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KR100567378B1 - Auto teaching disc of track equipment of semiconductor manufacturing process - Google Patents

Auto teaching disc of track equipment of semiconductor manufacturing process Download PDF

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Publication number
KR100567378B1
KR100567378B1 KR1020030101735A KR20030101735A KR100567378B1 KR 100567378 B1 KR100567378 B1 KR 100567378B1 KR 1020030101735 A KR1020030101735 A KR 1020030101735A KR 20030101735 A KR20030101735 A KR 20030101735A KR 100567378 B1 KR100567378 B1 KR 100567378B1
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teaching
disc
track equipment
equipment
auto
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KR20050069557A (en
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정명안
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동부아남반도체 주식회사
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H01L21/67225—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one lithography chamber
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

본 발명은 반도체 공정 중 포토공정에서 사용되는 트랙 장비로서 미세 패턴을 형성하기 위한 감광성 필름의 도포 및 현상 공정에 적용되는 장비에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to equipment applied to a coating and developing process of a photosensitive film for forming a fine pattern as a track equipment used in a photo process in a semiconductor process.

본 발명의 반도체 제조공정의 트랙 장비의 오토 티칭 원판은 스핀 척의 진공 홀에 삽입되는 티칭 축, 상기 티칭 축에 의해 지지되는 원판 및 상기 원판의 상부에 형성된 노즐 티칭 홀을 포함하여 이루어짐에 기술적 특징이 있다.The auto-teaching disc of the track equipment of the semiconductor manufacturing process of the present invention includes a teaching axis inserted into the vacuum hole of the spin chuck, a disc supported by the teaching axis, and a nozzle teaching hole formed on the disc. have.

따라서 본 발명의 트랙 장비의 오토 티칭 원판은 감광성 물질의 도포의 균일성을 확보 할 수 있고, 장비의 유지 관리가 수월하며, 가동률을 높일 수 있으며, 공정을 안정화 할 수 있는 효과 및 장점이 있다.Therefore, the auto-teaching disc of the track equipment of the present invention can secure the uniformity of the coating of the photosensitive material, the maintenance of the equipment is easy, the operation rate can be increased, and the process can be stabilized.

트랙, 티칭, 원판Track, teaching, disc

Description

반도체 제조공정의 트랙 장비의 오토 티칭 원판{Auto teaching circluar plate of tracking device} Auto teaching circluar plate of tracking device for semiconductor manufacturing process             

도 1a과 도 1b는 종래기술에 의한 반도체 트랙장비용 카세트 티칭 툴의 사시도.1A and 1B are perspective views of a cassette teaching tool for semiconductor track equipment according to the prior art;

도 2a 내지 도 2c는 본 발명에 따른 트랙 장비의 오토 티칭 원판의 구성도.2a to 2c is a block diagram of the auto-teaching disc of the track equipment according to the present invention.

<도면의 주요부분에 대한 부호의 설명><Description of Symbols for Main Parts of Drawings>

11 : 몸체 13 : 개구부11 body 13 opening

14 : 티칭 툴 100 : 원판14: teaching tool 100: disc

200 : 노즐 티칭 홀 300 : 반송 암 티칭 축200: nozzle teaching hole 300: conveying arm teaching axis

400 : 척 진공 홀400: Chuck Vacuum Hole

본 발명은 반도체 공정 중 포토공정에서 사용되는 트랙 장비로서 미세 패턴 을 형성하기 위한 감광성 필름의 도포 및 현상 공정에 적용되는 장비에 관한 것으로, 보다 자세하게는 스핀 척의 진공 홀에 삽입되는 티칭 축, 상기 티칭 축에 의해 지지되는 원판 및 상기 원판의 상부에 형성된 노즐 티칭 홀을 포함하여 이루어짐을 특징으로 하는 반도체 제조공정의 트랙 장비의 오토 티칭 원판에 관한 것이다.The present invention relates to equipment applied to the application and development process of the photosensitive film for forming a fine pattern as a track equipment used in the photo process of the semiconductor process, and more particularly, a teaching axis inserted into the vacuum hole of the spin chuck, the teaching It relates to an auto-teaching disc of the track equipment of the semiconductor manufacturing process, characterized in that it comprises a disc supported by the shaft and a nozzle teaching hole formed in the upper portion of the disc.

