KR100709821B1 - 감압성 접착 시이트 및 기능성 필름의 고정방법 - Google Patents
감압성 접착 시이트 및 기능성 필름의 고정방법 Download PDFInfo
- Publication number
- KR100709821B1 KR100709821B1 KR1020010046252A KR20010046252A KR100709821B1 KR 100709821 B1 KR100709821 B1 KR 100709821B1 KR 1020010046252 A KR1020010046252 A KR 1020010046252A KR 20010046252 A KR20010046252 A KR 20010046252A KR 100709821 B1 KR100709821 B1 KR 100709821B1
- Authority
- KR
- South Korea
- Prior art keywords
- pressure
- sensitive adhesive
- weight
- molecular weight
- parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000004820 Pressure-sensitive adhesive Substances 0.000 title claims abstract description 66
- 238000000034 method Methods 0.000 title claims description 20
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims abstract description 20
- 239000011521 glass Substances 0.000 claims abstract description 19
- 239000010410 layer Substances 0.000 claims abstract description 17
- 239000004094 surface-active agent Substances 0.000 claims abstract description 16
- 239000006087 Silane Coupling Agent Substances 0.000 claims abstract description 13
- 239000000178 monomer Substances 0.000 claims abstract description 12
- 125000000217 alkyl group Chemical group 0.000 claims abstract description 11
- 229920001519 homopolymer Polymers 0.000 claims abstract description 8
- 229920001577 copolymer Polymers 0.000 claims abstract description 7
- 238000005227 gel permeation chromatography Methods 0.000 claims description 8
- 239000004971 Cross linker Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 abstract description 17
- 239000000853 adhesive Substances 0.000 abstract description 16
- 239000003431 cross linking reagent Substances 0.000 abstract description 11
- 230000002035 prolonged effect Effects 0.000 abstract 1
- 229920000058 polyacrylate Polymers 0.000 description 33
- 238000012360 testing method Methods 0.000 description 28
- 229920000642 polymer Polymers 0.000 description 13
- -1 2-ethylhexyl Chemical group 0.000 description 12
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 12
- 230000000052 comparative effect Effects 0.000 description 8
- 238000004132 cross linking Methods 0.000 description 8
- 238000006116 polymerization reaction Methods 0.000 description 8
- 238000009826 distribution Methods 0.000 description 7
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 description 6
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 4
- 239000012298 atmosphere Substances 0.000 description 4
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 4
- TXTIIWDWHSZBRK-UHFFFAOYSA-N 2,4-diisocyanato-1-methylbenzene;2-ethyl-2-(hydroxymethyl)propane-1,3-diol Chemical compound CCC(CO)(CO)CO.CC1=CC=C(N=C=O)C=C1N=C=O TXTIIWDWHSZBRK-UHFFFAOYSA-N 0.000 description 3
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 230000007774 longterm Effects 0.000 description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
- 229910052708 sodium Inorganic materials 0.000 description 3
- 239000011734 sodium Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 239000006228 supernatant Substances 0.000 description 3
- 125000000022 2-aminoethyl group Chemical group [H]C([*])([H])C([H])([H])N([H])[H] 0.000 description 2
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 2
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 2
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 2
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 238000010528 free radical solution polymerization reaction Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 229920001228 polyisocyanate Polymers 0.000 description 2
- 239000005056 polyisocyanate Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 2
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 1
- IVIDDMGBRCPGLJ-UHFFFAOYSA-N 2,3-bis(oxiran-2-ylmethoxy)propan-1-ol Chemical compound C1OC1COC(CO)COCC1CO1 IVIDDMGBRCPGLJ-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 description 1
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 1
- ZYAASQNKCWTPKI-UHFFFAOYSA-N 3-[dimethoxy(methyl)silyl]propan-1-amine Chemical compound CO[Si](C)(OC)CCCN ZYAASQNKCWTPKI-UHFFFAOYSA-N 0.000 description 1
