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KR100616310B1 - Manufaturing method of a heatsink for electronic equipment - Google Patents

Manufaturing method of a heatsink for electronic equipment Download PDF

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KR100616310B1
KR100616310B1 KR1020050028617A KR20050028617A KR100616310B1 KR 100616310 B1 KR100616310 B1 KR 100616310B1 KR 1020050028617 A KR1020050028617 A KR 1020050028617A KR 20050028617 A KR20050028617 A KR 20050028617A KR 100616310 B1 KR100616310 B1 KR 100616310B1
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South Korea
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heat sink
fin
heat dissipation
fins
heat
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KR1020050028617A
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Korean (ko)
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송규섭
한재섭
김광수
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주식회사 에이팩
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

본 발명은 전자장비용 방열판의 제조방법에 관한 것으로, 더욱 상세하게는 방열판 기저부의 길이방향으로 다수개로 형성되며, 상기 방열판과 일체로 1차 방열핀을 상부로 연장되도록 압출성형하는 단계와; 상기 1차 방열핀에 대응되도록 삽입홈이 형성된 2차 방열핀을 삽입하는 단계와; 실시방법으로서, 상호 이웃하는 각각의 2차 방열핀의 양측에서 외력을 가해 2차 방열핀을 1차 방열핀에 압착/고정시키는 단계;로 이루어진 전자장비용 방열판 제조방법과; 또는 다른 실시방법으로서, 상기 방열판과 2차 방열핀을 본딩으로 결합하는 단계;를 포함하는 전자장비용 방열판의 제조방법에 관한 것이다. The present invention relates to a method for manufacturing a heat sink for electronic equipment, and more particularly, a plurality of formed in the longitudinal direction of the base of the heat sink, extrusion molding so as to extend the first heat radiation fins integrally with the heat sink; Inserting a second heat radiation fin having an insertion groove formed to correspond to the first heat radiation fin; As an embodiment of the invention, by applying an external force on each side of each of the secondary heat sink fins adjacent to each other, the step of pressing / fixing the secondary heat sink fins to the primary heat sink fins; Or as another embodiment, the method of manufacturing a heat sink for electronic equipment comprising a; bonding the heat sink and the secondary heat sink fins by bonding.

이는 방열판에 일체로 압출성형된 1차 방열핀을 성형한 후에 상기 1차 방열핀에 2차 방열핀을 부착하여 필요로 하는 열효율 향상을 위한 방열판을 제공하며, 1차 방열핀을 방열판과 일체로 압출 성형할 수 있는 높이범위내까지 충분히 형성한 후에, 2차 방열핀을 추가로 부착하는 제조공정을 제공하여 최소한의 제조공정으로 최대의 방열효과를 이루며, 제조공정을 단순화시켜 생산효율을 향상시킬 수 있도록 된 방열판을 제공하도록 히고자 하는 것이다.This provides a heat sink for improving the thermal efficiency required by attaching a secondary heat sink fin to the primary heat sink fin after molding the primary heat sink fin integrally extruded to the heat sink, and extruding the primary heat sink fin integrally with the heat sink. After forming enough within the height range, provide a manufacturing process for attaching additional secondary heat sink fins to achieve the maximum heat dissipation effect with the minimum manufacturing process, and to simplify the manufacturing process to improve the production efficiency I want to provide it.

방열판, 핀, 삽입홈, 압착, 본딩, 고정 Heat Sink, Fin, Slot, Clamping, Bonding, Fixing

Description

전자장비용 방열판의 제조방법 {Manufaturing Method of A HeatSink for Electronic Equipment}Manufacturing Method of Heat Sink for Electronic Equipment {Manufaturing Method of A HeatSink for Electronic Equipment}

도 1는 종래기술에 따른 전자장비용 방열판의 제조방법 11 is a method for manufacturing a heat sink for electronic equipment according to the prior art 1

도 2는 종래기술에 따른 전자장비용 방열판의 제조방법 2Figure 2 is a manufacturing method of the heat sink for electronic equipment according to the prior art 2

도 3은 본 발명에 따른 전자장비용 방열판의 제조방법Figure 3 is a method of manufacturing a heat sink for electronic equipment according to the present invention

