KR100599499B1 - Substrate inspection apparatus and method - Google Patents

Abstract

The present invention relates to a substrate inspection apparatus capable of detecting a defect having an intermediate level of resistance by using an electrical non-contact inspection probe. 101a and detection probes 103, a power supply probe 101b for being disposed opposite to the wiring at the other end of the wire in electrical contact with the wiring, and a test for applying a 1 MHz sine wave test signal Voa to the power supply probe 101a. Detection of the signal source 104a, the inspection signal source 104b for applying the inspection signal Voa and the inspection signal Vob having a phase 180 degrees to the power supply probe 101b, and the voltage generated in the detection probe 103 An amplifier 105 and a disconnection determination unit 109 for making good or bad determinations of the wirings based on the phase of the voltage detected by the amplifier 105 are provided.

Board, Inspection Equipment, Plasma Display Panel

Description

Substrate inspection apparatus and method             

1 is a block diagram for explaining an example of a configuration of a substrate inspection apparatus according to a first embodiment of the invention.

FIG. 2 is an X-X partial sectional view of the substrate inspection device shown in FIG. 1. FIG.

3 is a partial cross-sectional view in a direction crossing the wiring of the substrate inspection apparatus shown in FIG. 1.

FIG. 4 is a waveform diagram for explaining the operation of the disconnection inspecting unit shown in FIG. 1.

FIG. 5 is a view for explaining the operation of the disconnection inspecting unit shown in FIG. 1 in the case of a disconnection failure in which the wiring is completely disconnected.

FIG. 6 is a view for explaining the operation of the disconnection inspection unit shown in FIG. 1 in the case where the wiring is poor in resistance.

7 is a waveform diagram for explaining the operation of the short-circuit inspection unit shown in FIG. 1.

FIG. 8 is a conceptual view for explaining the operation of the substrate inspection apparatus shown in FIG. 1 when a short circuit failure occurs between wirings. FIG.

9 is a view for explaining the operation of the short-circuit inspection unit shown in FIG. 1 in the case where the wiring is poor in resistance.

It is a figure for demonstrating the probe arrangement | positioning at the time of the inspection of the glass substrate in which the wiring space | interval of one end side is narrowing in the disconnection test | inspection part shown in FIG.

FIG. 11: is a figure for demonstrating the probe arrangement | positioning in the case of inspecting the glass substrate in which the wiring space | interval of one end side is narrowing in the short circuit inspection part shown in FIG.

It is a block diagram which shows an example of a structure of the board | substrate inspection apparatus which concerns on 2nd Embodiment of this invention.

It is a wave form diagram for demonstrating operation | movement of the disconnection test part shown in FIG.

FIG. 14 is an X-X partial sectional view of the substrate inspection device shown in FIG. 12. FIG.

FIG. 15 is a diagram for explaining the operation in the case of a disconnection failure in which the wiring is completely disconnected in the disconnection inspection unit shown in FIG. 12.

FIG. 16 is a waveform diagram for explaining the operation of the short-circuit inspection unit shown in FIG. 12.

17 is a conceptual diagram for explaining the operation of the short-circuit inspection unit shown in FIG. 12.

It is a figure for demonstrating the operation | movement in the case of a short circuit defect between wirings in the short circuit inspection part shown in FIG.

It is a block diagram which shows an example of the structure of the board | substrate inspection apparatus which concerns on 3rd embodiment of this invention.

20 is a view for explaining the operation of the substrate inspection apparatus shown in FIG. 19.

Fig. 21 is a graph showing the relationship between the resistance value of disconnection failure and the resistance value of short circuit failure in the wiring and the phase difference Θ between the inspection signal and the detection signal.

FIG. 22 is a schematic diagram for explaining the effect of the distance between the detection probe and the wiring to be inspected on the voltage detected by the detection probe in the substrate inspection device shown in FIG. 1.

It is a block diagram which shows an example of the structure of the board | substrate inspection apparatus which concerns on 4th Embodiment of this invention.

24 is a diagram for explaining the operation of the phase detector shown in FIG.

FIG. 25 is a view for explaining the operation of the feedback unit shown in FIG. 23.

FIG. 26 is a view for explaining the operation of the feedback unit shown in FIG. 23.

It is a figure which shows the example of the glass substrate in which the wiring in which the wiring space is narrowed toward the one end of a board | substrate, and the wiring in which the wiring space is narrowing to the other end side of a board | substrate are alternately formed.

Fig. 28 is a perspective view showing an outline of the structure of a PAS plasma display panel that is an example of a substrate.

29 is a schematic diagram for explaining the effect of the distance between the sensor and the wiring pattern to be inspected on the current detected by the sensor in the substrate inspection apparatus according to the background art.

Explanation of symbols on the main parts of the drawings

1, 1a, 1b: substrate inspection device

2: control unit

3: display unit

4, 4a, 4b ': substrate

41, 42, 43, 44, 45, 46, 47: wiring

51: the wit

52: conveying mechanism (transfer section)

100, 100a: Disconnection inspection unit (disruption determination unit)

101a: Feed probe (probe for 1st feed)

101b: Feed probe (probe for second feed)

103 Hz: detection probe (first detection probe)

104a ': Inspection signal source (first signal supply)

104b: Inspection signal source (second signal supply unit)

105 Hz: Amplifier (first detector)

06, 107 Hz: comparator

08 ': Phase difference detector

08, 112 Hz: phase difference detector

09, 109a: Open Circuit

10 Hz: detection probe (second detection probe)

11 Hz: Amplifier (second detector)

12Hz: phase difference detection part

21 Hz: detection probe (sixth detection probe)

122 Hz: Amplifier (sixth detector)

123: Feedback section

124 Hz: wiring detection probe

125 Hz: Ammeter (current detector)

126: Periodic voltage supply unit

200, 200a, 200b: Short circuit inspection unit (paragraph judge)

201a: Feed probe (probe for third feed)

201b: Feed probe (probe for 4th feed)

203 Hz: detection probe (third detection probe)

204a: Inspection signal source (third signal supply section, inspection voltage source)

204b: inspection signal source (fourth signal supply unit, inspection voltage source)

205 Hz: Amplifier (third detector)

206 Hz: comparator

207: comparator

208 Hz: phase difference detector

209, 209a, 209b ': Short circuit judgment

210 Hz: detection probe (fourth detection probe)

211 Hz: Amplifier (4th detection unit)

212 Hz: phase difference detector

213, 214, and 215 Hz: detection probe (5th detection probe)

216, 217, 218 Hz: Amplifier (Fifth Detection Section)

219, 220 Hz: Comparator

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate inspection apparatus and a substrate inspection method for inspecting wiring of a substrate such as a glass substrate used in an electrode plate for a liquid crystal display or a plasma display, and more particularly, to inspecting wiring in a non-contact manner. will be. The present invention is not limited to glass substrates, but is applicable to inspection of electrical wiring on various substrates such as printed wiring boards, flexible substrates, multilayer wiring boards, electrode plates for plasma displays, and film carriers for semiconductor packages. In this specification, these various wiring boards are collectively called "substrate."

Conventionally, with the miniaturization of wiring patterns formed on printed wiring boards, plasma display panels or glass substrates for liquid crystal panels, inspection is performed while the wiring patterns and the inspection probe are physically separated from each other, or an insulating film is used for the inspection probe. Background Art An apparatus for inspecting a substrate in which conduction of a wiring pattern is inspected by using a non-contact inspection probe that does not scratch a fine wiring pattern by covering an electrode surface is known (for example, Japanese Patent Laid-Open No. 11-A). See 133090 (Patent Document 1).).

In the above-described substrate inspection apparatus, two electrodes covered with an insulating film are used as inspection probes, and one electrode is disposed to face at one end of the inspection target wiring pattern, and the other electrode is connected to the other end of the wiring pattern. Arranged so as to face each other, the insulating film covering the electrode is sandwiched and the electrodes and the wiring pattern are electrostatically coupled by the capacitance of the capacitor formed according to the electrodes and the wiring pattern facing each other. Then, by injecting a test signal into the wiring pattern from one electrode and detecting a signal from the other electrode to the other end of the wiring pattern, conduction of the wiring pattern is performed based on the detected signal level. It is supposed to check.

Moreover, the structure of @plasma display panel which is an example of a board | substrate is shown below. 28 is a perspective view showing an outline of a structure of a plasma display panel. The plasma display panel shown in FIG. 28 includes a front plate 601 and a back plate 602. The front plate 601 is formed with a wiring 606 made of, for example, a bus electrode 605 formed by an indium tin oxide (ITO) film 604 and a film such as silver on the surface of the glass substrate 603. It is comprised by the glass substrate. In the front plate 601 configured as described above, the wiring 606 represents a resistance value of about several Ω in the case of a good product. On the other hand, when only the bus electrode 605 of the wiring 606 is disconnected, the disconnected portion conducts only along the ITO film 604, and has a resistance value of an intermediate level of about 100?

Moreover, the board | substrate inspection apparatus which examines the conduction of a wiring pattern using a non-contact inspection probe, The stimulator which radiates an electromagnetic wave to the conductor circuit board used as an inspection object, and the non-contact which detects the displacement current which arises in a conductor circuit board. The conduction of the wiring pattern is established by comparing the current distribution obtained by the sensor with the current distribution obtained by the sensor by installing the sensor and scanning the unit consisting of the sensor and the stimulator along the direction of the wiring pattern. A board | substrate test | inspection apparatus which test | inspects is known (for example, refer Unexamined-Japanese-Patent No. 8-278342 (patent document 2).).

However, the above-described substrate inspection apparatus uses the capacitance of the capacitor formed according to the electrodes and the wiring patterns facing each other and injects and detects the inspection signal in the wiring pattern, so that the detected signal level is determined according to the wiring pattern and the electrodes. The signal level detected varies due to the capacitance of the formed capacitor and is influenced by error factors such as the distance between the wiring pattern and the electrode and the stray capacitance generated between the wiring pattern and the surroundings. Therefore, in the case of inspecting a substrate such as the front plate 601 by using such a substrate inspection apparatus, if a defect occurs in the intermediate level resistance value as in the case where only the bus electrode 605 is disconnected, the bus electrode 605 Since it is difficult to distinguish the decrease in the detection signal level due to disconnection and decrease in the signal level due to dispersion, it is inconvenient that it is difficult to detect a defect having an intermediate level of resistance.

Further, in the substrate inspection apparatus described in Patent Document 2, the displacement current detected by the non-contact sensor changes depending on the distance between the stimulator and the sensor and the substrate to be inspected, so that the substrate and the stimulule If the distance between the radar and the sensor is not kept uniform, there is an inconvenience in that the target current distribution cannot be obtained. Therefore, for example, it is necessary to provide a mechanism for absorbing the inversion and warpage of the substrate and maintaining the distance between the substrate, the stimulator and the sensor uniformly.

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and an object thereof is to provide a substrate inspection apparatus and a method thereof capable of detecting a defect having an intermediate level of resistance by using an electrical non-contact inspection probe. It is another object of the present invention to provide a substrate inspection apparatus and a method in which the influence of the distance change is small between the wiring and the inspection probe.

A substrate inspection apparatus according to a first means of the present invention for achieving the above object is a substrate inspection apparatus for inspecting a wiring formed on a substrate surface, the first class of which is disposed at one end of the wiring so as to be in electrical contact with the wiring without contact. A second probe for applying a first periodic signal having a predetermined period to the first feed probe and a first probe for detecting the first probe; A first signal supply unit, a second signal supply unit for applying a second periodic signal 180 degrees out of phase with the first periodic signal to the second power supply probe, and a second voltage detecting unit for detecting a voltage generated in the first detection probe; A 1st detection part and the disconnection determination part which perform the determination of the good or bad of the said wiring based on the phase of the voltage detected by the said 1st detection part are provided, It is characterized by the above-mentioned.

According to the present invention, at one end of the wiring to be inspected, the first power feeding probe and the first detecting probe are disposed to face each other in electrical non-contact so as to be capacitively coupled to the wiring. In addition, at the other end of the wiring, the second power supply probe is disposed capacitively opposite the wiring so as to be capacitively coupled with the wiring. The first periodic signal applied by the first signal supply unit is supplied to one end of the wiring via the first power supply probe, so that the second periodic signal, which is 180 degrees out of phase with the first periodic signal, is the second signal. The supply unit is supplied to the other end of the wiring via the second power supply probe. In addition, the voltage generated at one end of the wiring is detected by the first detection unit via the first detection probe, and the determination of good or bad of the wiring is performed based on the phase of the voltage detected by the first detection unit. As a result, a defect having an intermediate level of resistance value can be detected based on a phase of a voltage which is less affected by an error factor, and has less influence of a distance change between the wiring and the inspection probe.

In the above-described substrate inspection apparatus, the disconnection determination unit determines that the wiring is defective if the phase difference between the voltage detected by the first detection unit and the first periodic signal is within a range of a preset phase difference. It features.

According to this invention, when the phase difference between the voltage detected by the 1st detection part in the one end of the said wiring, and the 1st periodic signal supplied to the one end of the said wiring is in the range of a preset phase difference, it is determined that the said wiring is defective. do. Thereby, the defect which has a resistance value of intermediate level can be detected based on the phase of the voltage which is less influenced by an error factor.

In the above-described substrate inspection apparatus, the disconnection determination unit further determines that the wiring is defective when the phase difference between the voltage detected by the first detection unit and the first periodic signal is substantially 0 degrees. It is done.

According to the present invention, when the phase difference between the voltage detected by the first detection unit at one end of the wiring and the first periodic signal supplied to one end of the wiring is substantially 0 degrees, the wiring is determined to be defective. Thereby, the disconnection defect of the state which was completely disconnected can be detected based on the phase of the voltage with less influence of an error factor.

In the above-described substrate inspection apparatus, the disconnection judging unit further determines that the wiring is defective when the voltage value detected by the first detection unit exceeds a predetermined reference value.

According to this invention, when the voltage value detected by the 1st detection part exceeds a predetermined reference value, it is determined that the said wiring is defective. As a result, a defect having an intermediate level of resistance value is detected based on a phase of a voltage that is less influenced by an error factor, while a disconnection failure in a complete disconnection state is detected based on a voltage value detected by the first detection unit. can do.

In the above-described substrate inspection apparatus, the disconnection judging unit further determines that the wiring is a good product when the voltage value detected by the first detection unit is substantially zero.

According to this invention, when the voltage value detected by a 1st detection part is substantially zero, it is determined that the said wiring is a quality goods. As a result, the defect having the intermediate level of resistance can be detected based on the phase of the voltage which is less affected by the error factor, and the good product can be determined based on the voltage value detected by the first detection unit.

The above-described substrate inspection apparatus further includes a second detection probe disposed opposite to the wiring in electrical contact with the other end of the wiring, and a second detection section for detecting a voltage generated in the second detection probe. The disconnection determining unit determines that the wiring is a good product when the phase difference between the voltage detected by the first detection unit and the voltage detected by the second detection unit is substantially 0 degrees.

According to the present invention, the second detection probes are arranged in electrical contact with each other at the other end of the wiring to be inspected to be capacitively coupled to the wiring. Then, the voltage generated at the other end of the wiring is detected by the second detector through the second detection probe, so that the phase difference between the voltage detected by the first detector and the voltage detected by the second detector is substantially zero. In the case of Fig., It is determined that the wiring is a good product. Thereby, the quality goods judgment can be made based on the phase of the voltage which is less influenced by an error factor.

In the above-described substrate inspection apparatus, a second detection probe which is disposed at the other end of the wiring so as to be in electrical non-contact with the wiring and a second detection portion which detects a voltage generated in the second detection probe are further provided. The disconnection determining unit determines that the wiring is defective when the phase difference between the voltage detected by the first detector and the voltage detected by the second detector is substantially 180 degrees.

According to the present invention, the second detection probes are arranged in electrical contact with each other at the other end of the wiring to be inspected to be capacitively coupled to the wiring. Then, the voltage generated at the other end of the wiring is detected by the second detector through the second detection probe, and the phase difference between the voltage detected by the first detector and the voltage detected by the second detector is substantially 180. In the case of Fig., The wiring is determined to be defective. As a result, the defect can be judged based on the phase of the voltage which is less affected by the error factor.

In the above-described substrate inspection apparatus, the substrate surface is formed with a plurality of wires so as to extend in a predetermined direction along the substrate surface, and a transfer unit for transferring the substrate in a direction crossing the plurality of wires is further provided. And the disconnection determining unit performs the determination while transferring the substrate by the transfer unit.

According to this invention, the board | substrate formed in the direction in which several wiring cross | intersects the board | substrate surface is conveyed in the direction which cross | intersects each wiring, and good and bad judgment is performed. Thereby, since good or bad judgment of each wiring can be carried out continuously, conveying a board | substrate, inspection efficiency can be improved.

Further, in the above-described substrate inspection apparatus, the first and second power supply probes are characterized in that they extend so as to cover some or all of the various wirings, and are arranged to face each other in electrical non-contact.

According to this invention, the 1st and 2nd power supply probes extend | stretch and cross | intersect so as to cover some or all of several wirings, and are arrange | positioned facing them non-electrically. Thereby, the range where the 1st and 2nd power supply probes are arrange | positioned facing the wiring of an inspection object becomes wide, and positioning for inspection becomes easy.

