitting device for flip chip according to the prior art.

FIG. 2 is a cross-sectional view taken along the line II-II ′ of FIG. 1.

3 is a plan view showing the structure of a nitride-based semiconductor light emitting device for flip chip according to an embodiment of the present invention.

4 is a cross-sectional view taken along line IV-IV ′ of FIG. 3.

5 is a cross-sectional view illustrating a bump bonded state of a nitride semiconductor semiconductor light emitting device for flip chip according to an exemplary embodiment of the present invention.

6 and 7 are plan views showing a modified example of the nitride semiconductor light emitting device for flip chip according to an embodiment of the present invention.

<Explanation of symbols for the main parts of the drawings>

100 substrate 110 n-type nitride semiconductor layer

120: active layer 130: p-type nitride semiconductor layer

140: p-type electrode 150a: p-type electrode pad

160a: n-type electrode pad

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a nitride based semiconductor light emitting diode, and more particularly, to a nitride based semiconductor light emitting diode for flip chip capable of ensuring sufficient light emitting surface and improving current diffusion efficiency to realize low device resistance and high brightness.

In general, nitride-based semiconductors are group III-V semiconductors having an Al _x In _y Ga _(1-xy) N composition formula, where 0 ≦ x ≦ 1, 0 ≦ y ≦ 1, and 0 ≦ x + y ≦ 1. As a crystal, it is widely used for light-emitting elements which can emit short wavelength light (ultraviolet to green light), especially blue light.

On the other hand, since the nitride semiconductor light emitting device is manufactured using an insulating substrate such as a sapphire substrate or a SiC substrate that satisfies the lattice matching condition for crystal growth, two electrodes connected to the p-type and n-type nitride semiconductor layers emit light. It has a horizontal structure arranged almost horizontally on the upper surface of the structure.

Nitride-based semiconductor light emitting devices having such a horizontal structure are classified into Top-Emitting Light Emitting Diodes and Flip-Chip Light Emitting Diodes.

The top-emit light emitting diode is formed to emit light through the ohmic electrode layer in contact with the p-type nitride semiconductor layer, and the light emitting diode for flip chip is formed to emit light through the sapphire substrate.

 Next, a nitride semiconductor light emitting device for flip chip according to the prior art will be described in detail with reference to FIGS. 1 and 2.

1 is a plan view showing the structure of a nitride semiconductor semiconductor light emitting device for flip chip according to the prior art, Figure 2 is a cross-sectional view taken along the line II-II 'of FIG.

1 and 2, an n-type nitride semiconductor layer 110 sequentially formed on a sapphire substrate 110, a GaN / InGaN active layer 120 having a multi-well structure, and a p-type nitride semiconductor layer 130 are included. The portions of the p-type nitride semiconductor layer 130 and the active layer 120 are partially removed by a mesa etching process, and thus a portion of the n-type nitride semiconductor layer 110 is exposed. Has

The n-type electrode 160 is formed on the exposed n-type nitride semiconductor layer 110, and the p-type electrode 140 is formed on the p-type nitride semiconductor layer 130, respectively.

More specifically, the n-type electrode 160 of the nitride-based semiconductor light emitting device for flip chip according to the prior art includes two n-type electrode pads 160a and a plurality of branch electrodes 160b extending therefrom. It is formed in a structure that meshes with the type electrode 140, that is, in the form of a finger. In this case, the p-type electrode 140 also includes two p-type electrode pads 150a and a plurality of branch electrodes 150b extending therefrom.

That is, two n-type and p-type electrode pads 160a and 150a are provided to disperse the applied current when a large current is applied, and a plurality of branch electrodes 160b and p-type extending from the n-type electrode pad 160a are provided. A plurality of branch electrodes 150b extending from the electrode pad 150a are disposed in a finger shape to improve current spreading efficiency to prevent device defects due to application of a large current.

However, the above-described conventional flip chip nitride semiconductor light emitting device has two n-type electrode pads and a p-type electrode pad to disperse a large current applied thereto, thereby preventing the device from deteriorating driving voltage and characteristics. Since the two n-type electrode pads and the p-type electrode pads are formed to be concentrated on one side of the light emitting device, the overall resistance of the device is high, that is, the large current applied to the device is dispersed to improve the current spreading efficiency of the device. There is a limit in reducing the driving voltage.

