KR100632067B1 - Chamber for manufacturing semiconductor devices with stabilized pressure - Google Patents

Abstract

A chamber for manufacturing a semiconductor device with stabilized pressure is provided to minimize wafer damages by preventing rapid pressure variation in the chamber in order to prevent reverse flow of particles. An opening(120) is formed in a length direction of a pipe(110). A sliding pipe(130) is installed in the pipe. A pressure control valve is installed in the sliding pipe and exposed through the opening. The pressure control valve(140) controls an inner space pressure of a chamber by controlling a state of the sliding pipe. An elastic member(150) is prepared to supply a restitution force to the sliding pipe.

Description

Pressure stabilization chamber for semiconductor device manufacturing {CHAMBER FOR MANUFACTURING SEMICONDUCTOR DEVICES WITH STABILIZED PRESSURE}

1 is a schematic view showing a chamber for manufacturing a conventional semiconductor device,

2 is a cross-sectional view showing main parts of a pressure stabilization chamber for manufacturing a semiconductor device according to the present invention;

3 is a cross-sectional view showing the operation of the pressure stabilization chamber for manufacturing a semiconductor device according to the present invention.

<Description of Symbols for Main Parts of Drawings>

110: pipe 120: opening

130: slide tube 131: O-ring

140: pressure control valve 142: disk

150: elastic member

The present invention relates to a pressure stabilization chamber for manufacturing a semiconductor device, and more particularly, to a pressure stabilization chamber for manufacturing a semiconductor device to minimize a sudden pressure change inside the chamber in which a process for manufacturing a semiconductor device is performed.

In general, various unit processes, such as an exposure process, a diffusion process, an etching process, and a chemical vapor process, are performed to manufacture a semiconductor device. At this time, most of the process chambers performing the unit process are provided with a pressure control valve on the pipe to which the process gas, purge gas, vacuum, etc. are supplied or discharged in order to maintain a constant internal pressure. .

Referring to the accompanying drawings, a chamber for manufacturing a semiconductor device in which a conventional pressure control valve is provided is as follows.

1 is a schematic view showing a chamber for manufacturing a conventional semiconductor device. As shown, the chamber 1 for manufacturing a semiconductor device according to the prior art is connected with pipes 2 and 3 for supplying and discharging process gas to both sides, and the pipes 2 and 3, in particular the pipes on the discharge side. A pressure regulating valve 4 is provided on (3).

The pressure regulating valve 4 is controlled by a controller (not shown) that outputs a control signal by a pressure measured from a pressure sensor (not shown) installed in the chamber 1 to adjust the pressure inside the chamber 1. As a result, the pressure inside the chamber 1 is adjusted.

However, in the conventional chamber 1, when the internal pressure suddenly changes due to a pressure change on the pipes 2 and 3, a sudden change in gas flow, etc., the pressure control valve 4 alone does not reflect this momentarily. This makes it difficult to maintain the pressure in the chamber 1 and has a problem of lowering the quality of the process. In particular, the rapid pressure change of the chamber 1 has a problem of lowering the yield of the wafer by causing particles to flow into the chamber 1 or causing particles to float to cause contamination of the wafer.

The present invention is to solve the above-mentioned conventional problems, an object of the present invention is to minimize the sudden pressure change inside the chamber in which the process for manufacturing a semiconductor device is carried out so that a stable semiconductor manufacturing process is carried out, The present invention provides a pressure stabilization chamber for manufacturing a semiconductor device that prevents particle floating or backflow, thereby suppressing wafer defects.

The present invention for realizing the above object is a chamber for manufacturing a semiconductor device to which a pipe for supplying or discharging gas or a vacuum is connected, the opening being formed in the longitudinal direction on the pipe, and the opening being sealed in the pipe. A slide tube slidably installed therein, a pressure regulator valve installed in the slide tube and exposed through an opening, controlling a pressure inside the chamber by controlling the opening and closing of the slide tube, and the pressure regulating valve is fully or partially closed. The slide tube is characterized in that it comprises an elastic member for providing an elastic force to return to its original position when sliding due to the pressure difference between the two sides.

DETAILED DESCRIPTION Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art may easily implement the present invention.

2 is a cross-sectional view showing main parts of a pressure stabilization chamber for manufacturing a semiconductor device according to the present invention. As illustrated, the pressure stabilization chamber 100 for manufacturing a semiconductor device according to the present invention includes an opening 120 formed on the pipe 110, a slide tube 130 installed in the pipe 110, and a slide tube ( Pressure control valve 140 is installed on the 130, and the elastic member 150 for providing an elastic force to the slide tube (130).

The opening 120 is formed in the slide tube 130 by being formed along the longitudinal direction on the pipe 110 that requires pressure control among pipes for supplying or discharging process gas, purge gas, vacuum, etc. to the chamber 100. It provides a movement path of the control valve 140, preferably formed in the gas discharge pipe is a change in the gas flow is severe. In addition, the opening 120 may be partially formed on the pipe 110 as in the present exemplary embodiment of FIG. 2, or the opening 120 may be formed by a space generated by the pipe 110 being cut off and spaced apart. have.

The slide tube 130 is slidably installed in a state in which the opening 120 is sealed in the pipe 110. That is, the slide tube 130 is slid along the longitudinal direction inside the pipe 110, and has a suitable length so as to block the opening 120 even if the reciprocating movement to a certain distance to some extent, by contact with the pipe 110 O-ring 131, which is a sealing member, is installed at both ends to prevent leakage of gas or the like through the opening 120 by maximizing the sealing. On the other hand, the O-ring 131 may be installed on the inner peripheral surface of the pipe (110).

