KR100756727B1 - Gas delivery system - Google Patents
Gas delivery system Download PDFInfo
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- KR100756727B1 KR100756727B1 KR1020007012274A KR20007012274A KR100756727B1 KR 100756727 B1 KR100756727 B1 KR 100756727B1 KR 1020007012274 A KR1020007012274 A KR 1020007012274A KR 20007012274 A KR20007012274 A KR 20007012274A KR 100756727 B1 KR100756727 B1 KR 100756727B1
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- Prior art keywords
- gas
- process chamber
- substrate
- delivery system
- etching
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- 239000007789 gas Substances 0.000 claims abstract description 83
- 238000000034 method Methods 0.000 claims abstract description 70
- 239000000758 substrate Substances 0.000 claims abstract description 19
- 238000005530 etching Methods 0.000 claims description 20
- 239000003792 electrolyte Substances 0.000 claims description 7
- 229910052731 fluorine Inorganic materials 0.000 claims description 5
- 239000011737 fluorine Substances 0.000 claims description 5
- QKCGXXHCELUCKW-UHFFFAOYSA-N n-[4-[4-(dinaphthalen-2-ylamino)phenyl]phenyl]-n-naphthalen-2-ylnaphthalen-2-amine Chemical compound C1=CC=CC2=CC(N(C=3C=CC(=CC=3)C=3C=CC(=CC=3)N(C=3C=C4C=CC=CC4=CC=3)C=3C=C4C=CC=CC4=CC=3)C3=CC4=CC=CC=C4C=C3)=CC=C21 QKCGXXHCELUCKW-UHFFFAOYSA-N 0.000 claims description 4
- 238000002161 passivation Methods 0.000 claims description 4
- JOHWNGGYGAVMGU-UHFFFAOYSA-N trifluorochlorine Chemical compound FCl(F)F JOHWNGGYGAVMGU-UHFFFAOYSA-N 0.000 claims description 4
- 239000000203 mixture Substances 0.000 claims description 3
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 claims 1
- 239000002341 toxic gas Substances 0.000 abstract description 4
- 238000006243 chemical reaction Methods 0.000 description 5
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 4
- 238000001035 drying Methods 0.000 description 4
- 229910018503 SF6 Inorganic materials 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000002243 precursor Substances 0.000 description 3
- SFZCNBIFKDRMGX-UHFFFAOYSA-N sulfur hexafluoride Chemical compound FS(F)(F)(F)(F)F SFZCNBIFKDRMGX-UHFFFAOYSA-N 0.000 description 3
- 229960000909 sulfur hexafluoride Drugs 0.000 description 3
- 239000000463 material Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 230000003466 anti-cipated effect Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000010924 continuous production Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000005215 recombination Methods 0.000 description 1
- 230000006798 recombination Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000013077 target material Substances 0.000 description 1
- 230000000699 topical effect Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- B01J12/002—Chemical processes in general for reacting gaseous media with gaseous media; Apparatus specially adapted therefor carried out in the plasma state
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Abstract
기질이 위치하는 챔버(4)내부로 에칭제 및/또는 부착가스를 공급하여 기질이 처리된다. 유독가스의 전달과 관련한 문제들을 회피하기 위해 상기공정들에 요구되는 가스들이 상기 챔버에 대해 국소적으로 위치하는 전달시스템(1,2,3)으로부터 직접 전달된다. The substrate is processed by supplying an etchant and / or adhering gas into the chamber 4 where the substrate is located. In order to avoid problems associated with the delivery of toxic gases, the gases required for the processes are delivered directly from a delivery system 1, 2, 3 located locally with respect to the chamber.
Description
본 발명은 가스전달시스템, 특히 반도체웨이퍼 등위에서 에칭공정 또는 부착공정이 전환되는 사이클 또는 연속공정이 수행되는 건식공정장치에서 이용되는 가스전달시스템에 관한 것이다. The present invention relates to a gas delivery system, particularly a gas delivery system used in a dry process apparatus in which a cycle or a continuous process in which an etching process or an attachment process is switched on a semiconductor wafer or the like is performed.
