KR100461949B1 - solder ball for a semiconductor package and its manufacturing method, and evaporation method of solder ball - Google Patents
solder ball for a semiconductor package and its manufacturing method, and evaporation method of solder ball Download PDFInfo
- Publication number
- KR100461949B1 KR100461949B1 KR10-2002-0026778A KR20020026778A KR100461949B1 KR 100461949 B1 KR100461949 B1 KR 100461949B1 KR 20020026778 A KR20020026778 A KR 20020026778A KR 100461949 B1 KR100461949 B1 KR 100461949B1
- Authority
- KR
- South Korea
- Prior art keywords
- solder ball
- solder
- colored
- circuit board
- organic compound
- Prior art date
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- 229910000679 solder Inorganic materials 0.000 title claims abstract description 114
- 239000004065 semiconductor Substances 0.000 title claims abstract description 25
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 12
- 238000001704 evaporation Methods 0.000 title claims abstract description 11
- 239000003086 colorant Substances 0.000 claims abstract description 26
- 150000002894 organic compounds Chemical class 0.000 claims abstract description 15
- 230000004907 flux Effects 0.000 claims abstract description 8
- 239000002184 metal Substances 0.000 claims description 13
- 229910052751 metal Inorganic materials 0.000 claims description 13
- 239000000975 dye Substances 0.000 claims description 11
- 239000000203 mixture Substances 0.000 claims description 11
- HYZJCKYKOHLVJF-UHFFFAOYSA-N 1H-benzimidazole Chemical compound C1=CC=C2NC=NC2=C1 HYZJCKYKOHLVJF-UHFFFAOYSA-N 0.000 claims description 7
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 claims description 7
- 239000012964 benzotriazole Substances 0.000 claims description 7
- 238000004806 packaging method and process Methods 0.000 claims description 4
- 238000002791 soaking Methods 0.000 claims 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 239000000049 pigment Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 2
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- -1 Alkyl Imidazole Chemical compound 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
- H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
이 발명은 반도체패키지용 솔더볼 및 그 제조 방법, 그리고 솔더볼의 이베포레이션 방법에 관한 것으로, 다양한(다른 크기 및 다른 금속 조성) 종류의 솔더볼을 일견하여 구별할 수 있도록, 반도체패키지용 회로기판에 플럭스로 임시 부착된 후, 고온에서 리플로우되어 입출력 단자로 이용되는 솔더볼에 있어서, 상기 플럭스로 임시 부착된 솔더볼은 표면에 유기화합물과 염료가 혼합되어 형성된 착색제로 착색된 것을 특징으로 함.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solder ball for a semiconductor package, a method of manufacturing the same, and an evaporation method of the solder ball. The solder ball temporarily reflowed at high temperature and then used as an input / output terminal, wherein the solder ball temporarily adhering to the flux is colored with a colorant formed by mixing an organic compound and a dye on a surface thereof.
Description
본 발명은 반도체패키지용 솔더볼 및 그 제조 방법, 그리고 솔더볼의 이베포레이션 방법에 관한 것으로, 더욱 상세하게 설명하면 다양한(다른 크기 및 다른 금속 조성) 종류의 솔더볼을 일견하여 구별할 수 있는 반도체패키지용 솔더볼 및 그 제조 방법, 그리고 솔더볼의 이베포레이션 방법에 관한 것이다.The present invention relates to a solder ball for a semiconductor package, a method for manufacturing the same, and an evaporation method for the solder ball. More specifically, the present invention relates to a semiconductor package capable of distinguishing solder balls of various (different sizes and different metal compositions) at a glance. It relates to a solder ball, a method of manufacturing the same, and an evaporation method of the solder ball.
일반적으로 반도체패키지용 솔더볼은 주석(Sn), 납(Pb) 또는 은(Ag) 등의 합금으로, 생산 및 취급이 용이하고 또한 녹는점이 비교적 낮아서 반도체패키지를 외부장치에 연결하는 입출력 단자로 많이 사용되고 있다. 특히, BGA, PBGA 등과 같이 입출력 단자가 일면에 어레이(array)된 형태의 반도체패키지에 주로 이용되어 있다.In general, solder balls for semiconductor packages are alloys such as tin (Sn), lead (Pb) or silver (Ag). They are easy to produce and handle and have a relatively low melting point. have. In particular, it is mainly used in semiconductor packages in which input / output terminals are arrayed on one surface, such as BGA and PBGA.
이러한 솔더볼은 반도체패키지의 크기, 용도, 종류 및 고객의 취향에 따라 다양한 크기 및 다양한 금속 조성을 가질 수 있으며, 또한 최근의 환경 오염 규제가 날로 커짐에 따라 납이 없는 주석으로만 된 솔더볼도 많이 개발 및 출시되고 있다.These solder balls may have various sizes and various metal compositions according to the size, use, type, and customer's preference of the semiconductor package. Also, as the recent regulations on environmental pollution increase, many solder balls made of lead-free tin are also developed and It's coming out.
