KR100799614B1 - Mems module package having heat spreading function - Google Patents

Abstract

Lower substrate; A MEMS device mounted on the lower substrate; A driver IC driving the MEMS device and mounted on the lower substrate around the MEMS device; A sealing cap for receiving the MEMS element and the driver IC, the sealing cap coupled to the lower substrate; And an external optical module package that combines the lower substrate with the external light module package that emits predetermined light to the MEMS device and processes the reflected light, and includes a thermally conductive material formed of a thermally conductive material. Is presented. The MEMS module package having a heat dissipation function according to the present invention has an effect of dissipating heat generated in each device through an effective heat dissipation structure.

MEMS, light modulator, heat dissipation, thermally conductive material.

Description

Mems module package having heat spreading function

1 is a cross-sectional view of a MEMS module package using a sealing cap according to the prior art.

2 is a perspective view of a diffractive optical modulator module using a piezoelectric body applicable to a preferred embodiment of the present invention.

3 is a plan view of a diffractive light modulator array applicable to a preferred embodiment of the present invention.

4 is a schematic diagram of an image generated on a screen by a diffractive light modulator array applicable to a preferred embodiment of the present invention.

5 is a cross-sectional view of an optical modulator module package having a heat dissipation function according to a first preferred embodiment of the present invention.

6 is a cross-sectional view of an optical modulator module package having a heat dissipation function according to a second preferred embodiment of the present invention.

7 is a cross-sectional view of an optical modulator module package having a heat dissipation function according to a third preferred embodiment of the present invention.

<Explanation of symbols for the main parts of the drawings>

510: lower substrate 520: first adhesive

530: sealing cap 540: light modulator

550 (1), 550 (2): Driver IC 560 (1), 560 (2): Second Adhesive

570: printed circuit board 580: third adhesive

585: passivation layer 590 (1), 590 (2): UV bond

505 (1), 505 (2): thermally conductive material 575 (1), 575 (2): holder

The present invention relates to a semiconductor package, and more particularly, to a MEMS module package having a heat dissipation function and a method of manufacturing the same.

MEMS (Micro Electro Mechanical System) is a technology that forms three-dimensional structures on silicon substrates using semiconductor manufacturing technology. The fields of application of MEMS are very diverse, and examples thereof include various sensors for vehicles, inkjet printer heads, HDD magnetic heads, and portable communication devices that are rapidly progressing in miniaturization and high functionality. The MEMS element has an injured portion on the substrate so as to be mechanically operated. Hereinafter, a description will be given of the optical modulator in the MEMS structure. An optical modulator is a circuit or device that transmits a signal to light (optical modulation) in a transmitter when the optical medium or free space of an optical frequency band is used as a transmission medium. Optical modulators are used in the fields of optical memory, optical display, printer, optical interconnection, hologram, etc., and researches on the development of display devices using the same are being actively conducted.

The optical modulator element is largely divided into a direct method of directly controlling the on / off of light and an indirect method using reflection and diffraction, and the indirect method may be divided into an electrostatic method and a piezoelectric method. Here, the optical modulator element comprises a plurality of regularly spaced deformable reflective ribbons having reflective surface portions and suspended above the substrate. Therefore, the light reflected from the reflective surface and the reflective ribbon is diffracted to emit light corresponding to the signal.

1 is a cross-sectional view of a MEMS module package using a sealing cap according to the prior art. Referring to FIG. 1, the lower substrate 110, the first adhesive 120, the sealing cap 130, the MEMS element 140, the driver ICs 150 (1, 150 (2)), and the second adhesive 160 (1), 160 (2), MEMS module packages comprising printed circuit board 170, third adhesive 180, passivation layer 185 and UV bonds 190 (1), 190 (2) And a holder 175 (1) and 175 (2) to attach to one side of an optical module package including a light source 193, a lens system 195 with a predetermined lens, and a polygon mirror 197.

