KR100524850B1 - Flooring with higher thermal conductivity - Google Patents
Flooring with higher thermal conductivity Download PDFInfo
- Publication number
- KR100524850B1 KR100524850B1 KR10-2003-0002115A KR20030002115A KR100524850B1 KR 100524850 B1 KR100524850 B1 KR 100524850B1 KR 20030002115 A KR20030002115 A KR 20030002115A KR 100524850 B1 KR100524850 B1 KR 100524850B1
- Authority
- KR
- South Korea
- Prior art keywords
- flooring
- thermal conductivity
- parts
- layer
- weight
- Prior art date
Links
- 238000009408 flooring Methods 0.000 title claims abstract description 33
- 229920005989 resin Polymers 0.000 claims abstract description 20
- 239000011347 resin Substances 0.000 claims abstract description 20
- 239000000463 material Substances 0.000 claims abstract description 17
- 239000011231 conductive filler Substances 0.000 claims abstract description 11
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 abstract description 9
- 230000000694 effects Effects 0.000 abstract description 7
- 238000009413 insulation Methods 0.000 abstract description 3
- 238000010792 warming Methods 0.000 abstract description 2
- 238000005338 heat storage Methods 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 32
- 239000011229 interlayer Substances 0.000 description 7
- 239000006260 foam Substances 0.000 description 6
- 239000011247 coating layer Substances 0.000 description 4
- 239000004014 plasticizer Substances 0.000 description 4
- 239000000843 powder Substances 0.000 description 4
- 239000003381 stabilizer Substances 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- 239000000945 filler Substances 0.000 description 3
- 239000004088 foaming agent Substances 0.000 description 3
- 239000000049 pigment Substances 0.000 description 3
- 230000002787 reinforcement Effects 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 2
- 239000003365 glass fiber Substances 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 2
- 229910000859 α-Fe Inorganic materials 0.000 description 2
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 1
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000007646 gravure printing Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000011120 plywood Substances 0.000 description 1
- 239000002952 polymeric resin Substances 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 238000006748 scratching Methods 0.000 description 1
- 230000002393 scratching effect Effects 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 238000010023 transfer printing Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09B—EDUCATIONAL OR DEMONSTRATION APPLIANCES; APPLIANCES FOR TEACHING, OR COMMUNICATING WITH, THE BLIND, DEAF OR MUTE; MODELS; PLANETARIA; GLOBES; MAPS; DIAGRAMS
- G09B23/00—Models for scientific, medical, or mathematical purposes, e.g. full-sized devices for demonstration purposes
- G09B23/02—Models for scientific, medical, or mathematical purposes, e.g. full-sized devices for demonstration purposes for mathematics
- G09B23/04—Models for scientific, medical, or mathematical purposes, e.g. full-sized devices for demonstration purposes for mathematics for geometry, trigonometry, projection or perspective
Landscapes
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Computational Mathematics (AREA)
- Mathematical Analysis (AREA)
- Mathematical Optimization (AREA)
- Pure & Applied Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Mathematical Physics (AREA)
- Geometry (AREA)
- Business, Economics & Management (AREA)
- Algebra (AREA)
- Educational Administration (AREA)
- Educational Technology (AREA)
- Theoretical Computer Science (AREA)
- Floor Finish (AREA)
Abstract
본 발명은 일반 바닥재나 타일류 등에 적용되는 보온 및 축열을 위한 열전도성 바닥재에 관한 것으로, 다수의 수지층으로 이루어진 바닥재에 있어서 상기 다수의 수지층 중에서 적어도 하나의 층이 열전도성 충진제를 포함하여 바닥재에 열전도성을 부여한 것을 특징으로 한다.The present invention relates to a thermally conductive flooring material for thermal insulation and heat storage applied to general flooring materials or tiles, etc. In a flooring material consisting of a plurality of resin layers, at least one layer of the plurality of resin layers includes a thermally conductive filler It characterized by imparting thermal conductivity to the.