표준에칭제로서 육불화황이 전환식 에칭/부착공정 및 연속플라즈마공정에서 이용된다. 산업체에서 더 높은 에칭속도의 공정을 요구함에 따라 공정챔버내에서 작용핵종의 밀도를 증가시킬 수 있는 선택적 공정에칭가스가 연구되어 그 결과 공정속도가 개선되었다. Sulfur hexafluoride is used as the standard etching agent in the conversion etching / adhesion process and the continuous plasma process. As industries require higher etch rate processes, selective process etching gases have been studied that can increase the density of functional nuclei in the process chamber, resulting in improved process rates.
공정속도를 향상시키는 대상재료로서 여러 가지의 서로 다른 화학약품들이 공지되어 있다. 상기 재료들은 비용증가, 위생 및 안전문제의 증가의 문제점을 가지고, 상업적 이용가능성이 취약하다. 복합된 상기 요인들에 의해 상기 재료들을 이용하는 경제성이 악화되거나 설치작업과 관련한 위험이 발생된다. 최근에 다수의 용융전해질가스발생기들이 보고되었고, 지금 막 상업적으로 이용되고 있다. 상기 수단에 의해 불소, 삼불화질소 및 삼불화염소가 발생된다. 미국특허 제 5 688 384호에 불소가스발생기셀의 실시예가 설명된다. 상기 발생기에 의해 고순도 및 합리적 비용과 위험으로 공정가스를 발생시킬 수 있다. 저온상태에서 상기 가스발생기는 고체를 포함하여 상기 유니트들의 안전한 운반 및 보관이 가능하다. Various different chemicals are known as target materials for improving the processing speed. These materials have the problem of increased costs, increased hygiene and safety issues, and are vulnerable to commercial availability. The combined factors deteriorate the economics of using the materials or create a risk associated with the installation. Recently, many molten electrolyte gas generators have been reported and are just commercially available. By this means, fluorine, nitrogen trifluoride and chlorine trifluoride are generated. An example of a fluorine gas generator cell is described in US Pat. No. 5,688,384. The generator can generate process gas at high purity and reasonable cost and risk. At low temperatures, the gas generator, including solids, enables safe transportation and storage of the units.
공정챔버에 대해 국소적으로 배열된 가스전달시스템내부에 상기 가스발생기를 구성하면, 공정상 잇점을 위하여 서로 다른 공정가스들이 다양한 공정계획에서 이용될 수 있다. 시스템설계, 가스전달제어, 시스템운반, 설치의 용이성 및 공정상 잇점과 관련하여 건식공정환경에 대한 상기 가스발생기의 적용에 관한 다수의 신규한 특징들이 제공된다. If the gas generator is configured inside a gas delivery system arranged locally with respect to the process chamber, different process gases may be used in various process plans for process advantages. Numerous new features are provided for the application of the gas generator to dry process environments in terms of system design, gas delivery control, system transportation, ease of installation and process advantages.
따라서, 본 발명의 제 1 특징에 따르면, 공정챔버, 기질을 위한 지지체 및, 에칭제 및/또는 성분가스를 상기 공정챔버내부로 전달하기 위한 가스발생 및 전달시스템으로 구성되고 기질을 처리하기 위한 장치에 있어서, 상기 가스발생 및 전달시스템이 상기 공정챔버와 근접한 위치에 배열된다. Thus, according to a first aspect of the invention, an apparatus for treating a substrate and comprising a process chamber, a support for a substrate, and a gas generation and delivery system for delivering an etchant and / or component gas into the process chamber In this case, the gas generation and delivery system is arranged in a position proximate to the process chamber.
