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KR100470639B1 - A method for manufacturing heavily coated tin plate for k-plate application with no formation of smudge - Google Patents

A method for manufacturing heavily coated tin plate for k-plate application with no formation of smudge Download PDF

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KR100470639B1
KR100470639B1 KR10-2000-0070187A KR20000070187A KR100470639B1 KR 100470639 B1 KR100470639 B1 KR 100470639B1 KR 20000070187 A KR20000070187 A KR 20000070187A KR 100470639 B1 KR100470639 B1 KR 100470639B1
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treatment
plated
drag
plating
plate
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KR20020040212A (en
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김태엽
조준형
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주식회사 포스코
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    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48After-treatment of electroplated surfaces
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D11/00Electrolytic coating by surface reaction, i.e. forming conversion layers
    • C25D11/38Chromatising
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00Processes for servicing or operating cells for electrolytic coating
    • C25D21/02Heating or cooling
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/30Electroplating: Baths therefor from solutions of tin
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48After-treatment of electroplated surfaces
    • C25D5/50After-treatment of electroplated surfaces by heat-treatment
    • C25D5/505After-treatment of electroplated surfaces by heat-treatment of electroplated tin coatings, e.g. by melting

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

본 발명은 과즙음료를 담는 캔의 소재로 사용되는 후도금 석도강판, 일명 K-plate의 제조방법에 관한 것으로서, 본 발명의 목적은, 전기주석도금, 리플로우처리, 화학처리 등을 포함하여 이루어지는 석도강판의 제조방법에 있어서, 각 단계의 제조조건을 최적화함으로써, 별도의 처리나 설비를 추가하지 않고 기존 설비를 이용하여 스멋지 발생이 적은 백관용 후도금 석도강판을 제조할 수 있는 방법을 제공하는 데 있다. The present invention relates to a method for producing a post-plated stone plate, also known as K-plate used as a material of a can containing a juice drink, the object of the present invention comprises electro tin plating, reflow treatment, chemical treatment, etc. In the manufacturing method of the stone plate, by optimizing the manufacturing conditions of each step, to provide a method for producing a white-plated after-plated stone plate using less existing splatter without using additional treatment or equipment There is.

상기 목적을 달성하기 위한 본 발명은, 석도원판에 전기주석도금을 행하고, 드래그-아웃 용액을 이용한 드래그-아웃처리, 가열처리, 및 급냉처리로 이루어지는 리플로우처리를 행한 후, 화학처리를 행하는 것을 포함하여 이루어지는 석도강판의 제조방법에 있어서, 상기 전기주석도금시 도금액의 온도는 45~55℃이고, 상기 리플로우처리의 드래그-아웃처리시 드래그-아웃 용액 중 혼입되는 ENSA의 농도는 0.5 g/ℓ이하이며, 그리고 상기 화학처리에 의해 형성되는 피막중 크롬 부착량은 3~5 mg/㎡인 것을 특징으로 하는 스멋지 발생이 적은 백관용 후도금 석도강판의 제조방법을 기술적 요지로 한다.In order to achieve the above object, the present invention provides electro tin plating on the stone master disc, and then performs a chemical treatment after performing a reflow treatment consisting of a drag-out treatment using a drag-out solution, a heating treatment, and a quenching treatment. In the method of manufacturing a stone-plated steel sheet comprising a, the temperature of the plating liquid during the electro-tin plating is 45 ~ 55 ℃, the concentration of ENSA mixed in the drag-out solution during the drag-out treatment of the reflow treatment is 0.5 g / Less than l, and the amount of chromium deposited in the film formed by the above chemical treatment is 3 ~ 5 mg / ㎡ The method for producing a white-plated after-plated low-grade galvanized steel sheet, characterized in that the technical gist.

Description

스멋지 발생이 적은 백관용 후도금 석도강판의 제조방법{A METHOD FOR MANUFACTURING HEAVILY COATED TIN PLATE FOR K-PLATE APPLICATION WITH NO FORMATION OF SMUDGE}A method for manufacturing white-plated post-plated stone plate for less whiteness {A METHOD FOR MANUFACTURING HEAVILY COATED TIN PLATE FOR K-PLATE APPLICATION WITH NO FORMATION OF SMUDGE}

본 발명은 과즙음료를 담는 캔의 소재로 사용되는 후도금 석도강판, 일명 K-plate의 제조방법에 관한 것으로서, 보다 상세하게는 석도원판에 전기주석도금, 리플로우처리, 화학처리를 행하여 석도강판으로 제조할 때, 각각의 제조조건을 최적화함으로써, 표면에 스멋지(smudge) 발생을 방지할 수 있는 백관용 후도금 석도강판의 제조방법에 관한 것이다.The present invention relates to a method for producing a post-plated stone plate, also known as K-plate used as a material of a can containing a juice drink, more specifically, the stone plate by electroplating, reflow treatment, chemical treatment When manufacturing in accordance with the present invention, by optimizing the respective manufacturing conditions, to prevent the occurrence of smudge (sudge) on the surface relates to a method for producing a white plate post-plated stone plate.