도 1a 내지 1b는 대한민국 공개특허공보 제1999-0074207호에 기재된 종래의 기술로서, 반도체 트랙장비용 카세트 티칭 툴을 보인 사시도이다. 도시된 바와 같이, 링형의 몸체(11) 일측에 엔드 이팩터가 상,하방향으로 통과할 수 있도록 개구부(13)가 형성되어 있다. 그리고, 상기 몸체(11)의 두께는 1.2mm이고, 폭은 10mm이며, 외경은 8'로 웨이퍼와 유사한 크기로 제작하는 것이 바람직하다. 또한, 상기 개구부(13)의 폭은 엔드 이팩터의 티칭작업시 장애가 되지 않도록 130mm로 하는 것이 바람직하다.1A to 1B are perspective views illustrating a cassette teaching tool for semiconductor track equipment as a related art disclosed in Korean Laid-Open Patent Publication No. 1999-0074207. As shown, the opening 13 is formed on one side of the ring-shaped body 11 so that the end effector can pass in the up and down directions. In addition, the body 11 has a thickness of 1.2 mm, a width of 10 mm, and an outer diameter of 8 ', preferably manufactured in a size similar to a wafer. In addition, the width of the opening 13 is preferably 130mm so as not to be an obstacle during the teaching of the end effector.

상기와 같이 구성되어 있는 반도체 트랙장비용 카세트 티칭 툴(14)를 이용하여 웨이퍼 로딩/언로딩시의 티칭작업을 실시하는 동작을 설명하면 다음과 같다.The operation of carrying out the teaching operation at the time of wafer loading / unloading using the cassette teaching tool 14 for semiconductor track equipment configured as described above is as follows.

먼저, 웨이퍼(W)로딩시에는 상기와 같은 카세트 티칭 툴(14)을 티칭하고자 하는 카세트(15)의 슬롯(15a)에 카세트 티칭 툴(14)의 입구부(13)가 상기 카세트(15)의 전방 개구부와 일치되도록 삽입 설치한다.First, when loading the wafer W, the inlet portion 13 of the cassette teaching tool 14 is inserted into the slot 15a of the cassette 15 to teach the cassette teaching tool 14 as described above. Insert and install to match the front opening of the

그런 다음, 상기 엔드 이팩터(16)를 이용하여 웨이퍼(W)을 슬롯(15a)에 삽입시키고, 티칭 툴(14)의 상면에 웨이퍼(W)의 하면을 접촉시킨다. 상기 웨이퍼(W)의 하면이 티칭 툴(14)의 상측 전면에 접촉되도록 엔드 이팩터(16)의 X,Y,Z방향과 회전값 Rx,Ry,Rz을 조정한다. 상기와 같이 X,Y,Z방향 및 회전값 Rx,Ry,Rz을 셋팅한 다음, 엔드 이팩터(16)의 웨이퍼(W) 로딩동작을 입력하여 티칭 작업을 완료하며, 언로딩 동작의 티칭 작업시에도 상기와 같이 로딩동작의 셋팅시 회전값 Rx,Ry,Rz이 정확이 셋팅된 상태이기 때문에 엔드 이팩터(16)의 동작이 정확히 이루어지게 된다. Then, the end effector 16 is used to insert the wafer W into the slot 15a and to bring the lower surface of the wafer W into contact with the upper surface of the teaching tool 14. The X, Y, and Z directions and the rotation values Rx, Ry, and Rz of the end effector 16 are adjusted so that the lower surface of the wafer W contacts the upper front surface of the teaching tool 14. After setting the X, Y, Z directions and rotation values Rx, Ry, and Rz as described above, input the wafer W loading operation of the end effector 16 to complete the teaching operation, and during the teaching operation of the unloading operation. In addition, since the rotation values Rx, Ry, and Rz are accurately set when the loading operation is set as described above, the operation of the end effector 16 is accurately performed.

