KR100589938B1 - Vacuum deposition apparatus - Google Patents

Abstract

The present invention discloses a vacuum deposition chamber comprising an adhesion member that can be mounted and drawn out through a simple operation. According to the present invention, a chamber, comprising an evaporation source located in the chamber and heated by an applied power source and transferring heat to the evaporation material contained therein, flows vapor of the evaporation material generated in the evaporation source to the substrate surface. In the vacuum deposition apparatus for forming a deposition layer of deposition material on the surface of the substrate, a horizontal plate is installed at the same height as the upper end of the evaporation source at the center of the chamber, and an adhesion member formed of a single body of a polyhedron that can be accommodated in the chamber interior space. It further includes. The anti-stick member is composed of a hollow space for the flow of the deposition material, the outer shape is configured so that the outer surface is in close contact with the corresponding chamber inner surface, and the substrate mounted on the bottom and the top of the chamber corresponding to the evaporation source; The corresponding top is made up of an open structure and is located on the horizontal plate. In addition, the cutout member has a cutout formed at a lower end of one sidewall member, so that the contact with the evaporation source exposed on the plate is not made at the time of entering the pullout member into the chamber and withdrawing from the inside of the chamber.

Vacuum deposition chamber, scuff plate

Description

Vacuum deposition apparatus

1 is a cross-sectional view showing the internal configuration of a general vacuum deposition apparatus.

2 is a front view of a conventional deposition plate attached to the inner surface of the chamber of the vacuum deposition apparatus.

3 is a partial cross-sectional view showing a relationship between a conventional barrier plate and an inner surface of a chamber.

Figure 4 is a bottom perspective view of the anti-stick member according to the present invention.

FIG. 5 is a cross-sectional view of a deposition apparatus showing a state in which the anti-stick member shown in FIG. 4 is mounted. FIG.

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a vacuum deposition apparatus, and more particularly, to a vacuum deposition apparatus capable of mounting a barrier plate in a chamber in a simple operation without using a coupling means.

Thermal physical vapor deposition is a technique of forming a light emitting layer (organic layer) on a substrate surface with a deposition material, in which the deposition material heated to the vaporization temperature is vaporized, and vapor of the vaporized deposition material is moved out of the container containing the deposition material and then coated. Condensation on the substrate. This deposition process proceeds with a container to hold the deposition material to be vaporized and a substrate to be coated in a vessel under pressure ranging from 10 ⁻⁷ to 10 ⁻² Torr.

Generally, a deposition source containing a deposition material is made of an electrically resistive material that increases in temperature as current passes through the wall (member). When a current is applied to the evaporation source, the deposition material therein is heated by radiant heat from the wall of the evaporation source and conduction heat from contact with the wall. Typically, the evaporation source is box-shaped with an open top, which opening allows for the dispersion (outflow) of steam towards the substrate.

FIG. 1 is a cross-sectional view illustrating an internal configuration of a general vacuum deposition apparatus, and illustrates an evaporation source 11 mounted inside the chamber 13 of the deposition apparatus and a substrate 12 mounted on the evaporation source 11.

The substrate 12 on which the light emitting layer is deposited is mounted on the upper plate 13-1 of the chamber, and the substrate 12 may be mounted in a fixed state, but may be mounted to be movable in the width direction thereof. The evaporation source 11 is mounted on an insulating structure fixed to the bottom surface 13-2 of the chamber 13, and a cable for supplying power is connected to the member.

When a current is applied to the evaporation source 11, the deposition material therein is heated and vaporized by radiant heat from the wall of the evaporation source 11 and conduction heat from contact with the wall, and the vaporized vapor of the deposition material is baffle member ( 11B) and is discharged to the outside through the upper cutout 11A of the evaporation source 11. As such, the vaporized vapor of the deposition material discharged to the outside of the evaporation source 11 flows to the substrate 12 and condenses on the surface of the substrate 12 to form a film having a predetermined thickness.

