KR100646905B1 - Resin seal mold - Google Patents

Abstract

The lower mold | type and upper mold which mutually oppose are provided in the resin sealing mold. On the lower surface of the mold, the substrate is placed with the pressure absorbing layer interposed therebetween. A chip is mounted on the chip mounting surface of the substrate. On the surface, the pressure absorbing layer is provided so that a board | substrate may be contained in planar view. The pressure absorbing layer has heat resistance, constant thickness, constant hardness, constant elasticity, and constant compressive strength that can withstand the temperature when curing the flowable resin. When the chip is resin-sealed, the fluid resin is injected into the cavity of the upper mold in a state where the lower mold and the upper mold are closed. At this time, by locally deforming the pressure absorbing layer, the clamp pressure and the resin pressure applied to the substrate are reduced. As a result, even when a thin substrate or a substrate having brittleness is used, damage such as indentation and cracks, or disconnection of the wiring pattern on the substrate is prevented when the resin is sealed.

Resin, sealing, mold, mold

Description

Resin Sealed Type {RESIN SEAL MOLD}

1 is a partial cross-sectional view showing a state immediately before closing of the resin-sealed mold according to the first embodiment.

FIG. 2 is a partial cross-sectional view showing a state immediately after closing of the resin-sealed mold of Embodiment 1. FIG.

3 is a partial cross-sectional view showing a state immediately before closing of a conventional resin sealing type.

4 is a partial cross-sectional view showing a state immediately after closing of a conventional resin encapsulation type.

♠ Explanation of the symbols for the main parts of the drawings.

1: Lower type 2: Upper type

3, 13; Resin Sealed Type 4: Shape Surface

5 substrate 6 chip mounting surface

7: chip 8: wire

9: reflecting surface 10: wiring pattern

11: cavity 12: pressure absorbing layer

Technical field

The present invention relates to a resin sealing mold for resin sealing an electronic component mounted on a substrate.

Description of the prior art

First, with reference to Figs. 3 and 4, a conventional resin encapsulation type will be described. In addition, each figure used by the following description is shown typically, detailed structure is abbreviate | omitted or exaggerated suitably for the convenience of description.

The conventional resin sealing mold 3 has a lower mold 1 and an upper mold 2 facing the lower mold 1 as shown in Figs. 3 and 4. The board | substrate 5 is mounted on the mold surface 4 of the lower mold | type 1, and the chip | tip 7 as an electronic component is attached to the chip mounting surface 6 of the board | substrate 5. As shown in FIG.

Electrodes (both not shown) of the substrate 5 and the chip 7 are electrically connected through the wire 8. The board | substrate 5 has the chip mounting surface 6 and the opposite surface 9 located in the back side. On the opposite surface 9, a wiring pattern 10 made of a conductive material such as copper is provided. The wiring pattern 10 is comprised by the foil-shaped or protrusion-shaped external electrode connected to another electronic device, or the foil-shaped wiring which connects those external electrodes and the electrode provided in the chip mounting surface 6, etc. . Moreover, the upper mold | type 2 is provided with the cavity 11 in which fluid resin (not shown) is inject | poured, and the resin flow path (not shown) which guides fluid resin to the cavity 11 is provided.

The resin sealing mold 3 shown in FIG. 3 and FIG. 4 operates as follows. First, as shown in FIG. 3, the upper mold 2 is lowered after the substrate 5 on which the chip 7 is mounted is placed on the mold surface 4 of the lower mold 1. Then, as shown in FIG. 4, the mold surface of the upper mold | type 2 contacts the chip mounting surface 6 of the board | substrate 5, and the upper mold | type 2 presses the board | substrate 5 by a predetermined pressure. Thereby, while the lower mold | type 1 and the upper mold | type 2 are closed, the board | substrate 5 is clamped. Next, a fluid resin (not shown) is injected into the cavity 11 via a resin flow path (not shown) from the inside of the figure to the front side. The fluid resin cures and a cured resin (not shown) is formed.

Next, the upper die 2 is raised to open. In that case, the molded article containing the board | substrate 5 and cured resin protrudes from the resin sealing die 3 by an eject pin (not shown). Thereafter, the molded article is conveyed into the unit where the next step is performed in a state supported by the adsorption mechanism. Next, the unnecessary part of cured resin is removed from a molded article, and a package is completed.

Until now, the method by which one chip | tip 7 attached to one board | substrate 5 is resin-sealed is demonstrated. However, the resin sealing method performed by the resin sealing type of the present invention is not limited to the above-described method, but a method in which a plurality of chips are collectively resin-sealed in a state where a plurality of chips are mounted in a lattice shape on a substrate. It may be. According to this method, a molded article is cut | disconnected by an individual chip unit, and several packages are manufactured.

By the way, in recent years, since the request of miniaturization and thickness reduction of a package is increasing, the desire to thin the board | substrate 5 is also increasing. As the material of the substrate 5, a ceramic material having a small comparative strength is used.