그러나, 사람이 육안으로 티칭 정도를 확인하면서 진행하게 되므로 사람에 따른 오차가 발생하게 되고 장비 공간이 좁아 작업이 불편하고 신뢰성이 떨어질 뿐만 아니라 티칭이 잘못되었을 경우 감광성 물질의 도포 균일성이 좋지 않아서 미세 패턴 형성에 영향을 미치는 문제가 있었다.However, because the person proceeds while checking the teaching degree with the naked eye, an error occurs according to the person and the equipment space is narrow, which makes the work inconvenient and unreliable, and when the teaching is wrong, the uniformity of application of the photosensitive material is not good. There was a problem affecting pattern formation.

따라서 본 발명은 상기와 같은 종래 기술의 문제점을 해결하기 위한 것으로, 웨이퍼가 스핀 척 위에 정확하게 로딩되도록 하고, 상기 웨이퍼의 중심에 감광성 물질이 분사될 수 있도록 하기 위한 웨이퍼 로딩 암과 감광성 물질을 분사하는 암의 위치를 조정하는 툴을 사용하여 상기 웨이퍼의 중심을 상기 스핀 척의 중심과 감광성 물질의 분사 위치와 정확히 일치시켜 공정의 안정화를 확보하고 생산성을 향상시키기 위한 트랙 장비의 오토 티칭 원판을 제공함에 본 발명의 목적이 있다.
Accordingly, the present invention is to solve the above problems of the prior art, the wafer loading arm and the photosensitive material for spraying the photosensitive material to ensure that the wafer is accurately loaded on the spin chuck, the center of the wafer Using a tool to adjust the position of the arm, the center of the wafer is exactly aligned with the center of the spin chuck and the injection position of the photosensitive material to provide an auto-teaching disc of track equipment to ensure process stability and improve productivity. There is an object of the invention.

본 발명의 상기 목적은 스핀 척의 진공 홀에 삽입되는 티칭 축, 상기 티칭 축에 의해 지지되는 원판 및 상기 원판의 상부에 형성된 노즐 티칭 홀을 포함하여 이루어짐을 특징으로 하는 반도체 제조공정의 트랙 장비의 오토 티칭 원판에 의해 달성된다.The object of the present invention comprises a teaching axis inserted into a vacuum hole of a spin chuck, a disc supported by the teaching axis, and a nozzle teaching hole formed on an upper portion of the track equipment of the semiconductor manufacturing process. Achieved by a teaching disc.

본 발명의 상기 목적과 기술적 구성 및 그에 따른 작용효과에 관한 자세한 사항은 본 발명의 바람직한 실시예를 도시하고 있는 도면을 참조한 이하 상세한 설명에 의해 보다 명확하게 이해될 것이다.Details of the above object and technical configuration of the present invention and the effects thereof according to the present invention will be more clearly understood by the following detailed description with reference to the drawings showing preferred embodiments of the present invention.

도 2a 내지 도 2c는 본 발명에 따른 트랙 장비의 오토 티칭 원판의 구성도를 나타낸 것이다. 스핀 척에 형성된 척의 진공 홀(400)에 반송 암 티칭 축(300)을 삽입 한 후 원판(100)을 흡착시킨다. 이 상태에서 웨이퍼의 반송 암을 아크릴 원판에 위치시킨 후 티칭을 실시한다. 이 때 측정된 값을 장비에 셋팅하여 웨이퍼 반송 암의 티칭을 완료한다. 상기 원판(100)을 상기 스핀 척에 위치시킨 동일 상태에서 감광성 물질의 노즐을 노즐 티칭 홀(200)의 위치에 삽입 시켜 티칭을 실시한다. 이 때 측정된 값을 장비에 세팅한다. 2a to 2c show the configuration of the auto teaching disc of the track equipment according to the present invention. After inserting the conveying arm teaching shaft 300 into the vacuum hole 400 of the chuck formed in the spin chuck, the disc 100 is adsorbed. Teaching is performed after positioning the conveyance arm of a wafer in an acryl disc in this state. At this time, the measured value is set in the equipment to complete the teaching of the wafer transfer arm. Teaching is performed by inserting the nozzle of the photosensitive material into the position of the nozzle teaching hole 200 in the same state in which the disc 100 is placed on the spin chuck. The measured value is then set on the instrument.