In the vapor deposition apparatus having the structure as described above, a part of the vapor deposition material vapor discharged from the evaporation source 11 flows to the substrate 12 in the process of flowing to the inner surface of the chamber 13, and thus the deposition process for a predetermined time. After this process, an organic material layer, which is a deposition material layer, is formed on the inner surface of the chamber 13. When the organic material layer is formed on the surface of the chamber 13 to a certain thickness or more, the equipment is separated from the inner surface of the chamber 13 and dropped to the evaporation source 11, which greatly affects the function of the evaporation source. The organic layer formed on the inner surface of the chamber 13 must be stopped.

Generally, a barrier plate is used for more efficient operation of the deposition apparatus. FIG. 2 is a front view of any conventional deposition plate attached to the inner surface of the chamber 13 of the vacuum vapor deposition apparatus shown in FIG. 1, wherein the inner surface of the chamber 13 is made of a metallic material and has about 60 to 70 rooms. Mounting plates 15 are mounted.

When the deposition process is performed while the plurality of deposition plates 15 shown in FIG. 2 are mounted on the inner surface of the chamber 13, vapor deposition material vapors discharged from the evaporation source flow toward the substrate, but some of the deposition plates are The organic material layer is formed on the surface of each of the barrier plates 15 after the deposition process of a predetermined time is performed. When the organic material layer is deposited to a predetermined thickness or more, after separating the barrier plate 15 from the chamber 13, a new barrier plate is mounted, and the cleaning operation for the separated barrier plate 15 is performed in a separate space. .

3 is a partial cross-sectional view showing a chamber and a conventional anti-fouling plate mounted thereon, the structure and process for mounting and detaching the anti-fouling plate 14 in the chamber 13 and the problems thereof along with FIG. 2 and 3 Explain through.

A plurality of bolt through holes 15A are formed in each of the barrier plates 15, and the chamber 13 corresponding to each of the barrier plates 15 also corresponds to the bolt through holes 15A of the barrier plates 15. The bolt fastening groove 13A is formed in the position. After the bolts 16 penetrate through the bolt through holes 15A of the barrier plates 15 while the barrier plates 15 are in close contact with the inner surface of the chamber 13, the bolt fastening grooves 13A of the chamber 13 are closed. As shown in FIG. 3, each of the barrier plates 15 is fixed to the chamber 13 (the separation process of the barrier plates is the reverse of the above procedure, and a description thereof will be omitted). When the mounting process is performed on all the barrier plates 15, the inner surface of the chamber 13 is not exposed to the outside by the barrier plates 15.

However, as described above, since all the inner surfaces of the chamber 13 are usually mounted with 60 to 70 barrier plates 15, all the barrier plates 15 are attached to the inner surface of the chamber 13 using bolts 16. In addition to the mounting work, a considerable time and personnel are required to release the bolt 16 to separate the barrier plate 15 from the surface of the chamber 13. In particular, when the bolt 16 penetrating the bolt through hole 15A of the anti-stick plate 15 is fastened to the bolt fastening groove 13A formed in the chamber 13, foreign matters due to friction may also be generated.

In addition, since the organic layer is formed around the bolt through hole 15A formed in the barrier plate 15 and the fastened screw 16 in the deposition process, the organic material in the process of removing the bolt 16 to separate the barrier plate 15. This separation may contaminate the space inside the chamber 13. In addition, in the cleaning operation of the adhesion plate 15, there is also a problem that it is not easy to completely remove the organic layer formed around the bolt through hole 15A.

On the other hand, as mentioned above, after the deposition apparatus is operated for a certain time, the operation is temporarily stopped for maintenance and efficient use of the equipment. That is, in a production site, the evaporation source is turned off after about six days of operation, and then the evaporation source is removed, and each evaporation source is maintained while the evaporation source temperature is lowered. To supply. In addition, the barrier plate 15 fixed to the inner surface of the chamber 13 (the vaporized material of the deposition material is hardened) is removed and a new barrier plate is mounted.