본 발명의 바닥재는 열전도성이 우수하여 바닥에 난방시 발생되는 열에너지를 효과적으로 전달하고 일정시간 내에 바닥이 골고루 따뜻해질 수 있게 하며, 또한 일정시간 이상 보온효과를 가질 수 있다.The flooring of the present invention is excellent in thermal conductivity to effectively transfer the heat energy generated during heating on the floor and to allow the floor to be evenly warmed within a certain time, it may also have a warming effect for a certain time.
Description
본 발명은 일반 바닥재나 타일류 등에 적용되는 열전도성 바닥재에 관한 것이다.The present invention relates to a thermally conductive flooring applied to general flooring or tiles.
종래의 바닥재는 주된 소재인 PVC의 낮은 열전도 특성과 제품 구조상 발포형상으로 이루어져 열전도도가 낮은 단열효과를 보인다.Conventional flooring material is made of a low thermal conductivity of the main material PVC and the foam structure of the product structure shows a low thermal conductivity insulation effect.
주거공간에 시공하여 사용하는 이러한 바닥재는 하부층과 접촉하고 있는 바닥면을 난방할 경우 공급된 열이 PVC 바닥재의 낮은 열전도도의 단열 특성으로 인하여 쉽게 상부로 전달되지 못하고 난방효율이 떨어지는 단점이 있다.The flooring used in a residential space has a disadvantage in that when the floor surface in contact with the lower floor is heated, the supplied heat is not easily transferred to the upper portion due to the low thermal conductivity of the PVC flooring and the heating efficiency is lowered.
특히, 발포층의 구성이 많은 주거용도의 PVC 바닥재는 더욱 열전도도가 낮아 바닥난방 형식이 대부분인 우리나라 가정에서는 열효율 면에서 PVC 바닥재가 불리한 특징을 갖게 된다.In particular, PVC flooring for residential use, which has a large number of foam layers, has a lower thermal conductivity, and thus PVC flooring has disadvantageous characteristics in terms of thermal efficiency in Korean homes, which have a floor heating type.
본 발명은 상기한 종래의 문제점을 해결하기 위하여 안출된 것으로서, 본 발명의 목적은 열전도도가 높은 금속성 분말을 포함하여 PVC 바닥재의 열전도율을 극대화시킴으로써, 난방가동시 발생되는 열을 빨리 전달하여 바닥이 골고루 따뜻해질 수 있도록 설계된 열전도성 바닥재를 제공하는 것이다.The present invention has been made to solve the above-mentioned problems, the object of the present invention is to maximize the thermal conductivity of the PVC flooring material, including metallic powder with high thermal conductivity, to quickly transfer the heat generated during heating operation floor To provide a thermally conductive flooring designed to be evenly warm.
본 발명은 열전도성이 우수한 바닥재에 관한 것으로, 다수의 수지층으로 이루어진 바닥재에 있어서 하나 이상의 수지층이 질화알루미늄(AlN), 탄화규소(SiC), 페라이트 및 구리로 구성된 군에서 선택되는 1종 이상의 열전도성 충진제를 포함하는 것을 특징으로 한다.The present invention relates to a flooring material having excellent thermal conductivity, wherein at least one resin layer is selected from the group consisting of aluminum nitride (AlN), silicon carbide (SiC), ferrite and copper in a flooring material composed of a plurality of resin layers. It is characterized by including a thermally conductive filler.
상기 열전도성 충진제의 함량은 베이스수지 100 중량부에 대하여 0.1 내지 50 중량부가 바람직하다. 열전도성 충진제의 함량이 0.1 중량부 미만이면 열전도 효과가 미미하고, 50 중량부를 초과하면 유연성, 작업성 등 바닥재의 기본 물성이 발휘되지 않는다.The content of the thermally conductive filler is preferably 0.1 to 50 parts by weight based on 100 parts by weight of the base resin. If the content of the thermally conductive filler is less than 0.1 parts by weight, the thermal conductivity is insignificant, and if it exceeds 50 parts by weight, the basic physical properties of the flooring material such as flexibility and workability are not exhibited.
