KR100707241B1 - Insert for semiconductor package - Google Patents

Abstract

The present invention relates to an insert for storing a semiconductor package, and the semiconductor package can be stored without replacing the insert body provided with the latch, regardless of the size of the insertable semiconductor package, and the thickness variation of the semiconductor package having the same ball arrangement The present invention provides an insert for storing a semiconductor package having a versatility for storing a semiconductor package without having to replace a pocket guide even if it is large. That is, the present invention provides an insert for receiving a semiconductor package that is microscopically installed in a test tray, the insert body having an opening portion into which a semiconductor package can be inserted; A pocket guide inserted into the opening of the insert body so as to be movable, and on which the semiconductor package is mounted; A latch unit having a latch to prevent separation of the semiconductor package mounted on the pocket guide; And a lever plate installed on an upper portion of the insert body to position the latch on the upper surface of the semiconductor package or to evacuate the upper surface by an elastic shangdong, wherein the latch portion includes an opening of the insert body. A latch having a rotation bar rotatably installed on opposite sides adjacent to a bottom surface, and a restriction bar integrally formed with the rotation bar and extending into an opening of the insert body; And a latch driver elastically coupled between the rotation bar and the lever plate to convert the vertical movement of the lever plate into the rotational movement of the latch.

Test, Tray, Insert, Storage, Latches

Description

Insert for storing semiconductor package {INSERT FOR SEMICONDUCTOR PACKAGE}

1 is a cross-sectional view showing a semiconductor package insert according to the prior art.

2 is an exploded perspective view illustrating a test tray in which an insert for receiving a semiconductor package is installed according to an embodiment of the present invention.

3 is an exploded perspective view showing a semiconductor package insert according to an embodiment of the present invention.

4 is a cross-sectional view illustrating a closed state of the latch of FIG. 3.

5 is a cross-sectional view illustrating an open state of the latch of FIG. 3.

Description of the main parts of the drawing

10: test tray 20: insert body

21: opening 23: first guide hole

25: fastening hole 26: mounting groove

27: insertion groove 29: recess

30 latch portion 40 latch

41: rotating bar 43: restraining bar

45: shaft hole 47: slide hole

50 latch driver 51 rotating shaft

55: slide pin 57: latch button

60: pocket guide 61: pocket

63: bottom surface 65: insertion hole

67 fastening means 69 second guide hole

70: lever plate 71: lever plate stopper

100: Insert

The present invention relates to inserts for semiconductor package storage, and more particularly, to inserts for semiconductor package storage in which semiconductor packages of various sizes can be stably received.

In general, a semiconductor package manufactured by a semiconductor package manufacturing process undergoes reliability tests such as an electrical property test and a function test before shipment. Here, a handler is mainly used as a device for transferring the manufactured semiconductor package to a test apparatus and classifying the tested semiconductor package.

The handler conveys a number of semiconductor packages into a test apparatus, and electrically contacts each semiconductor package to a test head for testing by the tester. Each tested semiconductor package is then taken out of the test head and sorted according to the test results.

In this case, the handler may return the test tray in which the inserts in which the plurality of semiconductor packages are received are installed, to the test apparatus so that the test process may be performed.

The insert for accommodating a semiconductor package according to the prior art has an insert body having a pocket into which a semiconductor package can be inserted, and a latch for fixing a semiconductor package inserted into the insert body is installed in the insert body, and the latch body is opened and closed at an upper portion of the insert body. It has a structure provided with a lever plate.

Since the insert according to the prior art is limited to the type and size of the semiconductor package that can be accommodated, there is a problem that the insert must be provided for each type and size of semiconductor package.

An insert that solves this problem is disclosed in Korean Patent No. 392190. As shown in FIG. 1, the insert 116 disclosed in Korean Patent Publication No. 392190 has a pocket guide 167 having a pocket into which a semiconductor package IC is inserted, and an opening 119 of the insert body 161. It has a structure combined in a structure that can be attached to and detached from. The insert 116 is used for storing a ball grid array (BGA) type semiconductor package. Specifically, the insert 116 may be used for storing a chip scale package (CSP) even in a BGA type semiconductor package.