The lower substrate 110 transmits incident light incident to the MEMS element 140 and reflected and diffracted light emitted from the MEMS element 140. The first adhesive 120, the second adhesive 160 (1, 160 (2), and the third adhesive 180 are each sealed cap 130, lower substrate 110, MEMS element 140, and driver IC. 150 (1), 150 (2), the lower substrate 110, the printed circuit board 170, and the sealing cap 130 are bonded to each other. The light emitted from the light source 193 of the optical module package is reflected and diffracted by the MEMS element 140 via the predetermined lens system 195, and is scanned by the polygon mirror 197 and emitted.

Currently, the cap using the sealing cap 130 to reduce the failure rate and improve the reliability and workability generated during sealing of the micro mirror array module (Micro Mirror Array Module) such as the MEMS device 140 according to the prior art The method of cap sealing is used. That is, by sealing using the sealing cap 130 to reduce the penetration of moisture to improve the performance of the device. However, due to the structure that seals the portion to generate heat may cause a problem that the heat release becomes difficult. Since the difficulty of heat dissipation may cause a direct or indirect operation failure in driving the optical modulator, a heat dissipation structure is required to solve this problem.

The present invention provides a MEMS module package having a heat dissipation function capable of dissipating heat generated in each device through an effective heat dissipation structure.

In addition, the present invention provides a MEMS module package having a heat dissipation function capable of dissipating heat generated using a thermally conductive material.

In addition, the present invention provides a MEMS module package having a heat dissipation function that can effectively dissipate heat generated in the device by variously forming a heat dissipation structure.

In addition, the present invention provides a MEMS module package having a simple heat dissipation function by using a liquid thermally conductive material.

In addition, the present invention provides a MEMS module package having a heat dissipation function having a structure capable of dissipating heat generated in each device through a heat sink combined with a thermally conductive material.

Technical problems other than the present invention will be easily understood through the following description.

According to an aspect of the invention, the lower substrate; A MEMS device mounted on the lower substrate; A driver IC driving the MEMS device and mounted on the lower substrate around the MEMS device; A sealing cap for receiving the MEMS element and the driver IC, the sealing cap coupled to the lower substrate; And an external optical module package that combines the lower substrate with the external light module package that emits predetermined light to the MEMS device and processes the reflected light, and includes a thermally conductive material formed of a thermally conductive material. Can be provided.

Here, the thermally conductive material may be a thermal paste or a thermal pad.

According to another aspect of the invention, the lower substrate; A MEMS device mounted on the lower substrate; A driver IC driving the MEMS device and mounted on the lower substrate around the MEMS device; A sealing cap for receiving the MEMS element and the driver IC, the sealing cap coupled to the lower substrate; A first thermally conductive material coupled to the lower substrate with an external optical module package that emits predetermined light to the MEMS device and then processes reflected light; A case having a groove accommodating the sealing cap and coupled to the lower substrate; And a heat dissipation function that combines the case and the sealing cap and includes a second heat conductive material formed of a heat conductive material.

Here, the case may be formed of a metal.

Here, the second thermally conductive material may be a solidified epoxy resin or grease.

Further, according to another aspect of the invention, the lower substrate; A MEMS device mounted on the lower substrate; A driver IC driving the MEMS device and mounted on the lower substrate around the MEMS device; A sealing cap for receiving the MEMS element and the driver IC, the sealing cap coupled to the lower substrate; A holder coupled to a portion of one surface of the lower substrate by a bonding material, and the other surface of the holder coupled to one side of an external optical module package for processing reflected light after emitting predetermined light to the MEMS device; And a thermally conductive material positioned between the lower substrate and the holder at a side of the bonding material, the thermally conductive material being formed of a thermally conductive material.

Here, the bonding material may be a UV bond.

Here, one surface of the holder coupled to the external optical module package may have a pin shape.

Here, the thermally conductive material may be a solidified epoxy resin or grease.

Here, the lower substrate may be formed of a transparent material.

The printed circuit board may further include a printed circuit board positioned on the sealing cap and transmitting an electrical signal to the driver IC.

The printed circuit board may further include a printed circuit board positioned under the lower substrate and transmitting an electrical signal to the driver IC.

Here, the MEMS device may be an optical modulator that reflects and diffracts light modulated according to the driving signal received from the driver IC.