In addition, a plurality of n-type branch electrodes extending from the n-type electrode pads have a problem in that a part of the light emitting surface is partially removed by a mesa etching process to define a formation region thereof, thereby reducing the light emitting surface and lowering luminance. .

Accordingly, there is a continuing need for development of a light emitting device related technology capable of improving current spreading efficiency of the flip chip nitride semiconductor light emitting device and increasing a light emitting surface.

Accordingly, an object of the present invention is to provide a plurality of n-type and p-type electrode pads without each branch electrode, to solve the problems as described above, the light emitting surface is arranged to be uniformly distributed at equal intervals in a large area To provide a nitride-based semiconductor light-emitting device for flip chip that can increase the efficiency, and can efficiently distribute the current when a large current is applied.

In order to achieve the above object, the present invention is a nitride-based semiconductor light emitting device flip-bonded through a bump ball on the lead pattern of the submount, a substrate, and formed on the substrate, the first region and the second region An n-type nitride semiconductor layer divided by an active layer, an active layer formed on a first region of the n-type nitride semiconductor layer, a p-type nitride semiconductor layer formed on the active layer, and a p-type electrode formed on the p-type nitride semiconductor layer And a plurality of p-type electrode pads formed on the p-type electrode and uniformly spaced at equal intervals from each other and formed on a second region of the n-type nitride semiconductor layer, and the like with the p-type electrode pad. Provided are a nitride-based semiconductor light emitting device for flip chip including a plurality of n-type electrode pads arranged uniformly at intervals.

In the flip chip nitride semiconductor light emitting device of the present invention, the area of the first region is preferably larger than the area of the second region in order to maximize the light emitting surface.

In addition, in the nitride semiconductor semiconductor light emitting device for flip chip of the present invention, it is preferable that both sides of the first region are formed symmetrically with respect to the center of the substrate, which is uniform across the entire light emitting surface. This is to cause light emission.

In the flip chip nitride semiconductor light emitting device of the present invention, the n-type electrode pad and the p-type electrode pad may be formed of any one selected from a circle, a rectangle, a rounded rectangle, and a polygon. This does not significantly affect the characteristics and reliability of the light emitting device.

In addition, in the nitride-based semiconductor light emitting device for flip chip of the present invention, the n-type electrode pad and the p-type electrode pad, at least one metal selected from the group consisting of Au, Al, Cr, Sn and Pb or an alloy containing the same It is preferable to make.

In addition, in the nitride semiconductor semiconductor light emitting device for flip chip of the present invention, the p-type electrode pad preferably has a width of at least 100 μm or more in order to form bumps.

In addition, in the nitride semiconductor semiconductor light emitting device for flip chip of the present invention, the n-type electrode pad has a width of at least 100 μm or more to form bumps and a width of 500 μm or less to prevent reduction of the light emitting surface. At the same time, it is preferable to have a width of 500 μm or less in order to prevent the reduction of the light emitting surface.

In the flip chip nitride semiconductor light emitting device of the present invention, the reflective electrode, the ohmic contact electrode, and the transparent electrode may be formed of at least one layer.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art may easily implement the present invention.

In the drawings, the thickness of layers, films, panels, regions, etc., are exaggerated for clarity. Like reference numerals designate like parts throughout the specification.

A nitride semiconductor semiconductor light emitting device for flip chip according to an embodiment of the present invention will now be described in detail with reference to the accompanying drawings.

First, a structure of a flip chip nitride semiconductor light emitting device according to an embodiment of the present invention will be described in detail with reference to FIGS. 3 and 4.

3 is a plan view showing the structure of a nitride semiconductor semiconductor light emitting device for flip chip according to an embodiment of the present invention, Figure 4 is a cross-sectional view taken along the line IV-IV 'of FIG.

3 and 4, a buffer layer (not shown) and an n-type nitride semiconductor layer 110 are sequentially stacked on the light transmissive substrate 100. In this case, the n-type nitride semiconductor layer 110 is divided into a first region and a second region.

In more detail, the first region defines a light emitting surface. Accordingly, the area of the first region is preferably larger than the area of the second region to improve luminance characteristics of the device. That is, the area of the first region has an area corresponding to 50% or more of the total area of the n-type nitride semiconductor layer 110.