That is, the insert 116 disclosed in Korean Patent No. 392190 includes an insert body 161 having a latch 163 installed therein, and a pocket guide 167 corresponding to a semiconductor package type. The upper portion has a structure provided with a lever plate 162 that can open and close the latch 163. The latch 163 is positioned on the upper surface of the edge portion of the semiconductor package IC inserted into the pocket guide 167 to prevent the semiconductor package IC inserted into the pocket guide 167 from being separated.

Therefore, since the insert 116 can accommodate the semiconductor packages IC of various sizes through the exchange of the pocket guide 167, the problem that the inserts must be provided for the semiconductor packages IC of the various sizes is to some extent. I can eliminate it. For example, when the thickness of the semiconductor package IC having the same ball arrangement is almost the same, the semiconductor package IC positioned in the region where the latch 163 protrudes into the opening 119 of the insert may be accommodated.

By the way, since the movement width of the upper and lower ends of the end of the latch preventing the detachment of the semiconductor package is small, the width (hereinafter referred to as the first width) between the end of the closed latch and the bottom surface of the pocket guide is limited. Therefore, even when the semiconductor package has the same ball arrangement and the semiconductor package having a thickness greater than the first width is inserted, the latch does not operate normally, so that the semiconductor package cannot be stably supported.

On the contrary, even if they have the same ball arrangement, if the width of the semiconductor package is thin and the width (hereinafter referred to as the second width) between the top surface of the semiconductor package and the end of the closed latch is larger than the height of the ball of the semiconductor package, slight vibration may be applied to the insert. A defect that the stored semiconductor package is taken out may occur.

In order to cope with such a problem, the height of the rotation axis of the latch must be provided with some type of insert body different from each other according to the package thickness so that the second width can be kept constant according to the package thickness. That is, a problem arises in that the insert body in which the latch is installed, not the pocket guide, needs to be replaced.

In addition, the arm-shaped latch operating while maintaining the second width has a limitation in adjusting the height of the rotation axis of the latch because the constraint that the latch operation should be made in the limited space of the lever plate must be satisfied.

Accordingly, a first object of the present invention is to provide an insert for storing a semiconductor package which can accommodate the semiconductor package without replacing the insert body provided with a latch even when the external dimension of the semiconductor package is large.

It is a second object of the present invention to provide a semiconductor package storage insert that can accommodate a semiconductor package without replacing the pocket guide even if the thickness of semiconductor packages having the same ball arrangement is large.

In order to achieve the above object, there is provided an insert for receiving a semiconductor package that is microscopically installed in a test tray, the insert body having an opening portion into which a semiconductor package can be inserted; A pocket guide inserted into the opening of the insert body so as to be movable, and on which the semiconductor package is mounted; A latch unit having a latch to prevent separation of the semiconductor package mounted on the pocket guide; And a lever plate installed on an upper portion of the insert body to position the latch on the upper surface of the semiconductor package or to evacuate from the upper surface by elastic movement.

The latch unit may include a latch having a rotation bar rotatably installed on opposite sides of the insert body adjacent to the bottom surface of the insert body, and a restriction bar integrally formed with the rotation bar and extending into the opening of the insert body; And a latch driver elastically coupled between the rotation bar and the lever plate to convert the vertical movement of the lever plate into the rotational movement of the latch.

In the insert according to the present invention, in order to increase the amount of opening and closing of the latch, the rotation bar is bent upwardly inclined with respect to the restraining bar in a closed state, and the restraining bar is preferably formed longer than the rotation bar.

In the insert according to the present invention, a rotation shaft inserted in the boundary portion between the restriction bar and the rotation bar is installed in the insert body so that the latch can be opened and closed while rotating the axis between the restriction bar and the rotation bar.