"근접한 위치에(locally)"( 또는 사용위치)라는 용어와 관련하여, 가스발생 및 전달시스템이 공정챔버 또는 다수의 공정챔버들 또는 서로 근접하게 배열된 시스템들과 근접하게 배열되어, 발생된 가스들이 공정챔버와 떨어진 위치에서 발생되어 장치내부로 공급하기 위한 적합한 용기내에 운반되는 것이 아니라, 발생된 가스를 바로 사용하도록 상기 공정챔버 또는 시스템으로 직접 전달된다. With respect to the term "locally" (or location of use), the gas generated and delivered system is arranged in close proximity to the process chamber or to multiple process chambers or systems arranged in close proximity to one another Rather than being generated in a location away from the process chamber and transported in a suitable container for feeding into the apparatus, the gas is delivered directly to the process chamber or system for immediate use.
상기 가스발생 및 전달시스템이 용융전해질가스발생기를 포함하는 것이 선호된다. It is preferred that the gas generation and delivery system comprise a molten electrolyte gas generator.
본 발명의 제 2 특징에 따르면 에칭제 및/또는 성분가스를 기질이 위치하는 상기 챔버내부로 전달하고 기질을 처리하기 위한 방법이 제공되고 상기 챔버와 근접한 위치에 위치하는 상기 전달시스템으로부터 상기 가스가 전달된다. According to a second aspect of the invention there is provided a method for delivering an etchant and / or constituent gas into the chamber in which the substrate is located and for treating the substrate and from the delivery system located in proximity to the chamber. Delivered.
본 발명의 제 3 특징에 따르면, a)가스에 의해 기질을 에칭하는 단계,According to a third aspect of the invention, a) etching a substrate with a gas,
삭제delete
b)에칭특성을 가진 표면위에 페시베이션(passivation)층을 부착하는 단계,b) attaching a passivation layer on the surface with etching characteristics,
c)에칭특성을 가진 기저부로부터 페시베이션(passivation)층을 선택적으로 제거하는 단계를 주기적으로 수행하는 기질의 처리를 위한 방법이 제공되어, 에칭가스가 불소, 삼불화질소, 삼불화염소, 국소적으로 발생된 상기 가스들의 혼합물로 구성된다. c) A method is provided for the treatment of a substrate which periodically performs a step of selectively removing a passivation layer from a base having etching characteristics, so that the etching gas is fluorine, nitrogen trifluoride, chlorine trifluoride, topical. It consists of a mixture of the gases generated by.
상기 에칭가스가 SF6 와 혼합되는 것이 선호된다. It is preferred that the etching gas is mixed with SF 6 .
본 발명의 방법에 있어서, 용융전해질가스발생기를 포함한 전달시스템으로부터 상기 가스들이 공급되는 것이 이상적이다. In the method of the invention, it is ideal that the gases are supplied from a delivery system comprising a molten electrolyte gas generator.
종래기술의 실린더전달과정과 비교하여, 안전관련사항을 보면,Compared with the cylinder delivery process of the prior art, in terms of safety,
1. 발생기들은 대기압 또는 대기압근처에서 작동하여, 시스템상에 고압조정기가 불필요하다. 1. Generators operate at or near atmospheric, which eliminates the need for a high pressure regulator on the system.
2. 잠재적으로 아용자가 생산을 요구할 때까지 시스템내부에 유독가스가 존재하지 않으므로 보관상 위험문제가 제거된다. 작업자에 대한 위험이 상당히 감소된다. 2. Potentially no toxic gas is present in the system until the user requires production, eliminating storage hazards. The risk to the operator is significantly reduced.
3. 실온에서 상기 가스발생기들은 고형성분을 가져서 현장 또는 작업위치에서 유독가스를 운반해야하는 위험이 제거된다. 3. At room temperature, the gas generators have a solid component, eliminating the risk of transporting toxic gases on site or at work.