한편, 상술한 바와 같이 최근 반도체패키지에 사용되는 솔더볼의 종류(크기 및 금속 조성)가 다양해짐에 따라 하나의 생산 공정에서 여러 종류의 솔더볼을 사용해야만 하는 경우가 더욱 많아지고 있다.On the other hand, as described above, as the types (size and metal composition) of the solder balls used in the semiconductor package have been diversified, more and more cases have to use several kinds of solder balls in one production process.
예를 들면, 하나의 볼 범핑 장비에서 여러 종류의 반도체패키지와 여러 종류의 솔더볼을 이용해야 함으로써, 상기 솔더볼의 관리가 더욱 어려워지고 있다. 다른 말로 하면, 각각의 솔더볼마다 다른 볼 범핑 장비를 이용하면 상기 솔더볼의 관리가 어느 정도 수월하겠지만, 현실적으로 고가의 볼 범핑 장비는 그 갯수가 한정되기 때문에, 몇대의 볼 범핑 장비에서 수많은 종류의 솔더볼 범핑을 수행하여야 되고, 따라서 범핑되는 솔더볼의 혼합 및 섞일 확률이 더욱 커지고 있다.For example, it is more difficult to manage the solder balls by using various types of semiconductor packages and different types of solder balls in one ball bumping equipment. In other words, the use of different ball bumping equipment for each solder ball will make it easier to manage the solder balls, but in reality, the number of expensive ball bumping equipment is limited, so many types of solder ball bumping in several ball bumping equipment And therefore, the probability of mixing and mixing the bumped solder balls is increased.
상기와 같이 서로 다른 크기 및 금속 조성을 갖는 솔더볼이 혼합되었을 경우에는, 솔더볼이 반도체패키지에 단단하게 리플로우되지 않거나 또는 융착된 솔더볼의 직경이 크거나 작아서 외부 장치에 전기적으로 접속되지 않는 등 매우 다양한 후속 문제를 야기한다.When solder balls having different sizes and metal compositions are mixed as described above, the solder balls may not be reflowed firmly in the semiconductor package or the solder balls may be electrically connected to an external device due to the large or small diameter of the solder balls. Cause problems.
따라서 본 발명은 상기와 같은 종래의 문제를 해결하기 위해 안출한 것으로, 다양한 종류의 솔더볼을 일견하여 쉽게 구분할 수 있고, 또한 산화를 방지할 수도 있는 반도체패키지용 솔더볼 및 그 제조 방법, 그리고 솔더볼의 이베포레이션 방법을 제공하는데 있다.Accordingly, the present invention has been made to solve the above-described conventional problems, it is possible to easily distinguish the various kinds of solder balls at a glance, and also to prevent the oxidation of the solder ball for semiconductor packaging and its manufacturing method, and eBay of the solder ball It is to provide a forest method.
도1은 본 발명에 의한 솔더볼과 종래의 일반 솔더볼이 각각 유리병에 담긴 상태를 도시한 흑백 사진이다.1 is a black and white photograph showing a state in which a solder ball and a conventional general solder ball according to the present invention are each contained in a glass bottle.
도2는 본 발명에 의한 솔더볼에 일반 솔더볼이 섞인 상태를 도시한 흑백 사진이다.Figure 2 is a black and white photograph showing a state in which the general solder ball mixed with the solder ball according to the present invention.
도3a는 반도체패키지용 회로기판에 리플로우 전의 본 발명에 의한 솔더볼을 도시한 흑백 사진이고, 도3b는 반도체패키지용 회로기판에 리플로우 후의 색채가 휘발된 본 발명에 의한 솔더볼을 도시한 흑백 사진이다.Figure 3a is a black and white photograph showing the solder ball according to the invention before the reflow on the circuit board for semiconductor package, Figure 3b is a black and white photograph showing the solder ball according to the invention the color after the reflow on the circuit board for semiconductor package. to be.
도4는 본 발명에 의한 솔더볼의 리플로우 후 단면을 도시한 흑백 사진이다.Figure 4 is a black and white photograph showing a cross section after the reflow of the solder ball according to the present invention.