In the insert according to the present invention, the rotary bar is formed with a slide hole in the longitudinal direction in which the rotating shaft is installed.

In the insert according to the present invention, the latch driver includes a slide pin inserted into the slide hole of the rotary bar and a latch button coupled to both ends of the slide pin and elastically coupled to protrude to a predetermined height on the upper surface of the insert body. Include. At this time, the upper end of the latch button is in close contact with the lower surface of the lever plate.

In the insert according to the invention, the slide pin is located above the rotary shaft when the latch is closed, and the slide pin is located below the rotary shaft when the latch is opened.

In the insert according to the present invention, an insertion groove into which the restraining bar of the evacuated latch is inserted is formed in the inner surface of the insert body in which the restraining bar of the latch protrudes.

In the insert according to the present invention, the pocket guide is formed with a pocket into which the semiconductor package can be inserted, and an insertion hole into which the external connection terminal of the semiconductor package is inserted is formed at the bottom of the pocket.

And the pocket guide is inserted through the opening of the lower surface of the insert body, the pocket guide inserted into the insert body by the coupling means is installed in the insert body to be able to move.

Hereinafter, with reference to the accompanying drawings will be described in detail an embodiment of the present invention.

2 is an exploded perspective view illustrating a test tray 10 in which an insert 100 for receiving a semiconductor package is installed according to an exemplary embodiment of the present invention. Referring to FIG. 2, the test tray 10 is provided with a plurality of comb teeth 13 parallel to the rectangular frame 12 at equal intervals, and is provided on the side 12a of the frame facing both sides of these comb teeth 13. Each of the plurality of attachment pieces 14 is provided to protrude at equal intervals. The insert storage part 15 is comprised between these comb teeth 13, between the comb teeth 13 and the side 12a, and the two attachment pieces 14. As shown in FIG.

One insert 100 is accommodated in each insert accommodating part 15, respectively, and this insert 100 is installed in two attachment pieces 14 in a floating state (slidable state) using a fastener. For this reason, the fastening holes 25 with respect to the attachment piece 14 are formed in the both ends of the insert 100, respectively. Such inserts 100 are, for example, about 16 × 4 in one test tray 10, but are not limited thereto.

At this time, each insert 100 has the same shape and the same dimension, the opening part 21 is formed in each insert 100, and the semiconductor package IC is accommodated in the opening part 21. As shown in FIG. The insert 100 according to the present embodiment accommodates a BGA type semiconductor package, and specifically disclosed an example used for storing a CSP.

Insert 100 according to an embodiment of the present invention is shown in FIGS. 3 to 5. 3 is an exploded perspective view showing a semiconductor package insert 100 according to an embodiment of the present invention. 4 is a cross-sectional view illustrating a state in which the latch 40 of FIG. 3 is closed. 5 is a cross-sectional view illustrating an open state of the latch 40 of FIG. 3.

3 to 5, the insert 100 according to the embodiment of the present invention includes an insert body 20, a pocket guide 60, a latch portion 30 having a latch 40, and a lever plate 70. It is configured to include.

The insert body 20 has an opening 21 in which a semiconductor package IC can be accommodated. The pocket guide 60 is inserted into the opening 21 of the insert body so as to be able to move in a microscopic manner, and the semiconductor package IC is mounted thereon. The latch unit 30 includes a latch 40 to prevent the semiconductor package IC from being mounted on the pocket guide 60. In addition, the lever plate 70 is installed on the upper portion of the insert body 20 to position the latch 40 on the upper surface of the semiconductor package IC or evacuate from the upper surface.

In particular, the latch unit 30 according to the present embodiment includes a latch 40 and a latch driver 50 that opens and closes the latch 40. The latch 40 is rotatably installed on both sides of the insert body opening 21 facing each other in close proximity to the bottom of the insert body 21, and is formed integrally with the rotation bar 41 to open the insert body 21 of the insert body. It includes a restraining bar 43 extending inward. In addition, the latch driver 50 is elastically coupled between the rotation bar 41 and the lever plate 70 to convert the vertical movement of the lever plate 70 into the rotational movement of the latch 40.