On the other hand, regardless of whether the thickness of the hard plate 5 is thin and the strength of the substrate 5 is small, it is necessary to clamp the substrate 5 at a predetermined pressure to prevent the occurrence of resin burrs. have. Therefore, the clamp pressure concentrates on the part of the board | substrate 5 which is pressed by the peripheral edge of the cavity 11. In addition, the resin pressure of the fluid resin is applied to the substrate 5. Therefore, damage, such as an indentation and a crack, arises in the board | substrate 5. This problem is more likely to occur due to the fact that the substrate 5 is thin and the substrate 5 is made of a brittle material (ceramic material). In addition, there is a problem that defects such as cracking, deformation, and disconnection of the wiring pattern 10 occur due to concentration of pressure on the portion of the wiring pattern 10 having a small area. In addition, when the clamp pressure is lowered in order to prevent the above two problems, molten resin leaks from the inside of the cavity 11 onto the substrate 5, and a resin burr is formed on the substrate 5. The above-mentioned problem is a cause of decreasing the yield at the time of producing a package.

In addition, when the several chips 7 are collectively resin-sealed, the area of the board | substrate 5 becomes large. Therefore, the amount of flowable resin injected into the cavity increases. In connection with this, clamp pressure and resin pressure increase. As a result, the problem described above becomes more serious.

An object of the present invention is to prevent the occurrence of damage such as indentation and cracks in molded articles and the occurrence of cracks, deformations, and disconnections of wiring patterns formed on the substrate even when using a thin substrate or a substrate having brittleness. It is to provide a resin encapsulation type that can be done.

In order to achieve the above object, the resin encapsulation mold of the present invention is one mold on which a substrate on which an electronic component is mounted is mounted, and one mold is opposed to one mold and the electronic component is clamped together with one mold. Another type | mold contained in a cavity, and a pressure absorbing layer provided in at least one of one type | mold and another type | mold, and deform | transform so as to absorb the pressure applied to a board | substrate when one type | mold and another type | mold are closed is provided.

According to the above structure, even if the substrate is thin, the substrate is prevented from being damaged by the clamp pressure between one mold and the other mold. In addition, damage to the electronic components on the substrate, wiring patterns related thereto, etc., by the resin pressure is also prevented. As a result, the yield of a resin molded article improves.

In addition, if the pressure absorbing layer has an engineering plastic, its durability is improved. In addition, as long as the pressure absorbing layer is coated on at least one of the mold surfaces of one mold and the other mold, the formation method thereof becomes easy.

These and other objects, features and advantages of the present invention will become apparent from the following detailed description of the invention which is understood in conjunction with the accompanying drawings.

More preferred embodiment of the invention

With reference to FIG. 1 and FIG. 2, the resin sealing mold 13 of Embodiment 1 of this invention is demonstrated. The same code | symbol is attached | subjected to the same component shown in FIG.1 and FIG.2.

As shown in FIG. 1, the resin sealing mold 13 is provided with the lower mold | type 1 and the upper mold | type 2 which oppose each other. The substrate 5 is placed on the mold surface 4 of the lower mold 1 with the pressure absorbing layer 12 interposed therebetween. On the chip mounting surface 6 of the board | substrate 5, the chip 7 is mounted.

The pressure absorbing layer 12 contains the substrate 5 in plan view. In addition, the pressure absorbing layer 12 has heat resistance that can withstand the curing temperature at the time of curing the fluid resin, and has a constant thickness, a constant hardness, a constant elasticity, and a constant compressive strength. It is preferable that the material of the pressure absorbing layer 12 is engineering plastic.

However, depending on the curing temperature, it is preferable to use a super engineering plastic represented by polyether ether ketone (PEEK), polytetrafluoroethylene (PTFE), or the like as the material of the pressure absorbing layer 12. In addition, the pressure absorbing layer 12 may be formed as a coating film on the mold surface 4 by coating. The pressure absorbing layer 12 may be made of a single material such as fluororesin such as PTFE or PEEK, and may be a coating film of a composite material in which these materials are composited.

When resin sealing is performed, the pressure absorbing layer 12 functions as follows. As shown in FIG. 2, the upper mold 2 and the lower mold 1 with the pressure absorbing layer 12 are closed. At this time, a clamp pressure is applied to the substrate 5. Thereafter, when the flowable resin is injected into the cavity 11, the substrate 5 is further subjected to the resin pressure by the flowable resin. In this state, the pressure absorbing layer 12 slightly deforms locally in the lower portion of the wiring pattern 10.

Thereby, the pressure applied to the whole board | substrate 5 and the wiring pattern 10 is absorbed by the pressure absorbing layer 12, and it reduces. Therefore, the occurrence of damage such as indentation and cracks in the thin substrate 5 or the brittle substrate 5 and the occurrence of crack deformation and disconnection of the wiring pattern 10 formed on the substrate 5 are prevented.