본 발명에서 사용되는 열전도성 충진제는 열전도성이 우수한 금속성 분말로서, 예를 들면 질화알루미늄, 탄화규소, 페라이트(Ferrite) 및 구리 중에서 단독 또는 1종 이상을 혼합하여 사용한다. 열전도성 충진제의 입경은 1 내지 50 ㎛인 것을 사용하는 것이 바람직하다. 열전도성 충진제의 바람직한 사용량은 베이스수지인 PVC수지 또는 자외선 경화성수지 100 중량부에 대하여 0.1 내지 50 중량부이다.The thermally conductive filler used in the present invention is a metallic powder having excellent thermal conductivity, and is used, for example, alone or in combination of one or more of aluminum nitride, silicon carbide, ferrite and copper. It is preferable to use the particle diameter of a thermally conductive filler which is 1-50 micrometers. The preferred amount of the thermally conductive filler is 0.1 to 50 parts by weight based on 100 parts by weight of the PVC resin or the ultraviolet curable resin which is the base resin.
이하, 첨부도면 및 실시예에 의거하여 본 발명을 상세하게 설명한다. 그러나 첨부도면 및 실시예에 의해 본 발명의 권리범위가 한정되는 것은 아니다.Hereinafter, the present invention will be described in detail with reference to the accompanying drawings and examples. However, the scope of the present invention is not limited by the accompanying drawings and examples.
도 1은 본 발명의 바람직한 일 실시예에 따른 열전도성 바닥재의 단면도로서, 중앙에 졸 함침 치수보강층(4)을 중심으로 그 상측에는 인쇄층(3), 투명층(2) 및 자외선 코팅층(1)이 순차적으로 적층되어 있고, 그 하측에는 간지층(5), 발포층(6) 및 이지층(7)으로 구성되어 있다. 여기서 열전도층은 간지층(5) 및 이지층(7)이다. 열전도층은 간지층(5)과 이지층(7) 이외에 다른 층일 수 있으며, 열전도층의 수도 특별히 제한되지 않는다.1 is a cross-sectional view of a thermally conductive flooring according to a preferred embodiment of the present invention, the printing layer (3), the transparent layer (2) and the ultraviolet coating layer (1) above the sol-impregnated dimensional reinforcement layer (4) in the center It is laminated | stacked sequentially, and is comprised by the interlayer 5, the foam layer 6, and the easy layer 7 below. The heat conductive layer is an interlayer 5 and the easy layer 7 here. The heat conductive layer may be other layers in addition to the interlayer 5 and the easy layer 7, and the number of heat conductive layers is not particularly limited.
상기 층들은 PVC 고분자 수지를 주성분으로 하고 가소제, 안정제와 소량의 첨가제로서 충진제, 발포제, 안료 및 기타 첨가제 등을 함유하고 있다.The layers contain PVC polymer resin as a main component and contain fillers, foaming agents, pigments and other additives as plasticizers, stabilizers and small amounts of additives.
졸 함침 치수보강층(4)은 다공성으로 인하여 발생할 수 있는 균열이나 박리와 같은 문제를 방지하고 온도에 의한 치수의 변형을 최소화하기 위하여, 유리섬유(Glass Fiber)층을 PVC졸로 함침시킨 것이다.Sol-impregnated dimensional reinforcing layer (4) is to impregnate the glass fiber (Glass Fiber) layer with PVC sol in order to prevent problems such as cracking or peeling due to porosity and to minimize the deformation of the dimension due to temperature.
발포층(6)은 바닥재에 완충성을 부여하며, PVC수지 100 중량부, 가소제 30-80 중량부, 발포제 3-10 중량부, Ba-Zn계 안정제 1-8 중량부, 충진제 30-60 중량부 등이 혼합된 조성으로 되어 있다.The foam layer 6 provides cushioning properties to the flooring material, 100 parts by weight of PVC resin, 30 to 80 parts by weight of plasticizer, 3 to 10 parts by weight of foaming agent, 1 to 8 parts by weight of Ba-Zn-based stabilizer, and 30 to 60 weight of filler. It is in a composition in which parts and the like are mixed.