Therefore, the insert 100 according to the present embodiment increases the opening / closing amount of the latch 40 while maintaining the clearance between the insert body 20 and the lever plate 70, thereby greatly increasing the external dimensions of the semiconductor package IC. Even in this case, the semiconductor package IC may be stored without replacing the insert body 20 in which the latch 40 is installed. In addition, even if the thickness variation of the semiconductor package IC having the same ball HB arrangement is large, the semiconductor package IC may be accommodated without replacing the pocket guide 60.

Hereinafter, the insert 100 according to the present embodiment will be described in detail.

The insert body 20 has a first guide hole 23 formed vertically on both sides of the opening 21 facing each other, and can be fastened to the test tray near the first guide hole 23. The fastening hole 25 is formed. The first guide hole 23 guides the alignment of the position of the semiconductor package transfer means in loading / unloading the semiconductor package (IC), and guides the alignment of the test socket with respect to the insert 100 when testing.

The pocket guide 60 has a pocket 61 into which a semiconductor package can be inserted, and a ball HB of the semiconductor package is exposed on the bottom surface 63 of the pocket on which the semiconductor package IC is mounted. An insertion hole 65 is formed. Although the insertion hole 65 of the present embodiment has disclosed a form in which the entire ball HB formed on the lower surface of the semiconductor package IC can be exposed, various modifications are possible in addition to this. For example, insertion holes may be formed corresponding to each ball, or a second insertion hole having an opening shape may be formed at the center of the first insertion hole and the first insertion hole into which two rows of balls located on the outer side of the balls are fitted. have.

The pocket guide 60 is inserted through the opening 21 of the lower surface of the insert body 20, and is installed in the insert body 20 in a three-dimensional manner by the fastening means 67. As disclosed in this embodiment, the fastening means 67 may be implemented in the form of a flexible hook integrally formed with the pocket guide 60. As other fastening means, a tab pin or a pin may be used, as disclosed in Korean Patent No. 392190.

Moreover, the 2nd guide hole 69 is formed in the pocket guide 60 of both insertion holes 65. As shown in FIG. Therefore, when mounting the semiconductor package IC in the pocket 61 of the pocket guide, the position of the balls HB of the semiconductor package is aligned by the insertion hole 65 of the pocket guide, and the second guide hole 67 Since the alignment between the balls HB and the contact pins (not shown) of the test socket is performed, the alignment between the balls HB and the contact pins of the test socket can be realized with high accuracy.

In particular, while the latch 40 according to the present embodiment is configured to open and close a large amount, the latch 40 is installed to maintain the clearance between the insert body 20 and the lever plate 70.

That is, the latch 40 has a constraining bar 43 formed longer than the rotation bar 41, and the ends of the constraining bar 43 provided on both sides do not interfere with each other, and the end of the constraining bar 43 closes with the insert 100. Protruding out of the upper surface of the) is formed long in a range that does not interfere with other devices. For example, in the present embodiment, an example in which both latches 40 are provided at positions facing each other is disclosed, but the latches 40 may be alternately installed. When the latches are alternately installed, the ends of both restraining bars may be installed to cross each other.

At this time, the rotation bar 41 is bent upwardly inclined with respect to the restraining bar 43 in a closed state. The rotating shaft 51 is inserted into the shaft hole 45 formed at the boundary between the restraining bar 43 and the rotating bar 41 to be fixed to the insert body 20. And the slide bar 47 is provided with the slide hole 47 in the longitudinal direction in which the rotating shaft 51 was provided. The reason why the latch 40 is configured in this way is that the rotation angle of the restraining bar 43 can be increased while minimizing the vertical movement of the rotation bar 41.

Therefore, while maintaining the clearance between the insert body 20 and the lever plate 70 while minimizing the vertical movement of the rotary bar 41, it is possible to increase the rotation angle of the latch 40.