The substrate inspection apparatus according to the second means of the present invention for achieving the above object is a substrate inspection apparatus that sequentially inspects a plurality of wirings formed on the substrate surface, and is sequentially selected from the various wirings and is connected to the first inspection target wiring. A fourth class disposed in electrical contact with the non-contacting surface of the third power supply probe and the third detection probe, and the second non-contact wiring differs from the first inspection object wiring in a non-contact manner. A third signal supply unit for applying a third periodic signal having a predetermined period to the third probe, the fourth probe and a fourth period different in phase from the third periodic signal to the fourth feeding probe A fourth signal supply unit for applying a signal, a third detector for detecting a voltage generated in the third detection probe, and a phase of a voltage detected by the third detector. And a short circuit judging unit for determining the presence or absence of a short circuit failure between the first and the second inspection object wirings.

According to the present invention, the first inspection target wiring, the third power supply probe, and the third detection probe are disposed to face each other in an electrical non-contact manner so as to be capacitively coupled. In addition, the second inspection target wiring and the fourth power feeding probe are disposed capacitively to face each other in an electrical non-contact manner. The third periodic signal applied by the third signal supply unit is supplied to the first inspection target wiring through the third power supply probe, and the fourth periodic signal, which is 180 degrees out of phase with the third periodic signal, is supplied to the fourth periodic signal. The signal supply unit is supplied to the second inspection target wiring via the fourth feeding probe. In addition, the voltage generated on the first inspection target wiring is detected by the third detection unit via the third detection probe, and between the first and second inspection target wirings based on the phase of the voltage detected by the third detection unit. It is determined whether there is a short circuit failure. Thereby, the defect which the short circuit between the 1st and 2nd test object wiring was shorted by the resistance value of an intermediate level can be detected based on the phase of the voltage which is less influenced by an error factor.

In the above-described substrate inspection apparatus, the short circuit judging unit determines that the short circuit is defective when the phase difference between the voltage detected by the third detection unit and the third periodic signal is within a range of a preset phase difference. It features.

According to the present invention, when the phase difference between the voltage detected by the third detection unit from the first inspection target wiring and the first periodic signal supplied to the first inspection target wiring is within a range of a preset phase difference, the first and second It is determined that there is a short circuit failure between the inspection target wirings. Thereby, the short circuit defect which has the intermediate value of resistance value can be detected based on the phase of the voltage which is less influenced by an error factor.

In the above-described substrate inspection apparatus, the short circuit judging unit further determines that the short circuit failure exists when the voltage value detected by the third detection unit is substantially zero.

According to the present invention, when the voltage value detected by the third detection unit is substantially zero, it is determined that there is a short circuit failure between the first and second inspection object wiring lines. As a result, short-circuit defects having an intermediate level of resistance value can be detected based on a phase of a voltage that is less affected by an error factor, and short-circuit defects of low resistance can be detected based on the detected voltage.

In the above-described substrate inspection apparatus, the short circuit judging unit further determines that there is no short circuit failure when the phase difference between the voltage detected by the third detection unit and the third periodic signal is substantially 0 degrees. do.

According to the present invention, when the phase difference between the voltage detected by the third detector in the first inspection target wiring and the third periodic signal supplied to the first inspection target wiring is substantially 0 degree, the first and second inspection targets It is determined that there is no short circuit failure between the wirings. Thereby, the quality goods judgment can be performed between the first and second inspection object wirings based on the phase of the voltage which is less affected by the error factor.

In the above-described substrate inspection apparatus, the short circuit judging unit further determines that there is no short circuit failure when the voltage value detected by the third detection unit exceeds a predetermined reference value.

According to this invention, when the voltage value detected by the 3rd detection part exceeds a predetermined reference value, it is determined that there is no short circuit failure between the 1st and 2nd test object wiring. As a result, short-circuit defects having a middle level of resistance value can be detected based on the phase of the voltage which is less affected by the error factor, and good quality judgment can be made based on the voltage value detected by the first detection unit.

In the above-described substrate inspection apparatus, the fourth detection probe which is arranged in electrical non-contact with the second inspection object wiring different from the first inspection object wiring, and the voltage generated in the fourth detection probe are detected. And a fourth detector, wherein the short circuit judging further determines that the short circuit is defective when the phase difference between the voltage detected by the first detector and the voltage detected by the second detector is substantially 0 degrees. It features.

According to the present invention, the second inspection object wiring and the fourth detection probe are capacitively coupled by being electrically opposed to each other. Then, the voltage generated on the second inspection target wiring is detected by the fourth detection unit using the fourth detection probe, and the phase difference between the voltage detected by the third detection unit and the voltage detected by the fourth detection unit is substantially In the case of 0 degree, it is determined that the wiring is a good product. Thereby, the quality goods judgment can be made based on the phase of the voltage which is less influenced by an error factor.

The board inspection apparatus according to the third means of the present invention for achieving the above object is a wiring which is sequentially selected from various wirings formed on the substrate surface and constitutes a first inspection target wiring, and a different line from the first inspection target wiring. 2 is a substrate inspection apparatus for inspecting a substrate in accordance with a wiring of an inspection object wiring and one or a plurality of third inspection object wirings formed between the first and second inspection object wirings, wherein the first inspection A third feeding probe disposed to be in electrical contact with the target wiring in electrical contact, a fourth feeding probe disposed to be in electrical contact with the second inspection target wiring in electrical contact, and the electrical contactless with each of the one or a plurality of third inspection target wirings A potential difference is generated between one or a plurality of fifth detection probes disposed opposite to each other, and the third feeding probe and the fourth feeding probe. A detection voltage source for applying a predetermined inspection voltage for the detection, one or more fifth detection sections for detecting voltages generated in the one or more fifth detection probes, and one or more fifth detection sections. And a short circuit judging unit for determining the presence or absence of a short circuit failure in the third inspection object wiring based on the voltage to be obtained.

According to the present invention, the first inspection target wiring and the third power supply probe are capacitively coupled by being electrically opposed to each other. In addition, the second inspection target wiring and the fourth power feeding probe are disposed capacitively to face each other in an electrical non-contact manner. The one or more fifth detection probes and each of the one or more third inspection object wirings are capacitively coupled by being disposed in electrical contact with each other. In addition, when a predetermined inspection voltage is applied between the third power supply probe and the fourth power supply probe by the inspection voltage source, one or a plurality of voltages generated in one or more third inspection object wirings are applied. It detects by one or several 5th detection part using a 5th detection probe. Then, the presence or absence of a short circuit failure in the third inspection target wiring is determined based on the voltage detected by the one or the plurality of fifth detection units. Thereby, the short circuit defect of several parts can be detected collectively.

In the above-described substrate inspection apparatus, a plurality of third inspection object wirings are selected between the first and second inspection object wirings, and the short circuit judging is detected by two fifth detection units of the plurality of fifth detection units. It is determined that the short-circuit is defective in the third inspection target wiring when the voltage to be substantially equal is equal, and the short-circuit failure in the third inspection target wiring when all of the voltages detected by the plurality of fifth detection units are different. It is characterized by determining that there is no.

According to the present invention, when the voltages detected by the two fifth detection units of the plurality of fifth detection units are substantially equal to each other, it is determined that there is a short circuit failure in the third inspection target wiring, and the plurality of fifth detection units detects the failure. If all of the voltages to be different are different, it is determined that there is no short circuit failure in the third test object wiring. As a result, it is possible to determine whether there is a short circuit failure in the third inspection target wiring based on the voltage detected by the plurality of fifth detection units.

In the above-described substrate inspection apparatus, a plurality of wirings are formed on the substrate surface so as to extend in a predetermined direction along the substrate surface, and a transfer unit for transferring the substrate in a direction crossing the plurality of wirings is further provided. And the short circuit judging unit performs the determination while transferring the substrate by the transfer unit.

According to this invention, the presence or absence of a short circuit defect is determined, as the board | substrate formed in multiple numbers in the direction which a wiring crosses a board | substrate crosses in the direction which cross | intersects a some wiring. As a result, it is possible to make good and bad determinations between the respective wirings continuously while transferring the substrate, thereby improving inspection efficiency.

Further, in the above-described substrate inspection apparatus, the third power feeding probe extends so as to cover a plurality of wirings on the opposite side from the first inspection target wiring and the second inspection target wiring, and electrically contacts them with no contact. The fourth feeding probe is extended so as to cover a plurality of wirings on the opposite side to the second inspection target wiring and the first inspection target wiring, and to be disposed so as to be opposed to them electrically. It features.

According to this invention, the 3rd feeding probe extends and cross | intersects so that it may cover the some wiring of the opposite side to the 1st test object wiring and the 2nd test object wiring, and is arrange | positioned facing them electrically non-contact, and the 4th power supply probe Is extended so as to cover a plurality of wirings on the opposite side from the second inspection target wiring and the first inspection target wiring, and are disposed to face each other in electrical non-contact. Thereby, the range where the 3rd and 4th power supply probes are arrange | positioned facing the wiring of a test object becomes wide, and positioning for inspection is easy.

A substrate inspection apparatus according to a fourth means of the present invention for achieving the above object is a substrate inspection apparatus that sequentially performs inspection of a plurality of wirings formed to extend in a predetermined direction along a substrate surface, and is selected from the plurality of wirings and is a fourth In the wiring of the inspection target wiring, the first feeding probe and the first detecting probe disposed at one end of the wiring to be electrically non-contacted with the wiring, and the other end of the wiring to be tested at the other end of the wiring to be electrically non-contacting with the wiring. A second feed probe, a first signal supply unit applying a first periodic signal having a predetermined period to the first feed probe, and a phase different from the first periodic signal to the second feed probe by 180 degrees A second signal supply unit for applying a second periodic signal, a first detection unit for detecting a voltage generated in the first detection probe, and a plurality of wirings A third power supply probe and a third detection probe that are arranged to be in electrical contact with the wiring of the fifth inspection object wiring, and the third detection probe is disposed to be in electrical contact with the sixth inspection wiring that is different from the fifth inspection wiring. A third signal supply unit applying a third periodic signal having a predetermined period to the fourth feeding probe, the third feeding probe, and a phase different from the third periodic signal to the fourth feeding probe by 180 degrees A fourth signal supply unit for applying a fourth periodic signal, a third detector for detecting a voltage generated by the third detection probe, a transfer unit for transferring the substrate in a direction crossing the plurality of wires, and the transfer unit And a disconnection determination unit which judges whether the fourth inspection object wiring is good or bad based on the phase of the voltage detected by the first detection unit while transferring the substrate. While transferring the substrate by the conveyance portion is characterized by comprising a short-circuit determination for determining the presence or absence of short-circuit defects in the basis of the phase of the voltage detected by the third detecting section between the fifth and the sixth inspection target wiring.

According to the present invention, the first power supply probe and the first detection probe are disposed to face each other in electrical non-contact at one end of the fourth inspection object wiring so as to be capacitively coupled with the wiring. Further, the second power supply probe is capacitively coupled with the fourth inspection target wiring by being disposed oppositely in electrical contact with the other end of the fourth inspection target wiring. Then, the first periodic signal applied by the first signal supply unit is supplied to one end of the fourth inspection target wiring via the first power supply probe, so that the second periodic signal 180 degrees out of phase with the first periodic signal is supplied. The second signal supply unit is supplied to the other end of the fourth inspection target wiring via the second power supply probe. Further, the voltage generated at one end of the fourth inspection target wiring is detected by the first detection unit via the first detection probe, and based on the phase of the voltage detected by the first detection unit, A bad judgment is made. In addition, the fifth inspection target wiring, the third power supply probe, and the third detection probe are capacitively coupled by being disposed to face each other in an electrical non-contact manner. In addition, the sixth inspection object wiring and the fourth power feeding probe are disposed in a non-electrically opposed manner so as to be capacitively coupled. The third periodic signal applied by the third signal supply unit is supplied to the fifth inspection target wiring through the third power supply probe, and the fourth periodic signal, which is 180 degrees out of phase with the third periodic signal, is supplied to the fourth periodic signal. The signal supply unit is supplied to the sixth inspection target wiring via the fourth feeding probe. In addition, the voltage generated on the fifth inspection target wiring is detected by the third detection unit via the third detection probe, and between the fifth and sixth inspection target wiring based on the phase of the voltage detected by the third detection unit. It is determined whether there is a short circuit failure. As a result, the disconnection failure having the intermediate level of resistance value can be detected based on the phase of the voltage which is less affected by the error factor, and the defects shorted between the wirings to the intermediate level of resistance value are affected by the error factor. Receiving can be detected based on the phase of the low voltage.

In the above-described substrate inspection apparatus, the range of the set phase difference is 30 degrees to 90 degrees. According to this invention, the range of the said phase difference is preset in 30 degree-90 degree.

A substrate inspection method according to a fifth means of the present invention for achieving the above object is a substrate inspection method in which the wiring formed on the substrate surface is inspected, and the first feeding probe and the first detecting probe are connected at one end of the wiring. Disposed opposite to the wiring in electrical contact, and at the other end of the wiring, the second feeding probe is disposed in electrical contact with the wiring, and the first periodic signal having a predetermined period is applied to the first feeding probe. And applying a second periodic signal 180 degrees out of phase with the first periodic signal to the second power supply probe, and determining whether the wiring is good or bad based on the phase of the voltage generated in the first detection probe. It is characterized by.

According to the present invention, at one end of the wiring to be inspected, the first feeding probe and the first detecting probe are disposed to face each other in electrical non-contact so as to be capacitively coupled with the wiring. In addition, at the other end of the wiring, the second power supply probe is disposed in electrical contact with the wiring in a non-contact manner, thereby capacitively coupling the wiring. Then, a first periodic signal having a constant period is supplied to one end of the wiring via a first feed probe, and a second periodic signal 180 degrees out of phase with the first periodic signal is interposed through the second feed probe. Is supplied to the other end of the wiring. In addition, the determination of good or bad of the wiring is performed based on the phase of the voltage generated at one end of the wiring. Thereby, the defect which has a resistance value of intermediate level can be detected based on the phase of the voltage which is less influenced by an error factor.

The board | substrate test | inspection method which concerns on the 6th means of this invention for achieving the above-mentioned object is a board | substrate test | inspection method which test | inspects the multiple wiring formed in the board | substrate, and connects the 3rd supply probe and the 3rd detection probe to the said some wiring A non-electrically opposed contact with the wiring selected as the first inspection target wiring from the first inspection target wiring, and a fourth feeding probe is arranged in electrical contact with the second inspection target wiring different from the first inspection target wiring, Applying a third periodic signal having a predetermined period to the probe, applying a fourth periodic signal 180 degrees out of phase with the third periodic signal to the fourth feeding probe, and a voltage generated in the third detecting probe The presence or absence of a short circuit defect between the first and second inspection object wirings is determined based on the phase of?.

According to the present invention, the first inspection target wiring, the third power supply probe, and the third detection probe are disposed to face each other in an electrical non-contact manner so as to be capacitively coupled. In addition, the second inspection target wiring and the fourth power feeding probe are disposed capacitively to face each other in an electrical non-contact manner. The third periodic signal having a predetermined period is supplied to the first inspection target wiring through the third feeding probe, and the fourth periodic signal, which is 180 degrees out of phase with the third periodic signal, provides the fourth feeding probe. It is supplied to the 2nd test object wiring via an interposition. In addition, the presence or absence of a short circuit failure between the first and second inspection target wirings is determined based on the phase of the voltage generated in the first inspection target wiring. Thereby, the defect which the short circuit between the 1st and 2nd test object wiring was shorted by the resistance value of an intermediate level can be detected based on the phase of the voltage which is less influenced by an error factor.

In the substrate inspection method according to the seventh means of the present invention for achieving the above object, a plurality of wirings are formed on a substrate surface, and the first inspection target wiring selected from the plurality of wirings and the first inspection target wiring are different from each other. A substrate inspection method for inspecting a substrate by another second inspection object wiring and one or a plurality of third inspection object wirings formed between the first and second inspection object wirings. 1 is disposed so as to face the non-contact electrical contact with the inspection target wiring, and is arranged to face the fourth power supply probe in a non-contact electrical contact with the second inspection target wiring, and the one or the plurality of fifth detection probes is inspected by the one or the plurality of third inspection. It is arranged to face each other in electrical non-contact with each other, and the predetermined inspection for generating a potential difference between the third feeding probe and the fourth feeding probe The application and, on the basis of said one or plurality of fifth voltage occurs in the detection probe is characterized in that for determining the presence or absence of short-circuit failure according to the third inspection target wiring.

According to the present invention, the first inspection target wiring and the third power supply probe are capacitively coupled by being electrically opposed to each other. In addition, the second inspection target wiring and the fourth power feeding probe are disposed capacitively to face each other in an electrical non-contact manner. The one or more fifth detection probes and each of the one or more third inspection object wirings are capacitively coupled by being disposed in electrical contact with each other. Further, by applying a predetermined inspection voltage between the third power supply probe and the fourth power supply probe, the third inspection object wiring is based on the voltage detected by the one or the plurality of fifth detection probes. In the case of short circuit failure, it is determined. Thereby, the short circuit defect of several parts can be detected collectively.

In the above-described substrate inspection apparatus, a plurality of wirings are formed on the substrate surface so as to extend in a predetermined direction along the substrate surface, and the first and second power supply probes are partially or all of the plurality of wirings. Intersect and extend in a direction different from the direction in which the wiring extends so as to cover, and are disposed to face each other in an electrical non-contact manner, including a plurality of wirings including at least two of the wirings covered by the first and second feeding probes. A sixth detection probe which extends and crosses in a direction different from the direction in which the wiring extends so as to cover the wirings of the wirings; And a voltage level detected by the sixth detector at zero and a voltage level detected by the sixth detector. In the first signal supply unit and / or the second signal supply unit to increase or decrease the ratio of the first period signal application level to the second period signal application level according to the difference between the first period signal and the polarity of the first period signal. A feedback unit for adjusting the signal application level is also provided.

