KR100669802B1 - 박막 트랜지스터, 이의 제조 방법 및 상기 박막트랜지스터를 구비한 평판 표시 장치 - Google Patents
박막 트랜지스터, 이의 제조 방법 및 상기 박막트랜지스터를 구비한 평판 표시 장치 Download PDFInfo
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- KR100669802B1 KR100669802B1 KR1020040101523A KR20040101523A KR100669802B1 KR 100669802 B1 KR100669802 B1 KR 100669802B1 KR 1020040101523 A KR1020040101523 A KR 1020040101523A KR 20040101523 A KR20040101523 A KR 20040101523A KR 100669802 B1 KR100669802 B1 KR 100669802B1
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- thin film
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/60—Forming conductive regions or layers, e.g. electrodes
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
- H10K10/40—Organic transistors
- H10K10/46—Field-effect transistors, e.g. organic thin-film transistors [OTFT]
- H10K10/462—Insulated gate field-effect transistors [IGFETs]
- H10K10/464—Lateral top-gate IGFETs comprising only a single gate
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
- H10K10/40—Organic transistors
- H10K10/46—Field-effect transistors, e.g. organic thin-film transistors [OTFT]
- H10K10/462—Insulated gate field-effect transistors [IGFETs]
- H10K10/468—Insulated gate field-effect transistors [IGFETs] characterised by the gate dielectrics
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
- H10K77/10—Substrates, e.g. flexible substrates
- H10K77/111—Flexible substrates
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/10—Organic polymers or oligomers
- H10K85/111—Organic polymers or oligomers comprising aromatic, heteroaromatic, or aryl chains, e.g. polyaniline, polyphenylene or polyphenylene vinylene
- H10K85/113—Heteroaromatic compounds comprising sulfur or selene, e.g. polythiophene
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
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- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Abstract
Description
Claims (13)
- 게이트 전극;상기 게이트 전극과 절연된 소스 및 드레인 전극;상기 게이트 전극과 절연되고, 상기 소스 및 드레인 전극에 각각 접하는 유기 반도체층;상기 소스 및 드레인 전극 및 상기 유기 반도체층과 상기 게이트 전극을 절연시키는 절연층;상기 게이트 전극에 연결된 제1배선; 및상기 소스 및 드레인 전극 중 어느 하나에 연결된 제2배선을 구비하고,상기 게이트 전극, 상기 제1배선, 상기 소스 및 드레인 전극 및 상기 제2배선 중 적어도 하나가 도전성 나노 입자 및 경화성(curable) 수지의 경화물을 포함한 것을 특징으로 하는 박막 트랜지스터.
- 제1항에 있어서, 상기 도전성 나노 입자는 Au, Ag, Cu, Ni, Pt, Pd 및 Al 나노 입자로 이루어진 군으로부터 선택된 하나 이상인 것을 특징으로 하는 박막 트랜지스터.
- 제1항에 있어서, 상기 도전성 나노 입자는 2.0m2/g 내지 10.0m2/g의 비표면적을 갖는 것을 특징으로 하는 박막 트랜지스터.
- 제1항에 있어서, 상기 도전성 나노 입자는 10nm 내지 100nm의 평균 입경을 갖는 것을 특징으로 하는 박막 트랜지스터.
- 제1항에 있어서, 상기 경화성 수지의 경화물은 프탈레이트계 수지, 에폭시계 수지, 우레아계 수지, 멜라민계 수지, 아세틸렌계 수지, 피롤(pyrrole)계 수지, 티오펜계 수지 및 올레핀계 수지로 이루어진 군으로부터 선택된 하나 이상인 것을 특징으로 하는 박막 트랜지스터.
- 제1항에 있어서, 상기 경화성 수지의 경화물은 폴리에틸렌프탈레이트, 폴리부틸렌프탈레이트, 폴리디히드록시메틸사이클로헥실 테레프탈레이트, 우레아-포름알데히드 수지, 멜라민(2,4,6-트리아미노-1,3,5-트리아진)-포름알데히드 수지, 멜라민-우레아 수지, 멜라민-페놀 수지, 폴리아세틸렌, 폴리피롤, 폴리(3-알킬티오펜), 폴리페닐렌 비닐리덴 및 폴리티에틸 비닐리덴으로 이루어진 군으로부터 선택된 하나 이상인 것을 특징으로 하는 박막 트랜지스터.
- 제1항에 있어서, 상기 게이트 전극, 상기 제1배선, 상기 소스 및 드레인 전 극 및 상기 제2배선 중 적어도 하나의 표면 조도가 5Å 내지 500Å인 것을 특징으로 하는 박막 트랜지스터.
- 제1항에 있어서, 상기 유기 반도체층은 펜타센(pentacene), 테트라센(tetracene), 안트라센(anthracene), 나프탈렌(naphthalene), 알파-6-티오펜, 알파-4-티오펜, 페릴렌(perylene) 및 그 유도체, 루브렌(rubrene) 및 그 유도체, 코로넨(coronene) 및 그 유도체, 페릴렌테트라카르복실릭디이미드(perylene tetracarboxylic diimide) 및 그 유도체, 페릴렌테트라카르복실릭디안하이드라이드(perylene tetracarboxylic dianhydride) 및 그 유도체, 폴리티오펜 및 그 유도체, 폴리파라페닐렌비닐렌 및 그 유도체, 폴리파라페닐렌 및 그 유도체, 폴리플로렌 및 그 유도체, 폴리티오펜비닐렌 및 그 유도체, 폴리티오펜-헤테로고리방향족 공중합체 및 그 유도체, 나프탈렌의 올리고아센 및 이들의 유도체, 알파-5-티오펜의 올리고티오펜 및 이들의 유도체, 금속을 함유하거나 함유하지 않은 프탈로시아닌 및 이들의 유도체, 파이로멜리틱 디안하이드라이드 및 그 유도체, 파이로멜리틱 디이미드 및 이들의 유도체로 이루어진 군으로부터 선택된 하나 이상의 물질인 것을 특징으로 하는 박막 트랜지스터.