Hereinafter, a preferred embodiment of a MEMS module package having a heat dissipation function according to the present invention will be described in detail with reference to the accompanying drawings. Reference numerals will be omitted and duplicate description thereof will be omitted. In the following description of the present invention, if it is determined that the detailed description of the related known technology may unnecessarily obscure the subject matter of the present invention, the detailed description thereof will be omitted. Prior to describing the preferred embodiments of the present invention in detail, the light modulator applied to the present invention will be described first.

Optical modulators are largely divided into a direct method of directly controlling the on / off of light and an indirect method using reflection and diffraction, and the indirect method may be divided into an electrostatic method and a piezoelectric method. Herein, the optical modulator is applicable to the present invention regardless of the manner in which the optical modulator is driven. For example, the electrostatically driven grating light modulator disclosed in US Pat. No. 5,311,360 includes a plurality of uniformly spaced deformable reflective ribbons having reflective surface portions and suspended above a substrate. An insulating layer is deposited on the silicon substrate. Next, the deposition process of the sacrificial silicon dioxide film and the silicon nitride film is followed.

The nitride film is patterned from the ribbon and a portion of the silicon dioxide layer is etched so that the ribbon is held on the oxide spacer layer by the nitride frame. To modulate light with a single wavelength [lambda] 0, the modulator is designed such that the thickness of the ribbon and the thickness of the oxide spacers are [lambda] 0/4.

The lattice amplitude of this modulator, defined by the vertical distance d between the reflective surface on the ribbon and the reflective surface of the substrate, is the conduction of the ribbon (reflective surface of the ribbon serving as the first electrode) and the substrate (substrate serving as the second electrode). Film). Hereinafter, a case in which a piezoelectric diffraction type optical modulator is applied to an embodiment of the present invention will be described.

2 is a perspective view of a micromirror included in a diffractive light modulator element using a piezoelectric element among indirect light modulators applicable to the present invention. Referring to FIG. 2, an optical modulator 100 including a substrate 210, an insulating layer 220, a sacrificial layer 230, a ribbon structure 240, and a piezoelectric material 250 is illustrated.

The substrate 210 is a commonly used semiconductor substrate, and the insulating layer 220 is deposited as an etch stop layer, and an etchant for etching a material used as a sacrificial layer, where the etchant is an etching gas or an etching solution. Solution). The insulating layer 220 may be coated with a reflective layer 220 (a) to reflect incident light.

The sacrificial layer 230 supports the ribbon structure 240 at both sides such that the ribbon structure 240 is spaced apart from the insulating layer 220 at regular intervals, and forms a space at the center.

As described above, the ribbon structure 240 causes diffraction and interference of incident light to optically modulate the signal. The shape of the ribbon structure 240 may be configured in the form of a plurality of ribbons according to the electrostatic method, or may be provided with a plurality of open holes in the center of the ribbon according to the piezoelectric method. In addition, the piezoelectric member 250 controls the ribbon structure 240 to move up and down in accordance with the degree of contraction or expansion of up and down or left and right caused by the voltage difference between the upper and lower electrodes.

For example, when the wavelength of light is λ, the insulating layer 220 in which the ribbon structure 240 and the lower reflective layer 220 (a) are formed in the state in which the light modulator is not deformed (no voltage is applied) is formed. The interval between is equal to λ / 2. Therefore, in the case of zero-order diffracted light (reflected light), the total path difference between the light reflected from the ribbon structure 240 and the light reflected from the insulating layer 220 is equal to λ, so that constructive interference causes maximum light intensity. Here, in the case of the + 1st and -1st diffracted light, the light intensity has a minimum value due to destructive interference.

