KR100616434B1 - Socket tester for fine pitch ball grid arrayFPBGA - Google Patents

Abstract

The present invention relates to a socket tester for a fine pitch ball grid array, wherein in a short time the failure of the height of the socket pins for the individual sockets as well as the height of the socket pins for the entire socket mounted on the test board is tested. A socket tester for a fine pitch ball grid array (FPBGA) is provided. That is, a socket tester for a fine pitch ball grid array, comprising: a test tip having a size corresponding to the fine pitch ball grid array package to be inserted through an upper surface of the socket, and having a flat bottom surface and an electrical conductivity; A connection terminal connected to the socket pin exposed to the bottom surface of the socket; And a determination unit connected to the test tip and the connection terminal and determining whether the test tip and the socket pin are electrically connected to each other, wherein the socket pin is connected to the test tip and the socket pin by an electrical connection. It provides a socket tester for a fine pitch ball grid array, characterized in that the test of the failure of the height of the.

Fine Pitch Ball Grid Array, Socket Tester, Socket Pins, Ball Grid Array, BGA

Description

Socket tester for fine pitch ball grid array (FPBGA)

1 is a circuit diagram of a socket tester for a ball grid array according to the present invention;

2 is a plan view showing a socket tester for a ball grid array according to an embodiment of the present invention;

3 is a plan view illustrating a socket tester of FIG. 2 testing a socket for a ball grid array;

4 is a cross-sectional view taken along line 4-4 of FIG. 3;

5 is a perspective view showing a socket type tester for a ball grid array of a pen type according to another embodiment of the present invention.

Description of the main parts of the drawing

10: test board 12: tab

14 socket 16 socket pin

20, 30: socket tester 22: determination unit

24, 34: Test Tip 26: Slot

36: probe 38: main body

The present invention relates to a socket tester for a fine pitch ball grid array, and more particularly, to a socket tester for a fine pitch ball grid array, which can determine the failure of the height of the socket pin in a short time.

In general, after the semiconductor package manufacturing process is completed, a test process is performed on the manufactured semiconductor package. In general, the test process is performed in a state where the semiconductor package is stored in a socket. In particular, for sockets used for testing fine pitch ball grid array (FPBGA) packages among semiconductor packages, it is important to keep the socket pin height lower than the bottom of the FPBGA package inserted into the socket. Do. Because, when a specific socket pin among the socket pins is formed high with the bottom surface of the FPBGA package inserted into the socket, the ball and the socket pin of the FPBGA package accommodated in the socket may not be properly contacted, and the bottom surface of the FPBGA package may be mechanically contacted. This can damage the underside of the FPBGA package. That is, since a flexible test wiring board is generally used as the substrate of the FPBGA package, when the metal socket pin is mechanically contacted with the substrate of the flexible FPBGA package, the substrate may be damaged.

Therefore, a test process of filtering a socket including a defective socket pin by using a smart scope, which is a three-dimensional measuring device, of a defective quantity of a socket pin of a manufactured socket is being performed.                         

However, when using a smart scope, the time required to test one socket is about 5 minutes, so 168 × 5 minutes when testing all 168 (12 × 14) sockets on a test board = It takes 840 minutes (14 hours). In other words, it takes too much time to test sockets.

Therefore, in order to reduce the test time for the socket for the same reason as described above, some of the sockets mounted on the test board are selected and sample inspection is performed. However, in this case, since the test process for the socket was carried out by sample inspection, there is no guarantee of 100% quality of the socket mounted on the test board, so there is always a factor that may cause defects in the test process of the FPBGA package. have.

Accordingly, it is an object of the present invention to provide a socket tester capable of testing the failure of the height of the socket pins for an individual socket in a short time.

In order to achieve the above object, a socket tester for FPBGA, comprising: a test tip having a size corresponding to the FPBGA package to be inserted through an upper surface of the socket, the lower surface being flat and electrically conductive; A connection terminal connected to the socket pin exposed to the bottom surface of the socket; And a determination unit connected to the test tip and the connection terminal and determining whether the test tip and the socket pin are electrically connected to each other, wherein the socket pin is connected to the test tip and the socket pin by an electrical connection. It provides a socket tester for FPBGA, characterized in that for testing the failure of the height of the.                     

The determination unit according to the present invention includes a power supply unit for supplying power to the test tip and the connection terminal; It is connected to the power supply, and a notification unit for notifying the outside whether the electrical connection between the test tip and the socket pin; includes. As the connection terminal, it is preferable to use a probe capable of contacting the socket pin of the individual socket.