일반적으로 석도강판은, 산성 도금액으로 전기주석도금한 후, 도금층의 광택을 부여하기 위해 리플로우(reflow)처리에 의해 도금층을 용융시켰다가 응고시키고, 다시 그 위에 중크롬산 나트륨을 이용한 화학처리를 실시한 다음, 마지막으로 방청유를 도포하여 제조된다. 상기 리플로우 처리는, 도금층 표면의 산화를 방지하기 위한 플럭스 처리단계인 드래그-아웃 처리, 도금층을 용융시키는 가열처리, 용해된 도금층을 급속히 응고시키는 급냉처리의 세 단계로 구성된다. Generally, after the electroplating of tin plate with acidic plating solution, the plating layer is melted and solidified by reflow treatment to give glossiness of the plating layer, and then chemical treatment using sodium dichromate is performed thereon. Finally, it is prepared by applying antirust oil. The reflow treatment is composed of three stages: a drag-out treatment, a flux treatment step for preventing oxidation of the plating layer surface, a heat treatment for melting the plating layer, and a quenching treatment for rapidly solidifying the molten plating layer.

한편, 후도금 석도강판은 도금 부착량이 편면당 8.4~11.2g/㎡인 것으로서, 제관 공정에서 캔의 내부에 락카를 도포하지 않고 바로 내용물과 접촉시키는 백관용 소재로 사용된다. 이 때 캔에 담기는 내용물은 대부분 산성 과즙음료이므로, 주석 도금층이 소지 강판을 완전히 피복하고 있어야만 캔의 부식을 방지할 수 있다. 또한, 도금층이 그대로 노출되므로 표면광택도와 같은 외관이 우수해야만 하며, 특히 스멋지라고 불리우는 분말형태의 주석산화물을 주체로 하는 화합물이 형성되지 않도록 해야만 한다.On the other hand, the post-plated stone plate is used as the material for the white pipe to be plated adhesion amount of 8.4 ~ 11.2g / ㎡ per one side, in contact with the contents immediately without applying lacquer inside the can in the manufacturing process. At this time, since the contents of the cans are mostly acidic juice drinks, the tin plating layer must completely cover the steel sheet to prevent corrosion of the cans. In addition, since the plating layer is exposed as it is, the appearance such as surface glossiness should be excellent, and in particular, a compound mainly composed of tin oxide in the form of powder called sage should be avoided.

석도강판 표면에 스멋지가 발생하면, 전단 공정에서 콘베이어 벨트를 오염시키고, 표면에 롤 마크와 같은 결함을 발생시키며, 제관 공구를 오염시키고 검은색의 분말이 캔 내부로 혼입되는 등의 문제가 발생하게 된다. 그러나, 이와 같은 스멋지의 발생에 대해서는, 도금후 주석 분말이나 주석 산화물이 화학처리시 반응하여 회색 스멋지 또는 검은 스멋지의 형태로 발생하는 것으로만 알려져 있을 뿐, 정확한 발생원인은 아직 규명되지 못한 상태이다. If smudges are generated on the surface of the steel sheets, problems such as contamination of the conveyor belt in the shearing process, defects such as roll marks on the surface, contamination of the pipe making tool, and mixing of black powder into the can occur. Done. However, it is only known that tin powder or tin oxide react after chemical treatment in the form of gray spot or black spot after the plating, and the exact cause of the spot is not known. It is a state.