- 도전성 나노 입자 및 경화성 수지를 포함하는 경화성 페이스트 조성물을 제공하는 단계;상기 경화성 페이스트 조성물을 기판에 도포하는 단계;상기 경화성 페이스트 조성물을 게이트 전극, 상기 게이트 전극에 연결된 제1배선, 소스 및 드레인 전극 및 상기 소스 및 드레인 전극 중 어느 하나에 연결된 제2배선 중 적어도 하나의 패턴을 따라 경화시키는 단계; 및미경화된 경화성 페이스트 조성물을 제거하여, 게이트 전극, 상기 제1배선, 소스 및 드레인 전극 및 상기 제2배선 중 적어도 하나를 형성하는 단계;를 포함하는 박막 트랜지스터의 제조 방법.
- 제9항에 있어서, 상기 경화성 페이스트 조성물이 TEOS, 터피네올(terpineol), 부틸 카르비톨(butyl carbitol:BC), 부틸 카르비톨 아세테이트(butyl carbitol acetate:BCA), 톨루엔(toluene) 및 텍사놀(texanol)로 이루어진 군으로부터 선택된 하나 이상의 비이클을 더 포함하는 것을 특징으로 하는 박막 트랜지스터의 제조 방법.
- 제9항에 있어서, 상기 경화성 페이스트 조성물의 점도가 10cps 내지 100cps인 것을 특징으로 하는 박막 트랜지스터의 제조 방법.
- 제9항에 있어서, 상기 경화 단계를 UV 레이저 또는 IR 레이저를 이용하여 수행하는 것을 특징으로 하는 박막 트랜지스터의 제조 방법.
- 제1항 내지 제8항 중 어느 한 항의 박막 트랜지스터를 각 화소에 구비하고, 상기 박막 트랜지스터의 소스 전극 또는 드레인 전극에 화소 전극이 접속된 것을 특징으로 하는 평판 표시 장치.
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CNA2005101217399A CN1979910A (zh) | 2004-12-04 | 2005-12-02 | 薄膜晶体管、其制造方法以及使用薄膜晶体管的平板显示器 |
US11/291,928 US20060118789A1 (en) | 2004-12-04 | 2005-12-02 | Thin film transistor, method of manufacturing the same, and flat panel display using the thin film transistor |
EP05111624.2A EP1677374B1 (en) | 2004-12-04 | 2005-12-02 | Method of manufacturing an organic thin film transistor |
JP2005351028A JP2006165559A (ja) | 2004-12-04 | 2005-12-05 | 薄膜トランジスタ、その製造方法及び薄膜トランジスタを備えた平板表示装置 |
US12/078,171 US20080182356A1 (en) | 2004-12-04 | 2008-03-27 | Thin film transistor, method of manufacturing the same, and flat panel display using the thin film transistor |
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US8461628B2 (en) * | 2005-03-18 | 2013-06-11 | Kovio, Inc. | MOS transistor with laser-patterned metal gate, and method for making the same |
JP2007073856A (ja) * | 2005-09-09 | 2007-03-22 | Sony Corp | 導電性パターンの形成方法、半導体装置の製造方法、および有機電界発光素子の製造方法 |
KR100730192B1 (ko) * | 2005-12-24 | 2007-06-19 | 삼성에스디아이 주식회사 | 박막 트랜지스터 및 도전막 제조 방법 |
JP2009194351A (ja) * | 2007-04-27 | 2009-08-27 | Canon Inc | 薄膜トランジスタおよびその製造方法 |
KR100878872B1 (ko) * | 2007-09-03 | 2009-01-15 | 성균관대학교산학협력단 | 나노결정 전도성 탄소층을 게이트 전극으로 포함하여 이루어진 유기 박막 트랜지스터, 이의 제조방법 및 이를 포함하여 이루어진 유기 반도체 소자 |
KR100934260B1 (ko) * | 2007-09-14 | 2009-12-28 | 삼성모바일디스플레이주식회사 | 박막트랜지스터와 그의 제조방법, 유기전계발광표시장치와그의 제조방법 및 레이저 열 전사법용 도너기판 |
KR100917709B1 (ko) * | 2007-10-23 | 2009-09-21 | 에스케이씨 주식회사 | 전도성 고분자 용액 조성물을 이용한 고분자 막 |
JP5008146B2 (ja) * | 2008-02-29 | 2012-08-22 | 三菱マテリアル株式会社 | 密着性に優れた銅合金複合膜 |
KR20130049075A (ko) * | 2011-11-03 | 2013-05-13 | 삼성디스플레이 주식회사 | 신규한 헤테로고리 화합물 및 이를 포함한 유기발광 소자 |
KR101973166B1 (ko) * | 2012-03-27 | 2019-04-29 | 삼성디스플레이 주식회사 | 유기 발광 소자 및 이를 포함하는 유기 발광 표시 장치 |
KR20150106016A (ko) * | 2014-03-10 | 2015-09-21 | 삼성디스플레이 주식회사 | 표시장치 |
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EP1677374A2 (en) | 2006-07-05 |
KR20060062619A (ko) | 2006-06-12 |
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US20080182356A1 (en) | 2008-07-31 |
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