According to this invention, while the 1st and 2nd power supply probes cross | intersect so that a part or all of a some wiring may be covered, it will be arrange | positioned facing them electrically non-contact. Further, the sixth detection probe intersects to cover a plurality of wirings including two or more wirings among the wirings covered by the first and second power feeding probes, and is disposed so as to face each other in electrical non-contact. Then, the voltage generated in the sixth detection probe is detected by the sixth detection unit. The feedback unit maintains the voltage level detected by the sixth detection unit at zero, and applies the second periodic signal according to the difference between the polarity of the voltage detected by the sixth detection unit and the polarity of the first periodic signal. The signal application level is adjusted in the first signal supply section and / or the second signal supply section to increase or decrease the ratio of the first periodic signal application level to the level. As a result, when the inspection target wiring is a good product, the voltage level caused to the wiring by the signals supplied from the first signal supply section and the second signal supply section becomes zero. As a result, the voltage value detected by the first detection section is reduced. To zero.

Further, in the above-described substrate inspection apparatus, a wire detection probe disposed in a non-electrically opposed manner to the inspection target wiring in which the first detection probe is arranged opposite, and a periodic voltage having a constant period is applied to the wire detection probe. A periodic voltage supply unit and a current detector for detecting a current flowing through the wire detection probe are further provided, and the disconnection judging unit performs the good and bad judgment when a current is detected by the current detector.

According to the present invention, the wiring detection probe is arranged to be electrically non-contacted with the wiring on which the first detection probe is arranged to be opposed, and a periodic voltage having a constant period is applied to the wiring detection probe by the periodic voltage supply unit. In the case where the current flowing through the wire detection probe is detected by the current detection unit, a good disconnection judgment is made by the disconnection determiner. As a result, in the case where the first detection probe is arranged to be in electrical non-contact with the wiring, good or bad judgment is performed by the disconnection determination unit.

In this specification, the electrical non-contact means that the conductor portion and the wiring of the probe are non-contact, and the probe and the wiring are physically separated, such as when the probe and the wiring are physically separated and when the probe surface is covered with an insulating material. Means that it is in contact but not electrically conducting.

EMBODIMENT OF THE INVENTION Hereinafter, embodiment which concerns on this invention is described based on drawing. In addition, in each figure, the structure with the same code | symbol shows the same structure, and the description is abbreviate | omitted.

(First embodiment)

1 is a block diagram for explaining an example of the configuration of a substrate inspection apparatus according to a first embodiment of the present invention. The board | substrate test | inspection apparatus 1 shown in FIG. 1 is equipped with the control part 2, the display part 3, the disconnection test | inspection part 100, and the short circuit test | inspection part 200, for example. The disconnection inspection unit 100 includes, for example, the power supply probes 101a and 101b, the detection probe 103, the inspection signal sources 104a and 104b, the amplifier 105, the comparator 106 and 107, and the phase difference detection unit 108. And a disconnection judging unit 109. The short circuit inspection unit 200 includes, for example, the power supply probes 201a and 201b, the detection probe 203, the inspection signal sources 204a and 204b, the amplifier 205, the comparators 206 and 207, and the phase difference detection unit 208. And a short circuit judging unit 209.

In addition, the power supply probes 101a and 101b, the detection probe 103, the power supply probes 201a and 201b, and the detection probe 203 are integrally provided in the test plate which is not shown in figure. Moreover, the mounting base 51 for placing the board | substrate 4 used as an inspection object in the position which opposes the said test plate, and the conveyance mechanism 52 for conveying the board | substrate 4 mounted on the mounting base 51 is carried out. Is provided. As a result, when the substrate 4 is placed on the mounting table 51, the power supply probes 101a and 101b, the detection probe 103, the power supply probes 201a and 201b, the detection probes 203 and the substrate 4. Substrate surfaces of the substrates are opposed to each other in a state of physical and electrical non-contact with a small gap. This gap is such that an amount of capacitance is generated between the wiring formed on the substrate surface and each of the probes arranged oppositely, and the gap can be used to inject or detect a signal using the capacitance (for example, 0.1 mm to 0.5 mm). The interval may be such that each probe does not contact the substrate surface.

The board | substrate 4 is a test | inspection board | substrate, for example, is a glass substrate used as a front plate of a plasma display panel. On the surface of the board | substrate 4, the wirings 41, 42, 43, 44, 45, 46, 47 which are substantially linear wiring patterns are formed in parallel at equal intervals. In addition, the board | substrate 4 should just be a board | substrate with a wiring pattern which transmits an electrical signal on the surface, For example, it is used for the glass substrate of a liquid crystal panel, a printed wiring board, a flexible substrate, and TAB (Tape Automated Bonding) mounting of a semiconductor chip. It may be a film carrier or the like. In addition, although the wiring pattern is shown by the minimum number of wirings necessary in order to demonstrate the principle of this invention, in fact, many wirings are formed and a test | inspection is carried out sequentially by the same principle as described below, selecting such wiring sequentially. It is to be done.

FIG. 2 is an X-X partial sectional view of the substrate inspection apparatus 1 shown in FIG. 1. 3 is a partial cross-sectional view in a direction crossing the wirings 45 and 46. In the substrate 4 shown in Fig. 2, an ITO film 402 is formed on the substrate surface of the glass substrate 401, and a bus electrode 403 made of silver or the like is formed on the ITO film 402, for example. . The wiring 42 is formed by the ITO film 402 and the bus electrode 403. In addition, the wirings 41, 43, 44, 45, 46, 47 are also configured similarly to the wiring 42.

The conveyance mechanism 52 is provided on the mounting table 51, for example, and the user (user) supports the board | substrate 4 set on the mounting table 51, and the control signal from the control part 2 is carried out. According to this, the power supply probes 101a and 101b at a constant speed in the direction of the arrow Y shown in Fig. 1, that is, the direction crossing the wirings 41, 42, 43, 44, 45, 46 and 47. ), The detection probe 103, the power supply probes 201a and 201b, and the detection probe 203 and the substrate surface of the substrate 4, and the small distance between the wirings while maintaining the state of supporting Return.

As shown in Fig. 2, by placing the substrate 4 on the mounting table 51, for example, the power supply probes 101a and 101b, the detection probes 103 and the wiring 42 face each other, and the capacitance In this manner, capacitances C1, C2, and C3 are generated between the power supply probes 101a and 101b, the detection probe 103, and the wiring 42. Similarly, as shown in Fig. 3, the power supply probes ( 201a and the detection probe 203 and the wiring 45 are disposed to face each other to generate capacitances C4 and C6, respectively, and the power supply probe 201b and the wiring 46 are arranged to face each other and the capacitance C5 is generated.

Returning to FIG. 1, first, the disconnection inspection unit 100 will be described. The test signal source 104a outputs, for example, a test signal Vo of a sine wave having a frequency of 1 MHz to the power supply probe 101a and the phase difference detection unit 108. The inspection signal source 104b outputs, for example, a sine wave inspection signal Vob of 180 degrees out of phase with the inspection signal Voa to the power supply probe 101b.

An example of the disconnection inspection of the wiring 42 will be described below. The feed probes 101a and 101b are electrodes covered with an insulating film, for example, on the surface of the feed probes 101a and 101b, and are sized to cover a plurality of wirings, for example, three wirings. In the case where the inspection plate (not shown) is disposed to face the substrate 4 in a non-contact manner, the power supply probes 101a and 101b face the wiring 42 and the wiring 42 adjacent to the inspection object 42. It is arrange | positioned at the position, and it is a shape which covers the wiring 41, 42, 43.

The power supply probe 101a supplies the test signal Voa from the test signal source 104a to the wiring 42 via an electrostatic coupling generated between the wirings 42 arranged oppositely. On the other hand, the power feed probe 101b supplies the test signal Vob from the test signal source 104b to the wiring 42 via the electrostatic coupling generated between the wirings 42 arranged oppositely.

The detection probe 103 is, for example, an electrode whose surface opposite to the wiring is covered with an insulating film, and has a shape covering only one end of the wiring 42 to be inspected when the detection probe 103 is disposed to be opposed to and opposed to the substrate 4. . For example, when the wiring pattern to be inspected was the wiring 42, the detection probe 103 is disposed at a position facing the wiring 42, and is supplied to the wiring 42 from the power supply probes 101a and 101b. The voltage caused by the signal is detected through the electrostatic coupling generated between the wiring 42 and the wiring 42.

In this case, since the power supply probes 101a and 101b have a large shape covering a plurality of wiring patterns, the substrate 4 is placed on the substrate in a state where the detection probe 103 is disposed at a position facing the wiring 42. Even when the surface is inclined in the plane, the wiring 42 is opposed to the feeding probes 101a and 101b and the detection probe 103 in a wide range in which the feeding probes 101a and 101b can cover the wiring 42. To facilitate positioning. In addition, the power supply probes 101a and 101b may be the size which covers four or more wiring patterns, and the size which covers only two or one wiring pattern may be sufficient as them.

The amplifier 105 amplifies the signal derived from the detection probe 103 without changing the phase and outputs it to the comparator 106 and 107 and the phase difference detection unit 108 as the detection signal Voc. The comparator 106 detects that the voltage of the detection signal Voc detected by the amplifier 105 is substantially zero, compares the preset reference voltage Vrefo and the detection signal Voc, and detects the detection signal Voc. ) Outputs a zero determination signal to the disconnection determination unit 109 at a high level when the reference voltage Vrefo falls below the reference voltage Vrefo, and outputs a zero determination signal at a low level when the detection signal Voc is higher than the reference voltage Vrefo. Output to the disconnection decision unit 109. In addition, substantially zero means having the value of the range which added the error range of signal detection to zero.

As the reference voltage Vrefo, an upper limit voltage value that can be judged to be substantially zero is set. For example, irregularities of the test signal sources 104a and 104b, the detection probe 103 and the power supply probe 101a, and the like. A voltage value including an error factor that affects the detection signal Voc, such as a difference in distance between 101b) and an amplification accuracy of the amplifier 105, is set.

The comparator 107 compares the detection signal Voc detected by the amplifier 105 with a preset reference voltage Vrefh in order to detect a disconnection failure, and the detection signal Voc exceeds the reference voltage Vrefh. In one case, the disconnection determination signal is output to the disconnection determination unit 109 at a high level, and the disconnection determination signal is output to the disconnection determination unit 109 at a low level when the detection signal Voc is less than or equal to the reference voltage Vrefh. do. As the reference voltage Vrefh, in consideration of irregularities of the test signal sources 104a and 104b and the like, a voltage value that can be clearly determined as a disconnection failure is set.

In addition, the detection signal Voc is converted into a digital value using, for example, an AD converter or the like, instead of the comparator 106 or 107, and the detection is performed by digital signal processing using a CPU (Central Processing Unit) or the like. The voltage level of the signal Voc may be determined.

The phase difference detector 108 detects a phase difference between the detection signal Voc output from the amplifier 105 and the inspection signal Voa output from the inspection signal source 104a. For example, the phase difference detection unit 108 108 detects the peak positions of the detection signal Voc and the inspection signal Voa, respectively, and detects the phase difference by comparing the detection positions thereof. The phase difference detection unit 108 then outputs phase difference data indicating the detected phase difference to the disconnection determining unit 109.

The disconnection determination unit 109 judges whether the wiring 42 is good or bad based on the zero determination signal from the comparator 106, the disconnection determination signal from the comparator 107, and the phase difference data from the phase difference detection unit 108. It executes and outputs to the control part 2 the signal which shows the determination result. Specifically, the disconnection determination unit 109 determines that the wiring 42 is a good product when the zero determination signal from the comparator 106 is a high level, and the disconnection determination signal from the comparator 107 is a high level. The wiring 42 is judged to be disconnection defective, so that the zero determination signal and the disconnection determination signal are both at a low level, and the phase difference data from the phase difference detection unit 108 is within a range of a preset phase difference, for example, in a range of 30 degrees to 90 degrees. In the case of endurance, the wiring 42 determines that the resistance is in a state of having a resistance value as in the case where only the bus electrode 403 is disconnected, for example, and outputs a signal indicating the determination result to the control unit 2. Although the phase difference data does not theoretically exceed 90 degrees, a value exceeding 90 degrees may be used as an upper limit of the phase difference range in consideration of an error in signal detection or the like.

Next, the short circuit inspection unit 200 will be described. The test signal source 204a outputs a test signal Vsa of a sine wave having a frequency of 1 MHz to the power supply probe 201a and the phase difference detecting unit 208, for example. The test signal source 204b outputs the test signal Vsb of a sinusoidal wave 180 degrees out of phase with the test signal Vsa, for example, to the power supply probe 201b.

Hereinafter, the case where the presence or absence of the short circuit defect between the wiring 45 and the wiring 46 is examined is demonstrated, for example. The feed probes 201a and 201b are electrodes covered with an insulating film on the surface facing the wirings, for example, and are sized to cover two wirings, respectively. In the case where the inspection plate (not shown) is disposed on the substrate 4 in a non-contact manner, the power supply probe 201a is arranged on the opposite side from the wiring 45 and the wiring 46 of one of the inspection target wirings 45 and 46. It is provided in the position which opposes the wiring 44 adjacent to 45, and has the shape which covers the wiring 44 and 45 widely.

Similarly, in the case where the inspection plate (not shown) is arranged on the substrate 4 in a non-contact manner, the power supply probe 201b is on the opposite side from the other side wiring 46 and the wiring 45 among the wirings 45 and 46 to be inspected. It is provided in the position which opposes the wiring 47 adjacent to the wiring 46, and has the shape which covers the wiring 46 and 47 widely.

The power supply probe 201a uses the electrostatic coupling generated between the wirings 45 facing each other and supplies the test signal Vsa from the test signal source 204a to the wire 45. On the other hand, the power supply probe 201b uses the electrostatic coupling generated between the wiring 46 to which it faces, and supplies the test signal Vsb from the test signal source 204b to the wire 46.

The detection probe 203 is, for example, an electrode whose surface facing the wiring is covered with an insulating film and is arranged so as to be opposed to the substrate 4 in a non-contact manner. It is in the shape which covers only one end of (). And the detection probe 203 is arrange | positioned in the position which opposes the wiring 45, and the voltage which arises in accordance with the signal supplied to the wiring 45 from the power supply probes 201a and 201b arises between the wiring 45 and the wiring 45. As shown in FIG. Detect via electrostatic coupling.

In this case, since the power supply probes 201a and 201b have a large shape covering a plurality of wiring patterns, the substrate 4 has its substrate surface in a state where the detection probe 203 is disposed at a position facing the wiring 45. The wiring 45 is opposed to the power supply probe 201a and the detection probe 203 so that the power supply probes 201a and 201b can cover the wiring 45 even when inclined in the plane of the wire. Positioning becomes easy to oppose the 45 to the power supply probe 201b. In addition, the power supply probes 201a and 201b may be the size which covers three or more wiring patterns, or the size which covers only one test object wiring pattern.

The amplifier 205 amplifies the signal derived from the detection probe 203 without changing the phase and outputs it to the comparators 206 and 207 and the phase difference detection unit 208 as the detection signal Vsc. The comparator 206 detects that the detection signal Vsc detected by the amplifier 205 is substantially zero, and compares the preset reference voltage Vrefo with the detection signal Vsc. When the reference voltage Vrefo falls short, a zero determination signal is output to the short circuit determination unit 209 at a high level, and when the detection signal Vsc is higher than the reference voltage Vrefo, the zero determination signal is shorted at a low level. Output to the government 209.

As the reference voltage Vrefo, a voltage value that can be determined as an error range with respect to zero is set. For example, a detection signal such as irregularity of the test signal sources 204a and 204b and amplification accuracy of the amplifier 205 can be used. The voltage value including the error factor affecting (Vsc) is set.

The comparator 207 compares the detection signal Vsc detected by the amplifier 205 with a preset reference voltage Vrefh in order to detect disconnection failure, and the detection signal Vsc exceeds the reference voltage Vrefh. In this case, both determination signals are output to the short circuit determination unit 209 at the high level, and both determination signals are output to the short circuit determination unit 209 at the low level when the detection signal Vsc is less than or equal to the reference voltage Vrefh. . As the reference voltage Vrefh, a voltage value that can be clearly determined as a good product is set in consideration of irregularities of the test signal sources 204a and 204b.

As an alternative to the comparators 206 and 207, the detection signal Vsc is converted into a digital value using, for example, an AD converter, and the detection is performed by digital signal processing using a CPU (Central Processing Unit) or the like. The voltage level of the signal Vsc may be determined.

The phase difference detection unit 208 detects a phase difference between the detection signal Vsc output from the amplifier 205 and the test signal Vsa output from the test signal source 204a. The detection unit 208 detects the peak positions of the detection signal Vsc and the inspection signal Vsa, respectively, and compares the detection positions to detect the phase difference. The phase difference detection unit 208 then outputs phase difference data indicating the detected phase difference to the short circuit determination unit 209.