후도금 석도강판의 스멋지 발생을 감소시키기 위한 공지 기술로는, 일본특개 평5-88193호에서 개시한 리플로우 후 화학처리전에 알칼리 용액에서 양극전해처리를 실시하는 방법, 일본특개소61-104099호에서 개시한 화학처리 전에 중탄산나트륨 수용액에서 음극 전해처리를 실시하는 방법, 일본특개소52-91747호의 화학처리후 에폭시화된 soybean oil에 침지하는 방법, 일본특개소51-92739호의 전기주석도금후 아연도금을 추가로 실시하는 방법, 그리고 남아공 특허 70-08647호의 화학처리 용액에 유기화합물을 첨가하는 방법 등이 알려져 있다. 그러나, 상기한 공지기술들은 공통적으로 별도의 전해처리나 도유처리를 실시하기 위한 설비를 필요로 하며, 또한 주석 도금층의 고유특성을 저하시킬 가능성이 있는 아연도금을 추가로 실시하는 등 적용상 문제점을 안고 있다. As a well-known technique for reducing the occurrence of splatter in post-plated stone plate, a method of performing anodic electrolytic treatment in alkaline solution before chemical treatment after reflow disclosed in Japanese Patent Laid-Open No. 5-88193, Japanese Patent Laid-Open No. 61-104099 Cathodic electrolytic treatment in aqueous sodium bicarbonate solution prior to the chemical treatment disclosed in U.S. Patent No. 52, immersed in epoxidized soybean oil after chemical treatment in Japanese Patent Application Laid-Open No. 52-91747, and electroplated in Japanese Patent Application No. 51-92739. A method of further performing zinc plating and a method of adding an organic compound to a chemical treatment solution of South African Patent No. 70-08647 are known. However, the above known technologies commonly require a facility for carrying out a separate electrolytic treatment or oiling treatment, and also provide an application problem such as additionally performing zinc plating which may degrade the intrinsic properties of the tin plating layer. Holding it.

본 발명자들은, 후도금 석도강판상에 발생하는 스멋지를 최소화할 수 있는 방법을 밝혀내기 위해, 스멋지의 성분을 정밀 분석하여 구성 물질을 알아내고, 스멋지 발생에 미치는 공정 변수의 영향을 연구 및 조사하여, 본 발명을 완성시킨 것으로, 본 발명의 목적은, 전기주석도금, 리플로우처리, 화학처리 등을 포함하여 이루어지는 석도강판의 제조방법에 있어서, 각 단계의 제조조건을 최적화함으로써, 별도의 처리나 설비를 추가하지 않고 기존 설비를 이용하여 스멋지 발생이 적은 백관용 후도금 석도강판을 제조할 수 있는 방법을 제공하는 데 있다. The inventors have conducted a detailed analysis of the components of the swabs to find out the constituents and to investigate the influence of process variables on the generation of swabs in order to find out how to minimize the spots occurring on the plated stone plate. And the present invention has been completed, and an object of the present invention is to provide a method for producing a fine-grained steel sheet including electro tin plating, reflow treatment, chemical treatment, and the like, by optimizing the manufacturing conditions of each step, The present invention provides a method for manufacturing white-plated white plated stone plate using less existing scoop without using additional facilities or equipment.

상기 목적을 달성하기 위한 본 발명은, The present invention for achieving the above object,

석도원판에 전기주석도금을 행하고, 드래그-아웃 용액을 이용한 드래그-아웃처리, 가열처리, 및 급냉처리로 이루어지는 리플로우처리를 행한 후, 화학처리를 행하는 것을 포함하여 이루어지는 석도강판의 제조방법에 있어서,In the method of manufacturing a stone plate steel comprising electroplating the stone plate, performing a reflow treatment consisting of a drag-out treatment using a drag-out solution, a heat treatment, and a quenching treatment, followed by a chemical treatment ,

상기 전기주석도금시 도금액의 온도는 45~55℃이고, The temperature of the plating solution during the electro tin plating is 45 ~ 55 ℃,

상기 리플로우처리의 드래그-아웃처리시 드래그-아웃 용액 중 혼입되는 ENSA의 농도는 0.5 g/ℓ이하이며, 그리고In the drag-out process of the reflow process, the concentration of ENSA incorporated in the drag-out solution is 0.5 g / l or less, and

상기 화학처리에 의해 형성되는 피막중 크롬 부착량은 3~5 mg/㎡인 것을 특징으로 하는 스멋지 발생이 적은 백관용 후도금 석도강판의 제조방법에 관한 것이다.The amount of chromium deposited in the coating formed by the chemical treatment is 3 to 5 mg / m 2, and relates to a method for producing a white-plated low-plated white-plated steel plate.

이하, 본 발명에 대하여 설명한다.EMBODIMENT OF THE INVENTION Hereinafter, this invention is demonstrated.

