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KR100815265B1 - Method for manufacturing micro heater and crucible, and vacuum deposition apparatus of organic substances having the micro heater and crucible - Google Patents

Method for manufacturing micro heater and crucible, and vacuum deposition apparatus of organic substances having the micro heater and crucible Download PDF

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KR100815265B1
KR100815265B1 KR1020060081918A KR20060081918A KR100815265B1 KR 100815265 B1 KR100815265 B1 KR 100815265B1 KR 1020060081918 A KR1020060081918 A KR 1020060081918A KR 20060081918 A KR20060081918 A KR 20060081918A KR 100815265 B1 KR100815265 B1 KR 100815265B1
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crucible
micro heater
organic material
organic
mask
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KR20070050793A (en
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김경석
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주식회사 대우일렉트로닉스
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    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24Vacuum evaporation
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04Coating on selected surface areas, e.g. using masks
    • C23C14/042Coating on selected surface areas, e.g. using masks using masks
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24Vacuum evaporation
    • C23C14/243Crucibles for source material
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24Vacuum evaporation
    • C23C14/28Vacuum evaporation by wave energy or particle radiation
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54Controlling or regulating the coating process
    • C23C14/548Controlling the composition

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  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
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  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Electroluminescent Light Sources (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

유기물 증착 공정 시 유기물을 기판에 균일한 두께로 증착시킬 수 있을 뿐만 아니라, 유기물의 대부분이 불필요하게 사용되는 것을 감소시킬 수 있으며, 마스크의 열팽창을 방지하여 정밀한 얼라인먼트가 가능하도록 하는 마이크로 히터 및 도가니 제조 방법, 그리고 이들을 구비한 유기물 진공 증착 장치가 제공된다. 본 발명에 의한 유기물 진공 증착 장치는, 진공 챔버; 진공 챔버 내의 하부에 배치되고, 기판의 픽셀 영역의 크기 및 간격에 상응하는 패턴을 가지며, 그 내부에 유기물이 채워지는 도가니; 패턴의 상면을 제외한 도가니 전면에 형성되며, 도가니를 가열시켜 도가니 내부에 채워진 유기물을 패턴의 상면으로 증발시키기 위한 마이크로 히터; 도가니 상부에 배치되며, 마이크로 히터에 의해 가열되어 증발되는 유기물을 투과시키기 위한 투과부와, 유기물을 차단시키기 위한 차단부로 구성되는 마스크; 및 마이크로 히터가 형성된 도가니 하부에 설치되며, 마스크의 투과부를 통해 증발되는 유기물이 기판의 픽셀 영역에 정확하게 얼라인먼트될 수 있도록 도가니를 정밀하게 시프트시켜 주는 나노 스테이지를 포함한다.In the organic deposition process, not only can the organic material be deposited on the substrate to a uniform thickness, but also the unnecessary use of most of the organic material can be reduced, and micro heaters and crucibles can be manufactured to precise alignment by preventing thermal expansion of the mask. A method and an organic vacuum deposition apparatus having the same are provided. Organic matter vacuum deposition apparatus according to the present invention, a vacuum chamber; A crucible disposed below the vacuum chamber, having a pattern corresponding to the size and spacing of the pixel region of the substrate, and filled with organic matter therein; A micro heater which is formed on the entire surface of the crucible except for the upper surface of the pattern, and heats the crucible to evaporate the organic material filled in the crucible to the upper surface of the pattern; A mask disposed on the top of the crucible, the mask including a permeation part for permeating the organic material heated and evaporated by the micro heater and a blocking part for blocking the organic material; And a nano stage disposed under the crucible in which the micro heater is formed, and precisely shifting the crucible so that the organic material evaporated through the permeation part of the mask can be accurately aligned with the pixel area of the substrate.

유기물 증착, 얼라인먼트, 마이크로 히터, 도가니, 마스크, 나노 스테이지 Organic matter deposition, alignment, micro heater, crucible, mask, nano stage

Description

마이크로 히터 및 도가니 제조 방법, 그리고 이들을 구비한 유기물 진공 증착 장치{Method for manufacturing micro heater and crucible, and vacuum deposition apparatus of organic substances having the micro heater and crucible}Method for manufacturing micro heater and crucible, and vacuum deposition apparatus of organic substances having the micro heater and crucible}

도 1 및 도 2a 내지 도 2c는 종래기술에 따른 유기물 진공 증착 장치를 도시한 도면이다.1 and 2a to 2c is a view showing an organic vacuum deposition apparatus according to the prior art.

도 3은 본 발명의 실시예에 따른 유기물 진공 증착 장치를 설명하기 위해 도시한 도면이다.3 is a view illustrating an organic vacuum deposition apparatus according to an embodiment of the present invention.

도 4a 내지 도 4d는 도 3의 마이크로 히터의 제조 방법을 설명하기 위해 도시한 제조 공정도들이다.4A to 4D are manufacturing process diagrams for explaining the manufacturing method of the micro heater of FIG. 3.

도 5a 내지 도 5g는 도 3의 도가니의 제조 방법을 설명하기 위해 도시한 제조 공정도들이다.5A through 5G are manufacturing process diagrams for explaining the method of manufacturing the crucible of FIG. 3.

<도면의 주요 부분에 대한 부호의 설명><Explanation of symbols for the main parts of the drawings>

110: 진공 챔버 120: 도가니110: vacuum chamber 120: crucible

122: 패턴 124: 유기물122: pattern 124: organic matter

130: 마이크로 히터 140: 마스크130: micro heater 140: mask

150: 나노 스테이지 160: 단열층150: nano stage 160: heat insulation layer

170: 질소 가스170: nitrogen gas

본 발명은 유기물 진공 증착 장치에 관한 것으로서, 보다 상세하게는 유기물 증착 공정 시 유기물을 기판에 균일한 두께로 증착시킬 수 있을 뿐만 아니라, 유기물의 대부분이 불필요하게 사용되는 것을 감소시킬 수 있으며, 마스크의 열팽창을 방지하여 정밀한 얼라인먼트가 가능하도록 한 마이크로 히터 및 도가니 제조 방법, 그리고 이들을 구비한 유기물 진공 증착 장치에 관한 것이다.The present invention relates to an organic vacuum deposition apparatus, and more particularly, it is possible not only to deposit the organic material on the substrate in a uniform thickness during the organic material deposition process, but also to reduce the unnecessary use of most of the organic material. The present invention relates to a micro heater and crucible manufacturing method for preventing thermal expansion and enabling precise alignment, and an organic vacuum deposition apparatus having the same.

