KR100817823B1 - Method for cutting a substrate including a plurality of memory cards - Google Patents

Abstract

A method for cutting a memory card board is provided to easily cut a complicated memory card by using a laser beam having a wavelength of 200 to 700nm, as well as improving the quality of cut cross section. A memory card board(20) includes plural memory cards(30) having a printed circuit board layer with a circuit pattern formed on a lower surface thereof, and a resin molding layer applied on an upper surface of the printed circuit board layer. A laser beam is irradiated on the memory card board to melt and evaporate the printed circuit board layer and the resin molding layer, so that the memory card board is cut in a desired shape. The laser beam irradiated on the memory card board has a wavelength of 200 to 700nm.

Description

Method for cutting a substrate including a plurality of memory cards}

1 is a view for explaining a process of separating a memory card from a memory card substrate including a plurality of memory cards using a conventional rotary blade.

Figure 2 is a view showing an example of a memory card substrate cutting apparatus for implementing the memory card substrate cutting method of the present invention.

3 is a cross-sectional view of the memory card substrate of FIG.

4 is a perspective view of a memory card separated from the memory card substrate of FIG.

<Description of the symbols for the main parts of the drawings>

20: memory card substrate 30: memory card

31: Upper surface of the memory card 32: Lower surface of the memory card

33: corner portion of the memory card 34: resin molding layer

35: printed circuit board layer 36: side of the memory card

37: external connection of the memory card 110: laser oscillator

120: galvanometer scanner 130: telecentric lens

131: work area

The present invention relates to a method of cutting a memory card substrate, and more particularly, to a method of cutting a memory card substrate that can separate a memory card from the memory card substrate by cutting a memory card substrate including a plurality of memory cards using a laser. .

In the case of manufacturing a memory card, for mass production, a plurality of independent memory driving circuits are formed on one printed circuit board, and a flash memory mounted on the printed circuit board by coating a resin molding on an upper surface of the printed circuit board, Protects microprocessor chips and circuits. Recently, a method of separating an individual memory card from the memory card substrate by cutting the memory card substrate by first manufacturing an integrated substrate including a plurality of memory cards formed by stacking the printed circuit board and the resin molding is performed. It is used. One of the memory cards that have been in the spotlight recently is a SD (Secure Digital) memory card.

The SD memory card is a standard of a new small memory card jointly announced by Matsushita, SunDisk and Toshiba, and is composed of silicon semiconductor technology with several flash memories and one microprocessor chip. SD memory cards are small in size, light in weight, fast in storage and reading speed, and large in capacity, making them widely used in products such as computer peripherals, portable information terminals, and digital cameras.

1 is a view for explaining a process of separating a memory card from a memory card substrate including a plurality of memory cards using a conventional rotary blade.

Referring to FIG. 1, by moving the rotary blade 50 vertically and horizontally along a boundary line 40 of the memory card on the memory card substrate 20 coated with the resin molding material layer (see 23 in FIG. 3), the memory The card substrate 20 may be cut into a desired shape to separate the plurality of memory cards 30 from the memory card substrate 20.

By the way, when using the method of cutting the memory card substrate 20 using the rotary blade 50 as described above, the straight shape can be easily cut, due to the limitation of the size of the rotary blade 50 itself Complex shapes such as shapes in which irregularities are frequently repeated have a problem that cannot be cut.

In addition, since the edge portion 33 of the memory card is a portion that is always in contact with the user while using the memory card 30, the edge portion 33 of the memory card should be smoothly curved to prevent injury to the user. When cutting the memory card substrate 20 by using the rotary blade 50, it is difficult to curve the corners 33 of the memory card. Therefore, after the cutting operation is finished, the corners of the respective memory cards ( There is a problem in that additional grinding operations for 33) must be performed.

In addition, since the side surface of the memory card is also a site where the user frequently contacts, the processing state should be excellent. However, since the rotary blade 50 is in contact with the memory card substrate 20 and cuts the memory card substrate 20, the rotary blade 50 is quickly dull even if it is replaced with a new one, and is processed by the dull rotary blade 50. The processing state of the side of the memory card 30 becomes worse. Therefore, if the frequent replacement of the rotary blade to solve this problem, the cost is increased, and if the replacement cycle of the rotary blade to take a long time to prevent the increase in cost, the processing state of the side of the memory card as described above is worsened have.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-described problems, and can be freely cut into a complicated shape of a memory card substrate, and does not perform a separate operation in performing not only a straight portion but also a curved portion at a corner. It is an object of the present invention to provide a method of cutting a memory card substrate using the same.