The short circuit judging unit 209 determines the wiring 45 and the wiring 46 based on the zero determination signal from the comparator 206, the positive determination signal from the comparator 207, and the phase difference data from the phase difference detection unit 208. The presence or absence of a short circuit failure between and is determined, and a signal indicating the determination result is output to the control unit 2. Specifically, the short circuit judging unit 209 determines that there is no short circuit failure between the wirings 45 and 46 when both judgment signals from the comparator 207 are at a high level, and the zero judgment signal from the comparator 206 is determined. Is a high level, the short circuit is determined between the wirings 45 and 46, and the zero determination signal and the disconnection determination signal are both at the low level, and the phase difference data from the phase difference detection unit 108 is within the range of a preset phase difference, for example. For example, when it exists in the range of 30 degree-90 degree, it determines with the resistance between which the wiring 45 and 46 had a resistance value, and outputs the signal which shows the determination result to the control part 2.

The display unit 3 is a display device made of, for example, a liquid crystal display panel, and displays information output from the control unit 2. The control unit 2 controls the operation of the entire board inspection apparatus 1, for example, a ROM (Read Only Memory) for storing a control program of the board inspection apparatus 1, and a RAM for temporarily storing data ( And a CPU (Central Processing Unit) for executing a control program stored in a random access memory (ROM) and a ROM. And the control part 2 outputs a control signal to the conveyance mechanism 52, and conveys the board | substrate 4 mounted on the mounting base 51, or outputs it from the disconnection determination part 109 and the short circuit determination part 209. In accordance with the signal indicating the determined determination result, the determination result is displayed on the display unit 3.

Next, operation | movement of the board | substrate inspection apparatus 1 comprised as mentioned above is demonstrated. First, the disconnection inspection operation by the disconnection inspection unit 100 will be described. 4 is a waveform diagram illustrating the operation of the disconnection inspecting unit 100. First, referring to FIG. 2 again, the feed probe 101a and the capacitor C1 from the test signal source 104a with the feed probes 101a and 101b and the detection probe 103 and the wiring 42 facing each other. The test signal Voa shown in Fig. 4A is applied to the wiring 42 via? On the other hand, the inspection signal Vob shown in Fig. 4B is applied to the wiring 42 from the inspection signal source 104b via the power supply probe 101b and the capacitor C2.

Now, if the wiring 42 is a good product, the inspection signal Voa output from the inspection signal source 104a and the inspection signal Vob output from the inspection signal source 104b are synthesized on the wiring 42, and the composition thereof is synthesized. The signal waveform thus obtained is detected and amplified by the amplifier 105 via the capacitor C3 and the detection probe 103, and output to the comparator 106, 107 and the phase difference detecting unit 108 as the detection signal Voc.

Then, the phase of the test signal Voa and the test signal Vob is 180 degrees out of phase, i.e., because the signals are reversed in polarity, the voltages of the detection signals Voc are ideally zero. . However, in the actual apparatus, the voltage of the detection signal Voc is not completely offset due to error factors such as irregularities of the test signal sources 104a and 104b and differences in capacitances C1 and C2. As shown in Fig. 4 (d), a signal waveform substantially in phase with the phase is obtained as the detection signal Voc in the signal having the greater influence of either the inspection signal Voa or the inspection signal Vob. Alternatively, the phase of the detection signal Voc is affected by one of the inspection signal Voa and the inspection signal Vob due to the influence of the stray capacitance between the detection probe 103 and the peripheral circuit portion thereof. The signal is shifted slightly from phase.

In this way, the voltage of the detection signal Voc is substantially zero, and the test signal Voa and the test signal Vob that are not completely zero are offset on the wiring 42, thereby substantially leaving the voltage due to the error factor. To zero.

Next, referring to FIG. 1, the detection signal Voc output from the amplifier 105 is compared with the reference voltage Vrefo by the comparator 106. Now, the detection signal Voc is substantially zero, the detection signal Voc does not reach the reference voltage Vrefo, and the zero determination signal is output from the comparator 106 to the disconnection determination unit 109 at a high level. Then, the disconnection determination unit 109 determines that the wiring 42 is a good product, and a signal indicating the determination result indicating that the wiring 42 is a good product is output to the control unit 2. And the wiring 42 is displayed on the display part 3 by the control part 2 in the sense that it is a quality goods.

In this case, since the detection signal Voc is an AC waveform, the disconnection determination unit 109 has a predetermined time, for example, a period of 1 μsec or more that is one cycle of the inspection signal Voa, and a zero determination signal output from the comparator 106. Confirms that the low level does not become low, and determines that the wiring 42 is a good product.

Next, the operation | movement of the disconnection test | inspection part 100 in the case of the disconnection failure in which the wiring 42 is completely disconnected is demonstrated. FIG. 5 is a diagram for explaining the operation of the disconnection inspecting unit 100 in the case of a disconnection failure in which the wiring 42 is completely disconnected. First, as in the case described above, the inspection signal Voa shown in Fig. 4A is applied to one end of the wiring 42 from the inspection signal source 104a via the power supply probe 101a and the capacitor C1. On the other hand, the test signal Vob shown in Fig. 4B is applied to the other end of the wiring 42 by using the power supply probe 101b and the capacitor C2 from the test signal source 104b.

Now, disconnection defect A occurs in the wiring 42. Then, the test signal Voa output from the test signal source 104a and the test signal Vob output from the test signal source 104b are not synthesized on the wiring 42, and are output from the test signal source 104a. The detected test signal Voa is detected and amplified by the amplifier 105 via the power supply probe 101a, the capacitor C1, the wiring 42, the capacitor C3, and the detection probe 103, and the detection signal Voc. Are output to the comparator 106 and 107 and the phase difference detection unit 108 as a plurality.

Then, the detection signal Voc becomes a signal in phase with the inspection signal Voa shown in Fig. 4A as shown in Fig. 4F. In this case, since the inspection signal Voa and the inspection signal Vob are synthesized and the signal level is not offset, the signal level of the detection signal Voc is higher than that of the good quality wiring 42, and the reference voltage Vrefh. Will be exceeded.

Next, referring to FIG. 1, the detection signal Voc output from the amplifier 105 is compared with the reference voltage Vrefh by the comparator 107. Now, since the detection signal Voc exceeds the reference voltage Vrefh, the disconnection determination signal is output from the comparator 107 to the disconnection determination unit 109 at a high level. Then, the disconnection determination unit 109 determines that the wiring 42 is a defective wiring defect, and a signal indicating the determination result of the defective wiring 42 is output to the control unit 2. And the control part 2 displays the indication that the wiring 42 is defective on the display part 3. In this case, since the detection signal Voc is an AC waveform, the disconnection determination unit 109 has a disconnection determination signal from the comparator 107 at a predetermined time, for example, 1 μsec or more, which is one cycle of the inspection signal Voa. If detected at a high level, the wiring 42 determines that it is defective.

Next, the operation of the disconnection inspection unit 100 in the case where the wiring 42 is a poor resistance which is incompletely disconnected with a resistance value of an intermediate level will be described. FIG. 6 is a diagram for explaining the operation of the disconnection inspection unit 100 when the wiring 42 is poor in resistance. First, similarly to the above-described case, the test signal Voa shown in Fig. 4A is applied to one end of the wiring 42 from the test signal source 104a via the power supply probe 101a and the capacitor C1. On the other hand, the test signal Vo shown in Fig. 4B is applied from the test signal source 104b to the other end of the wiring 42 via the power supply probe 101b and the capacitor C2.

Now, in the wiring 42, when the resistance failure B in which only the bus electrode 403 is disconnected occurs, in the resistance failure B, a considerable resistance is generated in the resistor R1. Then, the CR series circuit that reaches the test signal source 104b from the test signal source 104a via the power supply probe 101a, the capacitor C1, the resistor R1, the capacitor C2, and the power supply probe 101b. It is composed. Then, the currents Ioa and Iob output from the test signal sources 104a and 104b become phases advanced by the phase difference Θ with respect to the test signals Voa and Vob.

In this case, if the phase difference Θ is the capacitance inductance of the capacitance C1 is X _C11 and the capacitance inductance of the capacitance C2 is X _C12 ,

X _C11 = 1 / (2 x pi x f x C1). (One)

X _C12 = 1 / (2 x pi x f x C2). (2)

In addition, since the capacitor C1 and the capacitor C2 are connected in series, the synthesized inductance is X _C11 + X _C12 .

Θ = Tan ^-1 (((X _C11 + X _C12 ) / R1)… (3)

It becomes

For example, the width W of the wiring 42 is 0.15 mm, and the length L of the power feeding probes 101a and 101b is 100 mm, respectively, in the length direction of the wiring 42, the wiring 42 and the power feeding probes 101a and 101b. If the distance D with 0.50 mm, the capacity (C1, C2), respectively

C1 = (C2) = epsilon 0 x epsilon r x S / DV. (4)

However, S = W × L

ε0 (dielectric constant of vacuum) = 8. 85 × 10-12 (F / m)

εr (dielectric constant) = 1

(C1) = (C2) = 0.27 pF can be obtained.

Now, if the phase difference Θ is calculated based on the equations (1) to (3) from the frequency f of 1 MHz, if the resistance R1 = 100 Ω to 100 kΩ, Θ = 90 ° and the resistance R1 = 1 MΩ If Θ = 85 °, resistance R1 = 10MΩ, Θ = 50 °, if resistance R1 = 20MΩ then Θ = 31 °.

Therefore, the currents Ioa and Iob output from the test signal sources 104a and 104b are in the range of 90 degrees to 31 degrees than the test signals Voa and Vob, respectively, in the range where the resistance R1 is 100? For example, if the resistor R1 is 100?, The current flowing through the resistor R1 becomes a peak at a position shifted from the test signal Voa by 90 degrees, as shown in Fig. 4C. On the other hand, since the voltage generated at the portion opposite to the detection probe 103 in the wiring 42 is caused by the voltage drop caused by the current flowing through the resistor R1, the voltage is also in phase with the test signal Voa. The voltage shifted by 90 degrees. This voltage is detected by the amplifier 105 via the capacitor C3 and the detection probe 103, amplified and output to the comparator 106, 107 and the phase difference detection unit 108 as the detection signal Voc. Then, as shown in Fig. 4E, the detection signal Voc is a signal which is out of phase with the inspection signal Voa shown in Fig. 4A. Similarly, when the resistance R1 is in the range of 100? To 20M ?, the detection signal Voc and the inspection signal Voa are out of phase in the range of 90 degrees to 31 degrees.

In addition, since the detection signal Voc shown in Fig. 4E is the resistor R1, the inspection signals Voa and Vob are conducted in a state in which the wiring 42 conducts with low resistance as in the case where the wiring 42 is a good product. The voltage level is higher than when synthesized. In addition, since the signal level of the test signals Voa and Vob is offset by the detection signal Voc shown in Fig. 4E through the resistor R1, the voltage is higher than when the wiring 42 is completely disconnected. The level is lowered. Therefore, the detection signal Voc shown in Fig. 4E may be an intermediate voltage between the reference voltage Vrefo and the reference voltage Vrefh.

In this case, the detection signal Voc output from the amplifier 105 is compared with the reference voltage Vrefo by the comparator 106, and as a result, the detection signal Voc is equal to or higher than the reference voltage Vrefo. ), The zero determination signal is output at the low level to the disconnection determination unit 109. On the other hand, since the detection signal Voc is compared with the reference voltage Vrefh by the comparator 107, since the detection signal Voc is less than or equal to the reference voltage Vrefh, the disconnection decision unit 109 is separated from the comparator 107. The disconnection signal is output at the low level. Then, the disconnection determination unit 109 cannot determine the wiring 42 as a good product because the zero determination signal is low level based on the voltage level of the detection signal Voc, and the wiring 42 because the disconnection signal is low level. Cannot be judged as bad.

On the other hand, for example, when the resistor R1 is 100 Ω, the phase difference detecting unit 108 supplies the detection signal Voc output from the amplifier 105 and the inspection signal Voa output from the inspection signal source 104a. Based on this, phase difference data indicating a phase difference of 90 degrees is output to the disconnection determining unit 109. Since the phase difference data is within the range of 30 degrees to 90 degrees, the disconnection determination unit 109 determines that the wiring 42 is poor in resistance. Similarly, if the resistance R1 is in the range of 100? 20 M ?, for example, the phase difference data is in the range of 90 degrees-31 degrees, and the disconnection determination unit 109 determines that the wiring 42 is poor in resistance. And the signal which shows the determination result of the badness of the wiring 42 is output to the control part 2, and the control part 2 becomes the indication that the wiring 42 is bad in the display part 3 by the control part 2.

As a result, the disconnection failure having the intermediate resistance R1 can be detected using the phase of the detection signal Voc without depending on the signal level of the detection signal Voc. This can detect disconnection defects with intermediate level of resistance.

Here, in the disconnection determination unit 109, an example in which the phase difference range 30 degrees to 90 degrees is set in advance as a criterion for determining the resistance resistance is shown, but the phase difference range is not limited to 30 degrees to 90 degrees, for example, wiring Capacities C1 and C2 such as the capacitance obtained based on equation (4) from the width W, the length L of the power feed probe in the length direction of the wiring, the distance D between the wiring and the power feed probe, and the test signals VoA and Vob. The phase difference range may be set based on the formulas (1) to (3) according to the frequency f, the range of the resistance value to be detected as the resistance failure, and the like.

Next, a short circuit inspection operation by the short circuit inspection unit 200 will be described with reference to FIG. In Fig. 3, the wirings 45 and 46 show a cross section in a direction crossing the longitudinal direction. 7 is a waveform diagram for explaining the operation of the short-circuit inspection unit 200. First, the power supply probe 201a, the detection probe 203, and the wiring 45 are arranged to face each other, and the power supply probe 201b and the wiring 46 are arranged to face each other. The inspection signal Vsa shown in Fig. 7A is applied to the wiring 45 via 201a and the capacitor C4, while the power supply probe 201b and the capacitor C5 are supplied from the inspection signal source 204b. The inspection signal Vsb shown in FIG. 7B is applied to the wiring 46 via the wiring 46.

Now, if the wirings 45 and 46 have no short-circuit or poor resistance, and are of good quality, the inspection signal Vsa output from the inspection signal source 204a is the feed probe 201a, the capacitor C4, the wiring 45, The amplifier 205 is detected and amplified through the capacitor C6 and the detection probe 203 and is output to the comparators 206 and 207 and the phase difference detection unit 208 as the detection signal Vsc.

Then, the detection signal Vsc becomes a signal in phase with the inspection signal Vsa shown in Fig. 7A, as shown in Fig. 7F. In this case, the signal level of the detection signal Vsc exceeds the reference voltage Vrefh.

Next, referring to FIG. 1, the detection signal Vsc output from the amplifier 205 is compared with the reference voltage Vrefh by the comparator 207. Now, since the detection signal Vsc exceeds the reference voltage Vrefh, both determination signals are output from the comparator 207 to the short circuit judging unit 209 at a high level. Then, the short circuit judging unit 209 determines that there is no short circuit failure between the wirings 45 and 46 and is a good product, and a signal indicating a determination result indicating that there is no short circuit failure between the wirings 45 and 46 is a control unit. Is output to (2). And the control part 2 becomes the indication that there is no short circuit defect between the wiring 45 and 46 in the display part 3. In this case, since the detection signal Vsc is an AC waveform, the short circuit judging unit 209 has a high determination signal from the comparator 207 at a predetermined time, for example, a period of 1 μsec or more, which is one cycle of the inspection signal Vsa. When the level is detected, it is determined that there is no short circuit failure between the wirings 45 and 46.

Next, the operation | movement of the board | substrate test | inspection apparatus 1 in the case where the short circuit defect generate | occur | produces between the wiring 45 and 46 is demonstrated. 8 is a conceptual diagram for explaining the operation of the substrate inspection apparatus 1 in the case where a short circuit failure occurs between the wirings 45 and 46. In Fig. 8, a metal film C such as silver is formed between the wirings 45 and 46, and the wirings 45 and 46 are short-circuited with low resistance.

In this case, the test signal Vsa output from the test signal source 204a and the test signal Vsb output from the test signal source 204b are first synthesized on the metal film C, and the synthesized signal waveform is capacitive. The amplifier 205 is detected and amplified via the C6 and the detection probe 203, and is amplified and output to the comparators 206 and 207 and the phase difference detection unit 208 as the detection signals Vsc.

Then, the phase of the test signal Vsa and the test signal Vsb is 180 degrees out of phase, i.e., because the signals are reversed in polarity, the voltage of the detection signal Vsc is shown in Fig. 7 (d). Is substantially zero. In this case, a signal waveform substantially in phase with the phase is obtained as the detection signal Vsc in the signal having the greater influence on either of the test signal Vsa and the test signal Vsb. Alternatively, the phase of the detection signal Vsc is influenced by one of the test signal Vsa and the test signal Vsb due to the stray capacitance between the detection probe 203 and the peripheral circuit portion thereof. It shifts from a phase slightly.

Next, referring to FIG. 1, the detection signal Vsc output from the amplifier 205 is compared with the reference voltage Vrefo by the comparator 206. Now, since the detection signal Vsc is substantially zero, the detection signal Vsc is not satisfied with the reference voltage Vrefo, and the zero determination signal is output from the comparator 206 to the short circuit judging unit 209 at a high level. Then, the short circuit judging unit 209 determines that there is a short circuit failure between the wirings 45 and 46, and a signal indicating the result of the determination as to whether the defective product is defective is output between the wirings 45 and 46 to the control unit 2. . Then, the control unit 2 displays the indication that the wirings 45 and 46 are defective on the display unit 3.