본 발명의 발명자들은 스멋지 성분을 분석한 결과, 회색 스멋지는 주석 분말과 SnO로 구성되며, 검은 스멋지는 도금층 성분인 Sn, Fe외에 SnOx(x = 1~2)와 비정질형 크롬 화합물로 구성되어 있는 것을 알았다. 또한, 본 발명자들은 스멋지 발생의 근본적인 원인을 규명하기 위하여, 전기도금 단계부터 관련 인자를 추정하여 그들의 영향을 조사한 결과, 스멋지는, 주석도금된 층이 리플로우 과정에서 산화되어 주석 산화층을 형성하고 그 층이 화학처리 용액과 반응하여 형성된다는 것을 알아내었다. 이를 좀 더 구체적으로 살펴보면 다음과 같다.The inventors of the present invention analyze the scotch component, and the gray scotch is composed of tin powder and SnO, and in addition to Sn, Fe, which is a black scouring layer, SnOx (x = 1-2) and an amorphous chromium compound We found out that it was comprised. In addition, the present inventors have estimated the relevant factors from the electroplating stage and investigated their influences in order to identify the root cause of the splatter occurrence. As a result, the splattered, tin-plated layer is oxidized in the reflow process to form a tin oxide layer. It was found that the layer was formed by reaction with a chemical treatment solution. In more detail, it is as follows.

첫째는, 전기주석도금 단계에 있어서, 부적절한 도금액 및 도금 조건에 의해 밀착성이 나쁜 도금층이 형성되는 경우, 표면적이 증가하여 도금층의 산화가 촉진된다는 것이며, First, in the electro tin plating step, when a poor adhesion layer is formed by an inappropriate plating solution and plating conditions, the surface area is increased to promote oxidation of the plating layer,

둘째는, 리플로우 과정에서 처리조건이 부적절할 경우, 도금층 산화가 촉진될 수 있다는 것이고, Secondly, if the treatment conditions are inappropriate during the reflow process, the plating layer oxidation can be promoted.

셋째는, 화학처리 조건에 의해 주석 산화층이 반응한다는 것이다. Third, tin oxide layer reacts by chemical treatment conditions.

이상의 원인 분석결과를 토대로, 본 발명의 발명자들은 상기한 3가지 기본적인 발생원인에 기초하여, 전기주석도금시 치밀한 도금층을 형성시키는 조건, 리플로우시 산화를 억제시킬 수 있는 조건, 화학처리시 주석 산화층과의 반응을 최소화할 수 있는 조건을 검토한 결과, 전기주석도금시에는 도금액의 온도를 45~55℃로 유지시키고, 리플로우처리의 드래그 아웃처리시에는 용액 중 혼입되는 ENSA의 농도를 0.5g/ℓ이하로 관리하며, 화학처리에 의해 형성되는 피막 중 크롬 부착량은 3~5 mg/㎡ 범위로 관리하는 것이 바람직한 것을 발견하였다. Based on the above cause analysis results, the inventors of the present invention, based on the three basic causes of the above, conditions for forming a dense plating layer during electro tin plating, conditions that can inhibit oxidation during reflow, tin oxide layer during chemical treatment As a result of examining the conditions for minimizing the reaction, the temperature of the plating solution was maintained at 45-55 ° C during electro tin plating, and the concentration of ENSA mixed in the solution was 0.5g during the drag-out of reflow treatment. / l or less, and found that it is desirable to manage the amount of chromium deposition in the film formed by chemical treatment in the range of 3 to 5 mg / m 2.

이하, 본 발명의 제조조건에 대하여 설명한다.Hereinafter, the manufacturing conditions of this invention are demonstrated.