As described above, according to the resin encapsulation type 3 of the present embodiment, when the resin encapsulation is performed, the pressure applied to the entirety of the substrate 5 and the wiring pattern 10 is reduced. Formation is prevented. Therefore, the yield at the time of producing a molded article improves. In addition, since engineering plastic is used as the pressure absorbing layer 12, durability of the pressure absorbing layer 12 is improved compared with the case where the sheet-like member, such as rubber | gum, is used.

The pressure absorbing layer 12 may be screwed to the lower mold 1 and may be fitted to a set pin or the like provided on the lower mold 1. Also by these methods, the same effect as the effect obtained with the resin sealing type shown in FIG. 1 mentioned above can be acquired. According to this attachment method, the pressure absorbing layer 12 can be easily replaced when the pressure absorbing layer 12 is damaged for some reason.

In addition, in this embodiment, the resin shaping | molding method by which one chip | tip 7 attached to one board | substrate 5 is resin-sealed is demonstrated. However, the resin shaping | molding method using a resin shaping | molding die is not limited to what was mentioned above, You may be used for the method which enclosed and sealed several chip | tips mounted in one board | substrate. In this method, the clamp pressure and the resin pressure increase as the area of the substrate 5 increases and the amount of the flowable resin injected into the cavity increases. However, when the pressure absorbing layer 12 is used, indentation and cracking of the substrate The occurrence of damage and the like and the occurrence of cracks, deformations, and disconnections in the wiring patterns are more effectively prevented. In this case, the material, thickness, hardness, elasticity, and compressive strength of the pressure absorbing layer 12 may be determined in accordance with the size of the substrate, the size of the resin pressure, and the like.

In addition, in the above-mentioned embodiment, although the pressure absorbing layer 12 is formed on the mold surface 4 of the lower mold | type 1, the resin sealing mold of this invention is not limited to this structure, The mold of the upper mold | type 2 is carried out. The substrate 5 may be placed on the surface, and the pressure absorbing layer 12 may be formed on the mold surface. Moreover, in the resin sealing mold 3 (but not limited to the lower mold 1 and the upper mold 2) which oppose each other, when the resin sealing mold 3 is closed and the board | substrate 5 is clamped, the board | substrate 5 ), The pressure absorbing layer 12 may be formed on part or all of the mold surface (not limited to the mold surface 4). For example, in FIG. 1, instead of the pressure absorbing layer 12 formed on the mold surface 4 of the lower mold 1, a portion of the mold surface of the upper mold 2 which contacts the substrate 5, that is, around the cavity 11. The pressure absorbing layer 12 may be formed in the part.

In addition to the pressure absorbing layer 12 formed on the mold surface 4 of the lower mold 1, the pressure absorbing layer 12 may be formed in a portion around the cavity 11 among the mold surfaces of the upper mold 2. In this case, in the state in which the lower mold | type 1 and the upper mold | type 2 were closed, the pressure absorbing layer 12 is formed in all the mold surfaces which contact | connect the board | substrate 5.

The specific structure of the above-mentioned resin sealing type pressure absorbing layer 12 may be appropriately selected depending on the material and size of the substrate, the material, width, thickness and arrangement of the wiring, the size of the resin pressure, and the like. By any configuration, occurrence of damage such as indentation and cracks in the substrate 5 and crack, deformation and disconnection of the wiring pattern 10 are prevented.

In addition, although the resin sealing type of this invention is comprised by the general steel type material, this invention is not limited to this, The resin sealing type may be comprised by the ceramic material.

While the invention has been shown and described in detail, it is to be understood that this is by way of illustration only and should be taken in a limiting sense, the spirit and scope of the invention being limited only by the appended claims.

According to the present invention, even if the substrate is thin, the substrate is prevented from being damaged by the clamp pressure between one mold and the other mold. In addition, damage to the electronic components on the substrate, wiring patterns related thereto, etc., by the resin pressure is also prevented. As a result, the yield of a resin molded article improves.

In addition, if the pressure absorbing layer has an engineering plastic, its durability is improved. In addition, as long as the pressure absorbing layer is coated on at least one of the mold surfaces of one mold and the other mold, the formation method thereof becomes easy.

Claims (3)

One type on which a board on which electronic components are mounted is mounted, Another mold that faces the one mold and includes the electronic component in a cavity while clamping the substrate with the one mold, And a pressure absorbing layer provided on at least one of the one mold and the other mold, and deformed to absorb the pressure applied to the substrate when the one mold and the other mold are closed. Sealed type. The method of claim 1, The said pressure absorbing layer has engineering plastics, The resin sealing type characterized by the above-mentioned. The method according to claim 1 or 2, The pressure-absorbing layer is coated on at least one of the mold surfaces of the one mold and the other mold.

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