간지층(5)은 합판력 보강을 위하여 졸 함침 치수보강층(4) 하부에 적층되어 있고, 이지층(7)은 상기 발포층(6)을 보호하도록 그 하부에 적층되어 있다. 간지층(5) 및 이지층(7)은 PVC수지를 주성분으로 하고 가소제, 안정제, 발포제, 안료 및 기타 첨가제로 조성되어 있으며, 베이스수지인 PVC수지 100 중량부에 대하여 0.1 내지 50 중량부의 열전도성 충진제가 함유되어 있다.The interlayer 5 is laminated under the sol-impregnated dimensional reinforcement layer 4 to reinforce the plywood force, and the easy layer 7 is laminated underneath to protect the foam layer 6. The interlayer 5 and the easy layer 7 are composed of PVC resin as a main component, and are composed of a plasticizer, a stabilizer, a foaming agent, a pigment, and other additives. The thermal conductivity is 0.1 to 50 parts by weight based on 100 parts by weight of the PVC resin as the base resin. Contains fillers.
인쇄층(3)은 공지의 그라비아 인쇄 및 전사인쇄등의 방법으로 인쇄되어 평면상 무늬와 색상을 갖고 있다. 인쇄층(3)의 잉크는 유기잉크, 무기잉크 또는 펄 잉크이다. 이때, 상기 유기 또는 무기잉크는 안료 1-8 중량%, 초산비닐 바인더 10-30 중량% 및 일정량의 솔벤트(메틸에틸케톤, 메틸이소부틸케톤 및 톨루엔 등)로 조성되어 있다.The print layer 3 is printed by a method such as gravure printing or transfer printing, and has a flat pattern and color. The ink of the printing layer 3 is organic ink, inorganic ink or pearl ink. At this time, the organic or inorganic ink is composed of pigment 1-8% by weight, vinyl acetate binder 10-30% by weight and a certain amount of solvent (methyl ethyl ketone, methyl isobutyl ketone and toluene, etc.).
투명층(2)은 인쇄면을 보호함과 동시에 인쇄면이 투시되도록 하며, PVC수지 100 중량부, 가소제 30-80 중량부, Ba-Zn계 안정제 1-5 중량부, 자외선 흡수제 0.1-2 중량부로 조성되어 있다.The transparent layer 2 protects the printed surface and at the same time allows the printed surface to be transparent, and includes 100 parts by weight of PVC resin, 30-80 parts by weight of plasticizer, 1-5 parts by weight of Ba-Zn-based stabilizer, and 0.1-2 parts by weight of UV absorber. It is formed.
자외선 코팅층(1)은 오염물질의 흡착을 방지함과 동시에 긁힘을 방지하도록 하며, 광경화성 우레탄과 같은 자외선 경화성 수지를 코팅하고 자외선을 조사하여 경화시킨 것이다. 자외선 코팅층(1)을 열전도층으로 할 경우, 베이스수지인 자외선 경화성수지 100 중량부에 대하여 열전도성 충진제를 0.1 내지 50 중량부를 첨가한다.The ultraviolet coating layer (1) is to prevent the adsorption of contaminants and at the same time to prevent scratching, coating the ultraviolet curable resin such as photocurable urethane and irradiated with ultraviolet rays to cure. When the ultraviolet coating layer 1 is used as the heat conductive layer, 0.1 to 50 parts by weight of a thermally conductive filler is added to 100 parts by weight of the ultraviolet curable resin as the base resin.
실시예Example
도 1과 같은 다층구조의 바닥재에 있어서, 간지층(5)과 이지층(7)에 열전도성이 우수한 금속분말 중 질화알루미늄을 PVC 수지 100 중량부에 대하여 각각 10 중량부(실시예 1) 및 15 중량부(실시예 2) 첨가하여 통상의 방법으로 바닥재를 제조하였다.In the multi-layered flooring as shown in FIG. 1, 10 parts by weight of aluminum nitride in the metal powder having excellent thermal conductivity in the interlayer 5 and the easy layer 7 was respectively 10 parts by weight based on 100 parts by weight of the PVC resin (Example 1) and 15 parts by weight (Example 2) was added to prepare a flooring in a conventional manner.