먼저, 상기한 바와 같이, 본 발명에서는 석도원판에 전기주석도금을 행하는 경우, 도금액의 온도를 45~55℃로 유지하는 것이 바람직한데, 그 이유는 다음과 같다. 전기 주석도금층은 결정학적으로 Sn(002)면으로부터 <100> 방향으로 성장하는데, 도금액 온도가 낮을 때는 핵생성이 충분치 않은 상태에서 (002)면이 표면에 평행한 방향으로 형성되어 이웃하는 결정핵들과 서로 간섭하지 않고 수직방향으로만 성장하기 때문에 치밀하지 못한 도금층이 형성된다. 또한, 도금액 온도가 높아지면 핵생성이 활발해지면서 (002)면이 시편 표면에서 약간 기울어진 방향으로 형성되므로 성장하는 결정핵들이 서로 간섭하여 동일 방향으로의 성장을 방해하므로 결정방위가 무질서하면서 형상은 치밀한 결정을 형성하게 된다. 이러한 효과를 얻기 위해서는, 도금액의 온도를 종전의 30~40℃ 보다 높은 온도인 45℃ 이상으로 관리하는 것이 바람직하다. 그러나, 도금액 온도가 높을수록, 도금액의 증발이 심해지고 또한 주석 이온의 산화가 촉진되므로 적용 가능한 도금액 온도의 상한은 55℃로 설정하는 것이 바람직하다. 한편, 도 1(a),(b)는 도금액 온도에 따른 주석 도금층의 결정 형상을 전자 현미경으로 관찰한 사진으로서, 도 1(a)는 도금액의 온도가 30℃인 경우이고, 도 1(b)는 도금액의 온도가 50℃인 경우이다. 도 1(a),(b)에 나타난 바와 같이, 도금액의 온도가 30℃인 도 1(a)의 경우에는, 치밀하지 못한 도금층이 형성되어 있는 반면에. 도금액의 온도가 50℃인 도 1(b)는 치밀한 도금층이 형성되어 있는 것을 알 수 있다.First, as described above, in the present invention, when electro tin plating is performed on the stone master disc, it is preferable to maintain the temperature of the plating liquid at 45-55 ° C., for the following reasons. The electroplated layer grows crystallographically from the Sn (002) plane to the <100> direction. When the plating solution temperature is low, the nucleation is insufficient and the (002) plane is formed in a direction parallel to the surface, so that the neighboring crystal nuclei are formed. Since they grow only in the vertical direction without interfering with each other, a dense plating layer is formed. In addition, as the plating solution temperature increases, the nucleation becomes active and the (002) plane is formed in a direction slightly inclined from the surface of the specimen, so that the growing crystal nuclei interfere with each other and prevent growth in the same direction, so that the crystal orientation is disordered and the shape is Dense crystals are formed. In order to acquire such an effect, it is preferable to manage the temperature of a plating liquid to 45 degreeC or more which is a temperature higher than the conventional 30-40 degreeC. However, the higher the plating liquid temperature, the more evaporation of the plating liquid becomes and the oxidation of tin ions is promoted, so the upper limit of the applicable plating liquid temperature is preferably set to 55 ° C. 1 (a) and (b) are photographs obtained by observing the crystal shape of the tin plating layer according to the plating liquid temperature with an electron microscope, and FIG. 1 (a) is a case where the temperature of the plating liquid is 30 ° C., and FIG. 1 (b) ) Is the case where the temperature of the plating liquid is 50 ° C. As shown in Figs. 1 (a) and (b), in the case of Fig. 1 (a) where the temperature of the plating liquid is 30 ° C., a dense plating layer is formed. It can be seen from FIG. 1 (b) that the temperature of the plating liquid is 50 ° C. that a dense plating layer is formed.

다음으로, 리플로우처리의 드래그-아웃 처리에서는, 상기한 바와 같이, 드래그 아웃용액 중 혼입되는 ENSA의 농도를 0.5g/ℓ이하로 관리하는 것이 바람직하다. 상기 드래그-아웃 처리는, 도금층 표면을 플럭스처리하기 위한 것으로, ENSA가 첨가되지 않은 묽은 도금액을 사용하는데, 연속 작업에 의해 강대에 묻어서 드래그-아웃 용액으로 혼입되는 도금액에 의해, 도금액 중 첨가제인 ENSA 농도가 점차 증가하게 된다. 도금액의 성분 중 PSA는 강산으로서 플럭스기능을 수행하지만, ENSA는 쉽게 슬럿지를 형성할 수 있는 성분으로서, ENSA농도가 높은 드래그-아웃 용액을 사용하면 리플로우의 가열과정에서 ENSA성분이 도금층 표면에 석출하여 나중에 스멋지 성분의 일부가 될 뿐만 아니라, 도금층의 산화도 촉진된다. 따라서, 스멋지 발생을 방지하기 위해서는, 가열과정에서 ENSA가 석출되지 않을 수 있는 범위 내로 그 함량을 관리해야 하는데, 본 발명자들은 실험에 의해 드래그-아웃 용액중 ENSA농도가 0.5 g/ℓ이하이면 가열시 석출하지 않는다는 것을 알아내었다. 따라서, 드래그-아웃 용액 중 ENSA의 농도는 0.5 g/ℓ이하로 제한하는 것이 바람직하다. 상기 ENSA는 에톡시레이티드 알파-나프톨 술폰산(Ethoxylated α-Naphthol sulfonic acid)을 약칭하는 것이다.Next, in the drag-out process of the reflow process, as described above, it is preferable to manage the concentration of ENSA mixed in the drag-out solution to 0.5 g / l or less. The drag-out treatment is for flux-treating the surface of the plating layer, and uses a thin plating solution without adding ENSA, and is an additive in the plating solution by a plating solution buried in a steel strip and mixed into a drag-out solution by a continuous operation. The concentration will increase gradually. Among the components of the plating solution, PSA performs a flux function as a strong acid, but ENSA is a component that can easily form a sludge. When using a drag-out solution having a high ENSA concentration, the ENSA component precipitates on the surface of the plating layer during reflow heating. This not only becomes a part of the spotted component later, but also promotes oxidation of the plating layer. Therefore, in order to prevent the occurrence of splatter, it is necessary to manage the content within the range that the ENSA may not be precipitated during the heating process, the inventors experimented by heating if the ENSA concentration in the drag-out solution is 0.5 g / L or less I found out that no poems were deposited. Therefore, the concentration of ENSA in the drag-out solution is preferably limited to 0.5 g / l or less. The ENSA stands for ethoxylated α-Naphthol sulfonic acid.