Next, the operation of the short-circuit inspection unit 200 in the case where the resistance between the wirings 45 and 46 is conducted with resistance is explained. 9 is a view for explaining the operation of the short-circuit inspection unit 200 when the wirings 45 and 46 are poor in resistance. In Fig. 9, for example, an ITO film is formed between the wirings 45 and 46, and a resistor R2 is formed between the wirings 45 and 46.

First, the inspection signal Vsa shown in FIG. 7A is applied to the wiring 45 from the inspection signal source 204a via the power supply probe 201a and the capacitor C4, while the inspection signal source 204b is applied. The test signal Vsb shown in Fig. 7B is applied to the wiring 45 via the power supply probe 201b and the capacitor C5. Then, the CR series circuit reaching the test signal source 204b from the test signal source 204a via the power supply probe 201a, the capacitor C4, the resistor R2, the capacitor C5, and the power supply probe 201b. It is composed. Then, the currents Isa and Isb outputted from the test signal sources 204a and 204b become phases advanced by the phase difference Θ with respect to the test signals Vsa and Vsb.

In this case, if the phase difference Θ is the capacitance inductance of the capacitance C4 is X _c21 and the capacitance inductance of the capacitance C5 is X _c22 ,

X _c21 = 1 / (2 x pi x f x C4). (5)

X _c22 = 1 / (2 x pi x f x C5). (6)

In addition, since the capacitor C4 and the capacitor C5 are connected in series, the synthesized inductance is X _c21 + X _c22 ,

Θ = Tan-1 ((X _c21 + X _c22 ) / R2)... (7)

It becomes

For example, the width W of the wirings 45 and 46 is 0.15 mm, respectively, and the length L of the power supply probes 201a and 201b is 100 mm and the wirings 45 and 46, respectively, in the longitudinal direction of the wirings 45 and 46, respectively. If the distance D from the power supply probes 201a and 201b is 0.50 mm, the capacitances C4 and C5 are respectively

C4 = (C5) = epsilon 0 x r x S / D \. (8)

However, S = W × L

ε0 (dielectric constant of vacuum) = 8. 85 × 10-12 (F / m)

εr (dielectric constant) = 1

(C4) = C5 = 0.27pF can be obtained.

Now, if the phase difference Θ is calculated based on the equations (5) to (7) from the frequency f of 1 MHz, Θ = 90 ° in the range of the resistance R2 = 100Ω to 100 kΩ, and Θ = if the resistance R2 = 1 MΩ. If the resistance R2 = 10MΩ, Θ = 50 °, and if the resistance R2 = 20MΩ, Θ = 31 °.

Therefore, the currents Isa and Isb outputted from the test signal sources 204a and 204b in the range where the resistance R2 is 100? To 20 M? Are in the range of 90 to 31 degrees out of phase with the test signals Vsa and Vsb, respectively. For example, if the resistor R2 is 100?, The currents Isa and Isb output from the test signal sources 204a and 204b are 90 degrees out of phase with the test signals Vsa and Vsb, respectively.

Therefore, the current flowing through the resistor R2 becomes a peak at a position where the phase of the test signal Vsa is 90 degrees out of phase as shown in Fig. 7C when the resistor R2 is 100 ?. On the other hand, since the voltage generated at the portion opposite to the detection probe 203 in the wiring 45 is caused by the voltage drop caused by the current flowing through the resistor R2, the voltage is also in phase with the test signal Vsa. The voltage shifted by 90 degrees. This voltage is detected and amplified by the amplifier 205 via the capacitor C6 and the detection probe 203, and is amplified and output to the comparators 206 and 207 and the phase difference detecting unit 208 as the detection signals Vsc. Then, as shown in Fig. 7E, the detection signal Vsc becomes a signal which is out of phase with the test signal Vsa shown in Fig. 7A. Similarly, when the resistance R2 is in the range of 100? To 20M ?, the detection signal Vsc, the inspection signal Vsa, and the phase are in the range of 90 degrees to 31 degrees.

In addition, the detection signal Vsc shown in FIG. 7E has a higher voltage level than the case where the test signals Vsa and Vsb are synthesized while the wirings 45 and 46 are connected with low resistance due to the resistance R2. . In addition, the detection signal Vsc shown in Fig. 7E is offset by the signal level of the test signals Vsa and Vsb via the resistor R2, so that the wirings 45 and 46 are insulated, and thus, in the case of a good product state. The voltage level is lowered. Therefore, the detection signal Vsc shown in Fig. 7E may be an intermediate voltage between the reference voltage Vrefo and the reference voltage Vrefh.

In this case, the detection signal Vsc output from the amplifier 205 is compared with the reference voltage Vrefo by the comparator 206. As a result, the detection signal Vsc is equal to or higher than the reference voltage Vrefo. The zero determination signal is output to the short circuit judging unit 209 at low level. On the other hand, since the detection signal Vsc is compared with the reference voltage Vrefh by the comparator 207, since the detection signal Vsc is less than or equal to the reference voltage Vrefh, the detection signal Vsc is changed from the comparator 207 to the short circuit judging unit 209. Both judgment signals are output at the low level. Then, since the zero determination signal is at the low level based on the voltage level of the detection signal Vsc, the short circuit judging unit 209 cannot determine that there is a short circuit failure between the wirings 45 and 46, and both determination signals are at the low level. For this reason, it cannot be judged as positive between the wirings 45 and 46.

On the other hand, for example, if the resistor R2 is 100?, Based on the detection signal Vsc output from the amplifier 205 by the phase difference detection unit 208 and the test signal Vsa output from the test signal source 204a. The phase difference data indicating the phase difference 90 degrees is output to the short circuit judging unit 209. The short circuit judging unit 209 determines that the resistance between the wirings 45 and 46 is poor because the phase difference data is within the range of the phase difference range of 30 degrees to 90 degrees. Similarly, for example, if the resistance R2 is in the range of 100? 20 M ?, the phase difference data is in the range of 90 degrees to 31 degrees, and the short circuit judging unit 209 determines that the resistance between the wirings 45 and 46 is poor. And between the wirings 45 and 46, the signal which shows the determination result of the defect notation is output to the control part 2 ,. And the control part 2 makes the display part 3 show that the wiring 45 and 46 are defective.

As a result, the short-circuit failure having the intermediate resistance value can be detected using the phase of the detection signal Vsc without being caused by the signal level of the detection signal Vsc. Short circuit defects with intermediate levels of resistance can be detected.

Here, although the short circuit judging unit 209 has shown an example in which the phase difference range 30 degrees to 90 degrees is set in advance as a criterion for determining the resistance failure, the phase difference range is not limited to 30 degrees to 90 degrees. Capacities C1 and C2 such as the capacitance obtained based on equation (8) from the width W, the length L of the power feeding probe in the longitudinal direction of the wiring, and the distance D between the wiring and the power feeding probe, and the test signals VoA and Vob. The phase difference range may be set based on equations (5) to (7), depending on the frequency f, the range of resistance values to be detected as a resistance failure, and the like.

Next, with reference to FIG. 1, the operation | movement of the board | substrate inspection apparatus 1 whole is demonstrated. First, when the board | substrate 4 is mounted on the mounting base 51, the conveyance mechanism 52 is driven according to the control signal from the control part 2, and the wiring 47 formed in the lower end part of the board | substrate 4 is carried out. ), And the power supply probes 101a and 101b and the detection probe 103 are positioned at opposite positions. Then, in accordance with the control signal from the control unit 2, the disconnection inspection by the disconnection inspection unit 100 described above starts with respect to the wiring 47, and the substrate 4 is moved by the conveyance mechanism 52 to the arrow Y. In the direction of).

By transferring the substrate 4 at a constant speed, the wirings 47, 46, 45, 44, and 43 are sequentially opposed to the power supply probes 101a, 101b and the detection probes 103 to each wiring. The disconnection inspection by the disconnection inspection unit 100 is performed. In addition, when the power supply probes 101a and 101b and the detection probe 103 and the wiring 43 face each other, the power supply probe 201a and the detection probe 203 and the wiring 45 face each other and the power supply probe ( 201b) and wiring 46 face each other. Then, according to the control signal from the control unit 2, the short circuit inspection by the short circuit inspection unit 200 described above is started with respect to the wirings 46 and 47.

Moreover, the disconnection test | inspection part 100 with respect to all the wiring 47, 46, 45, 44, 43, 42, 41 formed in the board | substrate surface of the board | substrate 4 by conveying and continuing at a constant speed. The disconnection inspection by () is performed, and the short circuit inspection about each wiring is performed by the short circuit inspection unit 200.

Thereby, disconnection test | inspection and short circuit test | inspection can be performed continuously about all the wirings 47, 46, 45, 44, 43, 42, 41, conveying the board | substrate 4 at a fixed speed. In addition, since the disconnection inspection and the short circuit inspection are carried out while the substrate 4 is transported at a constant speed and can be continued, there is no stopping of the substrate 4 every time the wiring is inspected, and thus it is easy to shorten the inspection time. Do. Further, a minute gap is supported between the power supply probes 101a and 101b, the detection probe 103, the power supply probes 201a and 201b and the detection probe 203, the substrate surface of the substrate 4, and the respective wirings. Since the board | substrate 4 is conveyed and the test | inspection of each wiring is carried out, maintaining a physically non-contact state, friction does not arise between each probe and a board | substrate, and damage to each wiring can be suppressed.

In addition, although the board | substrate test | inspection apparatus 1 showed the example provided with the disconnection test | inspection part 100 and the short circuit test | inspection part 200, the board | substrate test | inspection apparatus provided with only the disconnection test part 100 or the short circuit test part 200 may be sufficient. In addition, the wirings 47, 46, 45, 44, 43, 42, and 41 to be inspected are formed at equal intervals, and the feed probes 101a and 101b, the detection probe 103, and the short-circuit inspection for disconnection inspection are also formed. Although the power feeding probes 201a and 201b and the detection probes 203 for the dragons were positioned at positions facing the test object wiring at the same time, respectively, the disconnection inspection unit 100 and the short circuit inspection unit 200 are each independent, respectively. The inspection may be performed at timings at which the probes and the inspection target wirings face each other, and the wirings are not limited to examples in which the wirings are formed at equal intervals.

In addition, the inspection target wiring may not be parallel wiring. For example, in the glass substrate used for the plasma display panel, the wiring interval may be narrowed so that one end of the wiring can be easily connected to the connector. FIG. 10 shows an example in which the feeding probes 101a and 101b and the detection probe 103 are opposed to each other in the glass substrate 4a having such a narrow wiring gap on one end side in the disconnection inspection unit 100 shown in FIG. 1. It is a figure which shows. As shown in Fig. 10, the power supply probes 101a and 101b have a shape covering a plurality of wirings, and the detection probe 103 detects a report signal from one end of the wiring to be inspected. Therefore, even when the wiring to be inspected has different wiring spacings at both ends thereof, the disconnection inspection unit 100 transfers the substrate 4a in the direction of the arrow Y similarly to the case where the substrate 4 shown in FIG. 1 is inspected. It is possible to check the disconnection of each wiring continuously. In this case, when the detection probe 103 is made to face the wiring short side with a large wiring interval, the detection probe 103 can be enlarged and manufacture of the detection probe 103 becomes easy.

11 shows an example in which the power supply probes 201a and 201b and the detection probe 203 face each other in the short circuit inspection unit 200 shown in FIG. 1 on the glass substrate 4a having a narrow wiring gap at one end. It is a figure which shows. As shown in FIG. 11, in the short circuit inspection unit 200, the detection probe 203 detects a report signal from one end side of the wiring to be inspected and at the other end of which the wiring interval is narrowed, the power supply probe 201a. 201b) need not be opposed. Therefore, even when the wiring to be inspected has different wiring spacings at both ends thereof, the disconnection inspection unit 100 transfers the substrate 4a in the direction of the arrow Y similarly to the case where the substrate 4 shown in FIG. 1 is inspected. It is possible to check the disconnection of each wiring continuously.

In addition, each probe is not limited to the example which is arrange | positioned facing the board | substrate 4 of the board | substrate 4 in the state which is physically non-contact at a small space | interval, For example, the probe which covered the surface with the insulating film physically to a wiring It may be arranged to face the wiring in the state of electrical non-contact while making contact.

In addition, although the example which used the test | inspection signal source 104a and the test | inspection signal source 104b was shown, you may use a single signal source and connect the center point to the ground. When a test signal is supplied to the feed probes 101a and 101b using a single signal source, either of the feed probes 101a and 101b may be connected to the ground. Since the detection signal level is determined by the partial pressure ratio between the capacitance and the resistance included between the output side of the signal source, the error factor of the inspection increases.

Fig. 21 shows the resistance values of the resistance R1 of disconnection failure occurring in the wiring 42 and the resistance R2 of resistance failure in the short circuit occurring between the wirings 45 and 46, the test signals VoA and Vob and the currents Ioa and Iob. Is a graph showing the relationship between the phase difference Θ between and, and between the test signals Vsa and Vsb and the current Is and Isb. In Fig. 21, graph # 1 is an electrode length L = 10mm, graph # 2 is an electrode length L = 100mm, graph # 3 is a graph at electrode length L = 200mm, and the frequency f of the test signals VoA, Vob, Vsa, Vsb. All indicate the case of 1 MHz.

As shown in the graphs # 1, # 2, and # 3 shown in FIG. 21, even when the electrode length L is changed, the phase difference Θ is almost 90 degrees in the range of the resistance value of the defective portion of 100? Therefore, if the phase difference Θ determined by the disconnection determining unit 109 and the short circuit determining unit 209 is approximately 90 degrees, it is easy to detect a resistance failure of, for example, about 100? To 100 k ?. If the range of the phase difference Θ determined by the disconnection determination unit 109 and the short circuit determination unit 209 is poor in resistance is 30 degrees to 90 degrees, the graph # 1 having the worst condition among the graphs # 1, # 2, and # 3 ( Even in the case of L = 10 mm), it is easy to detect resistance defects, for example, about 100 Ω to 1 MΩ.

On the other hand, for example, in the substrate inspection apparatus described in Patent Document 2 related to the background art, the wiring pattern is determined by determining the coincidence and inconsistency between the current distribution obtained by the sensor and the current distribution obtained by the substrate of the good product. It is difficult to detect a defect having an intermediate resistance value because it is good or bad.

22 is a schematic diagram for explaining the effect of the distance between the detection probe 103 and the inspection target wiring, for example, the wiring 42, on the voltage detected by the detection probe 103. As shown in FIG. In FIG. 22, the power supply E1 models the voltage caused to the wiring 42 by the power supply probes 101a and 101b. The voltmeter V1 is a model of the amplifier 105 which detected the voltage detected by the detection probe 103. The variable capacitor CX models the capacitance C3 generated between the detection probe 103 and the wiring to be inspected, for example, the wiring 42. The increase in the distance between the detection probe 103 and the wiring 42 corresponds to the decrease of the capacitance CX, and the decrease in the distance between the detection probe 103 and the wiring 42 increases the capacitance CX. It corresponds to thing.

Here, since the input impedance of the voltmeter V1, that is, the input impedance of the amplifier 105 is extremely high, almost no current flows through the capacitor CX. Therefore, the voltage measured by the voltmeter V1 is hardly affected by the capacitance CX in principle. In other words, the detection signal Voc is hardly affected by the change in distance between the detection probe 103 and the wiring 42.

On the other hand, FIG. 29 is a sensor and an inspection object regarding the structure which detects a displacement current by the non-contact sensor from the wiring pattern of an inspection object like the board | substrate inspection apparatus of patent document 2 concerning background art, for example. It is a schematic diagram for demonstrating the influence which the distance between wiring pattern has on the electric current detected by a sensor. In Fig. 29, the power source E2 models the voltage caused to the wiring pattern by the stimulator. Ammeter A1 models the ammeter which measured the electric current detected by the sensor. The variable capacitance CY models a capacitance generated between the sensor and the wiring pattern. The increase in the distance between the sensor and the wiring pattern corresponds to a decrease in the capacitance CY, and the decrease in the distance between the sensor and the wiring pattern corresponds to an increase in the capacitance CY.

In this case, the input impedance of the ammeter A1 needs to be extremely low impedance from the need for current measurement. Therefore, in the closed circuit of the power supply E2, the variable capacitor CY, and the ammeter A1, a current iy proportional to the capacitance of the variable capacitor CY flows, and the wiring pattern is based on this current iy. Good and bad judgments are made.

Therefore, in the substrate inspection apparatus 1, since the short circuit defect which has the intermediate level resistance value can be detected using the phase of the detection signal Vsc, regardless of the signal level of the detection signal Vsc, the intermediate level resistance value The influence of the distance change between the wiring and the inspection probe for the detection of a short circuit fault having a low frequency can be reduced, and even when a disconnected fault that is completely disconnected and a short circuit fault that has been completely shorted are detected, Compared with the configuration for detecting the current as in the substrate inspection apparatus according to the background art, the influence of the distance change between the wiring and the inspection probe can be reduced.

(2nd embodiment)

Next, the board | substrate inspection apparatus which concerns on 2nd Embodiment of this invention is demonstrated. It is a block diagram which shows an example of a structure of the board | substrate inspection apparatus which concerns on 2nd Embodiment of this invention. The board | substrate inspection apparatus 1a shown in FIG. 12 differs from the board | substrate inspection apparatus 1 shown in FIG. That is, as the board | substrate test | inspection apparatus 1a shown in FIG. 12, the disconnection test | inspection part 100a is not equipped with the comparator 106 and 107, but is further provided with the detection probe 110, the amplifier 111, and the phase difference detection part 112. FIG. do. In addition, the short circuit inspection unit 200a does not include the comparators 206 and 207, and further includes a detection probe 210, an amplifier 211, and a phase difference detection unit 212.