In addition, when an appropriate voltage is applied to the piezoelectric member 250, the distance between the ribbon structure 240 and the insulating layer 220 on which the lower reflective layer 220 (a) is formed is equal to λ / 4. Therefore, in the case of the zero-order diffracted light, the total path difference between the light reflected from the ribbon structure 240 and the insulating layer 220 is equal to λ / 2, so that the interference is cancelled and the light intensity has a minimum value. Here, in the case of + 1st and -1st diffraction light, the intensity of light has a maximum value due to constructive interference. As a result of this interference, the light modulator can adjust the amount of reflected or diffracted light to carry the signal on the light. In the above, the case in which the distance between the ribbon structure 240 and the insulating layer 220 on which the lower reflective layer 220 (a) is formed is λ / 2 has been described. However, the intensity of interference caused by diffraction and reflection of incident light can be adjusted. Naturally, various embodiments capable of driving at intervals can be applied to the present invention.

Referring to FIG. 3, the optical modulator includes a first pixel (pixel # 1), a second pixel (pixel # 2),. And n micromirrors 100-1, 100-2,..., 100-n that are responsible for the n-th pixel (pixel #n). The optical modulator is responsible for the image information of the one-dimensional image of the vertical scanning line or the horizontal scanning line (assuming that the vertical scanning line or the horizontal scanning line is composed of n pixels), and each micromirror 100-1, 100-2. , ..., 100-n) is in charge of any one of the n pixels constituting the vertical scan line or the horizontal scan line. Thus, the reflected and diffracted light in each micro mirror is then projected on the screen as a two dimensional image by the light scanning device. For example, in the case of VGA 640 * 480 resolution, 640 modulations are performed on one side of an optical scanning device (not shown) for 480 vertical pixels, thereby generating one frame per screen of the optical scanning device. The optical scanning device may be a polygon mirror, a rotating bar, a galvano mirror, or the like.

Referring to FIG. 4, when n micro mirrors 100-1, 100-2,..., 100-n are arranged vertically, a screen 410 generated by scanning the screen 400 horizontally by an optical scanning device. -1, 410-2, 410-3, 410-4, ..., 410- (n-3), 410- (n-2), 410- (n-1), 410-n) are shown. Here, the scanning direction is shown in a left to right direction (arrow direction), but it is obvious that the image can be scanned in the reverse direction.

In the above description, a side view and a plan view of an optical modulator generally used in a MEMS module package having a heat dissipation function have been described. Hereinafter, the MEMS module package having a heat dissipation function according to the present invention will be described in detail with reference to the accompanying drawings. The description will be based on an example. Embodiments according to the present invention are largely divided into three, which will be described in turn below.

5 is a cross-sectional view of a MEMS module package having a heat dissipation function according to a first embodiment of the present invention. Referring to FIG. 5, the lower substrate 510, the first adhesive 520, the sealing cap 530, the light modulator 540, the driver ICs 550 (1, 550 (2)), and the second adhesive 560 (1), 560 (2), MEMS module package including printed circuit board 570, third adhesive 580, passivation layer 585 and UV bond 590 (1), 590 (2) ), Through thermally conductive materials 505 (1), 505 (2), and holders 575 (1), 575 (2) to one side of an optical module package (not shown).

The lower substrate 510 transmits incident light incident to the light modulator 540 and reflected and diffracted light emitted from the light modulator 540. Accordingly, the lower substrate 510 may be formed of a transparent material, for example, glass, or a predetermined hole may be formed in a portion where the light modulator 540 is mounted to transmit incident light, reflected light, and diffracted light. The first adhesive 520, the second adhesive 560 (1), 560 (2), and the third adhesive 580 are each sealed cap 530, lower substrate 510, light modulator 540, and driver IC. 550 (1) and 550 (2), the lower substrate 510, the printed circuit board 570, and the sealing cap 530 are adhered to each other. Here, the material of the sealing cap 530 may be a metal, for example, Invar (Covar), silver, copper, and the like. Here, when the material of the sealing cap 530 is Kovar or Invar, the Kovar or Invar has the same or similar thermal expansion coefficient as that of the optical modulator 540 because the thermal expansion coefficient is relatively small. can do. Herein, the thermal expansion coefficient of the sealing cap 530 is 5.86 ppm / 占 폚 and Invar is 1.3 ppm / 占 폚.