마지막으로, 화학처리에 의해 형성된 피막 중에는 크롬 부착량이 3~5 mg/㎡ 범위인 것이 바람직하다. 스멋지는 도금층 표면의 주석 산화물과 화학처리 용액의 반응에 의해 형성되는데, 상기 크롬 부착량이 5 mg/㎡ 이상이면 과다한 반응이 일어나 스멋지 발생이 심하게 되므로 바람직하지 않다. 그러나, 크롬 부착량이 너무 적으면, 화학처리 본연의 기능인 도금층의 산화방지 효과가 없어지므로, 하한은 3mg/㎡ 로 설정하는 것이 바람직하다.Finally, in the coating formed by the chemical treatment, the amount of chromium deposition is preferably in the range of 3 to 5 mg / m 2. The smudge is formed by the reaction of the tin oxide on the surface of the plating layer with the chemical treatment solution, but if the amount of chromium deposition is 5 mg / m 2 or more, an excessive reaction occurs, which is not preferable. However, if the amount of chromium deposition is too small, the anti-oxidation effect of the plating layer, which is a natural function of the chemical treatment, is lost. Therefore, the lower limit is preferably set to 3 mg / m 2.

이하, 실시예를 통해 본 발명을 보다 상세히 설명한다. Hereinafter, the present invention will be described in more detail with reference to Examples.

(실시예)(Example)

소지강판으로서, 통상의 방법에 의해 제조된 두께 0.22mm의 저탄소 석도원판에 대하여, 전해탈지, 수세, 산세, 수세, 전기도금, 수세의 공정을 갖는 도금 장치를 이용하여 통상의 조건으로 전해탈지 및 산세하였다. 전기도금은, 도금액을 순환시킴에 의해 실제 제조공정에서 강대가 이동하는 상황을 모사하는 상태에서 실시하였다. 이 때, 도금액으로는 통상의 황산 주석, PSA, ENSA로 구성되는 산성 도금액을 사용하였고, 도금액의 온도는 하기 표1과 같이 변화시키면서 편면당 11.2 g/㎡의 양으로 주석을 전기도금하였다.As the base steel sheet, electrolytic degreasing under ordinary conditions using a plating apparatus having a process of electrolytic degreasing, rinsing, pickling, rinsing, electroplating, and rinsing with respect to a low carbon stone master plate having a thickness of 0.22 mm manufactured by a conventional method Pickled. Electroplating was performed in the state which simulates the situation which a steel strip moves in an actual manufacturing process by circulating a plating liquid. At this time, an acidic plating solution composed of ordinary tin sulfate, PSA, and ENSA was used as the plating solution, and the plating solution was electroplated in an amount of 11.2 g / m 2 per single side while changing the temperature of the plating solution as shown in Table 1 below.

상기 전기도금된 시편에 대하여, 하기 표1과 같이 ENSA 농도를 변화시킨 드래그-아웃 용액으로 플럭스처리를 실시한 후, 저항가열식 리플로우 장치를 이용해 시편 중앙부의 최대 온도가 260℃가 되도록 가열한 후 70℃의 물에 급냉시켰다. The electroplated specimen was fluxed with a drag-out solution with varying ENSA concentrations as shown in Table 1 below, and then heated to a maximum temperature of 260 ° C. at the center of the specimen using a resistance heating reflow apparatus. It was quenched in water at 캜.

리플로우 처리된 시편에 대하여, 비이커 전해조 내 통상의 전기주석도금강판용 화학처리 용액(중크롬산 나트륨 수용액)에서 전하량을 변화시킴에 의해 크롬 부착량을 하기 표1과 같이 조절하여 화학처리하였다. 이 때, 크롬 부착량은 통상의 측정방법인 전해식 박리법으로 측정하였다.The reflowed specimens were chemically treated by adjusting the amount of chromium deposition as shown in Table 1 by varying the amount of charge in a chemical treatment solution (aqueous sodium bichromate solution) for a conventional electroplated steel sheet in a beaker electrolyzer. At this time, the chromium adhesion amount was measured by the electrolytic peeling method which is a normal measuring method.