제조된 바닥재의 열전도성을 열전도 분석기를 사용하여 측정하였으며, 열전도성 효과의 측정 결과는 하기의 표 1과 같다.The thermal conductivity of the prepared flooring material was measured using a thermal conductivity analyzer, and the measurement results of the thermal conductivity effect are shown in Table 1 below.
표 1에 따르면, 본 발명의 바닥재는 일반장판과 비교하여 열전도도가 10배로 매우 우수한 열전도성을 갖는다. 또한 본 발명의 바닥재를 바닥에 시공하고 난방을 공급한 결과 난방효과가 전체 바닥재에 신속하고 균일하게 나타났으며, 난방 종료후에도 보온효과가 지속되었다.According to Table 1, the flooring of the present invention has a very good thermal conductivity 10 times the thermal conductivity compared to the general floor. In addition, when the flooring of the present invention was installed on the floor and supplied with heating, the heating effect appeared quickly and uniformly on the entire flooring material, and the warming effect was continued even after the heating was finished.
이상 설명한 바와 같이, 본 발명은 열전도성이 우수한 금속성 분말을 다층구조의 바닥재에 적용하여 바닥재의 열전도를 극대화시켰다. 본 발명의 바닥재는 종래 PVC 바닥재에 비하여 열전도성이 우수하여 난방공급에 따른 효과가 신속히 나타나며, 또한 난방 종료후에도 상당시간 보온효과가 나타나므로 경제성이 뛰어나다.As described above, the present invention maximizes the thermal conductivity of the flooring material by applying the metallic powder having excellent thermal conductivity to the flooring material of the multilayer structure. The flooring of the present invention is excellent in thermal conductivity compared to the conventional PVC flooring, the effect of the heating supply appears quickly, and also after the heating is completed for a considerable time since the thermal insulation effect is excellent economical.
도 1은 본 발명의 바람직한 일 실시예에 따른 열전도성이 우수한 바닥재의 단면도이다.1 is a cross-sectional view of a flooring material having excellent thermal conductivity according to an embodiment of the present invention.
<도면의 주요부분에 대한 부호의 설명><Description of Symbols for Main Parts of Drawings>
1: 자외선 코팅층 2: 투명층1: ultraviolet coating layer 2: transparent layer
3: 인쇄층 4: 졸 함침 치수보강층3: printed layer 4: sol-impregnated dimensional reinforcement layer
5: 간지층 6: 발포층5: interlayer 6: foam layer
7: 이지층7: easy layer
Claims (2)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2003-0002115A KR100524850B1 (en) | 2003-01-13 | 2003-01-13 | Flooring with higher thermal conductivity |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2003-0002115A KR100524850B1 (en) | 2003-01-13 | 2003-01-13 | Flooring with higher thermal conductivity |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20040064487A KR20040064487A (en) | 2004-07-19 |
| KR100524850B1 true KR100524850B1 (en) | 2005-11-01 |
Family
ID=37355031
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR10-2003-0002115A KR100524850B1 (en) | 2003-01-13 | 2003-01-13 | Flooring with higher thermal conductivity |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR100524850B1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101225933B1 (en) * | 2009-02-19 | 2013-01-24 | (주)엘지하우시스 | Flooring having heat conductive layer |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101069501B1 (en) * | 2008-10-14 | 2011-09-30 | (주)엘지하우시스 | Energy-saving flooring and manufacturing method |
| KR101295424B1 (en) * | 2009-08-05 | 2013-08-09 | (주)엘지하우시스 | Energy saving decoration sheet and manufacturing method thereof |
| WO2020229952A1 (en) * | 2019-05-15 | 2020-11-19 | 3M Innovative Properties Company | (co)polymer matrix composites comprising thermally-conductive particles and endothermic particles and methods of making the same |
-
2003
- 2003-01-13 KR KR10-2003-0002115A patent/KR100524850B1/en not_active IP Right Cessation
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101225933B1 (en) * | 2009-02-19 | 2013-01-24 | (주)엘지하우시스 | Flooring having heat conductive layer |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20040064487A (en) | 2004-07-19 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR102680080B1 (en) | Glue-free and dust-free composite flooring system | |