The latch driver 50 is coupled to both ends of the rotation shaft 51, the slide pin 55 inserted into the slide hole 47 of the rotation bar, and the slide pin 55, and is fixed to the upper surface of the insert body 20. The latch button 57 is elastically coupled to protrude to the height of. At this time, the upper end of the latch button 57 is in close contact with the lower surface of the lever plate (70). A coil spring 59 is coupled to the latch button 57 so that the restraining bar 43 can maintain a predetermined pressing force while the latch 57 is closed. The coil spring 59 is restrained between the latch button 57 and the installation groove 26 of the insert body in which the latch button 57 is installed. In the insert 100 according to the present embodiment, since the latch button 57 is provided at both sides of the latch 40, four latch buttons 57 are installed.

At this time, when the latch 40 is closed, the slide pin 55 is positioned above the rotary shaft 51, and when the latch 40 is opened, the slide pin 55 is positioned below the rotary shaft 51 so that the slide pin 55 is positioned below the rotary shaft 51. Go along 47).

An insertion groove 27 into which the restraining bar 43 of the evacuated latch is inserted is formed on the inner surface of the insert body 20 from which the restraining bar 43 of the latch protrudes.

The coil spring 73 is interposed between the lever plate 70 and the insert body 20 so that the lever plate 70 can be elastically moved up and down with respect to the insert body 20. At this time, the concave portion 29 is formed on the outer surface of the insert body 20 to correspond to the convex portion 71 formed on the lever plate 70 so that the lever plate 70 can move up and down by being constrained by the insert body 20. Formed. The recess 29 is formed in a long slot shape to guide the vertical movement of the lever plate 70.

A method of accommodating the semiconductor package IC in the insert 100 according to the present embodiment having the above structure will be described below. First, the semiconductor package IC is transferred by the semiconductor package transfer means, and then the robot of the transfer means presses the lever plate 70 to evacuate the latch 40 from the pocket 61 to the insertion groove 27 so that the pocket 61 ) Is aligned with the pocket 61 of the pocket guide.

At this time, the lever plate 70 descends the latch button 77 while descending to the upper surface of the insert body 20. The slide pin 53, which is located above the rotary shaft 51, is lowered below the rotary shaft 51 by the lowering of the latch button 57, thereby rotating about the rotary shaft 51 to rotate the rotary bar 41 downward. Down and the restraining bar 43 rises. The restraining bar 43 is evacuated from the pocket 61 of the pocket guide and inserted into the insertion groove 27 of the insert body.

At this time, the restraining bar 43 of the latch rotates 70 degrees or more about the rotation shaft 51 to open the pocket 51 of the pocket guide.

In this state, the semiconductor package IC transferred by the transfer means is inserted into the pocket 61 of the pocket guide and mounted thereon. At this time, the balls HB of the semiconductor package are inserted into the insertion holes 65 of the pocket guide.

Next, the robot of the transfer means is lifted and separated from the lever plate 70, and the lever plate 70 is raised by the coil spring 71 interposed between the lever plate 70 and the insert body 20. In addition, when the latch button 57 is raised by the coil spring 59 installed in the latch button 57, the restraining bar 43 is in place to prevent the semiconductor package IC from being separated in the pocket guide 60. do.

Therefore, since the insert 100 according to the present embodiment can increase the amount of opening and closing of the latch 40 while maintaining the clearance between the insert body 20 and the lever plate 70, the external dimensions of the semiconductor package IC Even if the deviation is large, the semiconductor package IC may be stored without replacing the insert body 20 having the latch 40 installed therein. That is, since the restraining bars provided on both sides extend close to the center portion of the semiconductor package, the semiconductor package IC existing within the range restrained by the restraining bar 43 of the latch can be restrained. Of course, when the dimensional deviation of the semiconductor package IC is large, it may be necessary to replace the pocket guide 60 necessary for accommodating the semiconductor package IC.