<도면의 주요부위에 대한 부호의 설명><Explanation of symbols for major parts of drawings>

1 : 방열판 2 : 1차 방열핀 1: heat sink 2: primary heat sink fin

3 : 삽입홈 4 : 2차 방열핀3: insertion groove 4: secondary heat sink fins

5 : 방열핀       5: heat radiation fin

본 발명은 전자장비용 방열판의 제조방법에 관한 것으로, 더욱 자세하게는 방열판의 기저부에 길이방향으로 다수개의 1차 방열핀을 일체로 압출성형하며, 상기 1차 방열핀에 삽입홈이 형성된 2차 방열핀을 삽입한 후 외력에 의하여 또는 본딩에 의하여 고정시키도록 함으로써, 상기 1차 방열핀으로 인한 방열효과가 부족한 경우에, 추가로 2차 방열핀을 부착하여 방열효과를 증가시키고, 제조과정에 발생될 수 있는 방열판의 변형을 최소화시키는 한편, 제조공정을 단순화시켜 생산효율을 향상시킬 수 있도록 된 방열판의 제조방법에 관한 것이다.The present invention relates to a method for manufacturing a heat sink for electronic equipment, and more particularly, to integrally extruding a plurality of primary heat sink fins in the longitudinal direction at the base of the heat sink, and inserting a secondary heat sink fin having an insertion groove formed therein. After fixing by external force or by bonding, if the heat dissipation effect due to the primary heat dissipation fin is insufficient, by attaching a second heat dissipation fin to further increase the heat dissipation effect, deformation of the heat dissipation plate that may occur in the manufacturing process On the other hand, and to simplify the manufacturing process to improve the production efficiency relates to a manufacturing method of the heat sink.

일반적으로 , 여러가지 전자부품으로 이루어진 전자기기는 그 작동과정에서 필연적으로 열이 발생하게 되는데, 대표적인 예로 컴퓨터의 중앙처리장치 (CPU;Central Processing Unit)는 연산과정에서 많은 열이 열이 발생하게 된다. 이렇게 발생된 열을 신속하게 외부로 방출시키지 못하면 원하는 성능을 발휘하지 못하게 되거나, 심하면 전자기기 전체가 작동불능 상태에 이르게 되므로, 통상 방열판을 사용하여 중앙처리장치에서 발생되는 열을 외부로 신속하게 방출시키도록 구성되어 있다.In general, electronic devices made of various electronic components inevitably generate heat during its operation. As a representative example, a central processing unit (CPU) of a computer generates a large amount of heat during operation. Failure to dissipate this heat quickly to the outside will result in poor performance, or worse, the entire electronics will be inoperable, so heatsinks are used to quickly dissipate heat from the central processing unit. It is configured to.

도 1은 종래의 전자장비용 방열판의 제조방법을 도시한 것으로, 방열판(1)의 기저부에 삽입홈을 형성하고, 상기 삽입홈에 필요 높이의 방열핀(5)을 별개로 형성하여 삽입하는 제조방법에 의하여 이루어져 있다.1 illustrates a conventional method for manufacturing a heat sink for electronic equipment, in which an insertion groove is formed at a base of a heat sink 1, and a heat radiation fin 5 having a required height is separately formed in the insertion groove and inserted into the manufacturing method. Consists of

이러한 방열판은 필요에 의하여 추가로 방열판의 방열효과를 증가하기 위해서는 다시 새로운 방열판으로 변경하여야 하는 문제점을 안고 있다.Such a heat sink has a problem of changing to a new heat sink again in order to further increase the heat radiation effect of the heat sink.

도 2는 다른 종래의 제조방법에 의한 방열판을 도시한 것으로, 상기 방열판(1)의 기저부에 에폭시(Epoxy)와 같은 접착제를 도포하여 방열핀(5)을 부착하는 제조방법에 의하여 이루어져 있다.Figure 2 shows a heat sink according to another conventional manufacturing method, and is made by a manufacturing method for attaching a heat radiation fin (5) by applying an adhesive such as epoxy (epoxy) on the base of the heat sink (1).

그러나, 상기와 같은 종래의 방열판(1) 제조방법은 그 제조과정이 복잡하고 번거로우며, 추가 방열량을 필요로 하는 경우에는 전혀 새로운 방열판으로 변경하 여야 하는 곤란한 문제점이 있었다.However, the conventional heat sink 1 manufacturing method as described above has a difficult problem in that the manufacturing process is complicated and cumbersome, and in the case where additional heat dissipation is required, it must be changed to a new heat sink.

