KR100790274B1 - 반도체 웨이퍼 세정설비 - Google Patents
반도체 웨이퍼 세정설비 Download PDFInfo
- Publication number
- KR100790274B1 KR100790274B1 KR1020030094779A KR20030094779A KR100790274B1 KR 100790274 B1 KR100790274 B1 KR 100790274B1 KR 1020030094779 A KR1020030094779 A KR 1020030094779A KR 20030094779 A KR20030094779 A KR 20030094779A KR 100790274 B1 KR100790274 B1 KR 100790274B1
- Authority
- KR
- South Korea
- Prior art keywords
- cylinder
- coating film
- outer shell
- semiconductor wafer
- hole
- Prior art date
Links
- 238000004140 cleaning Methods 0.000 title claims abstract description 27
- 239000004065 semiconductor Substances 0.000 title claims abstract description 19
- 239000000126 substance Substances 0.000 claims abstract description 33
- 239000011248 coating agent Substances 0.000 claims abstract description 29
- 238000000576 coating method Methods 0.000 claims abstract description 29
- 239000011347 resin Substances 0.000 claims abstract description 10
- 229920005989 resin Polymers 0.000 claims abstract description 10
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims abstract description 9
- 239000011737 fluorine Substances 0.000 claims abstract description 9
- 229910052731 fluorine Inorganic materials 0.000 claims abstract description 9
- 238000001514 detection method Methods 0.000 claims description 6
- 230000008602 contraction Effects 0.000 abstract description 3
- 238000000034 method Methods 0.000 description 19
- 230000008569 process Effects 0.000 description 15
- 238000005086 pumping Methods 0.000 description 5
- 238000001311 chemical methods and process Methods 0.000 description 4
- 238000001035 drying Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 229910021642 ultra pure water Inorganic materials 0.000 description 3
- 239000012498 ultrapure water Substances 0.000 description 3
- 229910001018 Cast iron Inorganic materials 0.000 description 2
- 239000011247 coating layer Substances 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000005468 ion implantation Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 230000005856 abnormality Effects 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000012993 chemical processing Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 229940079593 drug Drugs 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 description 1
- 238000005755 formation reaction Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229940058401 polytetrafluoroethylene Drugs 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
- 230000032258 transport Effects 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
Description
Claims (3)
- 화학약품을 세정설비의 웨이퍼로 공급하기 위해 원통형의 외피, 외피 내주면에 코팅된 불소수지코팅막을 포함하는 실린더;상기 실린더의 외피에 형성되고 실린더 내부 불소수지 코팅막으로 연통되는 구멍을 포함하는 반도체 웨이퍼 세정설비.
- 제 1 항에 있어서, 상기 구멍에 연결되어 불소수지 코팅막 파손시 구멍을 통해 새나오는 화학용액을 검출하기 위한 검출수단을 더욱 포함하는 것을 특징으로 하는 반도체 웨이퍼 세정설비.
- 제 2 항에 있어서, 상기 검출수단은 실린더의 외측에서 상기 구멍에 연결설치되어 구멍으로부터 새나오는 화학약품이 흘러나가는 튜브와, 상기 튜브 일측에 설치되어 화학약품 유무를 검출하기 위한 정전용량센서를 포함하는 것을 특징으로 하는 반도체 웨이퍼 세정설비.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020030094779A KR100790274B1 (ko) | 2003-12-22 | 2003-12-22 | 반도체 웨이퍼 세정설비 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020030094779A KR100790274B1 (ko) | 2003-12-22 | 2003-12-22 | 반도체 웨이퍼 세정설비 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20050063380A KR20050063380A (ko) | 2005-06-28 |
KR100790274B1 true KR100790274B1 (ko) | 2007-12-31 |
Family
ID=37255238
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020030094779A KR100790274B1 (ko) | 2003-12-22 | 2003-12-22 | 반도체 웨이퍼 세정설비 |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR100790274B1 (ko) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20000047507A (ko) * | 1998-12-09 | 2000-07-25 | 이시카와 타다시 | 압축기의 피스톤 및 그 피스톤의 코팅방법 |
KR20020012484A (ko) * | 2000-08-07 | 2002-02-16 | 이시카와 신이치로우 | 다기통용의 헤드 개스킷 |
KR20190000860U (ko) * | 2017-09-27 | 2019-04-04 | 위야오 화시 일렉트로닉 테크놀로지 컴퍼니., 리미티드. | 셀카봉 |
-
2003
- 2003-12-22 KR KR1020030094779A patent/KR100790274B1/ko not_active IP Right Cessation
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20000047507A (ko) * | 1998-12-09 | 2000-07-25 | 이시카와 타다시 | 압축기의 피스톤 및 그 피스톤의 코팅방법 |
KR20020012484A (ko) * | 2000-08-07 | 2002-02-16 | 이시카와 신이치로우 | 다기통용의 헤드 개스킷 |
KR20190000860U (ko) * | 2017-09-27 | 2019-04-04 | 위야오 화시 일렉트로닉 테크놀로지 컴퍼니., 리미티드. | 셀카봉 |
Also Published As
Publication number | Publication date |
---|---|
KR20050063380A (ko) | 2005-06-28 |
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