Since the other structure is the same as that of the board | substrate test | inspection apparatus 1 shown in FIG. 1, the description is abbreviate | omitted and the following demonstrates the characteristic point of this embodiment.

The detection probe 110 is the same signal detection probe as the detection probe 103, and is integrally provided with other probes on the test plate, not shown. Moreover, when the board | substrate 4 is mounted on the mounting base 51 which opposes the said test plate, the detection probe 103 and the detection probe 110 oppose each wiring at the opposite ends, respectively. It is arrange | positioned on the said test plate.

The detection probe 210 is the same signal detection probe as the detection probe 203, and is integrally provided with other probes on the test plate, not shown. In addition, the detection probe 203 and the detection probe 210 are connected to the inspection target wiring on the other hand when the substrate 4 is placed on the mounting table 51 facing the inspection plate. 203 is opposite, and the detection probe 210 is disposed on the inspection plate so as to face the other inspection target wiring.

As a result, when the substrate 4 is placed on the mounting table 51, the detection probe 110 and the detection probe 210, like other probes, are physically and electrically non-contacted with a small gap between the substrate surfaces of the substrate 4. Are placed opposite in the state of. The detection probe 110 and the detection probe 210 are coupled to the wiring using the capacitance generated between the wirings facing each other.

Hereinafter, the power supply probes 101a and 101b and the detection probes 103 and 110 are opposed to the wiring 42 so as to check the disconnection of the wiring 42, and the wiring 45 and the wiring 46 between the wiring 45 and the wiring 46. For example, the detection probe 203 and the power supply probe 201a are opposed to the wiring 45 and the detection probe 210 and the power supply probe 201b are opposed to the wiring 46 in order to check for a short circuit failure. Explain.

The amplifier 111 amplifies the signal derived from the detection probe 110 without changing the phase and outputs it to the phase difference detecting unit 112 as the detection signal Vod. The amplifier 211 amplifies the signal derived from the detection probe 210 without changing the phase and outputs it to the phase difference detection unit 212 as the detection signal Vsd.

The phase difference detection unit 112 detects a phase difference between the detection signal Voc output from the amplifier 105 and the detection signal Vod output from the amplifier 111, and disconnects phase difference data indicating the phase difference. It outputs to the determination part 109a. The phase difference detection unit 212 detects a phase difference between the detection signal Vsc output from the amplifier 205 and the detection signal Vsd output from the amplifier 211, and short-circuits phase difference data indicating the phase difference. It outputs to the determination part 209a.

The disconnection determination unit 109a performs the determination of good or bad of the wiring 42 based on the phase difference data from the phase difference detection unit 108 and the phase difference data from the phase difference detection unit 112, and generates a signal indicating the result of the determination. Output to the control unit 2. Specifically, the disconnection determining unit 109a determines that the wiring 42 is a good product when the phase difference data from the phase difference detecting unit 112 is substantially 0 degrees, and the phase difference data from the phase difference detecting unit 112 is substantially 180 degrees. In addition, when the phase difference data from the phase difference detection unit 108 is within a preset phase difference range, for example, 30 degrees to 90 degrees, the wiring 42 determines that the resistance is in a state of having a resistance value, and thus the phase difference detection unit When the phase difference data from 112 is substantially 180 degrees and the phase difference data from the phase difference detecting unit 108 is substantially 0 degrees, the wiring 42 determines that the disconnection is defective, and controls the signal indicating the result of the determination. Output to (2).

The short circuit judging unit 209a performs a short circuit inspection between the wiring 45 and the wiring 46 based on the phase difference data from the phase difference detecting unit 208 and the phase difference data from the phase difference detecting unit 212. The signal indicative of the determination result is output to the control unit 2. Specifically, when the phase difference data from the phase difference detection unit 212 is substantially 0 degrees, the short circuit judging unit 209a determines that there is a short circuit failure between the wirings 45 and 46, so that the phase difference data from the phase difference detection unit 212 is determined. When the phase difference data from the phase difference detecting unit 208 is substantially 180 degrees and is within a range of a preset phase difference, for example, 30 degrees to 90 degrees, resistance between the wirings 45 and 46 has a resistance value. When the phase difference data from the phase difference detection unit 212 is substantially 180 degrees, and the phase difference data from the phase difference detection unit 208 is substantially 0 degrees, it is determined that there is no defect between the wirings 45 and 46. The control unit 2 outputs a signal indicating the determination result.

Next, operation | movement of the board | substrate inspection apparatus 1a comprised as mentioned above is demonstrated. First, the disconnection inspection operation by the disconnection inspection unit 100a will be described. 13 is a waveform diagram illustrating the operation of the disconnection inspecting unit 100a. 14 is an X-X partial sectional view of the board | substrate inspection apparatus 1a shown in FIG. First, referring to FIG. 14, the feed probe 101a and the capacitor C1 are removed from the test signal source 104a in a state where the feed probes 101a and 101b and the detection probe 103 and the wiring 42 are disposed to face each other. An inspection signal Voa shown in FIG. 13A is applied to the wiring 42 through the wiring 42. On the other hand, the inspection signal Vob shown in Fig. 4B is applied to the wiring 42 from the inspection signal source 104b via the power supply probe 101b and the capacitor C2.

Now, if the wiring 42 is a good product, the inspection signal Voa output from the inspection signal source 104a and the inspection signal Vob output from the inspection signal source 104b are synthesized on the wiring 42, and The synthesized signal waveform is detected and amplified by the amplifier 105 via the capacitor C3 and the detection probe 103, and is output to the phase difference detectors 108 and 112 as the detection signal Voc.

Then, the phase of the test signal Voa and the test signal Vob is 180 degrees out of phase, i.e., because the signals are reversed in polarity, the voltages of the detection signals Voc are ideally zero. . However, in the actual apparatus, it may not be completely offset due to error factors such as irregularities in the test signal sources 204a and 204b and differences in the capacities C1 and C2. In this case, if the error factor is within a certain small range, since the difference in the signal level of the detected detection signal Voc occurs when the wiring 42 to be inspected is a case of complete disconnection and a case of a good product, Fig. 1 Like the board | substrate test | inspection apparatus 1 shown to it, it can be judged whether the wiring 42 is a quality goods or a complete disconnection defect based on the signal level of the detection signal Voc. However, if the error factor increases, the signal level of the detection signal Voc, which is obtained in the case where the wiring 42 is a good product or a complete disconnection defect, approaches or overlaps, and thus the signal level of the detection signal Voc is increased. Based on this, it is difficult to determine whether the wiring 42 is a good product or a complete disconnection failure.

Then, in the board | substrate test | inspection apparatus 1a shown in FIG. 12, it is determined whether the wiring 42 is a quality goods or a complete disconnection defect based on the phase difference between the detection signal Voc and the detection signal Vod. Specifically, if the wiring 42 is a quality product, the inspection signal Voa output from the inspection signal source 104a and the inspection signal Vob output from the inspection signal source 104b are synthesized on the wiring 42, The synthesized signal waveform is detected and amplified by the amplifier 105 via the capacitor C3 and the detection probe 103 at one end of the wiring 42, and is then used as the phase difference detection unit 108 and the phase difference detection unit as the detection signal Voc. 112). On the other hand, the same signal waveform synthesized on the wiring 42 is detected and amplified by the amplifier 111 via the capacitor C7 and the detection probe 110 at the other end of the wiring 42, and the phase difference detecting unit 112 as the detection signal Vod. )

Then, since the same signal waveform synthesized on the wiring 42 with the detection signal Voc and the detection signal Vod is detected at both ends of the wiring 42, the detection signal Voc as shown in Fig. 13 (d). The phase difference between and the detection signal Vod is substantially identical, that is, substantially zero degrees. Therefore, the phase difference detection unit 112 compares the phase difference between the detection signal Voc and the detection signal Vod, and outputs phase difference data indicating substantially zero degrees to the disconnection determination unit 109a, thereby causing the disconnection determination unit ( 109a determines that the wiring 42 is a good product, and a signal indicating the determination result of the determination that the wiring 42 is a good product is output to the control unit 2. And the control part 2 makes the display part 3 show that the wiring 42 is a quality goods.

In this case, the phase of the test signal Voa and the test signal Vob is 180 degrees different from each other. Therefore, the signal waveform synthesized on the wiring 42 affects either the test signal Voa or the test signal Vob. In this larger signal, the phase waveform is almost in phase with the phase, so that the phase difference between the detection signal Voc and the inspection signal Voa is substantially 0 degrees or substantially 180 degrees.

Next, the operation | movement of the disconnection test | inspection part 100a in the case of resistance resistance in which the wiring 42 is incompletely disconnected is demonstrated. In this case, in the substrate inspection apparatus 1 described above, if the disconnection inspection unit 100 is the same and, for example, the resistor R1 is 100?, The detection signal Voc is shown in Fig. 13E, Fig. 13. The inspection signal Voa shown in (a) is a signal shifted by 90 degrees out of phase. Further, due to the voltage drop caused by the resistor R1 caused by the resistance failure B, a phase difference of 180 degrees occurs between the detection signal Voc and the detection signal Vod.

Then, based on the detection signal Voc output from the amplifier 105 by the phase difference detection unit 108 and the inspection signal Voa output from the inspection signal source 104a, phase difference data indicating a phase difference of 90 degrees is disconnected. It is output to the determination part 109a. In addition, since the phase difference data is substantially 90 degrees by the disconnection determining unit 109a, the wiring 42 is determined to be a poor resistance, and a signal indicating the determination result of whether the wiring 42 is defective is a control unit 2. Is output to The wiring 42 is displayed on the display unit 3 by the controller 2 to indicate that the wiring is defective.

Next, the operation | movement of the disconnection test | inspection part 100a in the case of the disconnection failure in which the wiring 42 is completely disconnected is demonstrated. FIG. 15 is a view for explaining the operation of the disconnection inspecting unit 100a when the disconnection of the wiring 42 is completely broken. First, the inspection signal Voa shown in FIG. 13A from the inspection signal source 104a is applied to one end of the wiring 42 via the power supply probe 101a and the capacitor C1, while the inspection signal Voa ) And an inspection signal Vob (Fig. 13 (b)) different from each other by 180 degrees are applied from the inspection signal source 104b to the other end of the wiring 42 via the power supply probe 101b and the capacitor C2.

Now, if there is a disconnection failure D in the wiring 42, the test signal Voa output from the test signal source 104a and the test signal Vob output from the test signal source 104b are connected to the wiring 42. Nothing is synthesized above. Therefore, the inspection signal Voa output from the inspection signal source 104a does not change in phase, but interposes the power supply probe 101a, the capacitor C1, the wiring 42, the capacitor C3, and the detection probe 103. The amplifier 105 is detected and amplified by the amplifier 105 and output to the phase difference detection unit 108 and the phase difference detection unit 112 as a detection signal Voc. On the other hand, the inspection signal Vob output from the inspection signal source 104b does not change in phase, but interposes the power supply probe 101a, the capacitor C2, the wiring 42, the capacitor C7, and the detection probe 110. The amplifier 111 is detected and amplified by the amplifier 111 and output to the phase difference detecting unit 112 as a detection signal Vod.

Then, as shown in Fig. 13 (f), the detection signal Voc is in phase with the inspection signal Voa shown in Fig. 13 (a), and the detection signal Voc and detection signal Vod are 180 degrees out of phase. different. Accordingly, phase difference data indicating substantially 0 degrees is output from the phase difference detecting unit 108 to the disconnection determining unit 109a, and phase difference data representing substantially 180 degrees is output from the phase difference detecting unit 112 to the disconnection determining unit 109a. .

Since the phase difference data from the phase difference detecting unit 108 is substantially 0 degrees by the disconnection determining unit 109a, and the phase difference data from the phase difference detecting unit 112 is substantially 180 degrees, the wiring 42 is not disconnected. Is determined, and a signal indicating the determination result is output to the control unit 2. The wiring 42 is displayed on the display unit 3 by the controller 2 to indicate that the wiring is defective.

By the above operation, the phases of the detection signals Voc and Vod, which are hard to be affected by the coupling capacitance between the probe and the wiring, are determined regardless of the signal level of the detection signal Voc with respect to the wiring 42 to be inspected. Since it can detect by using it, the precision of disconnection test | inspection using a non-contact inspection probe can be improved.

In addition, since the defects can be detected by using the phases of the detection signals (Voc, Vod) which are difficult to be affected by the coupling capacitance between the probe and the wiring, the influence of the distance change between the wiring and the inspection probe is reduced. can do.

Next, a short circuit inspection operation by the short circuit inspection unit 200a will be described. 16 is a waveform diagram for explaining the operation of the short circuit checker 200a. 17 is a conceptual diagram for explaining the operation of the short circuit inspection unit 200a. In FIG. 17, the wirings 45 and 46 are sectional views of the direction crossing with a longitudinal direction. First, referring to FIG. 17, a test signal in a state in which the power supply probe 201a and the detection probe 203 and the wiring 45, the power supply probe 201b and the detection probe 210 and the wiring 46 are disposed to face each other. The test signal Vsa shown in FIG. 16A is applied to the wiring 45 from the circle 204a via the power supply probe 201a and the capacitor C4. On the other hand, the inspection signal Vsb which is 180 degrees out of phase with the inspection signal Vsa in the wiring 46 via the power supply probe 201b and the capacitor C5 from the inspection signal source 204b (Fig. 16 (b)). Is applied.

Now, if there is no defect such as a short circuit between the wirings 45 and 46, the test signal Vsa output from the test signal source 204a and the test signal Vsb output from the test signal source 204b are synthesized. There is no work. Therefore, the test signal Vsa output from the test signal source 204a does not change in phase, and the amplifier is supplied via the power supply probe 201a, the capacitor C4, the wiring 45, the capacitor C6, and the detection probe 203. 205 is detected and amplified and output to the phase difference detector 208 and the phase difference detector 212 as a detection signal Vsc. On the other hand, the inspection signal Vsb outputted from the inspection signal source 204b does not change in phase and interposes the power supply probe 201a, the capacitor C5, the wiring 46, the capacitor C8, and the detection probe 210. The amplifier 211 detects and amplifies the amplifier 211 and outputs the detected signal Vsd to the phase difference detector 212.

Then, as shown in Fig. 16 (f), the detection signal Vsc is in phase with the inspection signal Vsa shown in Fig. 16 (a), and the detection signal Vsc and the detection signal Vsd are 180 degrees out of phase. different. Accordingly, phase difference data indicating substantially 0 degrees is output from the phase difference detecting unit 208 to the short circuit judging unit 209a, and phase difference data indicating substantially 180 degrees is output from the phase difference detecting unit 212 to the short circuit judging unit 209a. .

Since the phase difference data from the phase difference detection unit 208 is substantially 0 degrees and the phase difference data from the phase difference detection unit 212 is substantially 180 degrees by the short circuit determination unit 209a, the wirings 45 and 46 are used. It is determined that there is no defect in between, and a signal indicating the determination result is output to the control unit 2. And between the wirings 45 and 46 by the control part 2 on the display part 3, it shows that it is a quality goods.

Next, the operation of the short circuit inspection unit 200a in the case of a poor resistance having an intermediate resistance value between the wirings 45 and 46 will be described. In this case, in the substrate inspection apparatus 1 described above, if the disconnection inspection unit 100 is the same and, for example, the resistor R2 is 100?, The detection signal Vsc is shown in Fig. 16E, as shown in Fig. 16E. The test signal Vsa shown in (a) is shifted by 90 degrees out of phase. Also, due to the voltage drop caused by the resistor R2, a phase difference of 180 degrees occurs between the detection signal Vsc and the detection signal Vsd.

The phase difference detection unit 208 short-circuits the phase difference data representing the phase difference 90 degrees based on the detection signal Vsc output from the amplifier 205 and the inspection signal Vsa output from the inspection signal source 204a. It is output to the determination part 209a. In addition, the short-circuit determining unit 209a determines that the resistance between the wirings 45 and 46 is poor because the phase difference data is within the range of 30 degrees to 90 degrees of the phase difference range, and that the wirings 45 and 46 are defective. A signal indicating the determination result of the signal is output to the control unit 2. Then, the control unit 2 displays the indication that the wirings 45 and 46 are defective on the display unit 3.

Next, operation | movement of the short circuit inspection part 200a in the case of the short circuit defect which has completely shorted between the wiring 45 and 46 is demonstrated. FIG. 18 is a view for explaining the operation of the short-circuit inspection unit 200a in the case where the wirings 45 and 46 are short-circuit defects that are short-circuited with low resistance by the metal film C, for example. In Fig. 18, the test signal Vsa output from the test signal source 204a and the test signal Vsb output from the test signal source 204b are synthesized on the metal film C to form the synthesized signal waveform. On the wiring 45 side, it is detected and amplified by the amplifier 205 via the capacitor C6 and the detection probe 203, and is output to the phase difference detection units 208 and 212 as the detection signal Vsc. On the other hand, the same signal waveform synthesized on the metal film C is detected and amplified by the amplifier 211 through the capacitor C8 and the detection probe 210 on the wiring 46 side, and is a phase difference detection unit 212 as the detection signal Vsd. )

Then, since the same signal waveform synthesized on the metal film C is detected from the wiring 45 and the wiring 46, the detection signal Vsc and the detection signal Vsd are detected as shown in Fig. 16D. The phase difference between the signal Vsc and the detection signal Vsd substantially coincides, that is, becomes substantially zero degrees. Therefore, the phase difference detection unit 212 compares the phase difference between the detection signal Vsc and the detection signal Vsd, and outputs phase difference data indicating substantially 0 degrees to the short circuit judging unit 209a. 209a determines that there is a short circuit between the wirings 45 and 46, and a signal indicating the determination result indicating that the wirings 45 and 46 are defective is output to the controller 2. Then, the control unit 2 displays the indication that the wirings 45 and 46 are defective on the display unit 3.

