KR100697042B1 - Device for inspecting defects on board and inspection method using the same - Google Patents

Abstract

The present invention relates to an apparatus for inspecting a defect of a substrate and an inspection method using the same. Disclosed is a device for inspecting a defect of an object by irradiating light to the object with a probe, comprising: a lens having an enlarged spot size of light irradiated to the object, the light having a spot size enlarged by the lens; Is irradiated to the object, and the defect of the object is inspected by the difference between the wavelength signal of the light reflected from the object when there is no defect and the wavelength signal of the light reflected when there is a defect. According to this, it is possible to detect the presence or absence of a defect even with a relatively large spot size in a short time, especially on the entire surface of a large substrate. Accordingly, the defect measurement time can be shortened, the memory of the computer can be saved, and the defect detection of a large substrate is advantageous.

Liquid crystal display, glass substrate

Description

Apparatus for Inspecting Defects of Substrate and Inspection Methods Using the Same {APPARATUS FOR INSPECTION DEFECTS ON SUBSTRATE AND METHOD FOR INSPECTING SUBSTRATE USING THE SAME}

1 is a block diagram showing a substrate inspection apparatus according to the prior art.

2 is a block diagram showing a substrate inspection apparatus according to an embodiment of the present invention.

3 is a plan view showing an example of a substrate inspection method using a substrate inspection apparatus according to an embodiment of the present invention.

4 is a plan view showing another example of a substrate inspection method using a substrate inspection apparatus according to an embodiment of the present invention.

<Description of Symbols for Major Parts of Drawings>

100; Substrate inspection apparatus 110; Probe

120; Light source 130; spectroscope

140; A controller 150; lens

160; Display unit 200; Board

300; Nozzle

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate inspection apparatus and an inspection method, and more particularly, to an apparatus for inspecting a defect present on a glass substrate adopted as a substrate of a flat display element and an inspection method using the same.

In order to detect scratches, foreign matters and other defects that may be present in a predetermined film coated on a glass substrate widely used in a liquid crystal display device which is a kind of flat panel display device, an inspection apparatus configured as shown in FIG. 1 is used.

Referring to FIG. 1, the conventional substrate inspection apparatus 10 generally includes a probe 11, a light source 12, a spectrometer 13, and a controller 14. The apparatus 10 irradiates light onto the substrate 20 using the probe 11. If a defect d such as a foreign material or scratch is present on the substrate 20, a wavelength different from that of the initially irradiated light is applied. A light signal comes in. Accordingly, the presence of the defect d on the substrate 20 is checked.

By the way, it is common to measure the conventional board | substrate inspection apparatus 10 by the spot size of a comparatively small size. Therefore, when inspecting a large board | substrate with the conventional board | substrate inspection apparatus 10, since a measuring point has many, a long measurement time is required. Accordingly, the amount of memory of the computer used in the conventional substrate inspection apparatus 10 has to be increased, and there is a problem that the productivity of the product is hindered by the long measurement time.

The present invention has been made to solve the above-mentioned problems in the prior art, an object of the present invention is to provide a substrate inspection apparatus and a substrate inspection method using the same that can significantly reduce the defect measurement time of the substrate.

The present invention that can achieve the above object is characterized in that the large size of the spot irradiated to the substrate to inspect the entire large substrate for a relatively short time.

In the apparatus for inspecting a substrate according to an embodiment of the present invention capable of implementing the above characteristics, the apparatus for inspecting a defect of the object by irradiating light to the object with a probe, the lens for expanding the spot size of the light irradiated to the object And irradiating the object with light having a spot size enlarged by the lens, as a difference between a wavelength signal of light reflected from the object when there is no defect and a wavelength signal of reflected light when there is a defect. It is characterized by inspecting the defect of the object. The lens may be mounted to the probe.

Substrate inspection apparatus according to a modified embodiment of the present invention that can implement the above features, and a light source for generating light; A probe for irradiating light to the object; A lens for enlarging the spot size of the light irradiated from the probe; A spectroscope for separating light reflected from the object for each wavelength; And a controller for controlling the spectrometer. The display unit may further include a display unit that visually implements the presence or absence of a defect of the object.

Substrate inspection method according to an embodiment of the present invention that can implement the above features, comprising the steps of coating a film on the substrate by operating the nozzle; And inspecting a defect present in the film coated on the substrate by operating the inspection apparatus in a direction different from the movement direction of the nozzle in parallel with the movement operation of the nozzle.