| JP2020520398A (en) | Dielectric ink composition | |
| KR101090921B1 (en) | Pvc floor article using variable temperature ink and manufacturing method thereof | |
| BRPI0821717B1 (en) | process for the production of a laminate | |
| KR100805633B1 (en) | Flooring material with excellent wear resistance and scratch resistance | |
| KR101304624B1 (en) | Flooring decoration having superior surface endurance and a method for preparing thereof | |
| JP2002105874A (en) | Polyolefin floor material | |
| KR100524850B1 (en) | Flooring with higher thermal conductivity | |
| JP5997621B2 (en) | INKJET RECORDING SHEET, PRINTED MATERIAL, AND METHOD FOR PRODUCING PRINTED MATERIAL | |
| KR20060109242A (en) | Caster Flooring | |
| BR112020012484B1 (en) | DECORATIVE PANEL THAT HAS A MULTILAMINATED PLASTIC SUPPORT PLATE AND METHOD FOR ITS PRODUCTION | |
| KR100946201B1 (en) | Manufacturing Method of Transfer Film | |
| KR20160137862A (en) | Coating composition for decorative sheet, and decorative sheet | |
| KR101241496B1 (en) | Interior flooring using paper and synthetic resin layer | |
| JP6896891B2 (en) | Sound insulation flooring | |
| KR102238771B1 (en) | Decoration Sheet Having Excellent Soft Touch Surface and Preparing Method Thereof | |
| KR100449147B1 (en) | Heat-resisting film laminated PVC floors with reduced curling | |
| KR102164285B1 (en) | Thermal transcription film for embossing with anti-blocking property | |
| JP2004314498A (en) | Decorative sheet | |
| KR101968441B1 (en) | Transfer film for Melamine board | |
| KR20220006500A (en) | Glue Free Dust Free Composite Floor Material System | |
| KR100269772B1 (en) | A transfer film and process for preparing thesame | |
| KR102142547B1 (en) | Manufacturing method of decoration sheet and decoration sheet manufactured by the same | |
| CN111688304A (en) | Melamine plate for PCB drilling and manufacturing method thereof | |
| CN208881303U (en) | Flooring material |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A201 | Request for examination | ||
| PA0109 | Patent application |
Patent event code: PA01091R01D Comment text: Patent Application Patent event date: 20030113 |
|
| PA0201 | Request for examination | ||
| PG1501 | Laying open of application | ||
| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
Comment text: Notification of reason for refusal Patent event date: 20050330 Patent event code: PE09021S01D |
|
| E701 | Decision to grant or registration of patent right | ||
| PE0701 | Decision of registration |
Patent event code: PE07011S01D Comment text: Decision to Grant Registration Patent event date: 20051015 |
|
| GRNT | Written decision to grant | ||
| PR0701 | Registration of establishment |
Comment text: Registration of Establishment Patent event date: 20051021 Patent event code: PR07011E01D |
|
| PR1002 | Payment of registration fee |
Payment date: 20051019 End annual number: 3 Start annual number: 1 |
|
| PG1601 | Publication of registration | ||
| PR1001 | Payment of annual fee |
Payment date: 20081017 Start annual number: 4 End annual number: 4 |
|
| PR1001 | Payment of annual fee |
Payment date: 20090928 Start annual number: 5 End annual number: 5 |
|
| PR1001 | Payment of annual fee |
Payment date: 20100929 Start annual number: 6 End annual number: 6 |
|
| FPAY | Annual fee payment |
Payment date: 20110920 Year of fee payment: 7 |
|
| PR1001 | Payment of annual fee |
Payment date: 20110920 Start annual number: 7 End annual number: 7 |
|
| FPAY | Annual fee payment |
Payment date: 20120927 Year of fee payment: 8 |
|
| PR1001 | Payment of annual fee |
Payment date: 20120927 Start annual number: 8 End annual number: 8 |
|
| LAPS | Lapse due to unpaid annual fee | ||
| PC1903 | Unpaid annual fee |