4. 요구 즉시 챔버와 근접한 위치에서 가스가 전달되어, 중앙저장소로 부터 길게 구성되어야 하는 가스라인이 제거되고, 상기 파이프내부의 유독가스의 관련 위험이 제거된다. 4. On request, gas is delivered in close proximity to the chamber, eliminating gas lines that have to be constructed long from a central reservoir and eliminating the associated hazards of toxic gases in the pipe.
종래기술의 실린더전달작업과 비교하여, 가스발생기의 설치비용이 감소된다. Compared with the cylinder delivery operation of the prior art, the installation cost of the gas generator is reduced.
1. 국소전달시스템에 의해 시설의 중앙저장소로부터 공정환경까지 추가로 긴 가스라인을 추가해야하는 비용이 제거된다. Local delivery systems eliminate the need to add additional long gas lines from the facility's central repository to the process environment.
2. 전형적으로 상기 발생기로부터 제공된 공정가스의 품질 및 생산작업이 고압실린더에 의해 생산된 발생기로부터 제공된 공정가스의 품질 및 생산작업과 등가하다. 2. Typically, the quality and production operation of the process gas provided from the generator is equivalent to the quality and production operation of the process gas provided from the generator produced by the high pressure cylinder.
3. 정비작업동안 작업자를 보호하기 위해 요구되는 안전관련주의사항들이 공정장비에 대한 근접성에 의해 최소화된다. 3. Safety precautions required to protect workers during maintenance work are minimized by proximity to the process equipment.
상기 가스발생기의 새로운 이용 및 설계와 관련한 특징들에 의하면, According to features related to the new use and design of the gas generator,
1. 일반적인 고온수조대신에 전해질을 가열하는 전체적으로 건식인 방법이 제공된다. 1. An entirely dry method of heating the electrolyte is provided instead of the usual hot water bath.
2. 전해질셀의 음극 및 양극에서 상기 가스발생기들은 가스를 발생시킨다. 두 가지 가스들은 잠재적으로 극도의 반응성을 가지지만 야기될 수 있는 재결합작용을 방지하기 위해 시스템설계에 의해 분리될 수 있다. 2. The gas generators generate gas at the cathode and anode of the electrolyte cell. The two gases are potentially extremely reactive but can be separated by system design to prevent possible recombination.
3. 대기압 또는 대기압과 근사한 압력에서 작동되도록 상기 가스발생기들이 설계된다. 공정챔버에서 상기 발생기가 저압(진공)을 형성하지 않도록 공정챔버에 대한 가스라인 의 설계에 의해 신규한 제어시스템이 구성된다. 상기 구성은 전체 시스템에 대해 상기 가스발생기들의 작동과 관련하여 설계상 주요 특징을 형성한다. 3. The gas generators are designed to operate at or close to atmospheric pressure. The novel control system is constructed by the design of a gas line for the process chamber so that the generator does not form low pressure (vacuum) in the process chamber. This configuration forms a key design feature in relation to the operation of the gas generators for the whole system.
4. 공정챔버를 통과하기 전에 불필요한 불순물을 제거하기 위해 발생된 가스를 청소하는 능력이 국소전달시스템에 포함된다. 4. The local delivery system includes the ability to clean off the gases produced to remove unwanted impurities before passing through the process chamber.
본 발명이 다양한 방법들에 의해 실시될 수 있고, 본 발명의 선호되는 실시예가 첨부된 도면을 참고하여 상세하게 설명된다. The present invention can be implemented by various methods, and preferred embodiments of the present invention are described in detail with reference to the accompanying drawings.
도 1은 본 발명을 따르는 일반적인 가스발생시스템을 도시한 개략도. 1 is a schematic diagram showing a general gas generation system according to the present invention.