In the method according to an embodiment of the present invention, the step of inspecting the defect present in the film coated on the substrate by operating the inspection apparatus in a direction different from the movement direction of the nozzle in parallel with the movement operation of the nozzle The nozzle may coat a predetermined film on the substrate while moving in a linear direction on the substrate, and the inspection apparatus may inspect a defect of the film coated on the substrate while moving in a zigzag direction on the substrate.

 In the method according to an embodiment of the present invention, the step of inspecting the defect present in the film coated on the substrate by operating the inspection apparatus in a direction different from the movement direction of the nozzle in parallel with the movement operation of the nozzle And the nozzle coats a predetermined film on the substrate while moving on the substrate in a first direction, and the inspection apparatus moves on the substrate while moving in a second direction that is generally orthogonal to the first direction. Defects of the film coated on the surface can be inspected.

 In the method according to the embodiment of the present invention, the nozzle and the inspection apparatus may move on the substrate in conjunction with each other or move independently of each other.

According to the present invention, defects including foreign matter or scratches present on the surface of the substrate itself or on the film coated on the substrate can be detected as light having a spot size of a relatively large size compared to the conventional one. Therefore, defect measurement time can be shortened, and it is particularly advantageous for detecting defects of large substrates.

Hereinafter, a substrate inspection apparatus and a substrate inspection method using the same according to the present invention will be described in detail with reference to the accompanying drawings.

Advantages over the present invention and prior art will become apparent through the description and claims with reference to the accompanying drawings. In particular, the present invention is well pointed out and claimed in the claims. However, the present invention may be best understood by reference to the following detailed description in conjunction with the accompanying drawings. Like reference numerals in the drawings denote like elements throughout the various drawings.

(Example)

2 is a block diagram showing a substrate inspection apparatus according to an embodiment of the present invention. Referring to FIG. 2, the substrate inspection apparatus 100 according to an exemplary embodiment of the present invention irradiates light from a light source 120 to a substrate 200, which is an inspection object, using a probe 110. The substrate 200 may be, for example, a glass substrate that may be applied to a flat panel display device (FPD) such as a liquid crystal display (LCD). As the probe 110, an optical fiber probe using an optical fiber may be adopted.

Light irradiated from the probe 110 is absorbed, scattered, or reflected by a film coated on the substrate 200. At this time, the reflected light coming back to the probe 110 is analyzed by a spectrometer (130: Spectrometer). The spectrometer 130 is a kind of photodetecting device which is a mechanism for separating the collected light by wavelength band using a prism. Through the spectroscope 130, the wavelength signal (normal value) of the light when there is no defect (d) and the wavelength signal (distortion) of the light when there is no defect (d) on the substrate 200 Tooth) difference is detected to determine the presence of a defect (d) on the substrate (200). This measurement system is controlled by a controller 140. In addition, when the display unit 160 is further included, information on whether a defect is present is visually displayed to the outside so that the operator can take necessary follow-up.

On the other hand, the probe 110 preferably further includes a mechanism 150 for expanding the spot size of the irradiated light relative to the conventional. Such a mechanism may be, for example, a lens 150 that can be enlarged larger than the spot size of the original light exiting from the probe 110. As such, when the spot size of the light becomes larger than before, the time required for measuring the large substrate can be shortened as described below.

The defect inspection method of the substrate 200 using the substrate inspection apparatus 100 configured as described above is as follows.

3 is a plan view illustrating an example of a defect inspection method of the substrate 200 using the substrate inspection apparatus 100 described above. Referring to FIG. 3, it is assumed that, for example, the nozzle 300 for coating the upper surface of the substrate 200 with a predetermined film moves in the Y direction along the long side of the substrate 200. Here, it is assumed that the length of the nozzle 300 is not smaller than the length of the short side of the substrate 200, so that the coating operation of the entire substrate 200 can be performed only by moving once in the Y direction.

The nozzle 300 moves in the Y direction to coat a film on the upper surface of the substrate 200. At the same time as or immediately after the coating process by the nozzle 300, the substrate inspection apparatus 100 moves on the substrate 200 coated with a predetermined film and inspects for the presence of a defect. In the substrate inspection process, it may be said that the substrate inspection apparatus 100 scans the entire substrate 200 while moving as little as possible, which is preferable for productivity improvement. Therefore, the substrate inspection apparatus 100 performs an operation of inspecting defects of the substrate 200 while moving in the X direction and simultaneously with the movement of the nozzle 300 in the Y direction immediately after or immediately afterwards. It is preferable. The nozzle 300 and the substrate inspection apparatus 100 may be arbitrarily designed to operate in conjunction with each other or to operate independently of each other.