그 다음, 스멋지의 발생정도를 정량화하기 위하여, 편면 마찰계수를 측정하는 장치를 개조하여 사용하였다. 장치의 구성은 시편대에 시편을 놓고 면적이 40mm x 50mm인 다이로 30kgf의 하중으로 누르면서 시편을 하중 방향의 수직방향으로 분당 1m의 속도로 당기도록 되어 있다. 이 때, 시편과 다이사이에 여과지를 넣고 당기면 여과지에 스멋지가 묻어 나오게 되며, 묻어 나오는 스멋지의 양을 육안 판별에 의해 1등급(거의 묻어나지 않음)에서 5등급(검게 묻어 나옴)으로 1단계씩 구분하여 스멋지의 발생정도를 정량화하였다. 스멋지 발생 등급이 2이하이면, 사용상 아무 문제가 없다.Then, to quantify the occurrence of smudges, an apparatus for measuring the one-sided friction coefficient was used. The arrangement consists of placing the specimen on the specimen stage and pulling the specimen at a speed of 1m per minute in the vertical direction of the load direction while pressing at a load of 30kgf with a die of 40mm x 50mm. At this time, if the filter paper is inserted between the specimen and the die, the filter paper will be smudged out, and the amount of smudge will be removed from the 1st grade (nearly burried) to the 5th grade (black stained) by visual discrimination. The incidence of swamps was quantified by stepwise. If the snuff outbreak rating is 2 or less, there is no problem in use.

구분division 제조조건Manufacture conditions 평가결과Evaluation results 도금액온도(℃)Plating solution temperature (℃) 드래그-아웃용액중ENSA 농도 (g/l)ENSA concentration in drag-out solution (g / l) 화학처리크롬부착량 (mg/m2)Chemical treated chromium adhesion amount (mg / m 2 ) 스멋지발생 등급Outbreak Grade 발명예 1Inventive Example 1 4545 0.350.35 4.264.26 22 발명예 2Inventive Example 2 5050 0.350.35 4.384.38 1One 발명예 3Inventive Example 3 5454 0.350.35 4.294.29 1One 발명예 4Inventive Example 4 4747 0.030.03 4.784.78 22 발명예 5Inventive Example 5 4747 0.280.28 4.414.41 1One 발명예 6Inventive Example 6 4747 0.460.46 3.943.94 22 발명예 7Inventive Example 7 5353 0.350.35 3.223.22 1One 발명예 8Inventive Example 8 5353 0.350.35 3.593.59 1One 발명예 9Inventive Example 9 5353 0.350.35 4.874.87 22 발명예 10Inventive Example 10 4747 0.460.46 3.853.85 1One 발명예 11Inventive Example 11 4747 0.460.46 4.054.05 1One 발명예 12Inventive Example 12 4747 0.460.46 4.664.66 22 비교예 1Comparative Example 1 3535 0.350.35 4.274.27 44 비교예 2Comparative Example 2 6060 0.350.35 4.554.55 22 비교예 3Comparative Example 3 4545 0.70.7 4.034.03 44 비교예 4Comparative Example 4 4545 0.950.95 3.893.89 55 비교예 5Comparative Example 5 4545 0.350.35 2.382.38 1One 비교예 6Comparative Example 6 4545 0.350.35 6.236.23 44 비교예 7Comparative Example 7 4545 0.350.35 9.089.08 55

상기 표1에 나타난 바와 같이, 본 발명의 제조조건에 따라 제조한 발명예(1)~(12)의 경우에는, 스멋지 등급이 1~2로 매우 양호한 것을 알 수 있다. As shown in Table 1 above, in the case of Inventive Examples (1) to (12) manufactured according to the production conditions of the present invention, it can be seen that the snot grade is 1 to 2, which is very good.