오엘이디(OLED: Organic Light Emitting Diode) 소자는 낮은 전압에서 구동이 가능하고 박형화, 광시야각, 빠른 응답속도 등 LCD에서 문제로 지적되고 있는 결점을 해소할 수 있으며, 다른 디스플레이 소자에 비해 중형 이하에서는 TFT-LCD와 동등하거나 그 이상의 화질을 가질 수 있다는 점과 제조 공정이 단순하여 향후 가격 경쟁에서 유리하다는 등의 장점을 가진 차세대 디스플레이로 주목받고 있다.Organic Light Emitting Diode (OLED) devices can be driven at low voltages and eliminate the drawbacks of LCDs such as thinning, wide viewing angles and fast response speeds. It is attracting attention as a next-generation display having the advantages of having an image quality equal to or higher than that of a TFT-LCD and having a simple manufacturing process, which is advantageous in future price competition.

이러한 오엘이디 소자를 제작하기 위해서는, 양극과 음극 사이에 발광층 등을 포함하는 발광유기물층을 형성시켜야 하며, 이러한 발광유기물층은 기판 위에 R-G-B 각각의 픽셀(Pixel) 단위로 유기물을 증착하는 공정을 통해 형성된다.In order to manufacture such an LED element, a light emitting organic layer including a light emitting layer or the like must be formed between an anode and a cathode, and the light emitting organic layer is formed through a process of depositing an organic material in each pixel unit of RGB on a substrate. .

이러한 유기물 증착 시에는 증착 두께가 100~200nm의 박막으로 형성되어야 하기 때문에 핀홀(Pin-Hole)이 없는 균일한 성막이 요구된다. 하지만, 도 1과 같은 기존의 저항 가열 증착법을 이용해서는 기판(10)을 중심으로 증착원(20) 가운데 부분의 증착 두께는 두껍고, 가장자리 부분의 증착 두께는 얇아지는 문제점이 있다.When the organic material is deposited, since the deposition thickness must be formed as a thin film having a thickness of 100 to 200 nm, uniform film formation without pin-holes is required. However, using the conventional resistive heating deposition method as shown in FIG. 1, there is a problem in that the deposition thickness of the center portion of the deposition source 20 is thick and the deposition thickness of the edge portion is thinned around the substrate 10.

이러한 문제점을 해결하기 위해 증착원(20)과 기판(10)과의 최적의 거리를 찾고, 기판(10) 중심에서 오프셋(Off-Set)을 시켜가며 기판(10)을 회전하는 방법이 연구되고 있다. 하지만, TV와 같은 대형 사이즈에서는 균일한 성막에 한계가 있다.In order to solve this problem, a method of finding an optimal distance between the deposition source 20 and the substrate 10 and rotating the substrate 10 by offsetting the center of the substrate 10 is studied. have. However, there is a limit to uniform film formation in a large size such as a TV.

한편, 도 2a 내지 도 2c에 도시한 바와 같이, R, G, B 색 분리를 위해 새도우 마스크(Shadow Mask)법을 이용하게 되는데, 이것은 마스크(30)를 시프트(Shift)시켜 가면서 차례대로 증착하는 방식이다. 하지만, 이러한 방식에서도 다음과 같은 문제점이 있다.On the other hand, as shown in Figures 2a to 2c, the shadow mask (Shadow Mask) method is used to separate the R, G, B color, which is deposited in order by shifting the mask 30 (Shift) That's the way. However, this method also has the following problems.

첫째, RGB 색 대부분의 재료가 마스크(30) 위에 겹쳐지기 때문에 불필요한 부분이 많이 발생한다. 즉, 슬릿 마스크(Slit-Mask)(30)를 사용함으로써 R-G-B 패턴으로 증착되는 유기물보다는 마스크(30) 하부에 붙는 유기물이 거의 대부분(95% 이상)이므로, 재료 사용에 대한 효율성이 떨어지게 되고 마스크(30) 하부에 붙는 유기물들은 오염원으로 진공 챔버 내에서 작용할 가능성도 높아지게 된다.First, since most of the RGB color material is superimposed on the mask 30, a lot of unnecessary parts are generated. That is, by using the slit mask (Slit-Mask) 30, since most of the organic material attached to the lower portion of the mask 30 (95% or more) than the organic material deposited in the RGB pattern, the efficiency of material use is reduced and the mask ( 30) Organics that adhere to the bottom are more likely to act in the vacuum chamber as a source of contamination.

둘째, 디스플레이가 고정세화가 되면 될수록 섀도 마스크(30) 전체의 열팽창으로 정밀한 얼라인먼트(마스크 이동시 조정공차)가 어렵게 된다.Second, the finer the display becomes, the more precise alignment (adjustment tolerance during mask movement) becomes difficult due to thermal expansion of the entire shadow mask 30.

따라서, 유기물 증착 공정 시 유기물을 기판에 균일한 두께로 증착시킬 수 있을 뿐만 아니라, 유기물의 대부분이 불필요하게 사용되는 것을 감소시킬 수 있으며, 마스크의 열팽창을 방지하여 정밀한 얼라인먼트가 가능하도록 하는 유기물 진 공 증착 장치의 개발이 요청된다.Therefore, not only the organic material may be deposited on the substrate in a uniform thickness during the organic material deposition process, but also the unnecessary use of most of the organic material may be reduced, and the organic vacuum may be precisely aligned by preventing thermal expansion of the mask. Development of a deposition apparatus is required.

본 발명이 이루고자 하는 기술적 과제는 유기물 증착 공정 시 유기물을 기판에 균일한 두께로 증착시킬 수 있을 뿐만 아니라, 유기물의 대부분이 불필요하게 사용되는 것을 감소시킬 수 있으며, 마스크의 열팽창을 방지하여 정밀한 얼라인먼트가 가능하도록 하는 유기물 진공 증착 장치를 제공하는 데에 있다.The technical problem to be achieved by the present invention is not only to deposit the organic material on the substrate in a uniform thickness during the organic material deposition process, but also to reduce the unnecessary use of most of the organic material, and to prevent thermal expansion of the mask, precise alignment It is to provide an organic vacuum deposition apparatus that makes it possible.