The second adhesives 560 (1) and 560 (2) may be various materials, for example, an anisotropic conductive film (ACF) or an anisotropic conductive paste (ACP). In this case, the driver IC 550 (1) and the optical modulator 540 may be coupled to the lower substrate 510 using one second adhesive 560 (1). In addition, the second adhesives 560 (1) and 560 (2) are adhesives for sealing portions where the sealing cap 530 and the lower substrate 510 are bonded to each other. For example, a molding resin such as an epoxy resin may be used. Can be.

The printed circuit board 570 transmits an electrical signal capable of driving the optical modulator 540 to the drive ICs 550 (1) and 550 (2). Here, the printed circuit board 570 may be stacked below the upper or lower substrate 510 of the sealing cap 530. When the printed circuit board 570 is positioned below the lower substrate 510, a predetermined hole is formed in a portion where the light modulator 540 is mounted to transmit incident light, reflected light, and diffracted light. Can be. The passivation layer 585 protects the MEMS module package according to the embodiment of the present invention, and also includes a conductive line that can be electrically connected between the printed circuit board 570 and the lower substrate 510, thereby providing a printed circuit board 570. ) May be transmitted to the driver IC 550 (1) and the optical modulator 540 through the lower substrate 510.

UV bonds 590 (1) and 590 (2) are examples of bonding materials, such that the lower substrate 510 is coupled to holders 575 (1) and 575 (2) attached to one side of the optical module package. In addition, the light emitted from the optical module package can be moved to be reflected and diffracted to a predetermined position so that the tuning process can be performed. Thus, the UV bonds 590 (1) and 590 (2) can engage the lower substrate 510 at a portion of one side of the holder 575 (1) and 575 (2) attached to one side of the optical module package. have. Of course, any material other than the UV bonds 590 (1) and 590 (2) may be applied to the present invention as long as the material performs this function. For example, as the bonding form, various materials such as a bonding pad or a bonding paste may be used.

The thermal interface materials 505 (1) and 505 (2) discharge heat generated from the MEMS module package according to the embodiment of the present invention through the lower substrate 510. That is, the thermally conductive materials 505 (1) and 505 (2) combine the lower substrate 510 with an external optical module package that emits predetermined light to the light modulator 540 and then processes reflected light. It is formed of a thermally conductive material. Therefore, heat generated in the MEMS module package may be emitted to the outside or to the external optical module package through the lower substrate 510. Here, the thermally conductive materials 505 (1) and 505 (2) may be thermal conductive adhesive films or thermal pads such as thermal tapes. In this case, instead of the separate UV bonds 590 (1) and 590 (2), the thermally conductive materials 505 (1) and 505 (2) are attached, thereby simplifying the manufacturing process. According to another embodiment, the thermally conductive materials 505 (1) and 505 (2) may be thermally conductive adhesives or thermally conductive compounds, such as thermal paste or thermal It could be Grease. In this case, the thermally conductive materials 505 (1) and 505 (2) are liquid materials and are injected and solidified between the lower substrate 510 and the holders 575 (1) and 575 (2) to perform a heat conduction function. can do. Injecting the liquid material has an advantage that the process of forming the thermally conductive materials 505 (1) and 505 (2) can be simplified. Here, in general, the thermal conductivity (W / mK) of air is about 0.03, and in the case of general adhesive epoxy or grease, the thermal conductivity is about 0.2 to 1, but the thermally conductive materials 505 (1) and 505 (2) are In addition to bonding between heat-generating material and heat releasing material (Heat Sink or Heat Spreader), it also serves to transfer heat from the heat source and has higher thermal conductivity than general adhesive materials (2 ~ 7 depending on the type). Formed)

The MEMS module package is manufactured through the following steps. That is, the optical modulator 540 is mounted on the lower substrate 510, and the driver ICs 550 (1) and 550 (2) for driving the optical modulator 540 are disposed around the optical modulator 540. 510. Thereafter, a predetermined grooved sealing cap 530 is coupled to the lower substrate 510 to receive the optical modulator 540 and the driver ICs 550 (1) and 550 (2), and an upper portion of the sealing cap 530. After bonding the printed circuit board 570 to the passivation layer 585 is formed to protect the package. Thereafter, the formed package is bonded to holders 575 (1) and 575 (2) attached to one side of an optical module package (not shown) by using UV bonds 590 (1) and 590 (2), MEMS module according to an embodiment of the present invention by injecting and solidifying a thermally conductive material (505 (1), 505 (2)) between the lower substrate 510 and the holders (575 (1), 575 (2)) The package can be manufactured.