- QZPSOSOOLFHYRR-UHFFFAOYSA-N 3-hydroxypropyl prop-2-enoate Chemical compound OCCCOC(=O)C=C QZPSOSOOLFHYRR-UHFFFAOYSA-N 0.000 description 1
- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 description 1
- SXIFAEWFOJETOA-UHFFFAOYSA-N 4-hydroxy-butyl Chemical group [CH2]CCCO SXIFAEWFOJETOA-UHFFFAOYSA-N 0.000 description 1
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- 239000004342 Benzoyl peroxide Substances 0.000 description 1
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- 229920000538 Poly[(phenyl isocyanate)-co-formaldehyde] Polymers 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- ULUAUXLGCMPNKK-UHFFFAOYSA-N Sulfobutanedioic acid Chemical compound OC(=O)CC(C(O)=O)S(O)(=O)=O ULUAUXLGCMPNKK-UHFFFAOYSA-N 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical group CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- MBHRHUJRKGNOKX-UHFFFAOYSA-N [(4,6-diamino-1,3,5-triazin-2-yl)amino]methanol Chemical class NC1=NC(N)=NC(NCO)=N1 MBHRHUJRKGNOKX-UHFFFAOYSA-N 0.000 description 1
- YGCOKJWKWLYHTG-UHFFFAOYSA-N [[4,6-bis[bis(hydroxymethyl)amino]-1,3,5-triazin-2-yl]-(hydroxymethyl)amino]methanol Chemical class OCN(CO)C1=NC(N(CO)CO)=NC(N(CO)CO)=N1 YGCOKJWKWLYHTG-UHFFFAOYSA-N 0.000 description 1
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 150000005215 alkyl ethers Chemical class 0.000 description 1
- 125000005037 alkyl phenyl group Chemical group 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 229920005601 base polymer Polymers 0.000 description 1
- 229940077388 benzenesulfonate Drugs 0.000 description 1
- 235000019400 benzoyl peroxide Nutrition 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229920001400 block copolymer Polymers 0.000 description 1
- 238000012662 bulk polymerization Methods 0.000 description 1
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000010556 emulsion polymerization method Methods 0.000 description 1
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 description 1
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 1
- WOXXJEVNDJOOLV-UHFFFAOYSA-N ethenyl-tris(2-methoxyethoxy)silane Chemical compound COCCO[Si](OCCOC)(OCCOC)C=C WOXXJEVNDJOOLV-UHFFFAOYSA-N 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 239000002563 ionic surfactant Substances 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 150000007974 melamines Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- JAYXSROKFZAHRQ-UHFFFAOYSA-N n,n-bis(oxiran-2-ylmethyl)aniline Chemical compound C1OC1CN(C=1C=CC=CC=1)CC1CO1 JAYXSROKFZAHRQ-UHFFFAOYSA-N 0.000 description 1
- KBJFYLLAMSZSOG-UHFFFAOYSA-N n-(3-trimethoxysilylpropyl)aniline Chemical compound CO[Si](OC)(OC)CCCNC1=CC=CC=C1 KBJFYLLAMSZSOG-UHFFFAOYSA-N 0.000 description 1
- 239000002736 nonionic surfactant Substances 0.000 description 1
- 125000001400 nonyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 239000003505 polymerization initiator Substances 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 229920002503 polyoxyethylene-polyoxypropylene Polymers 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- GQIUQDDJKHLHTB-UHFFFAOYSA-N trichloro(ethenyl)silane Chemical compound Cl[Si](Cl)(Cl)C=C GQIUQDDJKHLHTB-UHFFFAOYSA-N 0.000 description 1
- JXUKBNICSRJFAP-UHFFFAOYSA-N triethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCOCC1CO1 JXUKBNICSRJFAP-UHFFFAOYSA-N 0.000 description 1
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
- 239000005050 vinyl trichlorosilane Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/49—Phosphorus-containing compounds
- C08K5/51—Phosphorus bound to oxygen
- C08K5/52—Phosphorus bound to oxygen only
- C08K5/521—Esters of phosphoric acids, e.g. of H3PO4
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/36—Sulfur-, selenium-, or tellurium-containing compounds
- C08K5/41—Compounds containing sulfur bound to oxygen
- C08K5/42—Sulfonic acids; Derivatives thereof
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
- C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/385—Acrylic polymers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31551—Of polyamidoester [polyurethane, polyisocyanate, polycarbamate, etc.]