In this case, since the phase of the test signal Vsa and the test signal Vsb is 180 degrees different from each other, the signal waveform synthesized on the wiring 45 affects either the test signal Vsa or the test signal Vsb. In this larger signal, the phase waveform is almost in phase with the phase, so that the phase difference between the detection signal Vsc and the inspection signal Vsa is substantially 0 degrees or substantially 180 degrees.

By the above operation, in the short circuit inspection between the wirings 45 and 46, the detection signals Vsc and Vsd which are hardly affected by the coupling capacitance between the probe and the wiring, regardless of the signal level of the detection signal Vsc. Since it can detect using the phase of (), the precision of the short circuit inspection using a non-contact inspection probe can be improved.

In addition, since the defects can be detected by using the phases of the detection signals Vsc and Vsd which are hard to be affected by the coupling capacitance between the probe and the wiring, the influence of the distance change between the wiring and the inspection probe is small. .

(Third embodiment)

Next, the board | substrate inspection apparatus which concerns on 3rd Embodiment of this invention is demonstrated. It is a block diagram which shows an example of the structure of the board | substrate inspection apparatus which concerns on 3rd Embodiment of this invention. The board | substrate test | inspection apparatus 1b shown in FIG. 19 differs from the board | substrate test | inspection apparatus 1 shown in FIG. That is, the board | substrate test | inspection apparatus 1b shown in FIG. 19 is not provided with the disconnection test | inspection part 100, but is provided with the short circuit test part 200b instead of the short circuit test part 200. As shown in FIG. In addition, the short circuit inspection part 200b shown in FIG. 19 differs from the short circuit inspection part 200 shown in FIG. 1 in the following points. That is, the short circuit inspection unit 200b shown in FIG. 19 includes a plurality of detection probes 213, 214, and 215 instead of the detection probe 203, and the plurality of amplifiers 216, 217, and 218 are used in place of the amplifier 205. And comparators 219 and 220 for the comparators 206 and 207 and the phase difference detection unit 208, and a short circuit determining unit 209b for the short circuit determining unit 209.

Since the other structure is the same as that of the board | substrate test | inspection apparatus 1 shown in FIG. 1, the description is abbreviate | omitted and the characteristic point of this embodiment is demonstrated below.

In the board | substrate test | inspection apparatus 1b shown in FIG. 19, the feed probes 201a and 201b are shown in figure so that it may interpose with the wiring adjacent to the outer side to the wiring of the both ends, respectively, between the wiring of the both ends. It is installed on the plate. For example, in the case where the wiring to be inspected is referred to as the wirings 43, 44, and 45, when the substrate 4 is placed on the mounting table 51, the power supply probe 201a faces the wiring 42 in a non-contact state. The power supply probe 201b is disposed to face the wiring 46 in a non-contact state. In addition, the detection probes 213, 214, and 215 are disposed to face each other in a non-contact state at the ends of the wires 43, 44, and 45 sandwiched between the wires 42 and 46.

Hereinafter, a case where the inspection target wiring is referred to as the wiring 43, 44, 45 will be described with an example. The amplifiers 216, 217, and 218 amplify the signals derived from the detection probes 213, 214, and 215, respectively, without changing the phase. The amplifier 216 outputs the amplified signal to the comparator 219 as the detection signal Voe, and the amplifier 217 outputs the amplified signal to the comparators 219 and 220 as the detection signal Vof. The amplifier 218 outputs the amplified signal to the comparator 220 as a detection signal Vog.

The comparator 219 compares the voltage of the detection signal Voe from the amplifier 216 with the voltage of the detection signal Vof from the amplifier 217. When the positive voltages are approximately equal, a signal indicating that the voltages are the same. Is outputted to the short circuit judging unit 209b, and when the positive voltages are different, a signal indicating that the voltages are different is output to the short circuit judging unit 209b. The comparator 220 compares the voltage of the detection signal Vof from the amplifier 217 with the voltage of the detection signal Vog from the amplifier 218. When the positive voltages are approximately equal, a signal indicating that the voltages are the same. Is outputted to the short circuit judging unit 209b, and when the positive voltages are different, a signal indicating that the voltages are different is output to the short circuit judging unit 209b.

The short circuit judging unit 209b determines that there is a short circuit failure between the wirings 43 and 44 when a signal indicating that the voltage is the same is output from the comparator 219, and a signal indicating that the voltage is the same from the comparator 220 is determined. When it is output, it is determined that there is a short circuit failure between the wirings 44 and 45, and a signal indicating the determination result is output to the control unit 2.

Next, operation | movement of the board | substrate inspection apparatus 1b comprised as mentioned above is demonstrated. When the substrate 4 is placed on the mounting table 51, the power supply probes 201a and 201b and the detection probes 213, 214, and 215 are arranged to face the wirings 42, 46, 43, 44, and 45, respectively. As a result, the power supply probe 201a and the wiring 42 are capacitively coupled by the capacitor C9, and the power supply probe 201b and the wiring 46 are capacitively coupled by the capacitor C1, and the detection probe 213 The wiring 43 is capacitively coupled by the capacitor C11, the detection probe 214 and the wiring 44 are capacitively coupled by the capacitor C12, and the detection probe 215 and the wiring 45 are capacitance C13. Is capacitively coupled by In addition, capacitances C14, C15, C16, and C17 are generated between the wirings 42 and 43, between the wirings 43 and 44, between the wirings 44 and 45, and between the wirings 45 and 46, respectively. Between the wiring 42 and the wiring 46, a series circuit of capacitors C14, C15, C16, C17 is formed.

FIG. 20 is a diagram for explaining the operation of the substrate inspection apparatus 1b shown in FIG. 19. First, the test signal Vsa is supplied from the test signal source 204a to the wiring 42 via the power supply probe 201a and the capacitor C9, and at the same time, the power supply probe 201b and the capacity (from the test signal source 204b). The test signal Vsb, which is 180 degrees out of phase with the test signal Vsa, is supplied to the wiring 46 via C1) 0. Then, the potential difference between the test signal Vsa and the test signal Vsb is divided by the capacitors C14, C15, C16, and C17, and the divided voltage is caused to the wirings 43, 44, and 45, respectively. The capacitors C11, C12, C13 and the detection probes 213, 214, and 215 are respectively amplified by the pulses 216, 217, and 218 and output as detection signals Vo, Vof, and Vog, respectively.

The detection signal Voe is output from the amplifier 216 to the comparator 219, the detection signal Vof is output from the amplifier 217 to the comparators 219 and 220, and the comparator 220 from the amplifier 218. Is output to the detection signal Vog.

Now, if the wirings 42, 43, 44, 45, 46 are formed in parallel at the same interval, and there is no short circuit failure between the respective wirings of the wirings 42, 43, 44, 45, 46, the capacitors C14, C15 And C16 and C17 are approximately equal to each other, so that the potential difference between the test signal Vsa and the test signal Vsb is divided equally by the capacitances C14, C15, C16 and C17, and the detection signal Voe, Vof and Vog are respectively different voltages. Then, the comparator 219 outputs a signal indicating that the voltage of the detection signal Voe and the voltage of the detection signal Vof are different to the short circuit judging unit 209b. In addition, the comparator 220 outputs a signal indicating that the voltage of the detection signal Vof and the voltage of the detection signal Vog are different to the short circuit judging unit 209b.

Since either of the comparators 219 and 220 outputs a signal indicating that the voltage is different from the short circuit determining unit 209b, a short circuit failure occurs between the wirings 43, 44 and 45 by the short circuit determining unit 209b. A signal indicating the determination result is output to the control unit 2, and the control unit 2 displays the indication that the wiring 43, 44, 45 is a high quality product on the display unit 3.

For example, when there is a short circuit failure between the wirings 43 and 44, since the voltages of the wiring 43 and the wiring 44 are the same, the detection signals Voe and Vof are also approximately the same voltage. Then, the comparator 219 outputs a signal indicating that the voltage of the detection signal Voe and the voltage of the detection signal Vof are the same to the short circuit decision unit 209b, and the wiring ( It is determined that there is a short circuit failure between 43 and 44, and a signal indicating the determination result is output to the control unit 2, and the control unit 2 indicates that there is a short circuit failure between the wirings 43 and 44 on the display unit 3. This is an indication.

By the above operation, the short-circuit inspection between the plurality of wirings 43, 44, and 45 can be performed simultaneously, so that the inspection time can be shortened.

In addition, in the board | substrate test | inspection apparatus 1b shown in FIG. 19, the example which applied the sine wave signal of 180 degree different phase between the feed probe 201a and the feed probe 201b was shown, for example, DC voltage May be applied between the power supply probe 201a and the power supply probe 201b. In this case, as a result of the DC voltage applied between the feed probe 201a and the feed probe 201b divided by the capacitors C9, C14, C15, C16, C17, C1, the detection signals Voe, Vof, Since Vog is set to different voltages, the same effects as in the case of applying a sine wave signal having a phase different from each other by 180 degrees between the power supply probe 201a and the power supply probe 201b can be obtained.

An example in which short circuit failure occurs when the voltage of the detection signal Voe and the voltage of the detection signal Vof are the same between adjacent wirings, or when the voltage of the detection signal Vof and the voltage of the detection signal Vog are the same. Although the value of the capacitance C9, (C14, C15, C16, C17, C1) 0 is acquired by measuring or the like in advance, the voltage applied between the power supply probe 201a and the power supply probe 201b, By dividing the difference between the test signal Vsa and the test signal Vsb by the capacitance values of the capacitors C9, C14, C15, C16, C17, and C1, the voltage of the detection signals Voe, Vof, and Vog is reduced. It is good also as a structure which detects a short circuit defect by making a prediction and comparing this prediction value with the actual value of the detection signal Voe, Vof, Vog obtained by the test | inspection. Alternatively, if the wirings 42, 46, 43, 44, 45, 46 are formed in parallel at the same interval, the capacitances C14, C15, C16, C17 are approximately equal, so that the wiring 42 and the wiring 46 The voltage of the detection signals Voe, Vof, and Vog may be predicted by dividing the voltage between them in equal parts.

(4th Embodiment)

Next, the board | substrate inspection apparatus which concerns on 4th Embodiment of this invention is demonstrated. It is a block diagram which shows an example of the structure of the board | substrate inspection apparatus which concerns on 4th Embodiment of this invention. The board | substrate inspection apparatus 1c shown in FIG. 23 differs from the board | substrate inspection apparatus 1 shown in FIG. That is, in the substrate inspection apparatus 1 shown in FIG. 1, when disconnection inspection is performed on the wiring of a good product, the inspection signal Voa output from the inspection signal source 104a and the inspection signal source 104b are output. The test signal Vob is not completely offset due to error factors such as irregularities in the test signal sources 204a and 204b and differences in the capacities C1 and C2. Therefore, as shown in Fig. 4 (d), the voltage of the detection signal Voc is a signal waveform almost in phase with the phase of the signal having the greater influence on either of the inspection signal Voa and the inspection signal Vob. It is obtained as this detection signal Voc.

In this case, since the difference between the capacitors C1 and C2 is caused by the irregularity of the distance between the feed probes 101a and 101b and the wiring, the detection signal is influenced by, for example, the substrate flipping or bending. The voltage of (Voc) is generated.

In the disconnection inspection part 100 shown in FIG. 1, when the detection signal Voc is substantially zero below the value which added the error range of signal detection to zero, the said wiring 42 judges that it is a quality goods, and it judges such a power supply probe. The error factor which arises by the distance irregularity between 101a and 101b and wiring is reduced.

On the other hand, the board | substrate test | inspection apparatus 1c shown in FIG. 23 further includes the detection probe 121, the amplifier 122, and the feedback part 123, The test | inspection signal is adjusted by adjusting the output level of the test | inspection signal source 104a. (Voa) and inspection signal Vob are offset on the inspection target wiring, so that the signal level of detection signal Voc is zero. As a result, an error factor caused by irregularities in the distance between the power feed probes 101a and 101b and the wiring is reduced.

In the substrate inspection apparatus 1 shown in FIG. 1, when the disconnection inspection is performed, if the inspection target wiring is a good product, the voltage of the detection signal Voc becomes substantially zero, while the detection probe 103 and Even when the wirings do not face each other or the substrate 4 itself is not placed on the mounting table 51, the voltage of the detection signal Voc becomes zero. Therefore, in the board | substrate test | inspection apparatus 1 shown in FIG. 1, it is difficult to judge whether only the wiring of a test object is a good quality, or whether the detection probe 103 and the wiring do not oppose only by the voltage of the detection signal Voc. Do.

Thus, the substrate inspection apparatus 1c shown in FIG. 23 further includes a wiring detection probe 124, an ammeter 125, a periodic voltage supply unit 126, and a phase detection unit 127, thereby detecting the detection probe 103. ) And the inspection target wiring are detected to face each other, and only when the detection probe 103 and the inspection target wiring face each other, the disconnection determining unit 109 determines whether the wiring is good or bad.

Since the other structure is the same as that of the board | substrate test | inspection apparatus 1 shown in FIG. 1, the description is abbreviate | omitted and the following demonstrates the characteristic point of this embodiment. 23, illustration of the disconnection test | inspection part 100 and the short circuit test | inspection part 200 is abbreviate | omitted.

Similar to the power supply probes 101a and 101b, the detection probe 121 and the wire detection probe 124 are integrally installed on an inspection plate, not shown, and are physically and electrically spaced apart from the substrate surface of the substrate 4 at a small distance. They are arranged opposite in a non-contact state. Moreover, the wiring 41, 42, 43, 44, 45, 46, 47 is formed in the substrate surface of the board | substrate 4 in plurality in the predetermined direction (one example in the figure) along a board surface. Then, a plurality of wirings including two or more wirings, for example, wirings 41, 42, and 43, and the detection probes 121 are arranged to face each other and are capacitively coupled to each other, among the wirings in which the power feeding probes 101a and 101b are disposed to face each other. The wires 42 and the wire detection probes 124 on which the detection probes 103 are disposed to face each other are disposed to face each other and are capacitively coupled to each other.

The amplifier 122 amplifies the signal derived from the detection probe 121 without changing the phase and outputs the signal to the feedback unit 123 as the detection signal Voh.

The feedback unit 123 uses, for example, a phase detector that performs phase detection of 0 degrees based on the detection signal Voh output from the amplifier 122 and the test signal Voa output from the test signal source 104a. It is composed. In addition, the feedback unit 123 performs a test signal Vob when the voltage obtained as a result of performing phase detection of 0 degrees with respect to the detection signal Voh is positive, that is, when the detection signal Voh and the test signal Voa are homogeneous. In order to lower the ratio of the output level of the test signal Vo to the output level of the test signal, the output level of the test signal Voa by the test signal source 104a is lowered.

In addition, the feedback unit 123 checks the test signal when the voltage obtained as a result of performing phase detection of 0 degrees with respect to the detection signal Voh is negative, that is, when the detection signal Voh and the test signal Voa are reverse polarity. In order to increase the ratio of the output level of the test signal Voa to the output level of Vob, the output level of the test signal Voa by the test signal source 104a is increased.

When the voltage obtained as a result of performing phase detection of 0 degrees with respect to the detection signal Voh is 0 V, the feedback unit 123 outputs the level of the inspection signal Voa by the inspection signal source 104a and the inspection signal source ( The output level of the test signal Vob by 104b is maintained.

The periodic voltage supply unit 126 applies a sinusoidal wave voltage Vd of 1 MHz, for example, to the wire detection probe 124 via the ammeter 125. The ammeter 125 detects the current flowing from the periodic voltage supply unit 126 to the wire detection probe 124 as the wire detection current Id. The phase detector 127 performs a phase detection of 90 degrees between the sinusoidal voltage Vd output from the periodic voltage supply unit 126 and the wiring detection current Id detected by the ammeter 125, and the phase detection of 90 degrees is performed. When a component that is out of shift is detected, a signal indicating that the wiring detection current Id flows is output to the disconnection determining unit 109, and when the component that is out of phase by 90 degrees is not detected, the wiring detection current Id does not flow. A signal indicating that the signal is output to the disconnection determining unit 109 is output.

Instead of using the phase detector 127, for example, a signal indicating the presence or absence of the wiring detection current Id is output to the disconnection determination unit 109 according to the execution value of the current detected by the ammeter 125. FIG. It is good also as a structure which may be used, and the other structure which can detect the presence or absence of wiring detection current Id may be used.

The disconnection determining unit 109 determines whether the wiring is good or bad when the signal indicating that the wiring detection current Id has flowed from the phase detector 127 is determined, while the wiring detection current Id is received from the phase detector 127. In the case where a signal indicating that does not flow is received, good or bad wiring is not judged.