In order to achieve the above object, the memory card substrate cutting method of the present invention includes a plurality of memory cards having a printed circuit board layer having a circuit pattern formed on a lower surface thereof and a resin molding layer coated on the upper surface of the printed circuit board layer. A memory card substrate cutting method for cutting the memory card substrate to separate the memory card substrate from the memory card substrate including the memory card, comprising: irradiating a laser beam to the memory card substrate to cut the memory card substrate into a desired shape And the wavelength of the laser beam irradiated onto the memory card substrate is 200 nm to 700 nm.

In the method of cutting a memory card substrate according to the present invention, Preferably, the laser beam irradiated onto the memory card substrate is irradiated in a direction from the printed circuit board layer toward the resin molding layer.

In the method of cutting a memory card substrate according to the present invention, preferably, the wavelength of the laser beam is the wavelength of the visible light region within the range of 400 nm to 700 nm.

In the method of cutting a memory card substrate according to the present invention, Preferably, the wavelength of the laser beam is substantially 532 nm.

In the method of cutting a memory card substrate according to the present invention, preferably, the wavelength of the laser beam is the wavelength of the ultraviolet region within the range of 200 nm to 400 nm.

In the method of cutting a memory card substrate according to the present invention, Preferably, the wavelength of the laser beam is substantially 355 nm.

In the method of cutting a memory card substrate according to the present invention, Preferably, in the cutting step, the laser beam irradiated to the memory card substrate, the telecentric to irradiate the incident laser beam in a state parallel to the optical axis It is irradiated onto the memory card substrate through a telecentric lens.

In the method of cutting a memory card substrate according to the present invention, preferably, the memory card separated from the memory card substrate is a memory card having a physical size and an external connection portion according to the SD card standard.

Hereinafter, a preferred embodiment of a memory card substrate cutting method according to the present invention will be described in detail with reference to the accompanying drawings.

2 is a view showing an example of a memory card substrate cutting apparatus for implementing a memory card substrate cutting method of the present invention, Figure 3 is a stage of the memory card substrate of Figure 2, Figure 4 is a memory card substrate of Figure 2 Is a perspective view of a memory card removed from the camera.

2 to 4, an example of a memory card substrate cutting apparatus for implementing a memory card substrate cutting method of the present invention includes a laser oscillator 110 to which a laser beam 1 is emitted and a laser beam incident to the F-theta for irradiating the focused laser beam 1 onto the memory card substrate 20 with a galvanometer scanner 120 for deflecting 1) at a desired angle and the focused laser beam 1. It has a lens.

In the present invention, the memory card substrate 20 is cut into a desired shape using the laser beam 1. The mechanical cutting method using a rotary blade or the like is a contact cutting method of cutting a part of the memory card substrate 20 by cutting the rotary blade into contact with the surface of the memory card substrate 20, whereas the laser beam 1 In the method of cutting using the resin), the resin molding layer 23 and the printed circuit board layer constituting the memory card substrate 20 by concentrating the energy of the laser beam 1 on the surface of the memory card substrate 20 24) This is a non-contact cutting method that melts and evaporates to get the desired shape.

The laser beam 1 used for cutting the memory card substrate 20 in the present invention has a wavelength within the range of 200 nm to 700 nm. In general, industrial sites that produce semiconductor products using lasers do not use lasers with wavelengths less than 200 nm. When the memory card substrate 20 is cut using the laser beam 1 having a wavelength of more than 700 nm, the portion of the memory card substrate 20 irradiated by the laser beam 1 receives heat. After melting, some of them cannot evaporate and are solidified again in the form of residue on the side of the memory card 30 and attached. The processing quality of the memory card 30 is evaluated by the generation amount of the solidified residue. When the laser beam 1 having a wavelength of more than 700 nm is used, the generation amount is considerable. As in the present invention, when the memory card substrate 20 is cut using the laser beam 1 having a wavelength in the range of 200 nm to 700 nm, it can be observed that the amount of the solidified residue is significantly reduced.