- Y10T428/31609—Particulate metal or metal compound-containing
- Y10T428/31612—As silicone, silane or siloxane
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
Description
실시예 1 | 실시예 2 | 비교예 1 | 비교예 2 | |
아크릴계 중합체의 유형 계면활성제의 존재 여부 | B 존재 | C 존재 | A 존재 | B 부재 |
졸 성분: 졸 분율(중량%) 중량 평균 분자량(만) 저분자량 성분(중량%) | 15 58 6 | 10 47 12 | 29 49 25 | 15 58 6 |
접착력 시험(N/25 mm(폭)) 내후성 시험 재작업성 시험 | 4.0 ○ ○ | 4.4 ○ ○ | 5.5 × ○ | 7.9 ○ × |
Claims (4)
- 알킬 (메트)아크릴레이트를 주성분으로 하는 단량체로 이루어진 단독중합체 또는 공중합체 100 중량부, 실란-커플링제 0.001 내지 5 중량부 및 계면활성제 0.001 내지 5 중량부(상기 단독중합체 또는 공중합체 100 중량부 기준)를 포함하고 가교결합제에 의해 가교결합된 감압성 접착제 층을 포함하고,겔 투과 크로마토그래피법으로 분자량을 측정하는 경우, 상기 가교결합된 감압성 접착제 층의 졸 성분이 300,000 이상의 중량 평균 분자량을 갖고, 상기 졸 성분 중의 100,000 이하의 분자량을 갖는 저분자량 성분의 비율이 15 중량% 이하인 것을 특징으로 하는 감압성 접착 시이트.
- 제 1 항에 있어서,가교결합된 감압성 접착제 층의 졸 성분의 졸 분율이 5 내지 60 중량%인 감압성 접착 시이트.
- 제 1 항에 있어서,유리에 대한 접착력이 3.5 내지 10 N/25 mm(폭)인 감압성 접착 시이트.
- 제 1 항 내지 제 3 항 중 어느 한 항에 따른 감압성 접착 시이트를 개재하여 기능 성 필름을 표시장치에 접착 고정시키는 것을 포함하는 기능성 필름의 고정방법.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000233105A JP4913937B2 (ja) | 2000-08-01 | 2000-08-01 | 感圧性接着シ―ト類と機能性フイルムの固定方法 |
JPJP-P-2000-00233105 | 2000-08-01 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20020011341A KR20020011341A (ko) | 2002-02-08 |
KR100709821B1 true KR100709821B1 (ko) | 2007-04-23 |
Family
ID=18725676
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020010046252A Expired - Fee Related KR100709821B1 (ko) | 2000-08-01 | 2001-07-31 | 감압성 접착 시이트 및 기능성 필름의 고정방법 |
Country Status (4)
Country | Link |
---|---|
US (1) | US6599967B2 (ko) |
JP (1) | JP4913937B2 (ko) |
KR (1) | KR100709821B1 (ko) |
TW (1) | TWI256962B (ko) |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3629021B2 (ja) * | 2001-09-28 | 2005-03-16 | 化研テック株式会社 | 熱剥離型接着構造体 |
JP4017156B2 (ja) * | 2003-01-27 | 2007-12-05 | 日東電工株式会社 | 粘着型光学補償層付偏光板および画像表示装置 |
US20050081993A1 (en) * | 2003-10-16 | 2005-04-21 | Ilkka Steven J. | Method of bonding glass |
TWI380900B (zh) * | 2004-09-17 | 2013-01-01 | Sumitomo Chemical Co | 光學疊層體 |
US7413787B2 (en) * | 2004-10-20 | 2008-08-19 | Agwest, Llc | Adhesive sheet |
JP4780647B2 (ja) * | 2004-12-02 | 2011-09-28 | 日東電工株式会社 | 光学フィルム用粘着剤、光学フィルム用粘着剤層およびその製造方法、粘着型光学フィルム、ならびに画像表示装置 |
JP4727238B2 (ja) * | 2005-01-25 | 2011-07-20 | 日東電工株式会社 | 光学部材用粘着剤組成物、光学部材用粘着剤層、粘着型光学部材、及び画像表示装置 |
TW200738838A (en) * | 2006-04-13 | 2007-10-16 | Daxon Technology Inc | Pressure sensitive adhesive with improved weatherability and method for improving weatherability thereof |
JP2009074083A (ja) * | 2007-08-31 | 2009-04-09 | Nitto Denko Corp | 粘着剤組成物および粘着シート |
US8962135B2 (en) * | 2007-10-22 | 2015-02-24 | Nitto Denko Corporation | Pressure-sensitive adhesive composition for optical film, pressure-sensitive adhesive layer for optical film, production method thereof, pressure-sensitive adhesive optical film and image display |
EP2072552A3 (en) * | 2007-12-20 | 2009-07-29 | Nitto Denko Corporation | Pressure-sensitive adhesive composition for optical films, pressure-sensitive adhesive optical film and image display |