In addition, both sides of the first region are formed symmetrically with respect to the center of the substrate 100, and the second region surrounds the first region and has protrusions protruding at equal intervals on each side. It is preferable that it is formed. This is to cause uniform light emission to occur over the entire light emitting surface made of a large area.

The substrate 100 is a substrate suitable for growing a nitride semiconductor single crystal, and is preferably formed using a transparent material including sapphire. In addition to sapphire, the substrate 110 may be formed of zinc oxide (ZnO), gallium nitride (GaN), silicon carbide (SiC), and aluminum nitride (AlN).

The buffer layer is a layer for improving lattice matching with the substrate 100 before the n-type nitride semiconductor layer 120 is grown on the substrate 100, and may be omitted according to process conditions and device characteristics.

The n-type nitride semiconductor layer 110 may be formed of a semiconductor material having an In _X Al _Y Ga _{1 -X - Y} N composition formula, where 0 ≦ X, 0 ≦ Y, and X + Y ≦ 1. More specifically, the n-type nitride semiconductor layer 110 may be formed of a GaN layer or a GaN / AlGaN layer doped with n-type conductive impurities, for example, Si, Ge, Sn Etc. are used, and preferably Si is mainly used.

In addition, the active layer 120 and the p-type nitride semiconductor layer 130 are sequentially stacked on the first region of the n-type nitride semiconductor 110 to form a light emitting structure.

The active layer 120 may be formed of an InGaN / GaN layer having a multi-quantum well structure.

The p-type nitride semiconductor layer 130 may be formed of a semiconductor material having an In _X Al _Y Ga _{1 -X - Y} N composition formula, where 0 ≦ X, 0 ≦ Y, and X + Y ≦ 1. More specifically, the p-type nitride semiconductor layer 130 may be formed of a GaN layer or a GaN / AlGaN layer doped with a p-type conductive impurities, for example, Mg, Zn, Be Etc., and Mg is mainly used preferably.

The p-type electrode 140 is formed on the p-type nitride semiconductor layer 130. The p-type electrode 140 may be formed of at least one layer selected from a reflective electrode, an ohmic contact electrode, and a transparent electrode. For example, the p-type electrode may include a single layer or a reflective electrode / omic contact electrode, an ohmic contact electrode / transparent electrode, an ohmic contact electrode / transparent electrode, and any one layer selected from a reflective electrode, an ohmic contact electrode, and a transparent electrode. / A multi-layer consisting of a reflecting electrode and the like can be selected and formed according to the process conditions and the characteristics of the device.

The p-type electrode pads 150a are uniformly spaced apart from each other on the p-type electrode 140. In this case, although the p-type electrode pad 150a according to the present embodiment is illustrated as being formed in a circular shape (see FIG. 3), the p-type electrode pad 150a is not limited thereto. It may be in the form.

In particular, since the p-type electrode pad 150a according to the present invention is electrically connected to the lead pattern 210 and the bump 220 of the submount 200 (see FIG. 5), the bump 220 formation region is provided. It is desirable to have a width of at least 100 μm in order to secure a margin. In addition, the p-type electrode pad 150a may include at least one metal selected from the group consisting of Au, Al, Cr, Sn, and Pb or an alloy containing the same to facilitate bonding when the lead pattern of the submount and the bump bonding are performed. It is preferable that it consists of.

5 is a cross-sectional view illustrating a bump bonded state of a flip chip nitride semiconductor light emitting device according to an exemplary embodiment of the present invention.

In addition, a plurality of n-type electrode pads 160a are formed on the second region of the n-type nitride semiconductor layer 110 at equal intervals from the p-type electrode pad 150a.

In addition, the n-type electrode pad 160a is formed in a semi-circular shape in this embodiment, but the present invention is not limited thereto, and the n-type electrode pad 160a may be formed of any one selected from a circle, a rectangle, a rounded rectangle, and a polygon. Since the lead pattern 210 and the bump 220 of the submount 200 are electrically connected to each other (see FIG. 5), it is preferable to have a width of at least 100 μm or more in order to secure a margin for forming the bump 220.