The resulting movement direction of the substrate inspection apparatus 100 becomes the zigzag direction, that is, the Z direction. In this case, as mentioned above, since the lens 150 is installed in the probe 110, the substrate inspection apparatus 100 may irradiate the surface of the substrate 200 with light having a relatively large spot size. If there is a defect in the substrate 200, light is irradiated to a large area, and thus it can be seen that a defect exists in the area. Therefore, the substrate inspection apparatus 100 of the present embodiment can perform the defect inspection operation on the entire surface of the substrate 200, in particular, the entire surface of the large substrate in a relatively short time. The presence or absence of a defect uses the difference between the wavelength signal (normal value) of the reflected light when there is no defect and the wavelength signal (distortion value) of the light when there is a defect as described above.

On the other hand, since the substrate inspection apparatus 100 moves in a zigzag manner on the substrate 200, there may be an area (hatched portion) that the substrate inspection apparatus 100 does not inspect. In the zigzag method, when the moving speeds of the substrate inspection apparatus 100 in the X and Y directions are appropriately adjusted, it is possible to minimize the time between inspections.

4 is a plan view illustrating another example of a defect inspection method of the substrate 200 using the substrate inspection apparatus 100 described above. Referring to FIG. 4, the nozzle 300 moves and coats the surface of the substrate 200 in the Y direction in units of steps. At this time, the substrate inspection apparatus 100 detects a defect while moving in the X direction. When the substrate inspection apparatus 100 moves in this manner, the entire region of the substrate 200 may be scanned without missing, so that the region that the substrate inspection apparatus 100 does not inspect does not occur.

The foregoing detailed description illustrates the present invention. In addition, the foregoing description merely shows and describes preferred embodiments of the present invention, and the present invention can be used in various other combinations, modifications, and environments. And, it is possible to change or modify within the scope of the concept of the invention disclosed in this specification, the scope equivalent to the written description, and / or the skill or knowledge in the art. The above-described embodiments are for explaining the best state in carrying out the present invention, the use of other inventions such as the present invention in other state known in the art, and the specific fields of application and uses of the present invention. Various changes are also possible. Accordingly, the detailed description of the invention is not intended to limit the invention to the disclosed embodiments. Also, the appended claims should be construed to include other embodiments.

As described in detail above, according to the present invention, it is possible to detect the presence or absence of a defect even on the entire surface of a large substrate in a short time as light having a relatively large spot size. Accordingly, the defect measurement time can be shortened, the memory of the computer can be saved, and the defect detection of a large substrate is advantageous.

Claims (7)

An apparatus for inspecting a defect of an object by irradiating light to the object with a probe, A lens having an enlarged spot size of light irradiated to the object to irradiate the object with light having a spot size enlarged by the lens to reflect the wavelength signal of light reflected when there is no defect and a defect when there is a defect The substrate defect inspection apparatus, characterized in that for inspecting the defect of the object by the difference between the wavelength signal of the light. The method of claim 1, And the lens is mounted to the probe. A light source for generating light; A probe for irradiating light to the object; A lens for enlarging the spot size of light emitted from the probe; A spectroscope for separating light reflected from the object for each wavelength; A controller for controlling the spectrometer; Substrate defect inspection apparatus comprising a. The method of claim 3, And a display unit for visually realizing whether or not a defect exists in the object. Operating the nozzle to coat the film on the substrate; Inspecting defects present in the film coated on the substrate by operating an inspection apparatus in a direction different from the moving direction of the nozzle in parallel with the nozzle for the coating operation; Substrate defect inspection method comprising a. The method of claim 5, The inspection of the defects present in the film coated on the substrate by operating the inspection device in a direction different from the moving direction of the nozzle in parallel with the nozzle for the coating operation, The nozzle is a substrate defect, characterized in that for coating the film on the substrate while moving in a linear direction on the substrate, the inspection device inspects the defect of the film coated on the substrate while moving in a zigzag direction on the substrate method of inspection. The method of claim 5, The inspection of the defects present in the film coated on the substrate by operating the inspection device in a direction different from the moving direction of the nozzle in parallel with the nozzle for the coating operation, The nozzle coats a film on the substrate while moving on the substrate in a first direction, and the inspection apparatus moves the film on the substrate while moving in a second direction orthogonal to the first direction. A board defect inspection method comprising inspecting a defect.

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