In addition, the optical module package may include a light source (not shown), a controller (not shown), a lens (not shown), and a polygon mirror (not shown), and the light emitted from the light source may pass through an external screen through a predetermined optical path. Not shown). Hereinafter, a case where the optical module package is used in a mobile projector using an optical modulator will be described.

The light source is a device that generates the laser beam reflected and diffracted by the light modulator 540. Here, the light source simultaneously generates a laser beam in a vertical direction, and the laser beam implements a 2D image by a rotating polygon mirror. According to another embodiment, the light source may be implemented by a laser or a laser diode, and the light source is turned on / off according to the driving control of the controller to generate a laser beam.

The controller performs on / off control of the light source, drive control of the polygon mirror, and light modulator control. The lens focuses the laser beam generated from the light source in the direction of the axis of rotation of the polygon mirror.

The polygon mirror is turned on / off according to the driving control of the controller, and rotates at a predetermined rotation speed during driving. Such a polygon mirror is implemented as a polygon to reflect a beam incident through each face during rotation.

The polygon mirror has a motor (not shown) capable of rotating in one direction or in both directions, and reflects the beam scanned through the lens in the direction of the screen while rotating by the motor.

6 is a cross-sectional view of an optical modulator module package having a heat dissipation function according to a second preferred embodiment of the present invention. Referring to FIG. 6, the lower substrate 610, the first adhesive 620, the sealing cap 630, the light modulator 640, the driver ICs 650 (1, 650 (2)), and the second adhesive 660. (1), 660 (2)) MEMS module package including printed circuit board 670, third adhesive 680, passivation layer 685 and UV bond 690 (1), 690 (2) ), Thermally conductive materials 605 (1), 605 (2), and holders 675 (1), 675 (2) to one side of the optical module package. The differences from the first embodiment described above will be mainly described.

Holders 675 (1) and 675 (2) attached to one side of the optical module package may have a shape for performing a function of a heat sink. That is, the holders 675 (1) and 675 (2) have a fin type, where the fin type has a plurality of holes or protrusions. For example, when viewed from one side, the shape of the holders 675 (1) and 675 (2) may have a plurality of bent portions. According to another embodiment, a plurality of holes or protrusions are not shown when viewed from one side, but a plurality of holes may be formed when viewed from a plane. Since the area in contact with the outside air and the like can be increased through the shape, the holders 675 (1) and 675 (2) have an advantage of efficiently dissipating heat transferred from the lower substrate 610.

7 is a cross-sectional view of an optical modulator module package having a heat dissipation function according to a third preferred embodiment of the present invention. Referring to FIG. 7, the lower substrate 710, the first adhesive 720, the sealing cap 730, the light modulator 740, the driver ICs 750 (1) and 750 (2), and the second adhesive 760. MEMS module package comprising (1), 760 (2), printed circuit board 770, third adhesive 780, passivation layer 785, case 787, and second thermally conductive material 787 Optical module package via temporary and UV bonds 790 (1), 790 (2), first thermally conductive material 705 (1), 705 (2) and holders 775 (1), 775 (2) It is attached to one side of the. The differences from the first embodiment described above will be mainly described.

The case 787 is formed with a groove for accommodating the sealing cap 730 and has a structure for engaging with the lower substrate 710. The case 787 may be formed of a metal, and may be a material having a good heat transfer function. As described above, the first thermally conductive materials 705 (1) and 705 (2) may be disposed between the lower substrate 710 and the holders 775 (1) and 775 (2) attached to one side of the optical module package at one side. The heat transfer is performed, and the second heat conductive material 787 is formed with a groove for receiving the sealing cap 730 at the other side and performs heat transfer between the case 787 coupled with the lower substrate 710. Accordingly, the second thermally conductive material 787 transfers heat received from the lower substrate 710 to the case 787, thereby allowing the heat generated from the MEMS module package to be released in various ways.