더욱이, 에폭시와 같은 접착제를 사용할 경우에는 피복된 에폭시로 인해 상기 방열판(1)의 방열핀(5)사이의 열전달 효율이 저하되어 전체적으로 방열판(1)의 열방출이 원활히 이루어지지 못하는 문제점이 있었다.In addition, when using an adhesive such as epoxy, there is a problem in that heat dissipation efficiency between the heat dissipation fins 5 of the heat dissipation plate 1 is lowered due to the coated epoxy, so that the heat dissipation of the heat dissipation plate 1 is not performed smoothly.

이에 본 발명은 상기와 같은 문제점들을 해결하기 위해 안출된 것으로, 방열판의 기저부에 길이방향으로 다수개의 1차 방열핀을 일체로 압출성형하며, 상기 1차 방열핀에 삽입홈이 형성된 2차 방열핀을 삽입한 후 외력에 의하여 또는 본딩에 의하여 고정시키도록 함으로써, 추가 방열량이 필요한 경우에 쉽게 2차 방열핀을 부착하여 전체적 형상의 손상이나 기능의 저하를 방지하면서 방열판의 제조공정을 단순화시켜 생산효율을 향상시킬 수 있도록 된 전자장비용 방열판 제조방법을 제공하는데 그 목적이 있다.Accordingly, the present invention has been made to solve the above problems, integrally extruding a plurality of primary heat sink fins in the longitudinal direction at the base of the heat sink, inserting a secondary heat sink fin formed with an insertion groove in the primary heat sink fins After fixing by external force or by bonding, if additional heat dissipation amount is needed, secondary heat sink fin can be easily attached to simplify the manufacturing process of heat sink and improve production efficiency while preventing damage to overall shape or deterioration of function. It is an object of the present invention to provide a heat sink manufacturing method for electronic equipment.

이하 본 발명을 첨부된 예시도면을 참조로 상세히 설명한다. 도 3은 본 발명에 따른 전자장비용 방열판의 제조방법으로서, 이를 상세히 설명하면, Hereinafter, the present invention will be described in detail with reference to the accompanying drawings. 3 is a manufacturing method of a heat sink for electronic equipment according to the present invention, and this will be described in detail.

방열판(1)기저부의 길이방향으로 다수개로 형성되며, 상기 방열판(1)과 일체로 1차 방열핀(2)을 상부로 연장되도록 압출성형하는 단계와; A plurality of heat sinks (1) formed in the longitudinal direction of the base, and extruding so as to extend the first heat dissipation fins (2) integrally with the heat sinks (1);

상기 1차 방열핀(2)에 대응되도록 삽입홈(3)이 형성된 2차 방열핀(4)을 삽입하는 단계와;Inserting a second heat dissipation fin (4) having an insertion groove (3) corresponding to the first heat dissipation fin (2);

상호 이웃하는 각각의 2차 방열핀(4)의 양측에서 외력을 가해 2차 방열핀(4)을 1차 방열핀(2)에 압착/고정시키는 단계;로 이루어진 하는 전자장비용 방열판 제조방법에 관한 것이다.A method of manufacturing a heat sink for an electronic device comprising a step of pressing / fixing the second heat dissipation fins 4 to the first heat dissipation fins 2 by applying an external force on each side of the second heat dissipation fins 4 adjacent to each other.

상기와 같은 방열판(1)은 평탄한 기저부에서 상부로 일정높이 일체로 연장압출성형되며, 상기 연장 성형된 1차 방열핀(2)은 충분한 높이로 연장 성형되며, 상기 1차 방열핀(2)에 상호 대응되도록 삽입홈(3)이 형성된 2차 방열핀(4)을 삽입한 후에, 2차 방열핀(4)이 삽입된 양측에서 외력을 가해 2차 방열핀(4)을 방열판에 압착/고정시키는 단계를 거쳐 형성되는 것이다.The heat dissipation plate 1 is extruded and formed integrally with a predetermined height from a flat base to an upper portion, and the elongated primary heat dissipation fins 2 are extended to a sufficient height and correspond to the primary heat dissipation fins 2. After inserting the secondary heat dissipation fin (4) having the insertion groove (3) so as to be formed, by applying an external force on both sides of the secondary heat dissipation fin (4) is formed through the step of pressing / fixing the secondary heat dissipation fin (4) to the heat sink Will be.