Next, operation | movement of the board | substrate inspection apparatus 1c comprised as mentioned above is demonstrated. First, for example, when the wiring 42 is a wiring to be inspected, when the substrate 4 is placed on the mounting table 51, the detection probe 103 and the wiring 42 are disposed to face each other, whereby the detection probe ( 103 and the wiring 42 are capacitively coupled by the capacitor C3, and the feed probes 101a and the wirings 41, 42, and 43 are disposed to face each other, whereby the wirings 41, 42, and 43 are respectively capacitive. Capacitively coupled to the feed probe 101a by (C21, C1, C22) and the feed probe 101b and the wirings 41, 42, 43 are disposed so as to face the wirings 41, 42, 43, respectively. Capacitively coupled to the feed probe 101b by the capacitors C23, C2, and C24, and the detection probes 121 and the wirings 41, 42, and 43 are opposed to each other so that the wirings 41, 42, and 43 are respectively disposed. The wire detection probe 124 and the wire 42 are capacitively coupled to the detection probe 121 by the capacitors C25, C26, and C27, and the wire detection probe 124 and the wire 42 are disposed to face each other. According to capacity (C28) It is coupled over capacity.

Next, operations of the wire detection probe 124, the ammeter 125, the periodic voltage supply unit 126, and the phase detector 127 will be described. First, for example, a sine wave voltage Vd of 1 MHz is applied to the wire detection probe 124 via the ammeter 125 by the periodic voltage supply unit 126. Then, the ammeter 125, the wiring detection probe 124, the capacitor C28, the wiring 42, the capacitors C1 and C2, the power supply probes 101a and 101b and the inspection signal from the periodic voltage supply unit 126. A current flows in the path to the ground via the circles 104a and 104b, and the current is detected by the ammeter 125 as the wiring detection current Id, and the wiring is detected from the ammeter 125 to the phase detector 127. A signal representing the current Id is output. In this case, the ammeter 125, the wiring detection probe 124, the capacitor C28, the wiring 42, the capacitors C1 and C2, the power supply probes 101a and 101b and the test signal from the periodic voltage supply unit 126. Since the path to the ground via the circles 104a and 104b is a series circuit of the capacitor, the phase of the wiring detection current Id advances 90 degrees from the phase of the sinusoidal voltage Vd.

24 is a diagram for explaining the operation of the phase detector 127. As shown in FIG. 24, when the wiring detection probe 124 and the wiring 42 are disposed to face each other, the phase of the wiring detection current Id advances 90 degrees from the phase of the sine wave voltage Vd. The phase detector 127 performs phase detection at 90 degrees between the sinusoidal voltage Vd and the wiring detection current Id. Then, by the phase detector 127, the wiring detection current Id is detected at the position where the phase detection is 90 degrees out of the peak position of the sinusoidal voltage Vd, and a signal indicating that the wiring detection current Id flows is disconnected. It is output to the government 109.

On the other hand, when the wiring detection probe 124 and the wiring 42 are not arranged oppositely, the ammeter 125, the wiring detection probe 124, the capacitor C28, and the wiring 42 from the periodic voltage supply unit 126. ), The wiring detection current Id does not flow because the path to the ground is not formed via the capacitors C1 and C2, the power supply probes 101a and 101b, and the test signal sources 104a and 104b. Therefore, the phase detector 127 indicates that the wiring detection current Id does not flow because there is no detection of the wiring detection current Id at the grade value deviated from the 90 degree phase at the peak position of the sinusoidal voltage Vd. The signal is output to the disconnection determination unit 109.

If the wiring detection probe 124 and the wiring are arranged to face each other, since the detection probe 103 and the wiring are arranged to face each other, the wiring detection current Id from the phase detector 127 by the disconnection determiner 109. If the detection probe 103 and the wiring are not arranged oppositely, the disconnection determination unit 109 performs the good and bad judgment only when a signal indicating that the signal is flowing is received. Is judged to be suppressed.

Next, operations of the detection probe 121, the amplifier 122, and the feedback unit 123 will be described. First, the feed probe 101a and the capacitors C21, C1, C22 from the test signal source 104a in a state where the feed probes 101a, 101b, the detection probe 121, and the wirings 41, 42, 43 are disposed to face each other. The test signal Vo is applied to the wirings 41, 42, and 43 via the circuit. On the other hand, the test signal Vob is applied from the test signal source 104b to the wirings 41, 42 and 43 via the power supply probe 101b and the capacitors C23, C2 and C24.

Then, the test signal Voa output from the test signal source 104a and the test signal Vob output from the test signal source 104b are synthesized on the wirings 41, 42, and 43, respectively, and the synthesized signal waveforms are combined. The capacitors C25, C26, and C27 and the detection probe 121 are detected and amplified by the amplifier 122 and output to the feedback unit 123 as the detection signal Voh.

25 is a graph illustrating an inspection signal Voa, an inspection signal Vob, and a detection signal Voh. The inspection signal Voa shown in Fig. 25A and the inspection signal Vob shown in Fig. 25B are combined and offset on the wirings 41, 42, and 43, respectively. At this time, the power supply probes 101a and 101b and the wiring 42 are influenced by irregularities in the output level in the test signal sources 204a and 204b, and for example, the inversion and bending of the substrate 4. Due to the irregularity of the distance that can be put in between, the difference occurs between the capacitors C21, C1 and C22 and the capacitors C23, C2 and C24. And if there is a difference between the capacitors C21, C1, C22 and the capacitors C23, C2, C24, the detection signal Voh may not become zero. In this case, for example, when the distance between the power supply probe 101a and the wiring 42 is smaller than the distance between the power supply probe 101b and the wiring 42, the capacitances C21, C1, and C22 become larger than the capacitances C23, C2, and C24. As a result, the waveform synthesized on the wirings 41, 42, 43 has a greater influence of the inspection signal Voa than the inspection signal Vob, and the detection signal Voh has a dead signal Voa as shown in Fig. 25 (c). ) Is in phase with the same polarity.

On the other hand, for example, if the distance between the power supply probe 101a and the wiring 42 is greater than the distance between the power supply probe 101b and the wiring 42, the result is that the capacitances C21, C1, C22 are smaller than the capacitances C23, C2, C24. The waveform synthesized on the wirings 41, 42, 43 has a greater influence of the inspection signal Vob than the inspection signal Voa, and the detection signal Voh has the inspection signal Voa as shown in FIG. And reverse phase (reverse polarity).

26 is a graph for describing the operation of the feedback unit 123. First, when the detection signal Voh is in phase with the test signal Voa (polarity) as shown in Fig. 25 (c), as shown in Fig. 26 (a), 0 in the feedback unit 123 is used. The voltage obtained by the phase detection of the diagram, that is, the voltage of the detection signal Voh which can be placed at phase 0 degrees, becomes positive. Then, a control signal for reducing the output level of the test signal Voa is output from the feedback unit 123 to the test signal source 104a, and as a result, the output level of the test signal Voa is lowered. (Voh) becomes 0V as shown to FIG. 25 (e).

On the other hand, when the detection signal Voh is in reverse phase (reverse polarity) with the inspection signal Voa as shown in Fig. 25 (d), as shown in Fig. 26 (b), the feedback unit 123 has a zero degree. The voltage obtained by the phase detection, that is, the voltage of the detection signal Voh which can be placed at 0 degrees of phase becomes negative. Then, a control signal for raising the output level of the test signal Voa is output from the feedback unit 123 to the test signal source 104a, and as a result of the increase of the output level of the test signal Voa, the detection signal ( Voh) becomes 0V as shown in Fig. 25E.

When the voltage obtained as a result of performing phase detection of 0 degrees with respect to the detection signal Voh by the feedback unit 123 is 0 V, the output level of the inspection signal Voa by the inspection signal source 104a and the inspection signal The output level of the test signal Vob by the circle 104b is maintained. At this time, since the voltage caused to the wiring 42 to be inspected becomes 0V, the detection signal Voc also becomes 0V.

As a result, the inspection signal Voa output from the inspection signal source 104a and the inspection signal Vob output from the inspection signal source 104b cause irregularities or capacitances of the inspection signal sources 204a and 204b. Even if the voltage level of the detection signal Voc does not become zero because it is not completely offset due to an error factor such as a difference in C2), by adjusting the output level of the inspection signal source 104a, the inspection signal ( Since the signal level of the detection signal Voc can be zeroed by offsetting Voa and the inspection signal Vob on the inspection target wiring, the distance between the feed probes 101a and 101b and the wiring is irregular. It is possible to reduce the error factor caused by such.

In addition, the board | substrate test | inspection apparatus 1c shown in FIG. 23 is the disconnection test | inspection part 100, the detection probe 121, the amplifier 122, the feedback part 123, the wiring detection probe 124, the ammeter 125, and a period. Although the voltage supply part 126 and the phase detector 127 were each provided, and the disconnection test | inspection of wiring was performed one by one, the several disconnection test part 100 etc. were provided, and several wirings are examined simultaneously. It is good also as a structure.

For example, in the glass substrate used for the plasma display panel, as in the substrate 4b shown in FIG. 27, the wiring spacing is narrowed so that one end of the wiring can be easily connected to the connector, and the wiring is connected to one end of the substrate. In some cases, the wirings having a narrower spacing and the wirings having a narrower wiring spacing are alternately formed on the other end side of the substrate. When performing disconnection inspection of the wiring formed in such a glass substrate 4b, for example, two disconnection inspection units 100 and the like are provided, and as shown in FIG. 27, the wiring spacing is narrowed at both ends of the substrate. The detection probe 103, the detection probe 121, and the wire detection probe 124 are opposed to each other, and the power supply probes 101a and 101b are alternately formed at the portions where the wirings are alternately formed in the wide wiring intervals. ) May be arranged to face each other. As a result, disconnection inspection can be performed on two wirings at the same time.

Since the board inspection apparatus and the board inspection method of such a structure detect the defect which has an intermediate level of resistance value based on the phase of the voltage which is less influenced by an error factor, it uses the electrical non-contact inspection probe of the intermediate level. It is possible to detect disconnection failure having a resistance value and to reduce the influence of the distance change between the wiring and the inspection probe.

In addition, since the board inspection apparatus and the board inspection method of such a structure detect the defect which has an intermediate level of resistance value based on the phase of the voltage which is less influenced by an error factor, wiring is performed using the electrical non-contact inspection probe. The defect short-circuited by the simple intermediate level resistance value can be detected based on the phase of the voltage which is less influenced by an error factor.

The substrate inspection apparatus and substrate inspection method of such a configuration can collectively detect short circuit defects between various wirings.

In addition, the substrate inspection apparatus having such a configuration detects disconnection defects and short circuit defects having an intermediate level of resistance value based on the phase of the voltage which is less influenced by an error factor. It is possible to detect disconnection defects having a level resistance value based on the phase of the voltage which is less influenced by the error factor, and at the same time, defects shorted by the intermediate level resistance value between wirings are less affected by the error factor. It can detect based on phase.

Claims (11)

In the substrate inspection apparatus for inspecting the wiring formed on the substrate surface, A first feeding probe and a first detecting probe disposed at one end of the wiring so as to face each other in electrical contact with the wiring; A probe for a second power supply disposed at the other end of the wiring so as to face the wiring in electrical non-contact; A first signal supply unit applying a first periodic signal having a predetermined period to the first feeding probe; A second signal supply unit applying a second periodic signal 180 degrees out of phase with the first periodic signal to the second power supply probe; A first detector for detecting a voltage generated in the first detection probe; And a disconnection judging unit for judging whether the wiring is good or bad based on the phase of the voltage detected by the first detecting unit. The board according to claim 1, wherein the disconnection determining unit judges that the wiring is defective when the phase difference between the voltage detected by the first detection unit and the first periodic signal is within a range of a preset phase difference. Inspection device. The board inspection apparatus according to claim 2, wherein the disconnection determining unit further determines that the wiring is defective when the voltage value detected by the first detection unit exceeds a predetermined reference value. 2. The second detecting probe according to claim 1, further comprising a second detecting probe disposed at the other end of the wiring so as to be in electrical contact with said wiring in a non-contact manner, and a second detecting section for detecting a voltage generated in said second detecting probe, And the disconnection determining unit judges that the wiring is a good product when the phase difference between the voltage detected by the first detection unit and the voltage detected by the second detection unit is substantially 0 degrees. 5. The second detecting probe according to claim 1 or 4, further comprising: a second detecting probe disposed at the other end of the wiring so as to be in electrical contact with said wiring in a non-contact manner; and a second detecting unit for detecting a voltage generated in said second detecting probe. , And the disconnection determining unit judges that the wiring is defective when the phase difference between the voltage detected by the first detector and the voltage detected by the second detector is substantially 180 degrees. A substrate inspection apparatus for sequentially inspecting a plurality of wirings formed on a substrate surface, A third power supply probe and a third detection probe which are sequentially selected from the plurality of wirings and are arranged to be electrically non-contacted with the wirings to be the first inspection target wirings; A probe for a fourth power supply disposed in electrical contact with the wiring to be a second inspection target wiring different from the first inspection target wiring; A third signal supply unit applying a third periodic signal having a predetermined period to the third power supply probe; A fourth signal supplier for applying a fourth periodic signal 180 degrees out of phase with the third periodic signal to the fourth power supply probe; A third detector for detecting a voltage generated in the third detection probe; And a short circuit judging unit for determining the presence or absence of a short circuit failure between the first and second inspection object wirings based on the phase of the voltage detected by the third detection unit. A wiring that is sequentially selected from a plurality of wirings formed on the substrate surface and becomes a first inspection target wiring, a wiring that is a second inspection wiring different from the first inspection wiring, and the first and second inspection wirings A substrate inspection apparatus for inspecting a substrate in accordance with a wiring formed of one or a plurality of third inspection target wirings formed between A third power supply probe disposed to face the first inspection target wiring in electrical non-contact; A fourth power supply probe disposed to face the second inspection target wiring in electrical non-contact; One or a plurality of fifth detection probes which are disposed to be in electrical contact with each other of the one or the plurality of third inspection target wirings; An inspection voltage source for applying a predetermined inspection voltage for generating a potential difference between the third feeding probe and the fourth feeding probe; One or a plurality of fifth detectors respectively detecting voltages generated in the one or a plurality of fifth detection probes; And a short circuit judging unit determining the presence or absence of a short circuit failure in the third inspection target wiring based on the voltage detected by the one or the plurality of fifth detection units. The method of claim 7, wherein the third inspection target wiring is selected in plurality between the first and the second inspection target wiring, The short circuit judging unit judges that there is a short circuit failure in the third inspection target wiring when the voltages detected by the two fifth detection units of the plurality of fifth detection units are substantially the same, and the plurality of fifth detection units And determining that there is no short circuit failure in the third inspection object wiring when all of the detected voltages are different from each other. A substrate inspection apparatus that sequentially performs inspection of a plurality of wirings extending in a predetermined direction along a substrate surface, A first feeding probe and a first detecting probe which are selected from the plurality of wirings and are arranged to be electrically non-contacted with the wirings at one end in the wirings to be the fourth inspection target wirings; A second power supply probe disposed at the other end of the fourth inspection target wiring in electrical contact with the wiring; A first signal supply unit applying a first periodic signal having a predetermined period to the first feeding probe; A second signal supply unit applying a second periodic signal 180 degrees out of phase with the first periodic signal to the second power supply probe; A first detector for detecting a voltage generated in the first detection probe; A third power supply probe and a third detection probe, which are selected from the plurality of wirings and are arranged to be in electrical contact with the wiring that is the fifth inspection target wiring; A fourth power feeding probe disposed to be in electrical contact with the sixth inspection target wiring different from the fifth inspection target wiring; A third signal supply unit applying a third periodic signal having a predetermined period to the third power supply probe; A fourth signal supplier for applying a fourth periodic signal 180 degrees out of phase with the third periodic signal to the fourth power supply probe; A third detector for detecting a voltage generated in the third detection probe; A transfer unit for transferring the substrate in a direction crossing the plurality of wires; A disconnection determination unit which judges whether the fourth inspection object wiring is good or bad based on the phase of the voltage detected by the first detection unit while transferring the substrate by the transfer unit; And a short circuit judging unit determining whether there is a short circuit failure between the fifth and sixth inspection object wirings based on the phase of the voltage detected by the third detection unit while transferring the substrate by the transfer unit. Substrate inspection equipment. The method of claim 1, wherein the substrate surface is formed with a plurality of wires extending in a predetermined direction along the substrate surface, The first and second power feeding probes are intended to extend and intersect in a direction different from the direction in which the wires extend so as to cover some or all of the plurality of wires, and to be electrically non-contacted thereto. Extending and crossing in a direction different from the direction in which the wire extends to cover a plurality of wires including two or more wires among the wires covered by the first and second power supply probes so as to be electrically non-contacted with them; A sixth detection probe, A sixth detector configured to detect a voltage generated in the sixth detection probe; The voltage level detected by the sixth detection unit is maintained at zero, and the voltage is applied to the second periodic signal application level according to a difference between the polarity of the voltage detected by the sixth detection unit and the polarity of the first periodic signal. And a feedback section for adjusting a signal application level at the first signal supply section and / or the second signal supply section to increase or decrease the ratio of the first periodic signal application level. The wire detection probe according to claim 1 or 10, wherein the first detection probe is arranged to face the non-contact electrical contact with the inspection target wiring to which the first detection probe is disposed; A periodic voltage supply unit for applying a periodic voltage having a predetermined period to the wire detection probe; Also provided with a current detector for detecting a current flowing through the wire detection probe, And the disconnection judging unit judges the good and bad judgments when a current is detected by the current detection unit.

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