The pressure control valve 140 is installed in the slide tube 130 is exposed through the opening 120, and controls the pressure inside the chamber 100 by controlling the opening and closing of the slide tube 130. In addition, the pressure control valve 140 may use a valve in which the opening and closing control plate is installed on the body to adjust the flow passage cross-sectional size of the slide tube 130 by moving across the slide tube 130, in this case the opening and closing control plate slides Since the structure of the slide tube 130 is complicated because it moves in a direction perpendicular to the longitudinal direction of the tube 130, as shown in FIG. 2, in this embodiment, a valve employing a disc-shaped disk 142 is used. .

In the pressure control valve 140 according to the present embodiment, the body 141 is fixed to the outside of the slide tube 130, and the disc 142 having a diameter corresponding to the inner diameter of the slide tube 130 is the body 141. It is connected to the rotatably installed inside the slide tube 130, a motor (not shown) for rotating the disk 142 inside the body 141 is installed. The body 141 of the pressure control valve 140 is fixed to the slide tube 130 through the disk connecting pipe 143, the rotational force of the motor (not shown) to the disk 142 inside the disk connecting pipe 143 A rotating shaft (not shown) is positioned at right angles to the longitudinal direction of the slide tube 130 to transmit.

The elastic member 150 provides an elastic force so that the slide pipe 130 returns to its original position when the slide tube 130 slides due to the pressure difference between both sides in a state in which the pressure control valve 140 is partially or fully closed. The elastic member 150 may be employed in a variety of spring structure, in this embodiment by providing a balanced elastic force to the slide tube 130, each side of the slide tube 130 to the inside of the pipe 110 for smooth return to the original Plural coil springs to be connected are preferable. Coil spring 150 is installed in a plurality of slide tube 130 for each side, for this purpose, both ends of the coil spring 150 to the spring fixing protrusions (151, 152) respectively provided on the inner peripheral surface of the pipe 110 and the end of the slide tube (130). It is fixed.

The operation of the pressure stabilization chamber for manufacturing a semiconductor device having such a structure is performed as follows.

The disk 142 by driving a motor (not shown) of the pressure regulating valve 140 under the control of a controller (not shown) receiving a pressure value output from a pressure sensor (not shown) installed inside the chamber 100. The pressure in the chamber 100 is adjusted by changing the flow path cross-sectional area in the slide tube 130 by rotating.

On the other hand, as shown in Figure 2, when the pressure (P1, P2) difference between both sides of the slide tube 130 is weak, the slide tube 130 is stopped at a predetermined position by the elastic force of the elastic member 150. At this time, in the state in which the pressure control valve 140 partially or completely closes the slide tube 130, the inside of the chamber 100 is suddenly changed due to a pressure change inside or outside the chamber 100 or a sudden change in gas flow. If the pressure of the pressure control valve 140 takes a predetermined time to operate the pressure control for a moment because the pressure adjustment is impossible, but the pressure due to the difference between the pressure (P1, P2) of both sides of the slide tube 130 The slide tube 130 partially or completely closed by the control valve 140 is slid along the pipe 100 to change its position, thereby changing the volume in the chamber 100. 100) maintains the pressure stable despite a sudden pressure change.

After the rapid pressure fluctuation in the chamber 100 and the pressure (P1, P2) difference between the two sides of the slide tube 130 is insufficient, the slide tube 130 is returned to the original position by the elastic member 150.

According to a preferred embodiment of the present invention as described above, the position of the pressure control valve 140 due to the sliding of the slide tube 130 even if the pressure control valve 140 does not instantaneously control the pressure inside the chamber 100. By adjusting the volume of the chamber 100 through variation, the sudden pressure change in the chamber 100 is minimized. Therefore, a stable semiconductor manufacturing process is performed by minimizing a sudden pressure change inside the chamber 100 where the process for manufacturing the semiconductor device is performed, and preventing the floating or backflow of particles inside the chamber 100 to prevent defects in the wafer. Suppress occurrence.

As described above, the pressure stabilization chamber for manufacturing a semiconductor device according to the present invention allows a stable semiconductor manufacturing process to be carried out by minimizing a sudden pressure change inside the chamber where a process for manufacturing a semiconductor device is performed, and floating of particles inside the chamber. To prevent backflow, thereby suppressing defects in the wafer.

What has been described above is just one embodiment for carrying out the pressure stabilization chamber for manufacturing a semiconductor device according to the present invention, the present invention is not limited to the above embodiment, as claimed in the following claims Without departing from the gist of the present invention, those skilled in the art to which the present invention pertains to the technical spirit of the present invention to the extent that various changes can be made.

Claims (3)

In the chamber for manufacturing a semiconductor device connected to the pipe for supplying or discharging gas or vacuum, An opening formed in the longitudinal direction on the pipe, A slide tube installed slidably in a state in which the opening is sealed in the pipe; A pressure regulating valve installed on the slide tube and exposed through the opening and controlling pressure of the inside of the chamber by controlling opening and closing of the slide tube; An elastic member that provides an elastic force to return to the original position when the slide tube is sliding due to the pressure difference between both sides in a state in which the pressure control valve is partially or partially closed Pressure stabilization chamber for manufacturing a semiconductor device comprising a. The method of claim 1, The pressure control valve, A body is fixed to the outside of the slide tube, a disk-shaped disk having a diameter corresponding to the inner diameter of the slide tube is connected to the body rotatably installed inside the slide tube, the disk is rotated inside the body With motors to let Pressure stabilization chamber for semiconductor device manufacturing, characterized in that. The method of claim 1, The elastic member, A plurality of coil springs each connecting both sides of the slide tube to the inside of the pipe Pressure stabilization chamber for semiconductor device manufacturing, characterized in that.

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