본 발명이 이루고자 하는 다른 기술적 과제는 상기 유기물 진공 증착 장치에 사용되는 마이크로 히터의 제조 방법을 제공하는 데에 있다.Another object of the present invention is to provide a method for manufacturing a micro heater used in the organic vacuum deposition apparatus.

본 발명이 이루고자 하는 또 다른 기술적 과제는 상기 유기물 진공 증착 장치에 사용되는 도가니의 제조 방법을 제공하는 데에 있다.Another object of the present invention is to provide a method of manufacturing a crucible used in the organic vacuum deposition apparatus.

본 발명이 이루고자 하는 기술적 과제들은 이상에서 언급한 기술적 과제들로 제한되지 않으며, 언급되지 않은 또 다른 기술적 과제들은 아래의 기재로부터 당업자에게 명확하게 이해될 수 있을 것이다.Technical problems to be achieved by the present invention are not limited to the technical problems mentioned above, and other technical problems not mentioned will be clearly understood by those skilled in the art from the following description.

상기의 기술적 과제를 해결하기 위한 본 발명의 실시예에 따른 유기물 진공 증착 장치는, 진공 챔버; 상기 진공 챔버 내의 하부에 배치되고, 기판의 픽셀 영역의 크기 및 간격에 상응하는 패턴을 가지며, 그 내부에 유기물이 채워지는 도가니; 상기 패턴의 상면을 제외한 상기 도가니 전면에 형성되며, 상기 도가니를 가열시켜 상기 도가니 내부에 채워진 상기 유기물을 상기 패턴의 상면으로 증발시키기 위한 마이크로 히터; 상기 도가니 상부에 배치되며, 상기 마이크로 히터에 의해 가열되어 증발되는 상기 유기물을 투과시키기 위한 투과부와, 상기 유기물을 차단시키기 위한 차단부로 구성되는 마스크; 및 상기 마이크로 히터가 형성된 상기 도가니 하부에 설치되며, 상기 마스크의 투과부를 통해 증발되는 상기 유기물이 상기 기판의 픽셀 영역에 정확하게 얼라인먼트될 수 있도록 상기 도가니를 정밀하게 시프트시켜 주는 나노 스테이지를 포함한다.An organic material vacuum deposition apparatus according to an embodiment of the present invention for solving the above technical problem, the vacuum chamber; A crucible disposed under the vacuum chamber, having a pattern corresponding to the size and spacing of the pixel region of the substrate, and filled with organic matter therein; A micro heater formed on an entire surface of the crucible except for the upper surface of the pattern, for heating the crucible to evaporate the organic material filled in the crucible to the upper surface of the pattern; A mask disposed on the crucible and configured to include a transmission part for transmitting the organic material heated and evaporated by the micro heater and a blocking part for blocking the organic material; And a nano stage disposed under the crucible in which the micro heater is formed, and precisely shifting the crucible so that the organic material evaporated through the permeation part of the mask can be accurately aligned with the pixel region of the substrate.

본 발명의 실시예에 있어서, 상기 도가니의 패턴은 상기 마스크의 투과부와 대응되는 위치에 형성되는 것이 바람직하다.In an embodiment of the present invention, the pattern of the crucible is preferably formed at a position corresponding to the transmission portion of the mask.

본 발명의 실시예에 따른 유기물 진공 증착 장치는, 상기 마이크로 히터가 형성된 상기 도가니의 측면 및 하면에 형성되어 상기 마이크로 히터에 의해 가열된 상기 도가니를 단열시켜주기 위한 단열층을 더 포함할 수 있다.The organic material vacuum deposition apparatus according to the embodiment of the present invention may further include a heat insulating layer formed on the side and bottom of the crucible in which the micro heater is formed to insulate the crucible heated by the micro heater.

상기 단열층 안쪽에는 상기 도가니가 열에 의해 팽창 및 변형되는 것을 방지하기 위한 질소 가스가 주입될 수 있다.Nitrogen gas may be injected into the heat insulation layer to prevent the crucible from expanding and deforming by heat.

상기의 다른 기술적 과제를 해결하기 위한 본 발명의 실시예에 따른 마이크로 히터 제조 방법은, 글래스 웨이퍼 상에 포토레지스트를 도포하는 단계; 상기 글래스 웨이퍼 상에 도포된 상기 포토레지스트를 패터닝하여 일정 간격 이격된 역테이퍼 형상의 포토레지스트 패턴을 형성하는 단계; 상기 포토레지스트 패턴이 형성된 상기 글래스 웨이퍼 상에 전극층을 형성하는 단계; 및 상기 포토레지스트 패턴을 제거하는 단계를 포함한다.Micro heater manufacturing method according to an embodiment of the present invention for solving the above other technical problem, the step of applying a photoresist on the glass wafer; Patterning the photoresist applied on the glass wafer to form an inverse tapered photoresist pattern spaced at regular intervals; Forming an electrode layer on the glass wafer on which the photoresist pattern is formed; And removing the photoresist pattern.

본 발명의 실시예에 있어서, 상기 포토레지스트 패턴을 형성하는 단계는 포토리소그래피 공정에 의해 진행될 수 있다.In an embodiment of the present invention, the forming of the photoresist pattern may be performed by a photolithography process.

상기 포토레지스트는 네거티브 포토레지스트인 것이 바람직하다.The photoresist is preferably a negative photoresist.

상기 전극층은 백금을 포함하는 전극 형성용 금속 물질인 것이 바람직하다.Preferably, the electrode layer is a metal material for forming an electrode including platinum.

상기 포토레지스트 패턴을 제거하는 단계는 아세톤 및 에칭 용액에 의한 습식 식각에 의해 진행될 수 있다.Removing the photoresist pattern may be performed by wet etching with acetone and an etching solution.