JP5379409B2 (ja) * | 2008-02-15 | 2013-12-25 | 日東電工株式会社 | 光学フィルム用粘着剤組成物、粘着型光学フィルムおよび画像表示装置 |
JP5641634B2 (ja) * | 2008-03-13 | 2014-12-17 | 日東電工株式会社 | 粘着剤組成物、粘着剤層、粘着部材および画像表示装置、並びに画像表示装置からの光学フィルムの剥離方法および表示パネルの取り出し方法 |
JP5379410B2 (ja) * | 2008-03-14 | 2013-12-25 | 日東電工株式会社 | 光学フィルム用粘着剤組成物、粘着型光学フィルムおよび画像表示装置 |
JP5627961B2 (ja) * | 2009-09-07 | 2014-11-19 | リンテック株式会社 | 保護フィルム及び保護フィルムの製造方法 |
KR20130097069A (ko) * | 2010-05-11 | 2013-09-02 | 아사히 가라스 가부시키가이샤 | 적층체의 제조 방법 및 적층체 |
JP6117478B2 (ja) * | 2011-04-22 | 2017-04-19 | 日東電工株式会社 | 粘着型機能性フィルム及び表示装置 |
WO2013009691A1 (en) * | 2011-07-08 | 2013-01-17 | Rok Protective Systems, Inc. | Composition for strengthening glass |
MX2016005005A (es) | 2013-10-30 | 2016-08-17 | C-Bond Systems Llc | Materiales mejorados, composiciones de tratamiento y laminados del material con nanotubos de carbono. |
CN104293249B (zh) * | 2014-10-23 | 2016-05-04 | 深圳市三利谱光电科技股份有限公司 | 压敏胶的制备方法、压敏胶及其应用 |
DE102015224734A1 (de) * | 2015-12-09 | 2017-06-14 | Tesa Se | Zusammensetzung zur Herstellung von Haftklebemassen |
JP6863870B2 (ja) * | 2017-10-10 | 2021-04-21 | リンテック株式会社 | 粘着シート |
JP7441012B2 (ja) * | 2019-08-02 | 2024-02-29 | 日東電工株式会社 | 粘着シート |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6446125A (en) * | 1987-08-14 | 1989-02-20 | Oki Electric Ind Co Ltd | Liquid crystal menu tablet |
JPH073221A (ja) * | 1993-06-18 | 1995-01-06 | Sekisui Chem Co Ltd | 装飾用粘着シート |
JPH07331206A (ja) * | 1994-06-01 | 1995-12-19 | Soken Kagaku Kk | 液晶素子用感圧接着剤組成物および液晶素子 |
JPH1046126A (ja) * | 1996-08-01 | 1998-02-17 | Nippon Synthetic Chem Ind Co Ltd:The | 粘着剤組成物 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2592875B2 (ja) | 1987-12-29 | 1997-03-19 | 日東電工株式会社 | 感圧性接着剤 |
JP2592876B2 (ja) | 1987-12-29 | 1997-03-19 | 日東電工株式会社 | 感圧性接着剤 |
JP3618192B2 (ja) | 1997-04-08 | 2005-02-09 | リンテック株式会社 | 粘着シート |
JP3819661B2 (ja) | 2000-02-24 | 2006-09-13 | 日東電工株式会社 | 感圧性接着シ―ト類および機能性フイルムの固定方法 |
-
2000
- 2000-08-01 JP JP2000233105A patent/JP4913937B2/ja not_active Expired - Fee Related
-
2001
- 2001-07-25 US US09/915,025 patent/US6599967B2/en not_active Expired - Fee Related
- 2001-07-27 TW TW090118446A patent/TWI256962B/zh not_active IP Right Cessation
- 2001-07-31 KR KR1020010046252A patent/KR100709821B1/ko not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6446125A (en) * | 1987-08-14 | 1989-02-20 | Oki Electric Ind Co Ltd | Liquid crystal menu tablet |
JPH073221A (ja) * | 1993-06-18 | 1995-01-06 | Sekisui Chem Co Ltd | 装飾用粘着シート |
JPH07331206A (ja) * | 1994-06-01 | 1995-12-19 | Soken Kagaku Kk | 液晶素子用感圧接着剤組成物および液晶素子 |
JPH1046126A (ja) * | 1996-08-01 | 1998-02-17 | Nippon Synthetic Chem Ind Co Ltd:The | 粘着剤組成物 |
Also Published As
Publication number | Publication date |
---|---|
US20020035177A1 (en) | 2002-03-21 |
KR20020011341A (ko) | 2002-02-08 |
US6599967B2 (en) | 2003-07-29 |
JP2002047463A (ja) | 2002-02-12 |
TWI256962B (en) | 2006-06-21 |
JP4913937B2 (ja) | 2012-04-11 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR100709821B1 (ko) | 감압성 접착 시이트 및 기능성 필름의 고정방법 | |