In the case of the semiconductor package IC having the same outer size, even if the variation in thickness is large, the latch 40 can be stored without replacing the pocket guide 60 because the latch 40 is large. In this case, the latch 40 is configured to maintain a height corresponding to the thickness of the semiconductor package having the smallest thickness that can be accommodated in the insert 100 so as to prevent separation of the semiconductor packages IC having various thicknesses. It is desirable to install it. When the thick semiconductor package is accommodated, the restraining bar 43 of the latch contacts the upper surface of the semiconductor package.

After the test process is completed, the method of taking out the semiconductor package IC stored in the insert 100 proceeds in the reverse order of the above-described storing method, and thus, detailed description thereof will be omitted.

On the other hand, the embodiments of the present invention disclosed in the specification and drawings are merely presented specific examples to aid understanding, and are not intended to limit the scope of the present invention. In addition to the embodiments disclosed herein, it is apparent to those skilled in the art that other modifications based on the technical idea of the present invention may be implemented.

Therefore, according to the structure of the present invention, it is possible to maximize the amount of opening and closing of the latch installed on the insert body while maintaining the clearance between the insert body and the lever plate, so that even if the external dimension deviation of the semiconductor package is large, The semiconductor package can be stored without replacement. That is, since the restraining bars provided on both sides extend close to the center portion of the semiconductor package, the semiconductor package existing within the range restrained by the restraining bars of the latch can be restrained.

In the case of a semiconductor package having the same outer size, the semiconductor package can be stored without replacing the pocket guide because the latch opening and closing amount is large even if the thickness variation is large.

Claims (9)

An insert for storing a semiconductor package which is installed in the test tray in a microscopic manner, An insert body having an opening portion into which a semiconductor package can be inserted; A pocket guide inserted into the opening of the insert body so as to be movable, and on which the semiconductor package is mounted; A latch unit having a latch to prevent separation of the semiconductor package mounted on the pocket guide; And And a lever plate installed on an upper portion of the insert body to position the latch on the upper surface of the semiconductor package or to evacuate from the upper surface by elastic shankdong. The latch unit, A latch having rotatable bars rotatably installed on opposite sides adjacent to the bottom surface of the open portion of the insert body, and a constraint bar integrally formed with the rotary bar and extending into the open portion of the insert body; And a latch driver elastically coupled between the rotation bar and the lever plate to convert the vertical movement of the lever plate into the rotational movement of the latch. The insert of claim 1, wherein the rotation bar is bent upwardly inclined with respect to the restriction bar in a closed state. The insert of claim 2, wherein the restraining bar is formed to be relatively longer than the rotation bar, and a rotation shaft coupled to a boundary portion between the restraining bar and the rotation bar is installed on the insert body. 4. The insert for accommodating semiconductor package according to claim 3, wherein the rotating bar has a slide hole formed in a longitudinal direction in which the rotating shaft is installed. The method of claim 4, wherein the latch driver, A slide pin inserted into the slide hole of the rotating bar; And latch buttons coupled to both ends of the slide pin and elastically coupled to protrude to an upper surface of the insert body at a predetermined height. An upper end of the latch button is in close contact with the lower surface of the lever plate, the insert for receiving a semiconductor package. The insert of claim 5, wherein the slide pin is positioned above the rotation axis when the latch is closed, and the slide pin is located below the rotation axis when the latch is opened. 7. The insert for accommodating semiconductor package according to claim 6, wherein an inserting groove into which the restraining bar of the latch is inserted is formed in an inner surface of the insert body in which the restraining bar of the latch protrudes. 2. The pocket guide of claim 1, wherein a pocket into which the semiconductor package can be inserted is formed, and an insertion hole into which the external connection terminal of the semiconductor package is inserted is formed at the bottom of the pocket guide. Insert for semiconductor package storage. The method of claim 8, wherein the pocket guide is inserted through the opening of the lower surface of the insert body, characterized in that it further comprises a coupling means for slidingly installing the pocket guide inserted in the insert body to the insert body Insert for storing semiconductor package.

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