상기의 또 다른 기술적 과제를 해결하기 위한 본 발명의 실시예에 따른 도가니 제조 방법은, 기판 상에 픽셀 크기 및 간격에 상응하는 몰드 패턴을 형성하는 단계; 상기 몰드 패턴이 형성된 상기 기판 상에 프리폴리머 계열의 물질을 도포하여 큐어링한 후 상기 기판으로부터 분리하여 레플리카 몰드를 완성하는 단계; 상기 레플리카 몰드를 액체 금속 상태의 백금에 프레스하여 큐어링 한 후 상기 레플리카 몰드를 상기 백금으로부터 분리하여 도가니를 완성하는 단계; 및 상기 도가니 내부에 유기물을 주입하는 단계를 포함한다.According to another aspect of the present invention, there is provided a crucible manufacturing method comprising: forming a mold pattern corresponding to a pixel size and a spacing on a substrate; Coating and curing a prepolymer-based material on the substrate on which the mold pattern is formed, and then separating from the substrate to complete a replica mold; Pressing the replica mold onto platinum in a liquid metal state to cure and then separating the replica mold from the platinum to complete a crucible; And injecting an organic material into the crucible.

본 발명의 실시예에 있어서, 상기 몰드 패턴을 형성하는 단계는 RIE 식각에 의해 진행될 수 있다.In an embodiment of the present invention, the forming of the mold pattern may be performed by RIE etching.

기타 실시예들의 구체적인 사항들은 상세한 설명 및 첨부 도면들에 포함되어 있다.Specific details of other embodiments are included in the detailed description and the accompanying drawings.

본 발명의 이점 및 특징, 그리고 그것들을 달성하는 방법은 첨부되는 도면과 함께 상세하게 후술되어 있는 실시예들을 참조하면 명확해질 것이다. 그러나, 본 발명은 이하에서 개시되는 실시예들에 한정되는 것이 아니라 서로 다른 다양한 형 태로 구현될 것이며, 단지 본 실시예들은 본 발명의 개시가 완전하도록 하며, 본 발명이 속하는 기술분야에서 통상의 지식을 가진 자에게 발명의 범주를 완전하게 알려주기 위해 제공되는 것이며, 본 발명은 청구항의 범주에 의해 정의될 뿐이다. 명세서 전체에 걸쳐 동일 참조 부호는 동일 구성요소를 지칭한다.Advantages and features of the present invention and methods for achieving them will be apparent with reference to the embodiments described below in detail with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but will be implemented in various different forms, only these embodiments are intended to make the disclosure of the present invention complete, and common knowledge in the art to which the present invention pertains. It is provided to fully inform the person having the scope of the invention, which is defined only by the scope of the claims. Like reference numerals refer to like elements throughout.

또한, 도면에서 층과 막 또는 영역들의 크기 두께는 명세서의 명확성을 위하여 과장되어 기술된 것이며, 어떤 막 또는 층이 다른 막 또는 층의 "상에" 형성된다라고 기재된 경우, 상기 어떤 막 또는 층이 상기 다른 막 또는 층의 위에 직접 존재할 수도 있고, 그 사이에 제3의 다른 막 또는 층이 개재될 수도 있다.In addition, in the drawings, the size and thickness of layers and films or regions are exaggerated for clarity of description, and when any film or layer is described as being formed "on" of another film or layer, It may be directly on top of the other film or layer, and a third other film or layer may be interposed therebetween.

또한, 도면에서 발명을 구성하는 구성요소들의 크기는 명세서의 명확성을 위하여 과장되어 기술된 것이며, 어떤 구성요소가 다른 구성요소의 "내부에 존재하거나, 연결되어 설치된다"고 기재된 경우, 상기 어떤 구성요소가 상기 다른 구성요소와 접하여 설치될 수도 있고, 그 소정의 이격거리를 두고 설치될 수도 있으며, 이격거리를 두고 설치되는 경우엔 상기 어떤 구성요소를 상기 다른 구성요소에 고정 내지 연결시키기 위한 제3의 수단에 대한 설명이 생략될 수도 있다.In addition, the size of the components constituting the invention in the drawings are exaggerated for clarity of the specification, when any component is described as "exists inside, or is installed in connection with" other components, any of the above configuration An element may be installed in contact with the other component, or may be installed at a predetermined distance from the other component, and when installed at a distance, a third element for fixing or connecting the component to the other component The description of the means of may be omitted.

도 3은 본 발명의 실시예에 따른 유기물 진공 증착 장치를 설명하기 위해 도시한 도면이다.3 is a view illustrating an organic vacuum deposition apparatus according to an embodiment of the present invention.

도 3을 참조하면, 본 발명의 실시예에 따른 유기물 진공 증착 장치는 진공 챔버(110)와, 진공 챔버(110) 내의 하부에 배치되고, 기판(10)의 픽셀 영역의 크기 및 간격에 상응하는 패턴(122)을 가지며, 그 내부에 유기물(124)이 채워지는 도가니(120)와, 도가니(120)의 패턴(122)의 상면을 제외한 도가니(120) 전면에 형성되며, 도가니(120)를 가열시켜 도가니(120) 내부에 채워진 유기물(124)을 도가니(120)의 패턴(122)의 상면으로 증발시키기 위한 마이크로 히터(130)와, 도가니(120) 상부에 배치되며, 마이크로 히터(130)에 의해 가열되어 증발되는 유기물(124)을 투과시키기 위한 투과부(142)와, 유기물(124)을 차단시키기 위한 차단부(144)로 구성되는 마스크(140)와, 마이크로 히터(130)가 형성된 도가니(120) 하부에 설치되며, 마스크(140)의 투과부(142)를 통해 증발되는 유기물(124)이 기판(10)의 픽셀 영역에 정확하게 얼라인먼트(Alignment)될 수 있도록 도가니(120)를 정밀하게 시프트(Shift)시켜 주는 나노 스테이지(150)를 포함한다.Referring to FIG. 3, the organic vacuum deposition apparatus according to the exemplary embodiment of the present invention is disposed under the vacuum chamber 110 and the vacuum chamber 110, and corresponds to the size and spacing of the pixel region of the substrate 10. The crucible 120 having the pattern 122, and the organic material 124 is filled therein, and is formed on the entire surface of the crucible 120 except for the upper surface of the pattern 122 of the crucible 120. The micro heater 130 for evaporating the organic material 124 filled in the crucible 120 to the upper surface of the pattern 122 of the crucible 120 and the crucible 120 are disposed above the micro heater 130. A crucible with a mask 140 comprising a permeation part 142 for transmitting the organic material 124 heated and evaporated by the heat treatment, a blocking part 144 for blocking the organic material 124, and a micro heater 130. The organic material 124 is installed below the 120 and is evaporated through the transmission part 142 of the mask 140. Exactly in the pixel region (10) comprises a nano-stage 150, which was precisely shift (Shift) of the crucible 120 so as to be alignment (Alignment).