그러나, 도금액의 온도가 발명조건 보다 낮은 비교예(1)은 스멋지 등급이 불량하고, 도금액 온도가 55 ℃로 높은 비교예(2)는 스멋지 발생은 거의 없었으나, 도금액의 증발이 심하여 적용상 문제가 있었다. 화학처리 크롬 부착량이 5 mg/㎡ 이상인 비교예(6),(7)은 도금층의 산화 발생이 심하였고, 3 mg/㎡ 이하인 비교예(5)는 보관 중 누런색으로 산화가 되는 문제가 발생하여 적용이 불가능하였다. 또한, 드래그-아웃 중 ENSA 농도가 0.5 g/ℓ 이상인 비교예(3),(4)는 표면에 ENSA가 석출하여 스멋지 발생이 심한 문제가 있었다.However, Comparative Example (1) having a lower temperature of the plating liquid than the invention condition had a poor grade, and Comparative Example (2) having a high plating solution temperature of 55 ° C. had almost no occurrence of squeak, but it was applied due to severe evaporation of the plating liquid. There was a phase problem. In Comparative Examples (6) and (7) having a chemically treated chromium adhesion amount of 5 mg / m 2 or more, oxidation of the plating layer was severe, and Comparative Example (5) having a concentration of 3 mg / m 2 or less had a problem of oxidizing to yellow color during storage. It was not applicable. In addition, the comparative examples (3) and (4) having an ENSA concentration of 0.5 g / L or more during drag-out had a problem of severe occurrence of sessage due to precipitation of ENSA on the surface.

상기한 바와 같이 본 발명에 의하면, 전기도금시 치밀한 도금층이 형성되고, 리플로우 공정에서 산화가 억제되며, 주석 도금층 표면의 주석 산화물과 화학처리 용액간의 과다한 반응이 억제됨으로써, 스멋지 발생이 거의 없는 백관용 후도금 석도강판을 제조할 수 있는 효과가 있는 것이다. As described above, according to the present invention, a dense plated layer is formed during electroplating, oxidation is suppressed in the reflow process, and excessive reaction between tin oxide and the chemical treatment solution on the surface of the tin plated layer is suppressed, so that there is little occurrence of splatter. It is effective to produce a white plate post-plated stone plate.

도 1(a),(b)는 도금액 온도에 따른 전기주석 도금층의 결정 형상을 나타내는 사진(주사 전자 현미경(배율 5,000배)에 의함)으로서, 1 (a) and (b) are photographs (by scanning electron microscope (5000 times magnification)) showing the crystal shape of the electro-tin plating layer according to the plating liquid temperature,

(a)는 도금액 온도가 30℃인 경우(a) is when the plating liquid temperature is 30 ℃

(b)는 도금액 온도가 50℃인 경우를 나타낸다.(b) shows the case where the plating liquid temperature is 50 ° C.

Claims (1)

석도원판에 전기주석도금을 행하고, 드래그-아웃 용액을 이용한 드래그-아웃처리, 가열처리, 및 급냉처리로 이루어지는 리플로우처리를 행한 후, 화학처리를 행하는 것을 포함하여 이루어지는 석도강판의 제조방법에 있어서,In the method of manufacturing a stone plate steel comprising electroplating the stone plate, performing a reflow treatment consisting of a drag-out treatment using a drag-out solution, a heat treatment, and a quenching treatment, followed by a chemical treatment , 상기 전기주석도금시 도금액의 온도는 45~55℃이고, The temperature of the plating solution during the electro tin plating is 45 ~ 55 ℃, 상기 리플로우처리의 드래그-아웃처리시 드래그-아웃 용액 중 혼입되는 ENSA의 농도는 0.5 g/ℓ이하이며, 그리고In the drag-out process of the reflow process, the concentration of ENSA incorporated in the drag-out solution is 0.5 g / l or less, and 상기 화학처리에 의해 형성되는 피막중 크롬 부착량은 3~5 mg/㎡인 것을 특징으로 하는 스멋지 발생이 적은 백관용 후도금 석도강판의 제조방법Method for producing a white-plated after-plated stone plate for less whiteness, characterized in that the coating amount of chromium in the film formed by the chemical treatment is 3 ~ 5 mg / ㎡
KR10-2000-0070187A 2000-11-24 2000-11-24 A method for manufacturing heavily coated tin plate for k-plate application with no formation of smudge Expired - Fee Related KR100470639B1 (en)

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57203797A (en) * 1981-06-10 1982-12-14 Kawasaki Steel Corp Production of surface treated steel plate of high rust prevention for welded can
JPH0488193A (en) * 1990-07-30 1992-03-23 Nkk Corp Production of bright tin plated steel sheet
JPH05140793A (en) * 1991-11-19 1993-06-08 Nkk Corp Production of tin-electroplated steel sheet excellent in surface luster

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57203797A (en) * 1981-06-10 1982-12-14 Kawasaki Steel Corp Production of surface treated steel plate of high rust prevention for welded can
JPH0488193A (en) * 1990-07-30 1992-03-23 Nkk Corp Production of bright tin plated steel sheet
JPH05140793A (en) * 1991-11-19 1993-06-08 Nkk Corp Production of tin-electroplated steel sheet excellent in surface luster

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