It is preferable to cut the memory card substrate 20 using the laser beam 1 having a wavelength in the range of 400 nm to 700 nm, which is the visible light region, in the range of 200 nm to 700 nm. More preferably, the memory card substrate 20 is cut using the laser beam 1 having a wavelength of substantially 532 nm.

Further, the laser beam 1 having a wavelength in the ultraviolet region within the range of 200 nm to 400 nm, which is shorter than the visible light region, in consideration of the property that the shorter the wavelength, the better the processing state of the side surface 36 of the memory card becomes. It is preferable to cut the memory card substrate 20 using. More preferably, the memory card substrate 20 is cut out using the laser beam 1 having a wavelength of 355 nm substantially among the laser beams 1 having a wavelength in the ultraviolet region.

The f-theta lens has a predetermined working area 131. The working area 131 is a concept of a total area capable of working in a fixed state without moving the f-theta lens, and is, for example, an area of 30 mm in width and 30 mm in length depending on the type of f-theta lens used. An area equal to an area of 50 mm in width and 50 mm in length is determined. The laser beam 1 passing through the center portion of the f-theta lens is normally irradiated to a desired position of the memory card substrate 20 without errors due to aberration. However, the laser beam 1 passing through the edge of the f-theta lens is irradiated with distortion and not irradiated to a desired position of the memory card substrate 20 due to an error caused by aberration. Therefore, even if the memory card substrate 20 is cut in one working area 131, the size and processing quality of the memory card 30 located in the center portion of the working area 131 are good, while in the working area 131 The dimensions of the memory card 30 located at the edges are not accurate, and the processing quality is also significantly degraded.

As such, in order to improve the processing state of all the memory cards 30 located in one work area 131, a telecentric lens 130 is used as the f-theta lens in this embodiment. The telecentric lens 130 irradiates the incident laser beam 1 in parallel with the optical axis, regardless of the position on the telecentric lens 130, and thus toward the central portion of the telecentric lens 130. The incident laser beam or the laser beam incident to the edge portion of the telecentric lens 130 proceeds parallel to the optical axis. Therefore, since the error due to aberration can be prevented by using the telecentric lens 130, the processing state of all the memory cards 30 in one work area 131 can be maintained the same. In this embodiment, a telecentric lens 130 having a working area 131 of 50 mm in width and 50 mm in length is used.

On the other hand, the memory card substrate 20 cut using the laser beam 1 is composed of a printed circuit board layer 24 and a resin molding layer 23, as shown in FIG. The printed circuit board layer 24 includes an electrically conductive plate such as a copper plate 24b and an insulating layer 24a coated on the copper plate 24b. A flash memory (not shown) is mounted on the insulating layer 24a, and a part of the insulating layer 24a is removed by etching or the like to expose the copper plate 24b to thereby expose the flash memory. A circuit pattern for driving is formed. The resin molding layer 23 is applied to the upper surface of the printed circuit board layer 24 to protect components, circuits, and the like mounted on the printed circuit board layer 24.

In this embodiment, the memory card 30 separated from the memory card substrate 20 is an SD memory card 30 having a physical size and an external connection 37 according to the SD card standard. Since the SD memory card is generally manufactured in a small size, the cutting method is more efficient using a laser as in the present invention than the mechanical cutting method such as a rotary blade.

Hereinafter, an embodiment of a method of cutting a memory card substrate using a memory card substrate cutting device using a laser constructed as described above will be described with reference to FIGS. 2 to 4.

First, the memory card substrate 20 is disposed so that the lower surface 22 of the memory card substrate 20 shown in FIG. 3 faces upward. That is, the memory card substrate 20 is disposed so that the printed circuit board layer 24 is positioned above and the resin molding layer 23 is located below, so that the laser beam 1 irradiated to the memory card substrate 20 is Irradiation is made in the direction from the printed circuit board layer 24 toward the resin molding layer 23. In this way, the memory card substrate 20 is disposed so that the printed circuit board layer 24 is located at the top to smooth the processed end surface of the copper plate 24b of the printed circuit board layer. When the memory card substrate 20 is disposed so that the resin molding layer 23 is located above, the irradiated laser beam 1 consumes a considerable amount of energy to melt the resin molding layer 23 and prints. Sufficient energy cannot be allocated to cut the copper plate 24b located below the circuit board layer 24. Therefore, even if the copper plate 24b is cut | disconnected, the processing cross section may not be smooth and overall processing quality will fall. By arranging the memory card substrate 20 so that the copper plate 24b, which consumes a lot of energy to cut, is located at the top, it is possible to improve the processing quality of the memory card 30 that is cut and separated.