However, since the n-type electrode pad 160a according to the present invention is formed in a region in which a part of the light emitting surface is removed by mesa etching, the n-type electrode pad 160a preferably has a width of 500 μm or less in order to prevent reduction of the light emitting surface. In addition, the n-type electrode pad 160a may include at least one metal selected from the group consisting of Au, Al, Cr, Sn, and Pb to facilitate bonding with the sub-mount lead pattern, bump bonding (see FIG. 5), and bonding. Or an alloy containing the same.

As described above, the nitride-based semiconductor light emitting device for flip chip according to the present invention can improve current diffusion characteristics by alternately arranging a plurality of p-type electrode pads and n-type electrode pads (see arrow of FIG. 3). ).

In addition, the current resistance can be further improved by reducing the overall resistance of the device through a plurality of electrode pads receiving current from the outside, thereby reducing the driving voltage.

Meanwhile, the first region and the second region defined on the n-type nitride semiconductor layer 110 may be changed as shown in FIGS. 6 and 7, and, like the exemplary embodiment of the present invention, many The n-type electrode pads 160a and the plurality of p-type electrode pads 150a are arranged to be uniformly spaced at equal intervals from each other, and thus the same functions and effects as in the embodiment of the present invention as described above can be obtained. have.

In particular, Fig. 7 is preferably applied to a light emitting device having a large area light emitting surface, and accordingly, it is possible to further increase the current diffusion effect of the light emitting device having a large area light emitting surface and to reduce the resistance of the overall device. There is an advantage to that.

6 and 7 are plan views illustrating modified examples of the nitride semiconductor light emitting device for flip chip according to the exemplary embodiment of the present invention.

Although the preferred embodiments of the present invention have been described in detail above, those skilled in the art will understand that various modifications and equivalent other embodiments are possible therefrom. Accordingly, the scope of the present invention is not limited thereto, and various modifications and improvements of those skilled in the art using the basic concept of the present invention as defined in the following claims also fall within the scope of the present invention.

As described above, in the present invention, only a plurality of n-type and p-type electrode pads are disposed on the large-area LED so as to be uniformly distributed at equal intervals, thereby increasing the light emitting surface and efficiently spreading the current when applying a large current. Can be.

In addition, the present invention is a nitride-based semiconductor for flip chip that can improve luminance by uniformly dispersing the current in all parts of the light emitting surface when a large current is applied through a plurality of electrode pads, so that light emission occurs uniformly throughout the light emitting surface A light emitting device can be provided.

Therefore, the present invention has the effect of reducing the driving voltage of the flip chip nitride semiconductor light emitting device, and improves the characteristics and reliability of the device by improving the brightness.

Claims (9)

In the nitride-based semiconductor light-emitting device flip-bonded through the bump ball on the lead pattern of the submount, Board; An n-type nitride semiconductor layer formed on the substrate and divided into a first region and a second region; An active layer formed on the first region of the n-type nitride semiconductor layer; A p-type nitride semiconductor layer formed on the active layer; A p-type electrode formed on the p-type nitride semiconductor layer; A plurality of p-type electrode pads formed on the p-type electrode and equally spaced from each other; And And a plurality of n-type electrode pads formed on the second region of the n-type nitride semiconductor layer and uniformly spaced at equal intervals from the p-type electrode pads. The method of claim 1, The first region is a nitride-based semiconductor light emitting device for a flip chip, characterized in that both sides are formed symmetrically with respect to the center portion of the substrate. The method of claim 1, The area of the first region is larger than the area of the second region. The method of claim 1, The n-type electrode pad is a nitride-based semiconductor light emitting device for a flip chip, characterized in that formed of any one selected from a circle, a square, a rounded rectangle and a polygon. The method of claim 4, wherein The n-type electrode pad is a nitride-based semiconductor light emitting device for a flip chip, characterized in that having a width in the range of 100㎛ to 500㎛. The method of claim 1, The p-type electrode pad is a nitride-based semiconductor light emitting device for a flip chip, characterized in that formed of any one selected from a circle, a square, a rounded rectangle and a polygon. delete The method of claim 1, The n-type electrode pad and the p-type electrode pad, nitride-based semiconductor light emitting device for flip chip, characterized in that made of at least one metal selected from the group consisting of Au, Al, Cr, Sn and Pb or an alloy containing the same. The method of claim 1, The p-type electrode is a nitride-based semiconductor light emitting device for a flip chip, characterized in that consisting of at least one layer selected from a reflective electrode, ohmic contact electrode and a transparent electrode.

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