상기 방열판(1) 기저부의 1차 방열핀(2)에 상기 2차 방열핀(4)을 삽입한 후, 상기 기저부의 양측에서 외력을 가하게 되면, 상기 2차 방열핀(4)에 형성된 삽입홈(3)들이 서로 밀리면서 상기 방열판(1)과 밀착하게 되고, 상기 방열판(1)과 2차 방열핀(4) 사이의 압착이 충분히 이루어진 후, 외력을 제거하면 상기 1차 방열핀(2)과 삽입홈(3)의 고정작업이 완료되어 상기 2차 방열핀(4)의 유동이 없는 상태로 방열판(1)이 완성된다.After inserting the secondary heat dissipation fins 4 into the primary heat dissipation fins 2 of the base of the heat dissipation plate 1, when external forces are applied from both sides of the base, the insertion grooves 3 formed in the secondary heat dissipation fins 4 are formed. They are in close contact with the heat dissipation plate 1 while being pressed against each other, and after sufficient compression is made between the heat dissipation plate 1 and the secondary heat dissipation fins 4, when the external force is removed, the primary heat dissipation fins 2 and the insertion grooves 3 ) Is completed, the heat dissipation plate 1 is completed without the flow of the secondary heat dissipation fins (4).

다른 실시방법에 의하면, 방열판(1)기저부의 길이방향으로 다수개로 형성되며, 상기 방열판(1)과 일체로 1차 방열핀(2)을 상부로 연장되도록 압출성형하는 단계와; According to another embodiment, a plurality of heat sink (1) is formed in the longitudinal direction of the base portion, the step of extruding so as to extend the first heat radiation fin (2) to the top integrally with the heat sink (1);

상기 1차 방열핀(2)에 대응되도록 삽입홈(3)이 형성된 2차 방열핀(4)을 삽입하는 단계와; 상기 방열판(1)과 2차 방열핀(4)을 본딩으로 결합하는 단계;를 포함하는 전자장비용 방열판의 제조방법에 관한 것이다. Inserting a second heat dissipation fin (4) having an insertion groove (3) corresponding to the first heat dissipation fin (2); The heat dissipating plate 1 and the secondary heat dissipation fins (4) by bonding to a method for manufacturing a heat dissipating plate for electronic equipment comprising a.

종래기술에 보는바와 같이, 방열판(1)의 편평한 기저부에 방열핀(5)을 애폭시와 같은 본딩에 의하여 부착하면, 본딩 부착면이 충분하지 못하여, 예상하지 못한 외력에 의하여 방열핀(5)이 방열판(1)으로부터 이탈되는 경우가 발생하며, 열전달 효율이 저하되는 문제점이 발생하는 것이다.As shown in the prior art, when the heat radiation fins 5 are attached to the flat base of the heat sink 1 by bonding such as epoxy, the bonding surface is not sufficient, and the heat radiation fins 5 are exposed by the unexpected external force. A case arises from (1), and the problem that heat transfer efficiency falls is generated.

상기 2개의 제조방법에서, 방열판(1)에 일체로 압출성형된 1차 방열핀(2)에 의하여 1차로 충분하게 전자장비등의 열생성부에서 발생하는 열을 방출시키며, 방열량이 증가하여 상기 1차 방열핀으로 증가된 방열량을 방출시키지 못한 경우에, 삽입홈이 형성된 2차 방열핀을 추가로 쉽게 부착하는 제조공정을 제공하고자 하는 것이다. In the two manufacturing methods, the primary heat dissipation fin (2) integrally extruded to the heat sink (1) to release the heat generated in the heat generating unit such as electronic equipment sufficiently, primarily, the amount of heat dissipation increases 1 In the case of failing to release the increased heat dissipation by the primary heat dissipation fin, it is to provide a manufacturing process for easily attaching the secondary heat dissipation fin formed with the insertion groove.

본 발명에 따른 방열판(1)은 열전도성(thermal conductivity)이 우수한 재질로 이루어지며, 그 크기 및 형상은 방열을 원하는 부위에 알맞도록 본 발명의 요지를 벗어나지 않는 범위내에서 다양하게 변형하여 실시할 수 있음은 당연하다.Heat sink 1 according to the present invention is made of a material having excellent thermal conductivity (thermal conductivity), the size and shape of the heat dissipation can be carried out by various modifications within the scope not departing from the gist of the present invention to fit the desired site. Of course it can.