여기서, 상기 도가니(120)의 패턴(122)은 마스크(140)의 투과부(142)와 대응되는 위치에 형성되는 것이 바람직하다.Here, the pattern 122 of the crucible 120 is preferably formed at a position corresponding to the transmission portion 142 of the mask 140.

추가하여, 본 발명의 실시예에 따른 유기물 진공 증착 장치는 마이크로 히터(130)가 형성된 도가니(120)의 측면 및 하면에 형성되어 마이크로 히터(130)에 의해 가열된 도가니(120)를 단열시켜주기 위한 단열층(160)을 더 포함한다.In addition, the organic vacuum deposition apparatus according to the embodiment of the present invention is formed on the side and the bottom of the crucible 120, the micro heater 130 is formed to insulate the crucible 120 heated by the micro heater 130 It further comprises a heat insulating layer 160 for.

이러한 단열층(160)의 안쪽에는 도가니(120)가 마이크로 히터(130)의 열에 의해 팽창 및 변형되는 것을 방지하기 위한 질소(N2) 가스(170)가 주입된다.Nitrogen (N2) gas 170 is injected into the heat insulation layer 160 to prevent the crucible 120 from expanding and deforming due to the heat of the micro heater 130.

이하에서는 본 발명의 실시예에 따른 유기물 진공 증착 장치의 마이크로 히터를 제조하는 방법에 대하여 도 4a 내지 도 4d를 참조하여 상세히 설명하기로 한다.Hereinafter, a method of manufacturing a micro heater of an organic vacuum deposition apparatus according to an embodiment of the present invention will be described in detail with reference to FIGS. 4A to 4D.

도 4a 내지 도 4d는 도 3의 마이크로 히터의 제조 방법을 설명하기 위해 도시한 제조 공정도들이다.4A to 4D are manufacturing process diagrams for explaining the manufacturing method of the micro heater of FIG. 3.

먼저, 도 4a를 참조하면, 글래스 웨이퍼(Glass Wafer)(210) 상에 포토레지스트(Photo Resist)(220)를 콘포말(Conformal)하게 도포한다. 이때, 포토레지스트(220)로는 네거티브(Negative) 포토레지스트를 사용하는 것이 바람직하다. First, referring to FIG. 4A, a photoresist 220 is conformally coated on a glass wafer 210. In this case, it is preferable to use a negative photoresist as the photoresist 220.

참고로, 포토레지스트(220)는 포지티브 포토레지스트와 네거티브 포토레지스트로 구분되는데, 포지티브(Positive) 포토레지스트는 빛이 조사되는 부분을 패터닝하기 위해 사용되고, 네거티브 포토레지스트는 빛이 조사되지 않은 부분을 패터닝하기 위해 사용된다.For reference, the photoresist 220 is divided into a positive photoresist and a negative photoresist. A positive photoresist is used to pattern a portion to which light is irradiated, and a negative photoresist is patterning a portion to which light is not irradiated. Used to

다음에, 도 4b를 참조하면, 글래스 웨이퍼(210) 상에 도포된 포토레지스트(220)를 패터닝(Patterning)하여 일정 간격 이격된 역테이퍼(Reverse Taper) 형상의 포토레지스트 패턴(230)을 형성한다. 이때, 포토레지스트 패턴(230)은 포토리소그래피(Photo lithography) 공정에 의해 형성될 수 있다.Next, referring to FIG. 4B, the photoresist 220 coated on the glass wafer 210 is patterned to form a reverse taper-shaped photoresist pattern 230 spaced at regular intervals. . In this case, the photoresist pattern 230 may be formed by a photo lithography process.

다음에, 도 4c를 참조하면, 포토레지스트 패턴(230)이 형성된 글래스 웨이퍼(210) 상에 전극층(240)을 형성한다. 이때, 전극층(240)은 백금을 포함하는 전극 형성용 금속 물질을 사용하여 형성할 수 있다.Next, referring to FIG. 4C, an electrode layer 240 is formed on the glass wafer 210 on which the photoresist pattern 230 is formed. In this case, the electrode layer 240 may be formed using a metal material for forming an electrode including platinum.

마지막으로, 도 4c 및 도 4d를 참조하면, 글래스 웨이퍼(210) 상에 형성된 포토레지스트 패턴(230)을 제거하여 글래스 웨이퍼(210) 상에 전극층(240)만 남도록 한다. 이때, 글래스 웨이퍼(210) 상에 형성된 포토레지스트 패턴(230)은 아세톤 및 에칭 용액에 의한 습식 식각에 의해 제거될 수 있다.4C and 4D, the photoresist pattern 230 formed on the glass wafer 210 is removed so that only the electrode layer 240 remains on the glass wafer 210. In this case, the photoresist pattern 230 formed on the glass wafer 210 may be removed by wet etching with acetone and an etching solution.

상기와 같은 과정을 통하여, 본 발명의 실시예에 따른 유기물 진공 증착 장치에 사용되는 마이크로 히터의 제조는 완료된다.Through the above process, the manufacturing of the micro heater used in the organic material vacuum deposition apparatus according to the embodiment of the present invention is completed.

이하에서는 본 발명의 실시예에 따른 유기물 진공 증착 장치의 도가니를 제조하는 방법에 대하여 도 5a 내지 도 5g를 참조하여 상세히 설명하기로 한다.Hereinafter, a method of manufacturing a crucible of an organic vacuum deposition apparatus according to an embodiment of the present invention will be described in detail with reference to FIGS. 5A to 5G.

도 5a 내지 도 5g는 도 3의 도가니의 제조 방법을 설명하기 위해 도시한 제조 공정도들이다.5A through 5G are manufacturing process diagrams for explaining the method of manufacturing the crucible of FIG. 3.