On the other hand, after arranging the memory card substrate 20 to be cut as described above, the laser beam 1 is irradiated onto the memory card substrate 20. Since the galvanometer scanner 120 can deflect the laser beam 1 to a desired angle, the laser beam 1 can be adapted to the shape of the memory card 30 included on the memory card substrate 20. It is possible to freely adjust the position vertically and horizontally. When the focused laser beam 1 is moved at a predetermined speed along the shape of the memory card 30, a portion of the memory card substrate 20 to which the focused laser beam 1 is irradiated is melted. The memory card 30 can be separated from the memory card substrate 20.

In the memory card substrate cutting method of the present invention configured as described above, the memory card substrate is cut into a desired shape by using a non-contact laser beam, even if the shape of the memory card is a shape having a straight portion and a complex uneven portion. Since the operation of separating the memory card from the memory card substrate can be easily performed, there is an effect of increasing the flexibility of the operation. In addition, by using a laser beam having a wavelength of 200 nm to 700 nm having a shorter wavelength than 1064 nm, it is possible to obtain the effect of improving the processing quality of the side surface of the memory card as the cut end surface.

In addition, the memory card substrate cutting method of the present invention can perform not only the cutting operation of the straight portion of the memory card, but also the processing of the curved portion of the edge of the memory card at one time through one continuous cutting operation. By performing the curve processing work on the corners separately, it is possible to reduce the loss caused.

In the embodiment of the present invention, although a telecentric lens is used to prevent errors due to aberrations at the edges in the working area, a general f-theta having a small working area can be minimized to minimize errors due to aberrations at the edges. It is also possible to use a lens.

In the embodiment of the present invention, the memory card separated from the memory card substrate is illustrated as an SD memory card, but the memory card may be a memory card conforming to another standard such as an MMC memory card.

Although the preferred embodiments and modifications have been described above, the method of cutting the memory card substrate according to the present invention is not limited to the above-described examples, and the scope does not depart from the technical spirit of the present invention by modifications or combinations thereof. Various types of memory card substrate cutting methods can be embodied within.

The cutting method of the memory card substrate of the present invention is such that the memory card substrate is cut into a desired shape by using a laser beam having a wavelength of 200 nm to 700 nm. This high, short wavelength laser beam is used to improve the quality of the processed cross section.

In addition, since only one cutting operation can be performed at the same time, the cutting operation of the straight portion of the memory card and the curve processing of the corner portion of the memory card can be performed at once, thereby reducing the manufacturing process step of the memory card.

Claims (8)

The memory card for separating each memory card from a memory card substrate, the memory card substrate comprising a plurality of memory cards having a printed circuit board layer having a circuit pattern formed on a lower surface thereof and a resin molding layer applied to an upper surface of the printed circuit board layer. In the memory card substrate cutting method for cutting a card substrate, Irradiating a laser beam onto the memory card substrate to melt and evaporate the printed circuit board layer and the resin molding layer to cut the memory card substrate into a desired shape. And a wavelength of the laser beam irradiated onto the memory card substrate is 200 nm to 700 nm. The method of claim 1, And a laser beam radiated onto the memory card substrate in a direction from the printed circuit board layer toward the resin molding layer. The method of claim 1, And the wavelength of the laser beam is a wavelength of a visible light region within a range of 400 nm to 700 nm. The method of claim 3, And the wavelength of the laser beam is 532 nm. The method of claim 1, The wavelength of the laser beam is a wavelength of the ultraviolet region in the range of 200 nm to 400 nm. The method of claim 5, And a wavelength of the laser beam is 355 nm. The method of claim 1, In the cutting step, The laser beam irradiated onto the memory card substrate is irradiated to the memory card substrate through a telecentric lens for irradiating the incident laser beam in a state parallel to the optical axis. . The method of claim 1, And a memory card separated from the memory card substrate is a memory card having a physical size and an external connection portion in accordance with the SD card standard.

Images