이상 설명한 바와 같이 본 발명에 따르면, 방열판과 일체로 길게 압출성형된 1차 방열핀을 형성하고, 이러한 1차 방열핀에 삽입홈이 형성된 2차 방열핀을 삽입한 후 외력을 가해 압착하여 고정하거나, 에폭시와 같은 본딩에 의하여 상호 결합함으로써, 기존의 방열판의 형상 변경을 방지하고, 단순화된 제조공정을 통해 손쉽게 전자장비용 방열판을 제조하는 방법을 제공하는데 있는 것이다. As described above, according to the present invention, the primary heat dissipation fin is formed integrally with the heat dissipation plate, and the secondary heat dissipation fin is formed by inserting the secondary heat dissipation fin having an insertion groove in the primary heat dissipation fin, and then compresses and fixes it by applying an external force, By bonding to each other by the same bonding, to prevent the shape change of the existing heat sink, and to provide a method for easily manufacturing a heat sink for electronic equipment through a simplified manufacturing process.

Claims (2)

방열판(1)기저부의 길이방향으로 다수개로 형성되며, 상기 방열판(1)과 일체로 1차 방열핀(2)을 상부로 연장되도록 압출성형하는 단계와; A plurality of heat sinks (1) formed in the longitudinal direction of the base, and extruding so as to extend the first heat dissipation fins (2) integrally with the heat sinks (1); 상기 1차 방열핀(2)에 대응되도록 삽입홈(3)이 형성된 2차 방열핀(4)을 삽입하는 단계와;Inserting a second heat dissipation fin (4) having an insertion groove (3) corresponding to the first heat dissipation fin (2); 상호 이웃하는 각각의 2차 방열핀(4)의 양측에서 외력을 가해 2차 방열핀(4)을 1차 방열핀(2)에 압착/고정시키는 단계;로 이루어진 것을 특징으로 하는 전자장비용 방열판의 제조방법.And pressing / fixing the secondary heat dissipation fins (4) to the primary heat dissipation fins (2) by applying an external force on each side of the secondary heat dissipation fins (4) adjacent to each other. 방열판(1)기저부의 길이방향으로 다수개로 형성되며, 상기 방열판(1)과 일체로 1차 방열핀(2)을 상부로 연장되도록 압출성형하는 단계와;       A plurality of heat sinks (1) formed in the longitudinal direction of the base, and extruding so as to extend the first heat dissipation fins (2) integrally with the heat sinks (1); 상기 1차 방열핀(2)에 대응되도록 삽입홈(3)이 형성된 2차 방열핀(4)을 삽입하는 단계와;Inserting a second heat dissipation fin (4) having an insertion groove (3) corresponding to the first heat dissipation fin (2); 상기 방열판(1)과 2차 방열핀(4)을 본딩으로 결합하는 단계;를 포함하는 것을 특징으로 하는 전자장비용 방열판의 제조방법.Bonding the heat dissipation plate (1) and the secondary heat dissipation fins (4) by bonding;
KR1020050028617A 2005-04-06 2005-04-06 Manufaturing method of a heatsink for electronic equipment KR100616310B1 (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR200459454Y1 (en) 2009-09-23 2012-04-02 김대칠 A radiate heating equipment
KR101846201B1 (en) * 2016-11-11 2018-04-06 현대오트론 주식회사 Elctronic control device having selective heat dissipating structure

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6176304B1 (en) 1998-11-24 2001-01-23 Hon Hai Precision Ind. Co., Ltd. Heat sink
JP2001102786A (en) 1999-10-01 2001-04-13 Mizutani Denki Kogyo Kk Radiator of electronic part and manufacturing method therefor
US6520248B2 (en) 2000-05-18 2003-02-18 Aavid Thermalloy Llc Heat sink having bonded cooling fins
JP2005033157A (en) 2003-07-04 2005-02-03 Taida Electronic Ind Co Ltd Radiator and its manufacturing method

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6176304B1 (en) 1998-11-24 2001-01-23 Hon Hai Precision Ind. Co., Ltd. Heat sink
JP2001102786A (en) 1999-10-01 2001-04-13 Mizutani Denki Kogyo Kk Radiator of electronic part and manufacturing method therefor
US6520248B2 (en) 2000-05-18 2003-02-18 Aavid Thermalloy Llc Heat sink having bonded cooling fins
JP2005033157A (en) 2003-07-04 2005-02-03 Taida Electronic Ind Co Ltd Radiator and its manufacturing method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR200459454Y1 (en) 2009-09-23 2012-04-02 김대칠 A radiate heating equipment
KR101846201B1 (en) * 2016-11-11 2018-04-06 현대오트론 주식회사 Elctronic control device having selective heat dissipating structure

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