The present invention is also a socket tester for a test board mounted with a plurality of sockets for FPBGA, the test tip having a size corresponding to the FPBGA package to be inserted through the upper surface of the socket, the lower surface is flat and electrically conductive and; A slot connected to a plurality of tabs of the test board; And a determining unit connecting the test tip and the slot to each other and determining whether the test tip and the socket pin are electrically connected to each other. There is provided a socket tester for FPBGA, characterized by testing the defects in height.

Determination unit according to the invention, the power supply for supplying power to the test tip and the slot; It is connected to the power supply, and a notification unit for notifying the outside whether the electrical connection between the test tip and the socket pin; includes.

Hereinafter, with reference to the accompanying drawings will be described in detail an embodiment of the present invention.

1 is a circuit diagram of a socket tester 20 for FPBGA according to the present invention. Referring to FIG. 1, the socket tester 20 includes a determination unit 22, a test tip 24 and a connection terminal 26 connected to the determination unit 22.

The discriminating unit 22 is a portion that indicates the defectiveness of the height of the socket pin with or without the opening and closing of the electrical circuit, the power supply unit 21 for supplying power to the test tip 24 and the connection terminal 26, and the test tip It is composed of a notification unit 23 for notifying the electrical connection between the socket pin 24 and the outside, for example, a red light-emitting diode (LED), and when the power is supplied from the power supply 21 to the outside Means for informing include, for example, a blue LED 25. That is, the determination unit 22 is driven so that the notification unit 23 can notify the outside of the failure of the socket pin only when the closed circuit is formed, including the notification unit 23 by the power supplied from the power supply unit 21. do.

The test tip 24 is inserted into a storage space into which the FPBGA package is inserted, so that there are socket pins (hereinafter referred to as 'bad pins') among the socket pins that are in contact with the lower surface of the FPBGA package to be mounted. As a means of inspection, it has a shape similar to that of the FPBGA package to be inserted into the socket, and the bottom surface is flat and electrically conductive to inspect the bad pins. In addition, the test tip 24 is connected to the (+) terminal of the power supply 21, the notification unit 23 is connected between the test tip 24 and the power supply (21). The reason why the bottom surface of the test tip 24 is flat and electrically conductive is to easily determine whether any of the socket pins has a bad pin contacting the bottom surface of the FPBGA package to be mounted with a relatively high height. . That is, when the test tip 24 is inserted into the socket in accordance with the position where the FPBGA package is to be mounted, the bad pin is in contact with the lower surface of the test tip 24, so that the presence or absence thereof can be easily determined.

In addition, the connection terminal 26 is connected to the negative terminal of the power supply 21 to make an electrical connection with the socket pin of the socket. As will be described later, the connection terminal 21 is connected to the socket pin exposed to the lower surface of the socket when testing in the socket unit, the electrical connection with the tab portion of the test board when testing the socket mounted on the test board Achieve.

Accordingly, in the socket tester 20 according to the present invention, when at least one bad pin exists in the socket in a state where power is supplied from the power supply 21, the bad test pin 20 is connected to the test tip 24 and the connection terminal 26. By connecting to the) to form a closed circuit to turn on the red LED of the notification unit 23 to inform that the socket pin of the socket contains a bad pin is a bad height. Conversely, if there are no bad pins in the socket, the red LED will not light up if the test tip, test tip 24, and all socket pins are not connected, so that the socket pins of this socket contain bad socket pins. You will be notified.

An implementation example of a specific socket tester using the circuit diagram of FIG. 1 will be described with reference to FIGS. 2 to 4. The socket tester 20 shown in FIGS. 2 to 4 is for a test board 10 mounted with a plurality of sockets 14, for example, 168 (14 × 12) BGA packages, and includes a test tip 24 and a connection terminal. It consists of an in slot 26 and the discriminator 22.

The discriminating unit 22 is a portion for displaying the defective quantity of the height of the socket pin 16 with or without the opening and closing of the electric circuit, and is composed of a power supply unit 21 and a notification unit 23. That is, the determination unit 22 notifies the outside of the failure of the socket pin 16 in the notification unit 23 only when the closed circuit is formed, including the notification unit 23 by the power supplied from the power supply unit 21. To be able to drive. Although the red LED is shown in FIG. 1 as the alarm unit 23, a sound generating means such as a buzzer may be used.

The test tip 24 has a size corresponding to the FPBGA package to be inserted through the upper surface of the socket 14, for example, a rectangular plate shape, and the lower surface is flat and electrically conductive. That is, when the test tip 24 is inserted into the socket 14 according to the position where the FPBGA package is to be mounted, since the bad pin 15 contacts the bottom surface of the test tip 24, it is easy to determine the presence or absence thereof. have.

The slot 26 is a connection terminal connected to the plurality of tabs 12 of the test board 10, and is connected to the negative terminal of the power supply unit 21.