먼저, 도 5a 및 도 5b를 참조하면, 기판(310) 상에 오엘이디 소자용 기판(도 3의 10 참조)의 픽셀 영역의 크기 및 간격에 상응하는 몰드 패턴(312)을 형성한다. 이때, 몰드 패턴(312)은 RIE(Reactive Ion Etching) 식각에 의해 형성될 수 있다.First, referring to FIGS. 5A and 5B, a mold pattern 312 is formed on the substrate 310 corresponding to the size and spacing of the pixel area of the ODL element substrate (see 10 of FIG. 3). In this case, the mold pattern 312 may be formed by reactive ion etching (RIE) etching.

다음에, 도 5c 및 도 5d를 참조하면, 몰드 패턴(312)이 형성된 기판(310) 상에 프리폴리머(Prepolymer) 계열의 물질(320)을 도포하고, 이어서 이 프리폴리머 계열의 물질(320)을 큐어링(Curing)하여 경화시킨 뒤, 기판(310)으로부터 분리하여 레플리카 몰드(330)를 완성한다.Next, referring to FIGS. 5C and 5D, a prepolymer-based material 320 is coated on the substrate 310 on which the mold pattern 312 is formed, and then the prepolymer-based material 320 is cured. After curing by curing, the replica mold 330 is completed by separating from the substrate 310.

이러한 레플리카 몰드(330)는 이후에 완성될 도가니를 제조하기 위한 금형으로 사용된다.This replica mold 330 is used as a mold for manufacturing a crucible to be completed later.

다음에, 도 5e 내지 도 5g를 참조하면, 레플리카 몰드(330)를 액체 금속 상태의 백금(340)에 프레스(Press)한 다음 큐어링하여 경화시킨다. Next, referring to FIGS. 5E to 5G, the replica mold 330 is pressed onto the platinum 340 in a liquid metal state, and then cured by curing.

이후에, 액체 금속 상태의 백금(340)이 경화되면 레플리카 몰드(330)를 백금(340)으로부터 분리하여 도가니(350)를 완성한다.Thereafter, when the platinum 340 in the liquid metal state is cured, the replica mold 330 is separated from the platinum 340 to complete the crucible 350.

이후에, 도가니(350) 내부에 유기물(360)을 주입한다.Thereafter, the organic material 360 is injected into the crucible 350.

상기와 같은 과정을 통하여, 본 발명의 실시예에 따른 유기물 진공 증착 장치에 사용되는 도가니의 제조는 완료된다.Through the above process, the manufacture of the crucible used in the organic material vacuum deposition apparatus according to the embodiment of the present invention is completed.

이상 첨부된 도면 및 표를 참조하여 본 발명의 실시예들을 설명하였으나, 본 발명은 상기 실시예들에 한정되는 것이 아니라 서로 다른 다양한 형태로 제조될 수 있으며, 본 발명이 속하는 기술분야에서 통상의 지식을 가진 자는 본 발명의 기술적 사상이나 필수적인 특징을 변경하지 않고서 다른 구체적인 형태로 실시될 수 있다는 것을 이해할 수 있을 것이다. 그러므로 이상에서 기술한 실시예들은 모든 면에서 예시적인 것이며 한정적이 아닌 것으로 이해해야만 한다.Although the embodiments of the present invention have been described above with reference to the accompanying drawings and tables, the present invention is not limited to the above embodiments, but may be manufactured in various forms, and common knowledge in the art to which the present invention pertains. Those skilled in the art can understand that the present invention can be implemented in other specific forms without changing the technical spirit or essential features of the present invention. Therefore, it should be understood that the embodiments described above are exemplary in all respects and not restrictive.

본 발명의 실시예에 따른 유기물 진공 증착 장치에 의하면, 유기물 증착 공정 시 유기물을 기판에 균일한 두께로 증착시킬 수 있을 뿐만 아니라, 유기물의 대부분이 불필요하게 사용되는 것을 감소시킬 수 있으며, 마스크의 열팽창을 방지하여 정밀한 얼라인먼트가 가능하도록 하는 효과가 있다.According to the organic vacuum deposition apparatus according to an embodiment of the present invention, not only can the organic material be deposited on the substrate in a uniform thickness during the organic material deposition process, but also the unnecessary use of most of the organic material can be reduced, and the thermal expansion of the mask can be reduced. There is an effect to enable precise alignment by preventing the.

Claims (11)