-도면중 주요 부호에 대한 설명-Description of the main symbols in the drawings
2; 본 발명에 의한 솔더볼2; Solder ball according to the present invention
2'; 리플로우 후 원래의 색으로 복귀된 본 발명에 의한 솔더볼2'; Solder ball according to the present invention returned to the original color after reflow
4; 종래의 일반 솔더볼4; Conventional plain solder ball
6; 반도체패키지용 회로기판6; Circuit Board for Semiconductor Package
8; 구리 배선패턴8; Copper wiring pattern
10; 본 발명의 솔더볼과 구리 배선패턴 사이의 계면10; Interface between solder ball and copper wiring pattern of the present invention
상기한 목적을 달성하기 위해 본 발명은, 반도체패키지용 회로기판에 플럭스로 범핑된 후, 고온에서 리플로우되어 입출력 단자로 이용되는 솔더볼에 있어서, 상기 플럭스로 범핑된 솔더볼은 표면에 유기화합물과 소정 색채를 갖는 염료가 혼합되어 형성된 착색제로 착색된 것을 특징으로 한다.In order to achieve the above object, the present invention is a solder ball bumped to a circuit board for semiconductor packaging, and then reflowed at a high temperature to be used as an input / output terminal, wherein the solder ball bumped with the flux is an organic compound and predetermined on the surface It is characterized by being colored with a colorant formed by mixing a dye having a color.
여기서, 상기 유기화합물은 벤조트리아졸, 알킬이미다졸 또는 벤조이미다졸중 어느 하나일 수 있다.Here, the organic compound may be any one of benzotriazole, alkylimidazole or benzoimidazole.
더불어, 상기 솔더볼은 그 크기 및 금속 조성에 따라 서로 다른 색채로 착색됨이 바람직하다.In addition, the solder balls are preferably colored in different colors according to their size and metal composition.
또한, 상기한 목적을 달성하기 위해 본 발명은 반도체패키지용 회로기판에 플럭스로 범핑된 후, 고온에서 리플로우되어 입출력 단자로 이용되는 솔더볼의 제조 방법에 있어서, 원형의 솔더볼이 형성된 후, 상기 솔더볼이 유기화합물과 소정 색채의 염료가 혼합된 대략 25~50℃의 온도를 갖는 착색제에 대략 1~5분 정도 담궈짐으로써, 솔더볼의 표면이 소정 색채로 착색되도록 함을 특징으로 한다.In addition, in order to achieve the above object, the present invention in the method of manufacturing a solder ball used as an input and output terminal after being bumped to a circuit board for a semiconductor package, and reflowed at a high temperature, after the circular solder ball is formed, the solder ball It is characterized in that the surface of the solder ball is colored in a predetermined color by being immersed in a colorant having a temperature of approximately 25-50 ° C. in which the organic compound and a dye of a predetermined color are mixed.
또한, 상기한 목적을 달성하기 위해 본 발명은 유기화합물에 소정 색채의 염료가 함유되어 이루어진 착색제로 착색된 솔더볼의 이베포레이션 방법에 있어서, 상기 솔더볼이 반도체패키지용 회로기판에 플럭스로 범핑된 후, 대략 150~260℃의 온도를 갖는 퍼니스(furnace)에 대략 30~60초 동안 리플로우(reflow)되어, 솔더볼의 표면에 착색된 착색제가 이베포레이션되도록 함을 특징으로 한다.In addition, in order to achieve the above object, the present invention is an evaporation method of a solder ball colored with a coloring agent comprising a dye of a predetermined color in an organic compound, wherein the solder ball is bumped on a circuit board for semiconductor packages , Reflow for about 30 to 60 seconds in a furnace having a temperature of about 150 ~ 260 ° C, characterized in that the coloring agent on the surface of the solder ball is evaporated.
상기와 같이 하여 본 발명에 의한 반도체패키지용 솔더볼 및 그 제조 방법, 그리고 솔더볼의 이베포레이션 방법에 의하면, 다른 종류의 솔더볼에는 다른 색채가 착색되어 있음으로써, 다른 크기 및 다른 금속 조성의 솔더볼을 일견하여 쉽게 구분할 수 있는 장점이 있는 동시에, 또한 리플로우되기 전에는 솔더볼이 외부 공기와 직접 접촉되는 현상이 억제됨으로써, 솔더볼의 산화도 방지할 수 있는 장점이있다.According to the solder ball for a semiconductor package according to the present invention, a manufacturing method thereof, and an evaporation method of the solder ball as described above, different types of solder balls are colored, so that solder balls of different sizes and different metal compositions are at a glance. In addition, there is an advantage that can be easily distinguished, and also before the reflow, the phenomenon that the solder ball is in direct contact with the outside air is suppressed, thereby preventing the oxidation of the solder ball.
이하 본 발명이 속하는 기술 분야에서 통상의 지식을 가진 자가 본 발명을 용이하게 실시할 수 있을 정도로 본 발명의 바람직한 실시예를 첨부된 도면을 참조하여 상세하게 설명하면 다음과 같다.Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art may easily implement the present invention.