The present invention is not limited to the above embodiments, and many variations are possible by those skilled in the art within the spirit of the present invention.

As described above, the MEMS module package having a heat dissipation function according to the present invention has an effect of dissipating heat generated in each device through an effective heat dissipation structure.

In addition, the MEMS module package having a heat dissipation function according to the present invention has an effect of dissipating heat generated using a thermally conductive material.

In addition, the MEMS module package having a heat dissipation function according to the present invention has an effect of effectively dissipating heat generated in the device by forming a variety of heat dissipation structure.

In addition, the MEMS module package having a heat release function according to the present invention has a simple manufacturing process by using a liquid thermally conductive material.

In addition, the MEMS module package having a heat dissipation function according to the present invention has an effect of dissipating heat generated in each device through a heat sink combined with a thermally conductive material.

Although the above has been described with reference to a preferred embodiment of the present invention, those of ordinary skill in the art to the present invention without departing from the spirit and scope of the present invention and equivalents thereof described in the claims below It will be understood that various modifications and changes can be made.

Claims (13)

Lower substrate; A MEMS device mounted on the lower substrate; A driver IC driving the MEMS device and mounted on the lower substrate around the MEMS device; A sealing cap for receiving the MEMS element and the driver IC, the sealing cap coupled to the lower substrate; And The MEMS module package having a heat dissipation function comprising a thermally conductive material formed of a thermally conductive material, for coupling the lower substrate with an external optical module package that emits predetermined light to the MEMS device and then processes reflected light. The method of claim 1, And the thermally conductive material is a thermal paste or a thermal pad. Lower substrate; A MEMS device mounted on the lower substrate; A driver IC driving the MEMS device and mounted on the lower substrate around the MEMS device; A sealing cap for receiving the MEMS element and the driver IC, the sealing cap coupled to the lower substrate; A first thermally conductive material coupled to the lower substrate with an external optical module package that emits predetermined light to the MEMS device and then processes reflected light; A case having a groove accommodating the sealing cap and coupled to the lower substrate; And A MEMS module package having a heat dissipation function for coupling the case and the sealing cap and including a second thermally conductive material formed of a thermally conductive material. The method of claim 3, The casing module package having a heat release function, characterized in that the case is formed of a metal. The method of claim 3, The second thermally conductive material is a MEMS module package having a heat release function, characterized in that the solidified epoxy resin or grease (Grease) in the liquid phase. Lower substrate; A MEMS device mounted on the lower substrate; A driver IC driving the MEMS device and mounted on the lower substrate around the MEMS device; A sealing cap for receiving the MEMS element and the driver IC, the sealing cap coupled to the lower substrate; A holder coupled to a portion of one surface of the lower substrate by a bonding material, and the other surface of the holder coupled to one side of an external optical module package for processing reflected light after emitting predetermined light to the MEMS device; And A MEMS module package having a heat dissipation function located between the lower substrate and the holder on the side of the bonding material, the thermal conductive material formed of a thermally conductive material. The method of claim 6, The bonding material is a MEMS module package having a heat release function, characterized in that the UV bond. The method of claim 6, One surface of the holder coupled to the external optical module package has a heat dissipation function, characterized in that the pin module shape. The method according to claim 1 or 6, The thermally conductive material is a MEMS module package having a heat release function, characterized in that the solidified epoxy resin or grease in the liquid phase. The method according to any one of claims 1, 3 and 6, The lower substrate is a MEMS module package having a heat release function, characterized in that formed of a transparent material. The method according to any one of claims 1, 3 and 6, The MEMS module package having a heat dissipation function, the printed circuit board further comprising a printed circuit board positioned on the sealing cap and transmitting an electrical signal to the driver IC. The method according to any one of claims 1, 3 and 6, The MEMS module package having a heat dissipation function under the lower substrate, further comprising a printed circuit board for transmitting an electrical signal to the driver IC. The method according to any one of claims 1, 3 and 6, And the MEMS device is an optical modulator for reflecting and diffracting light modulated according to a drive signal received from the driver IC.

Images