진공 챔버;A vacuum chamber; 상기 진공 챔버 내의 하부에 배치되고, 기판의 픽셀 영역의 크기 및 간격에 상응하는 패턴을 가지며, 그 내부에 유기물이 채워지는 도가니;A crucible disposed under the vacuum chamber, having a pattern corresponding to the size and spacing of the pixel region of the substrate, and filled with organic matter therein; 상기 패턴의 상면을 제외한 상기 도가니 전면에 형성되며, 상기 도가니를 가열시켜 상기 도가니 내부에 채워진 상기 유기물을 상기 패턴의 상면으로 증발시키기 위한 마이크로 히터;A micro heater formed on an entire surface of the crucible except for the upper surface of the pattern, for heating the crucible to evaporate the organic material filled in the crucible to the upper surface of the pattern; 상기 도가니 상부에 배치되며, 상기 마이크로 히터에 의해 가열되어 증발되는 상기 유기물을 투과시키기 위한 투과부와, 상기 유기물을 차단시키기 위한 차단부로 구성되는 마스크; 및A mask disposed on the crucible and configured to include a transmission part for transmitting the organic material heated and evaporated by the micro heater and a blocking part for blocking the organic material; And 상기 마이크로 히터가 형성된 상기 도가니 하부에 설치되며, 상기 마스크의 투과부를 통해 증발되는 상기 유기물이 상기 기판의 픽셀 영역에 정확하게 얼라인먼트될 수 있도록 상기 도가니를 정밀하게 시프트시켜 주는 나노 스테이지를 포함하는 유기물 진공 증착 장치.Organic vapor deposition, which is installed under the crucible where the micro heater is formed, includes a nano stage for precisely shifting the crucible so that the organic material evaporated through the permeation part of the mask can be accurately aligned with the pixel region of the substrate. Device. 제1항에 있어서,The method of claim 1, 상기 도가니의 패턴은 상기 마스크의 투과부와 대응되는 위치에 형성되는 것을 특징으로 하는 유기물 진공 증착 장치.The pattern of the crucible is organic vapor deposition apparatus, characterized in that formed in a position corresponding to the transmission portion of the mask. 제1항에 있어서,The method of claim 1, 상기 마이크로 히터가 형성된 상기 도가니의 측면 및 하면에 형성되어 상기 마이크로 히터에 의해 가열된 상기 도가니를 단열시켜주기 위한 단열층을 더 포함하는 것을 특징으로 하는 유기물 진공 증착 장치.And a heat insulation layer formed on side and bottom surfaces of the crucible in which the micro heater is formed to insulate the crucible heated by the micro heater. 제3항에 있어서,The method of claim 3, 상기 단열층 안쪽에는 상기 도가니가 열에 의해 팽창 및 변형되는 것을 방지하기 위한 질소 가스가 주입되는 것을 특징으로 하는 유기물 진공 증착 장치.Organic gas deposition apparatus, characterized in that the nitrogen gas is injected into the heat insulating layer to prevent the crucible from expanding and deforming by heat. 삭제delete 삭제delete 삭제delete 삭제delete 삭제delete 삭제delete 삭제delete
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US8833294B2 (en) 2010-07-30 2014-09-16 Samsung Display Co., Ltd. Thin film deposition apparatus including patterning slit sheet and method of manufacturing organic light-emitting display device with the same
US8846547B2 (en) 2010-09-16 2014-09-30 Samsung Display Co., Ltd. Thin film deposition apparatus, method of manufacturing organic light-emitting display device by using the thin film deposition apparatus, and organic light-emitting display device manufactured by using the method
US8852687B2 (en) 2010-12-13 2014-10-07 Samsung Display Co., Ltd. Organic layer deposition apparatus
US8859043B2 (en) 2011-05-25 2014-10-14 Samsung Display Co., Ltd. Organic layer deposition apparatus and method of manufacturing organic light-emitting display device by using the same
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US9174250B2 (en) 2009-06-09 2015-11-03 Samsung Display Co., Ltd. Method and apparatus for cleaning organic deposition materials
US9206501B2 (en) 2011-08-02 2015-12-08 Samsung Display Co., Ltd. Method of manufacturing organic light-emitting display apparatus by using an organic layer deposition apparatus having stacked deposition sources
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US9306191B2 (en) 2012-10-22 2016-04-05 Samsung Display Co., Ltd. Organic light-emitting display apparatus and method of manufacturing the same
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US9453282B2 (en) 2010-03-11 2016-09-27 Samsung Display Co., Ltd. Thin film deposition apparatus
US9461277B2 (en) 2012-07-10 2016-10-04 Samsung Display Co., Ltd. Organic light emitting display apparatus
US9466647B2 (en) 2012-07-16 2016-10-11 Samsung Display Co., Ltd. Flat panel display device and method of manufacturing the same
US9512515B2 (en) 2011-07-04 2016-12-06 Samsung Display Co., Ltd. Organic layer deposition apparatus and method of manufacturing organic light-emitting display device by using the same
US9534288B2 (en) 2013-04-18 2017-01-03 Samsung Display Co., Ltd. Deposition apparatus, method of manufacturing organic light-emitting display apparatus by using same, and organic light-emitting display apparatus manufactured by using deposition apparatus
US9624580B2 (en) 2009-09-01 2017-04-18 Samsung Display Co., Ltd. Thin film deposition apparatus
US9748483B2 (en) 2011-01-12 2017-08-29 Samsung Display Co., Ltd. Deposition source and organic layer deposition apparatus including the same
US9873937B2 (en) 2009-05-22 2018-01-23 Samsung Display Co., Ltd. Thin film deposition apparatus
US10246769B2 (en) 2010-01-11 2019-04-02 Samsung Display Co., Ltd. Thin film deposition apparatus

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100862340B1 (en) * 2007-08-16 2008-10-13 세메스 주식회사 Linear evaporator for manufacturing thin film of organic light emitting diodes(oled)
US8802200B2 (en) 2009-06-09 2014-08-12 Samsung Display Co., Ltd. Method and apparatus for cleaning organic deposition materials
KR101117720B1 (en) 2009-06-25 2012-03-08 삼성모바일디스플레이주식회사 Apparatus for thin layer deposition and method of manufacturing organic light emitting device using the same
KR101127575B1 (en) 2009-08-10 2012-03-23 삼성모바일디스플레이주식회사 Apparatus for thin film deposition having a deposition blade
US8486737B2 (en) 2009-08-25 2013-07-16 Samsung Display Co., Ltd. Thin film deposition apparatus and method of manufacturing organic light-emitting display device by using the same
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KR101223723B1 (en) 2010-07-07 2013-01-18 삼성디스플레이 주식회사 Apparatus for thin layer deposition, method for manufacturing of organic light emitting display apparatus using the same, and organic light emitting display apparatus manufactured by the method
KR101678056B1 (en) 2010-09-16 2016-11-22 삼성디스플레이 주식회사 Apparatus for thin layer deposition, method for manufacturing of organic light emitting display apparatus using the same, and organic light emitting display apparatus manufactured by the method
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KR20130069037A (en) 2011-12-16 2013-06-26 삼성디스플레이 주식회사 Apparatus for thin layer deposition, method for manufacturing of organic light emitting display apparatus using the same, and organic light emitting display apparatus
US9496524B2 (en) 2012-07-10 2016-11-15 Samsung Display Co., Ltd. Organic layer deposition apparatus, method of manufacturing organic light-emitting display apparatus using the same, and organic light-emitting display apparatus manufactured using the method
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KR102013318B1 (en) 2012-09-20 2019-08-23 삼성디스플레이 주식회사 Apparatus for thin layer deposition, method for manufacturing of organic light emitting display apparatus using the same, and organic light emitting display apparatus
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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05222521A (en) * 1992-02-10 1993-08-31 Matsushita Electric Ind Co Ltd Manufacture of thin film and device therefor
KR19990009346A (en) * 1997-07-09 1999-02-05 윤종용 Electron Beam Pattern Generator Using Flat Field Emitter and Etching Method
KR20050000585A (en) * 2003-06-24 2005-01-06 주식회사 옵트론-텍 Method for manufacturing microchip
KR20050025812A (en) * 2003-09-08 2005-03-14 엘지.필립스 엘시디 주식회사 Method for molding pattern of liquid crystal display device and method for fabricating liquid crystal display device using the same
KR100553937B1 (en) 2003-11-12 2006-02-24 엘지전자 주식회사 Apparatus of deposing organic matter
KR20070013441A (en) * 2005-07-26 2007-01-31 주성엔지니어링(주) Shadow mask and method of depositing thin film using the same