따라서 스핀 유닛을 가진 장비의 경우 웨이퍼의 반송 유닛에 스핀 척에 대한 티칭을 수행하고, 이 경우 원형판을 반송 암에서 상기 스핀 척에 로딩과 언로딩을 수 차례 반복하면서 사람이 육안으로 아크릴 원판에 표시된 마크를 사용하여 티칭을 수행할 때 발생하는 문제점이 해소된다.Therefore, in the case of a device having a spin unit, teaching of the spin chuck to the conveying unit of the wafer is performed, and in this case, the circular plate is repeatedly loaded and unloaded from the conveying arm to the spin chuck several times, and the human eye is visually marked on the acrylic disc. The problem that occurs when teaching using the mark is solved.

이때 감광성 필름의 도포는 스핀 척에 웨이퍼를 로딩한 상태에서 웨이퍼의 중심 부위에 감광성 물질을 분사하고 모터를 이용하여 스핀 척을 회전시켜서 원하는 두께로 감광물질을 웨이퍼 위에 형성시키는 것이다. 또한, 동일한 회전수일지라도 감광성 물질이 분사되는 위치에 웨이퍼가 상기 스핀 척에 올라가는 정밀도에 따 라서 웨이퍼 전체의 감광성 물질의 균일한 두께로 도포된다.At this time, the application of the photosensitive film is to spray the photosensitive material on the center portion of the wafer while the wafer is loaded on the spin chuck and to rotate the spin chuck using a motor to form the photosensitive material on the wafer. Further, even at the same rotational speed, the wafer is applied with a uniform thickness of the photosensitive material of the entire wafer, depending on the precision of the wafer rising to the spin chuck at the position where the photosensitive material is ejected.

또한, 상기 원판의 재질은 아크릴을 사용하는 것이 바람직하다.In addition, it is preferable that the material of the disc is acrylic.

상세히 설명된 본 발명에 의하여 본 발명의 특징부를 포함하는 변화들 및 변형들이 당해 기술 분야에서 숙련된 보통의 사람들에게 명백히 쉬워질 것임이 자명하다. 본 발명의 그러한 변형들의 범위는 본 발명의 특징부를 포함하는 당해 기술 분야에 숙련된 통상의 지식을 가진 자들의 범위 내에 있으며, 그러한 변형들은 본 발명의 청구항의 범위 내에 있는 것으로 간주된다.It will be apparent that changes and modifications incorporating features of the invention will be readily apparent to those skilled in the art by the invention described in detail. It is intended that the scope of such modifications of the invention be within the scope of those of ordinary skill in the art including the features of the invention, and such modifications are considered to be within the scope of the claims of the invention.

따라서 본 발명의 트랙 장비의 오토 티칭 원판은 감광성 물질의 도포의 균일성을 확보할 수 있고, 장비의 유지 관리가 수월하며, 가동률을 높일 수 있으며, 공정을 안정화할 수 있는 효과 및 장점이 있다.Therefore, the auto-teaching disc of the track equipment of the present invention can secure the uniformity of the coating of the photosensitive material, the maintenance of the equipment is easy, the operation rate can be increased, and the process can be stabilized.

Claims (2)

스핀 척의 진공 홀에 삽입되는 티칭 축;A teaching axis inserted into the vacuum hole of the spin chuck; 상기 티칭 축에 의해 지지되는 원판; 및A disc supported by the teaching axis; And 상기 원판의 상부에 형성된 노즐 티칭 홀Nozzle teaching hole formed in the upper portion of the disc 을 포함하여 이루어짐을 특징으로 하는 반도체 제조공정의 트랙 장비의 오토 티칭 원판.Auto-teaching disc of the track equipment of the semiconductor manufacturing process characterized in that it comprises a. 제1항에 있어서,The method of claim 1, 상기 원판의 재질은 아크릴임을 특징으로 하는 반도체 제조공정의 트랙 장비의 오토 티칭 원판.The disc of the auto-teaching disc of the track equipment of the semiconductor manufacturing process, characterized in that the material of the disc.
KR1020030101735A 2003-12-31 2003-12-31 Auto teaching disc of track equipment of semiconductor manufacturing process Expired - Fee Related KR100567378B1 (en)

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