KR100717805B1 - 증착 마스크 조립체 - Google Patents
증착 마스크 조립체 Download PDFInfo
- Publication number
- KR100717805B1 KR100717805B1 KR1020060054452A KR20060054452A KR100717805B1 KR 100717805 B1 KR100717805 B1 KR 100717805B1 KR 1020060054452 A KR1020060054452 A KR 1020060054452A KR 20060054452 A KR20060054452 A KR 20060054452A KR 100717805 B1 KR100717805 B1 KR 100717805B1
- Authority
- KR
- South Korea
- Prior art keywords
- deposition mask
- substrate
- alignment
- mask
- deposition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 230000008021 deposition Effects 0.000 title claims abstract description 80
- 239000000758 substrate Substances 0.000 claims abstract description 34
- 238000005530 etching Methods 0.000 claims description 6
- 238000000034 method Methods 0.000 claims description 6
- 238000000151 deposition Methods 0.000 description 65
- 239000010409 thin film Substances 0.000 description 9
- 239000010408 film Substances 0.000 description 4
- 238000004140 cleaning Methods 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000011368 organic material Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 230000003746 surface roughness Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
- H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/12—Organic material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
- H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/191—Deposition of organic active material characterised by provisions for the orientation or alignment of the layer to be deposited
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Physical Vapour Deposition (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
Description
Claims (5)
- 소정의 패턴을 갖는 슬롯이 형성된 증착 마스크; 및상기 증착 마스크의 상기 슬롯이 형성된 영역에 대응하여 형성된 개구부를 구비하고, 그 일면에 상기 증착 마스크를 부착하여 상기 증착 마스크를 지지하는 마스크 프레임을 포함하며,상기 증착 마스크는 상기 증착 마스크와 기판을 정렬하기 위한 얼라인 홈을 구비하는 증착 마스크 조립체.
- 제1 항에 있어서,상기 얼라인 홈의 표면은 상기 증착 마스크의 다른 부분의 표면보다 거칠기가 큰 증착 마스크 조립체.
- 제1 항에 있어서,상기 얼라인 홈은 상기 증착 마스크의 가장자리에 구비되는 증착 마스크 조립체.
- 제1 항에 있어서,상기 얼라인 홈은 하프 에칭에 의해 형성되는 증착 마스크 조립체.
- 제1 항에 있어서,상기 기판은 유기 발광 표시 장치의 기판인 증착 마스크 조립체.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020060054452A KR100717805B1 (ko) | 2006-06-16 | 2006-06-16 | 증착 마스크 조립체 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020060054452A KR100717805B1 (ko) | 2006-06-16 | 2006-06-16 | 증착 마스크 조립체 |
Publications (1)
Publication Number | Publication Date |
---|---|
KR100717805B1 true KR100717805B1 (ko) | 2007-05-11 |
Family
ID=38270627
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020060054452A Active KR100717805B1 (ko) | 2006-06-16 | 2006-06-16 | 증착 마스크 조립체 |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR100717805B1 (ko) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9757764B2 (en) | 2012-07-31 | 2017-09-12 | Samsung Display Co., Ltd. | Mask for deposition and method for aligning the same |
KR101827804B1 (ko) | 2011-07-29 | 2018-02-12 | 주성엔지니어링(주) | 섀도우 마스크, 증착 장치 및 증착 방법 |
CN113481468A (zh) * | 2021-06-29 | 2021-10-08 | 京东方科技集团股份有限公司 | 掩膜版 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR980005295A (ko) * | 1996-06-05 | 1998-03-30 | 문정환 | 정렬 마크(mark) 및 그 제조방법 |
KR19990073665A (ko) * | 1998-03-02 | 1999-10-05 | 김규현 | 정렬마크 패턴구조 |
KR20030034730A (ko) * | 2001-10-26 | 2003-05-09 | 삼성 엔이씨 모바일 디스플레이 주식회사 | 유기 el 소자의 마스크용 프레임 |
KR20050029877A (ko) * | 2003-09-24 | 2005-03-29 | 엘지.필립스 엘시디 주식회사 | 비정질 실리콘층의 결정화 공정 및 이를 이용한 스위칭 소자 |
KR20050120072A (ko) * | 2004-06-18 | 2005-12-22 | 동부아남반도체 주식회사 | 반도체 소자의 얼라인 마크 및 그를 이용한 얼라인 방법 |
-
2006
- 2006-06-16 KR KR1020060054452A patent/KR100717805B1/ko active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR980005295A (ko) * | 1996-06-05 | 1998-03-30 | 문정환 | 정렬 마크(mark) 및 그 제조방법 |
KR19990073665A (ko) * | 1998-03-02 | 1999-10-05 | 김규현 | 정렬마크 패턴구조 |
KR20030034730A (ko) * | 2001-10-26 | 2003-05-09 | 삼성 엔이씨 모바일 디스플레이 주식회사 | 유기 el 소자의 마스크용 프레임 |
KR20050029877A (ko) * | 2003-09-24 | 2005-03-29 | 엘지.필립스 엘시디 주식회사 | 비정질 실리콘층의 결정화 공정 및 이를 이용한 스위칭 소자 |
KR20050120072A (ko) * | 2004-06-18 | 2005-12-22 | 동부아남반도체 주식회사 | 반도체 소자의 얼라인 마크 및 그를 이용한 얼라인 방법 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101827804B1 (ko) | 2011-07-29 | 2018-02-12 | 주성엔지니어링(주) | 섀도우 마스크, 증착 장치 및 증착 방법 |
US9757764B2 (en) | 2012-07-31 | 2017-09-12 | Samsung Display Co., Ltd. | Mask for deposition and method for aligning the same |
CN113481468A (zh) * | 2021-06-29 | 2021-10-08 | 京东方科技集团股份有限公司 | 掩膜版 |
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