Looking at the method of using the socket tester 20 having such a structure and the operation principle accordingly, first turn on the power supply unit 21, the test state in the slot 26 to the tab 12 of the test board, the test A test is made on the socket 14 on the test board 10 while inserting the test tip 24 into the socket 14 to be tested on the board 10. For example, when the test tip 24 is inserted into the socket 14 in which the bad pin 15 is present, the bottom surface of the test tip 24 and the bad pin 15 come into contact with each other, thereby forming a closed circuit, thereby providing a notification unit. (23) is activated to inform the outside that the bad pin 15 is present in this socket (14). On the contrary, when the test tip 24 is inserted into the socket without a bad pin, the lower surface of the test tip 24 and the socket pin do not contact each other, so that an open circuit is formed and the notification unit 23 does not operate. The socket notifies you that there are no bad pins.

After the socket 26 of the socket tester is plugged into the test board 10, since the test time required for the socket 14 is only a few seconds, the time required for conventional sockets by 5 minutes can be greatly reduced. have. That is, since the test time per socket 14 is short, the entire socket 14 mounted on the test board 10 can be tested.                     

In addition, the socket treated as defective in the socket tester 20 may proceed with the retest with a conventional smart scope.

5 is a perspective view showing a socket type tester 30 for FPBGA of a pen type according to another embodiment of the present invention. Referring to FIG. 5, the socket tester 30 is a socket tester used when testing in an individual socket unit before mounting on a test board, and includes a pen-shaped body 38 and a test tip connected to one end of the body 38. It consists of 34. Of course, the main body 38 includes a power supply, a notification unit and a probe 36 which is a connection terminal. It is preferable to use a conventional battery or a rechargeable battery as the power supply, and the probe 36 is exposed at the other end of the main body 38.

Looking at the method of using the socket tester 30 having such a structure and the operation principle accordingly, first turning on the power supply, and after inserting the test tip 34 into the socket, the socket exposed to the lower surface of the socket The test is made by contacting the probes 36 to the pins (16a in FIG. 4) respectively. For example, when the probe 36 contacts the bad pin of the socket in which the bad pin is present, a closed circuit is formed along with the bad pin in contact with the lower surface of the test tip 34 so that the alarm unit operates and the bad pin is inserted into the socket. This presence is announced to the outside. On the contrary, when there is no bad pin, since the open circuit is formed even if it contacts with the probe 36, a notification part does not drive.

On the other hand, the embodiments of the present invention disclosed in the specification and drawings are merely presented specific examples to aid understanding, and are not intended to limit the scope of the present invention. In addition to the embodiments disclosed herein, it is apparent to those skilled in the art that other modifications based on the technical idea of the present invention may be implemented. For example, the test tip has a (+) terminal connected to the connection terminal, but a negative terminal may be connected to the test tip.

In the case of using the socket tester according to the present invention, it is possible to easily determine the failure of the height of the socket pin in a short time, it is possible to test the entire socket mounted on the test board.

In addition, the pen-type socket tester has the advantage of being able to test individual sockets and being portable.

Claims (5)

Socket tester for fine pitch ball grid array, A test tip having a size corresponding to the fine pitch ball grid array package to be inserted through an upper surface of the socket and having a flat lower surface and an electrical conductivity; A connection terminal connected to the socket pin exposed to the bottom surface of the socket; And a determination unit connected to the test tip and the connection terminal and determining whether the test tip and the socket pin are electrically connected to each other. The socket tester for fine pitch ball grid array, characterized in that for testing the defectiveness of the height of the socket pin by the electrical connection according to the contact of the test tip and the socket pin. The method of claim 1, wherein the determining unit, A power supply unit supplying power to the test tip and the connection terminal; And a notification unit connected to the power supply unit and notifying an externally connected electrical connection between the test tip and the socket pin. 2. The socket tester of claim 1, wherein the connecting terminal is a probe. A socket tester for test boards equipped with a plurality of sockets for fine pitch ball grid arrays. A test tip having a size corresponding to the fine pitch ball grid array package to be inserted through an upper surface of the socket, the test tip having a flat bottom surface and being electrically conductive; A slot connected to a plurality of tabs of the test board; And a determination unit connecting the test tip and the slot to each other and determining whether the test tip and the socket pin are electrically connected to each other. The socket tester for fine pitch ball grid array, characterized in that for testing the defectiveness of the height of the socket pin by the electrical connection in accordance with the contact of the test tip and the socket pin. The method of claim 4, wherein the determining unit, A power supply unit supplying power to the test tip and the slot; And a notification unit connected to the power supply unit and notifying an externally connected electrical connection between the test tip and the socket pin.

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