KR100723113B1 (ko) | 감압성 접착 시이트, 및 기능성 필름의 고정방법 | |
KR101423478B1 (ko) | 점착제 조성물 및 점착 필름 | |
CN106189943B (zh) | 粘结剂组合物及粘结膜 | |
TWI494394B (zh) | 黏著劑層及黏著膜 | |
CN103131357B (zh) | 粘合剂组合物及表面保护膜 | |
CN104592905B (zh) | 光扩散粘结剂层和光扩散粘结膜 | |
KR101351621B1 (ko) | 점착제 조성물 및 이를 이용한 광학 부재 | |
KR20110076839A (ko) | 점착제용 바인더, 그 제조방법, 이를 포함하는 점착제 조성물 및 광학 부재 | |
KR20110068888A (ko) | 점착제 조성물 및 이를 이용한 광학 부재 | |
JP7411624B2 (ja) | 粘着剤層及び粘着フィルム | |
KR101631826B1 (ko) | 점착제 조성물, 그것을 사용한 점착 필름 및 표면 보호 필름 | |
KR100405311B1 (ko) | 편광판용 아크릴계 점착제 조성물 | |
KR20180031330A (ko) | 광학 투명 점착제 조성물, 그를 포함하는 광학 투명 점착 필름 및 평판표시장치 | |
KR102403279B1 (ko) | 광학 필름용 점착제, 점착제층, 광학 부재 및 화상표시장치 | |
KR20150025843A (ko) | 점착제 조성물 | |
JP7242925B2 (ja) | 光拡散粘着フィルム | |
JP6793233B2 (ja) | 光拡散粘着フィルム | |
JP7019782B2 (ja) | 光拡散粘着フィルム | |
CN111849361B (zh) | 光学用粘着剂组合物及使用了该光学用粘着剂组合物的粘着膜、粘着片 | |
KR101881186B1 (ko) | 점착제 조성물 | |
JP6590384B2 (ja) | 光拡散粘着剤層、及び光拡散粘着フィルム | |
JP6334012B2 (ja) | 光拡散粘着剤層、及び光拡散粘着フィルム | |
JP2022159367A (ja) | 粘着剤層、粘着剤層付き偏光板、及び粘着剤層付き光学フィルム | |
JP2022118057A (ja) | 光拡散粘着剤層、光拡散粘着フィルム、及び粘着剤層付き光学フィルム |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PA0109 | Patent application |
Patent event code: PA01091R01D Comment text: Patent Application Patent event date: 20010731 |
|
PG1501 | Laying open of application | ||
A201 | Request for examination | ||
PA0201 | Request for examination |
Patent event code: PA02012R01D Patent event date: 20060503 Comment text: Request for Examination of Application Patent event code: PA02011R01I Patent event date: 20010731 Comment text: Patent Application |
|
E701 | Decision to grant or registration of patent right | ||
PE0701 | Decision of registration |
Patent event code: PE07011S01D Comment text: Decision to Grant Registration Patent event date: 20070215 |
|
GRNT | Written decision to grant | ||
PR0701 | Registration of establishment |
Comment text: Registration of Establishment Patent event date: 20070413 Patent event code: PR07011E01D |
|
PR1002 | Payment of registration fee |
Payment date: 20070413 End annual number: 3 Start annual number: 1 |
|
PG1601 | Publication of registration | ||
PR1001 | Payment of annual fee |
Payment date: 20100413 Start annual number: 4 End annual number: 4 |
|
PR1001 | Payment of annual fee |
Payment date: 20110318 Start annual number: 5 End annual number: 5 |
|
PR1001 | Payment of annual fee |
Payment date: 20120322 Start annual number: 6 End annual number: 6 |
|
FPAY | Annual fee payment |
Payment date: 20130321 Year of fee payment: 7 |
|
PR1001 | Payment of annual fee |
Payment date: 20130321 Start annual number: 7 End annual number: 7 |
|
FPAY | Annual fee payment |
Payment date: 20140319 Year of fee payment: 8 |
|
PR1001 | Payment of annual fee |
Payment date: 20140319 Start annual number: 8 End annual number: 8 |
|
LAPS | Lapse due to unpaid annual fee | ||
PC1903 | Unpaid annual fee |
Termination category: Default of registration fee Termination date: 20160309 |