부호설명Description
1,2 ... 공급원 4 ... 공정챔버1,2 ... Source 4 ... Process Chamber
5,6 ... 제어시스템 7 ... 배출시스템5,6
9 ... 바이패스라인 10 ... 지지체9
도 1의 배열을 참고할 때, 한 개 또는 두 개이상의 적합한 공급원(1,2)으로부터 공정챔버(4)까지 한 개이상의 선구가스들이 통과되고, 상기 선구가스들에 의해 건식공정이 수행된다. 반응챔버(3)에 제공되고 선구가스를 적합하게 제어하고 격리하기 위한 한 개이상의 밸브들이 구성된다. 공정챔버(4) 또는 바이패스라인(9)을 공급되는 가스의 공급이 연결상태의 제어시스템(5,6)에 의해 감시되고 유지된다. Referring to the arrangement of FIG. 1, one or more precursor gases are passed from one or two or more suitable sources 1, 2 to the process chamber 4, and a dry process is performed by the precursor gases. One or more valves are provided in the
공정챔버(4)로부터 배출시스템(7)으로 가스들이 이동하고 다음에 (일반적으로 요구되는) 감소작용공구(8)에 도달한다. 바이패스라인(9)이 반응챔버(3)로부터 배출시스템(7)으로 연결되어, 가스들이 공정챔버에서 필요할 때만 가스들이 상기 공정챔버로 공급될 수 있다. 그 결과 가스들이 공정챔버로 공급되기 전에, 안정한 가스성분 및 안정한 유동이 유지될 수 있다. 공급되는 가스들에 의해 처리되어야 하는 기질을 위한 지지체(10)가 상기 공정챔버(4)내에 배열된다. Gases move from the process chamber 4 into the
동시계류중인 하기 출원들에서 본 발명이 이용될 수 있을 것으로 예상된다. It is anticipated that the present invention may be used in the co-pending applications below.
1. (유럽특허출원 제 9909091.3호의) 연속작업식 건식공정. 공정챔버내부에 배열된 기질을 에칭하는 공정가스를 공급하도록 상기 가스발생기가 이용될 수 있다. 그 결과 발생된 가스가 기질과 즉시 반응하는 한, 반응핵종을 발생시키는 플라즈마의 이용여부를 선택할 수 있다. 1. Continuous working dry process (of European Patent Application No. 9909091.3). The gas generator may be used to supply a process gas for etching a substrate arranged within the process chamber. As long as the resulting gas reacts immediately with the substrate, it is possible to choose whether or not to use the plasma to generate the reactive nuclide.
2. (문헌 제 EP-A-0822584 호 및 제 EP-A-0822582호의) 전환된 플라즈마공정을 위한 선택적 가스. 발생된 가스가 추가되면 전환된 플라즈마공정에서 이용되고 존재하는 공정에칭가스가 교체되거나 추가될 수 있다. 존재하는 육불화황과 조합하거나 개별적으로 공정에칭속도를 증가시키기 위해 불소, 삼불화질소 또는 삼불화염소와 같은 발생가스가 이용되는 것이 유리하다. 2. Optional gas for the converted plasma process (of EP-A-0822584 and EP-A-0822582). When the generated gas is added, the process etching gas used and existing in the converted plasma process may be replaced or added. It is advantageous to use an off-gas such as fluorine, nitrogen trifluoride or chlorine trifluoride in combination with the sulfur hexafluoride present or individually to increase the process etching rate.
3. (국제특허출원 제 PCT/GB99/02368호의 ) 플라즈마가 덜 전환된 공정을 위한 선택적 가스. 발생된 가스가 자발적 반응이 이루어지는 한, 육불화황의 공정가스가 대체되면 또한 공정챔버내부에서 플라즈마없이도 공정작업이 가능하다. 3. Optional gas for a process with less plasma conversion (of International Patent Application PCT / GB99 / 02368). As long as the generated gas reacts spontaneously, if the sulfur hexafluoride process gas is replaced, the process can be performed without plasma in the process chamber.