In order to improve the productivity of the device using the deposition apparatus, it is most desirable to minimize the maintenance time, which takes several hours as described above, and in particular, to minimize the time required to separate a large number of mounting plates from the chamber surface and to install a new barrier plate. This shortening should be considered as important for the efficient operation of the equipment.

SUMMARY OF THE INVENTION The present invention is directed to solving the above-mentioned problems arising in the process of mounting and detaching the barrier plate on the inner surface of the deposition chamber. The barrier member can be mounted in the chamber and withdrawn from the chamber in a short time and through a simple operation. It is an object of the present invention to provide a vacuum deposition apparatus.

According to the present invention for realizing the above object, comprising a evaporation source located in the chamber and heated by an applied power source to transfer heat to the evaporation material contained therein, the evaporation material produced in the evaporation source The vacuum deposition apparatus for flowing vapor to the substrate surface to form a deposition layer of deposition material on the substrate surface further includes an adhesion member consisting of a monolithic polyhedron mounted in the interior space of the chamber, so that the deposition material vapor flows into the chamber inner surface. Can be prevented.

In the vapor deposition apparatus according to the present invention, a horizontal plate is provided at the same height as the upper end of the evaporation source at the center of the chamber, and the anti-glare member has an empty space therein for the flow of the deposition material. The outer shape of the adhesion member is configured such that its outer surface is in close contact with the corresponding inner surface of the chamber, and the bottom portion corresponding to the evaporation source and the substrate corresponding to the substrate mounted on the upper portion of the chamber have an open structure and are positioned on the horizontal plate. . In addition, the cutout member has a cutout formed at a lower end of one sidewall member, so that the contact with the evaporation source exposed on the plate is not made at the time of entering the pullout member into the chamber and withdrawing from the inside of the chamber.

The invention will be more fully understood by the following detailed description of the preferred embodiment with reference to the accompanying drawings.

Figure 4 is a bottom perspective view of the anti-stick member according to the present invention, Figure 5 is a cross-sectional view of the deposition apparatus showing a state in which the anti-stick member shown in Figure 4 mounted, the structure and function of the anti-stick member according to the present invention 4 and FIG. Explain through 5. Meanwhile, members constituting the deposition apparatus illustrated in FIG. 5 have the same configuration and function as members of the general deposition apparatus illustrated in FIG. 1, and thus descriptions thereof will not be repeated.

A horizontal plate 23A is provided at the same height as the upper end of the evaporation source 21 at the central portion of the chamber 20, which is a member constituting the vapor deposition apparatus, and the evaporation source ( The upper part of 21 is exposed. In addition, one side wall member 23 of the chamber 20 is provided with an openable door (not shown).

The greatest feature of the present invention is that the adhesion member 30 is formed as a single body of a polyhedron that can be accommodated in the inner space of the chamber 20. The interior of the adhesion member 30 is composed of an empty space for the flow of the deposition material, in particular the external shape is configured such that the outer surface of the adhesion member 30 can be in close contact with the inner surface of the corresponding chamber 20. . In addition, the bottom portion corresponding to the evaporation source 21 and the upper portion corresponding to the substrate (12 of FIG. 1) mounted on the chamber 20 are open.

On the other hand, a cutout 31A having a predetermined area is formed at the lower end portion of the side wall member 31 that constitutes the adhesion member 30, and when the adhesion member 30 is introduced into the chamber 20 and the chamber 20 is formed. At the time of withdrawing the anti-glare member 30 from), interference due to the evaporation source 21 and other members can be minimized.