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05222521A (en) * 1992-02-10 1993-08-31 Matsushita Electric Ind Co Ltd Manufacture of thin film and device therefor
KR19990009346A (en) * 1997-07-09 1999-02-05 윤종용 Electron Beam Pattern Generator Using Flat Field Emitter and Etching Method
KR20050000585A (en) * 2003-06-24 2005-01-06 주식회사 옵트론-텍 Method for manufacturing microchip
KR20050025812A (en) * 2003-09-08 2005-03-14 엘지.필립스 엘시디 주식회사 Method for molding pattern of liquid crystal display device and method for fabricating liquid crystal display device using the same
KR100553937B1 (en) 2003-11-12 2006-02-24 엘지전자 주식회사 Apparatus of deposing organic matter
KR20070013441A (en) * 2005-07-26 2007-01-31 주성엔지니어링(주) Shadow mask and method of depositing thin film using the same

Cited By (51)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11920233B2 (en) 2009-05-22 2024-03-05 Samsung Display Co., Ltd. Thin film deposition apparatus
US11624107B2 (en) 2009-05-22 2023-04-11 Samsung Display Co., Ltd. Thin film deposition apparatus
US10689746B2 (en) 2009-05-22 2020-06-23 Samsung Display Co., Ltd. Thin film deposition apparatus
US8916237B2 (en) 2009-05-22 2014-12-23 Samsung Display Co., Ltd. Thin film deposition apparatus and method of depositing thin film
US9873937B2 (en) 2009-05-22 2018-01-23 Samsung Display Co., Ltd. Thin film deposition apparatus
US8882920B2 (en) 2009-06-05 2014-11-11 Samsung Display Co., Ltd. Thin film deposition apparatus
US8882921B2 (en) 2009-06-08 2014-11-11 Samsung Display Co., Ltd. Thin film deposition apparatus
US9174250B2 (en) 2009-06-09 2015-11-03 Samsung Display Co., Ltd. Method and apparatus for cleaning organic deposition materials
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US8921831B2 (en) 2009-08-24 2014-12-30 Samsung Display Co., Ltd. Thin film deposition apparatus, method of manufacturing organic light-emitting display device by using the apparatus, and organic light-emitting display device manufactured by using the method
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US8852687B2 (en) 2010-12-13 2014-10-07 Samsung Display Co., Ltd. Organic layer deposition apparatus
US9748483B2 (en) 2011-01-12 2017-08-29 Samsung Display Co., Ltd. Deposition source and organic layer deposition apparatus including the same
US9076982B2 (en) 2011-05-25 2015-07-07 Samsung Display Co., Ltd. Patterning slit sheet assembly, organic layer deposition apparatus, method of manufacturing organic light-emitting display apparatus, and the organic light-emitting display apparatus
US8859043B2 (en) 2011-05-25 2014-10-14 Samsung Display Co., Ltd. Organic layer deposition apparatus and method of manufacturing organic light-emitting display device by using the same
US9249493B2 (en) 2011-05-25 2016-02-02 Samsung Display Co., Ltd. Organic layer deposition apparatus and method of manufacturing organic light-emitting display apparatus by using the same
US8906731B2 (en) 2011-05-27 2014-12-09 Samsung Display Co., Ltd. Patterning slit sheet assembly, organic layer deposition apparatus, method of manufacturing organic light-emitting display apparatus, and the organic light-emitting display apparatus
US8951610B2 (en) 2011-07-04 2015-02-10 Samsung Display Co., Ltd. Organic layer deposition apparatus
US9512515B2 (en) 2011-07-04 2016-12-06 Samsung Display Co., Ltd. Organic layer deposition apparatus and method of manufacturing organic light-emitting display device by using the same
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US9150952B2 (en) 2011-07-19 2015-10-06 Samsung Display Co., Ltd. Deposition source and deposition apparatus including the same
US9206501B2 (en) 2011-08-02 2015-12-08 Samsung Display Co., Ltd. Method of manufacturing organic light-emitting display apparatus by using an organic layer deposition apparatus having stacked deposition sources
US9260778B2 (en) 2012-06-22 2016-02-16 Samsung Display Co., Ltd. Organic layer deposition apparatus, method of manufacturing organic light-emitting display apparatus using the same, and organic light-emitting display apparatus manufactured using the method
US8956697B2 (en) 2012-07-10 2015-02-17 Samsung Display Co., Ltd. Method of manufacturing organic light-emitting display apparatus and organic light-emitting display apparatus manufactured by using the method
US9461277B2 (en) 2012-07-10 2016-10-04 Samsung Display Co., Ltd. Organic light emitting display apparatus
US9466647B2 (en) 2012-07-16 2016-10-11 Samsung Display Co., Ltd. Flat panel display device and method of manufacturing the same
US9012258B2 (en) 2012-09-24 2015-04-21 Samsung Display Co., Ltd. Method of manufacturing an organic light-emitting display apparatus using at least two deposition units
US9306191B2 (en) 2012-10-22 2016-04-05 Samsung Display Co., Ltd. Organic light-emitting display apparatus and method of manufacturing the same
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US9136476B2 (en) 2013-03-20 2015-09-15 Samsung Display Co., Ltd. Method of manufacturing organic light-emitting display apparatus, and organic light-emitting display apparatus manufactured by the method
US8993360B2 (en) 2013-03-29 2015-03-31 Samsung Display Co., Ltd. Deposition apparatus, method of manufacturing organic light emitting display apparatus, and organic light emitting display apparatus
US9534288B2 (en) 2013-04-18 2017-01-03 Samsung Display Co., Ltd. Deposition apparatus, method of manufacturing organic light-emitting display apparatus by using same, and organic light-emitting display apparatus manufactured by using deposition apparatus
US9040330B2 (en) 2013-04-18 2015-05-26 Samsung Display Co., Ltd. Method of manufacturing organic light-emitting display apparatus
US8962360B2 (en) 2013-06-17 2015-02-24 Samsung Display Co., Ltd. Organic layer deposition apparatus and method of manufacturing organic light-emitting display device by using the organic layer deposition apparatus

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