또한 국제특허출원 제 PCT/GB99/02368호의 경우와 유사하고 플라즈마/플라즈마가 덜 전환된 공정을 위한 가스의 발생작업에서 본 발명이 이용가능하다고 예상된다. 반응핵종을 발생시키거나 자발적으로 기질과 반응하기 위해 플라즈마를 요구하는 가스혼합물을 결합시키거나 가스를 발생시키기는 능력에 의하여 전체 공정계획에서 한 개 또는 다른 한 개의 고정단계들을 위한 플라즈마를 요구하는 공정계획이 도입될 수 있다. It is also contemplated that the present invention may be used in the generation of gases for processes similar to that of International Patent Application No. PCT / GB99 / 02368 and with less plasma / plasma conversion. Process requiring plasma for one or other fixed steps in the overall process plan by the ability to combine or generate gas mixtures that require plasma to generate reactive nuclei or spontaneously react with the substrate. A plan can be introduced.
Claims (6)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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GBGB9904925.6A GB9904925D0 (en) | 1999-03-04 | 1999-03-04 | Gas delivery system |
GB9904925.6 | 1999-03-04 |
Publications (2)
Publication Number | Publication Date |
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KR20010043309A KR20010043309A (en) | 2001-05-25 |
KR100756727B1 true KR100756727B1 (en) | 2007-09-07 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020007012274A KR100756727B1 (en) | 1999-03-04 | 2000-03-06 | Gas delivery system |
Country Status (6)
Country | Link |
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US (1) | US6602433B1 (en) |
EP (1) | EP1082754A1 (en) |
JP (1) | JP4926318B2 (en) |
KR (1) | KR100756727B1 (en) |
GB (1) | GB9904925D0 (en) |
WO (1) | WO2000052740A1 (en) |
Families Citing this family (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6290864B1 (en) | 1999-10-26 | 2001-09-18 | Reflectivity, Inc. | Fluoride gas etching of silicon with improved selectivity |
US6949202B1 (en) | 1999-10-26 | 2005-09-27 | Reflectivity, Inc | Apparatus and method for flow of process gas in an ultra-clean environment |
US7041224B2 (en) | 1999-10-26 | 2006-05-09 | Reflectivity, Inc. | Method for vapor phase etching of silicon |
US20030010354A1 (en) * | 2000-03-27 | 2003-01-16 | Applied Materials, Inc. | Fluorine process for cleaning semiconductor process chamber |
US6500356B2 (en) * | 2000-03-27 | 2002-12-31 | Applied Materials, Inc. | Selectively etching silicon using fluorine without plasma |
US6843258B2 (en) | 2000-12-19 | 2005-01-18 | Applied Materials, Inc. | On-site cleaning gas generation for process chamber cleaning |
US7189332B2 (en) | 2001-09-17 | 2007-03-13 | Texas Instruments Incorporated | Apparatus and method for detecting an endpoint in a vapor phase etch |
US20030098038A1 (en) * | 2001-11-26 | 2003-05-29 | Siegele Stephen H. | System and method for on-site generation and distribution of fluorine for fabrication processes |
US20090001524A1 (en) * | 2001-11-26 | 2009-01-01 | Siegele Stephen H | Generation and distribution of a fluorine gas |
US20030121796A1 (en) * | 2001-11-26 | 2003-07-03 | Siegele Stephen H | Generation and distribution of molecular fluorine within a fabrication facility |
US6902629B2 (en) * | 2002-04-12 | 2005-06-07 | Applied Materials, Inc. | Method for cleaning a process chamber |
DE10229037A1 (en) | 2002-06-28 | 2004-01-29 | Robert Bosch Gmbh | Device and method for producing chlorine trifluoride and plant for etching semiconductor substrates with this device |
JP2005024068A (en) * | 2003-07-02 | 2005-01-27 | Toyo Tanso Kk | Feeder of halogen gas or halogen-contained gas |
US7645704B2 (en) | 2003-09-17 | 2010-01-12 | Texas Instruments Incorporated | Methods and apparatus of etch process control in fabrications of microstructures |