Referring to the process of installing the anti-stick member 30 having such a structure in the interior space of the chamber 20 as follows. First, in order to install the adhesion member 30 in the chamber 20, the door comprised in the side wall member 23 of the chamber 20 is opened in the arrow direction. Thereafter, the adhesion member 30 is pushed into the inner space of the chamber 20 through the open portion, wherein the cutout 31A formed in one sidewall member 31 of the adhesion member 30 is the chamber 20. Must face toward the inner space of the unit.

In the process of sliding the lower end of the adhesion member 30 along the surface of the plate 23A, the evaporation source 21 exposed onto the plate 23A is provided at the lower end of one sidewall member 31 of the adhesion member 30. Passing through the formed cutout 31A, the movement (installation) of the adhesion member 30 is not affected by the evaporation source 21 exposed on the plate 23A.

When the adhesion member 30 completely enters the interior space of the chamber 20, all outer surfaces of the adhesion member 30 are in close contact with the inner wall surface of the corresponding chamber 20 as shown in FIG. 5. However, as described above, since the bottom and top portions of the adhesion member 30 have an open structure, steam generated in the evaporation source 21 flows into the interior space of the adhesion member 30 without any interference. After that, the deposition process may be performed smoothly by flowing to the substrate 22 installed above the chamber 20.

After the deposition process has been performed for a certain period of time, the adhesion member 30 (the vaporized material of the deposition material is solidified on the inner surface) installed in the interior space of the chamber 20 is taken out and a new adhesion member is installed. After opening the door formed in the side wall member 23 of the chamber 20, the operator pulls the anti-stick member 30 so that the anti-stick member 30 can be taken out of the interior space of the chamber 20 without great resistance.

The anti-deposition member used in the present invention as described above does not require the process of fastening hundreds of screws, which are essential for the installation of the existing deposition plate, and enters the interior of the chamber through the simple process by entering the anti-deposition member into the chamber space without cumbersome work. An anti-stick member can be provided. Therefore, the effect which can remarkably shorten the replacement time of an adhesion member can be acquired.

The illustrative embodiments described above are intended to be illustrative within all aspects of the invention rather than limiting. Accordingly, the invention is susceptible to various modifications from the description contained herein by those skilled in the art. For example, although the drawing member is configured as a hexahedron, which is a kind of polyhedron, it may have various shapes including a cylindrical shape according to the shape of the internal space of the deposition chamber. In addition, any type of anti-deposition member may be used as long as it is possible to prevent the vaporization vapor of the deposition material from flowing to the inner surface of the chamber.

All such modifications and variations are considered to be within the scope and spirit of the invention as defined by the following claims.

Claims (3)

A deposition material generated in the evaporation source 21, including an evaporation source 21 located in the chamber 20 and heated by an applied power source to transfer heat to the deposition material contained therein. In the vacuum vapor deposition apparatus which forms the vapor deposition layer of vapor deposition material on the surface of the board | substrate 22 by flowing the vapor | steam of vapor to the surface of the board | substrate 22, Vacuum deposition apparatus, characterized in that the inner space of the chamber (20) is equipped with an adhesion member (30) consisting of a single body of a polyhedron in order to prevent the deposition material vapor flows to the inner surface of the chamber (20). The chamber 20 is provided with a horizontal plate 23A at the same height as the upper end of the evaporation source 21 at the center thereof, and the adhesion member 30 has the inside of the chamber for the flow of deposition material. The outer shape is configured so that the outer surface is in close contact with the corresponding inner surface of the chamber, the bottom portion corresponding to the evaporation source 21 and the upper portion corresponding to the substrate 22 mounted on the upper chamber are opened. Vacuum deposition apparatus, characterized in that the structure is located on the horizontal plate (23A). The method of claim 1, wherein the anti-corrosion member 30 has a cutout 31A formed at a lower end of one sidewall member 31, and thus the anti-corrosion member 30 enters into the chamber 20 and enters the chamber 20. The vacuum deposition apparatus which prevents contact with the evaporation source 21 exposed on the plate 23A at the time of withdrawing from the same.

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