US20070066038A1 (en) | 2004-04-30 | 2007-03-22 | Lam Research Corporation | Fast gas switching plasma processing apparatus |
US7708859B2 (en) * | 2004-04-30 | 2010-05-04 | Lam Research Corporation | Gas distribution system having fast gas switching capabilities |
JP2006049817A (en) * | 2004-07-07 | 2006-02-16 | Showa Denko Kk | Plasma treatment method and plasma etching method |
US20060266288A1 (en) * | 2005-05-27 | 2006-11-30 | Applied Materials, Inc. | High plasma utilization for remote plasma clean |
US20070074743A1 (en) * | 2005-10-04 | 2007-04-05 | Mcfarlane Graham | H2 conditioning of chamber following cleaning cycle |
JP4018726B2 (en) | 2006-02-07 | 2007-12-05 | 東洋炭素株式会社 | Semiconductor manufacturing plant |
SG184131A1 (en) | 2010-03-26 | 2012-10-30 | Solvay | Method for the supply of fluorine |
WO2014037485A1 (en) * | 2012-09-10 | 2014-03-13 | Solvay Sa | A chamber cleaning method using f2 and a process for manufacture of f2 for this method |
WO2014037486A1 (en) * | 2012-09-10 | 2014-03-13 | Solvay Sa | A chamber cleaning method using low pressure f2 |
CN114857492B (en) * | 2022-04-19 | 2023-10-31 | 安徽新力电业科技咨询有限责任公司 | Sectional type supercharged and continuously stored SF 6 Gas on-site recovery device |
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EP0429809A2 (en) * | 1989-11-22 | 1991-06-05 | Texas Instruments Incorporated | Method and apparatus for etching semiconductor materials |
WO1999003137A1 (en) * | 1997-07-11 | 1999-01-21 | Applied Materials, Inc. | Fuel delivery system and method |
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Publication number | Priority date | Publication date | Assignee | Title |
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JPS53121469A (en) * | 1977-03-31 | 1978-10-23 | Toshiba Corp | Gas etching unit |
JPH0644986B2 (en) * | 1988-05-08 | 1994-06-15 | 忠弘 大見 | Process gas supply piping device |
JPH0231419A (en) * | 1988-07-20 | 1990-02-01 | Hashimoto Kasei Kogyo Kk | Dryetching device |
JPH03222417A (en) * | 1990-01-29 | 1991-10-01 | Nec Corp | Manufacture of semiconductor device |
US6033969A (en) * | 1996-09-30 | 2000-03-07 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method of forming a shallow trench isolation that has rounded and protected corners |
-
1999
- 1999-03-04 GB GBGB9904925.6A patent/GB9904925D0/en not_active Ceased
-
2000
- 2000-03-06 JP JP2000603078A patent/JP4926318B2/en not_active Expired - Lifetime
- 2000-03-06 EP EP00907803A patent/EP1082754A1/en not_active Ceased
- 2000-03-06 US US09/674,658 patent/US6602433B1/en not_active Expired - Lifetime
- 2000-03-06 KR KR1020007012274A patent/KR100756727B1/en active IP Right Grant
- 2000-03-06 WO PCT/GB2000/000789 patent/WO2000052740A1/en not_active Application Discontinuation
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
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EP0429809A2 (en) * | 1989-11-22 | 1991-06-05 | Texas Instruments Incorporated | Method and apparatus for etching semiconductor materials |
WO1999003137A1 (en) * | 1997-07-11 | 1999-01-21 | Applied Materials, Inc. | Fuel delivery system and method |
Also Published As
Publication number | Publication date |
---|---|
EP1082754A1 (en) | 2001-03-14 |
US6602433B1 (en) | 2003-08-05 |
WO2000052740A1 (en) | 2000-09-08 |
JP2002538620A (en) | 2002-11-12 |
GB9904925D0 (en) | 1999-04-28 |
JP4926318B2 (en) | 2012-05-09 |
KR20010043309A (en) | 2001-05-25 |
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