도1은 본 발명에 의한 솔더볼(2)과 종래의 일반 솔더볼(4)이 각각 유리병에 담긴 상태를 도시한 흑백 사진이고, 도2는 본 발명에 의한 솔더볼(2)에 종래의 일반 솔더볼(4)이 섞인 상태를 도시한 흑백 사진이다.1 is a black and white photograph showing a state in which a solder ball 2 according to the present invention and a conventional general solder ball 4 are contained in a glass bottle, respectively, and FIG. 2 is a conventional general solder ball in a solder ball 2 according to the present invention. 4) is a black and white photograph showing the mixed state.
도시된 바와 같이 본 발명에 의한 솔더볼(2)은 외형이 종래와 같이 대략 구체형으로 되어 있으며, 단지 그 표면에 소정 색채로 착색되어 있는 것이 특징이다. 물론, 이러한 솔더볼(2)은 종래와 같이 반도체패키지용 회로기판에 플럭스로 범핑된 후, 고온에서 리플로우되어 입출력 단자로 이용된다.As shown, the solder ball 2 according to the present invention is characterized in that its outer shape is substantially spherical as in the prior art, and is colored only in a predetermined color on its surface. Of course, such a solder ball (2) is bumped into a circuit board for semiconductor packages as in the prior art, and then reflowed at a high temperature to be used as an input / output terminal.
여기서, 상기 착색제는 금속과 물리화학적 결합을 하는 유기화합물에 적절한 색채의 염료나 안료가 첨가되어 형성된 것이다. 상기한 금속과 물리화학적 결합을 하는 유기화합물의 대표적인 것으로는 벤조트리아졸, 알킬이미다졸 또는 벤조이미다졸이 바람직하며, 이중 고온에서 쉽게 휘발되는 알킬이미다졸이 가장 바람직한 유기화합물이다.Here, the colorant is formed by adding a dye or pigment of a suitable color to an organic compound having a physicochemical bond with a metal. Representative examples of the organic compounds having a physicochemical bond with the metals described above are benzotriazole, alkylimidazole or benzoimidazole, and alkylimidazole which is easily volatilized at high temperature is the most preferred organic compound.
참고로, 상기 벤조트리아졸, 알킬이미다졸, 벤조이미다졸의 화학적 구조는 아래와 같다.For reference, the chemical structures of the benzotriazole, alkylimidazole and benzoimidazole are as follows.
벤조트리아졸(Benzotriazole)Benzotriazole
알킬이미다졸(Alkyl Imidazole)Alkyl Imidazole
벤조이미다졸(Benzimidazole)Benzimidazole
한편, 이러한 유기화합물과 염료 및 안료 등이 혼합되어 형성된 착색제는 솔더볼(2)의 리플로우중 고온의 환경에 의해 모두 휘발되어 제거된다. 즉, 도3a에서와 같이 솔더볼(2)이 플럭스에 의해 회로기판(6)에 범핑된 후(리플로우 되기 전 상태)에는 상기 솔더볼(2)이 소정 색채를 가지고 있으나, 도3b에서와 같이 솔더볼(2')이 리플로우에 의해 회로기판(6)에 완전히 부착된 후에는, 상기 솔더볼(2') 표면에서 모든 착색제가 제거됨으로써, 원래의 솔더볼(2') 색채로 복귀된다.On the other hand, the colorant formed by mixing such organic compounds, dyes, pigments, etc. are all volatilized and removed by the high temperature environment during the reflow of the solder ball (2). That is, the solder ball 2 has a predetermined color after the solder ball 2 is bumped onto the circuit board 6 by flux as shown in FIG. 3A (before reflowed), but as shown in FIG. 3B. After 2 'is completely attached to the circuit board 6 by reflow, all colorants are removed from the surface of the solder ball 2', thereby returning to the original solder ball 2 'color.
물론, 여기서 상기 솔더볼(2)은 그 종류 즉, 크기 및 금속 조성에 따라 서로 다른 색채로 착색된다. 예를 들면, 납이 없는 솔더볼의 경우 청색으로 착색함으로써, 일반적인 주석 및 납으로 만들어진 회색의 솔더볼과 쉽게 구분할 수 있도록 할 수 있다.Of course, the solder ball 2 is colored in different colors according to the type, that is, the size and the metal composition. For example, lead-free solder balls can be colored blue, making it easier to distinguish them from gray solder balls made of ordinary tin and lead.
계속해서, 종래의 일반 솔더볼과 본 발명에 의해 착색된 솔더볼이 회로기판에 리플로우 즉, 융착된 후의 전단응력 테스트 결과는 아래 표와 같다.Subsequently, the shear stress test results after the conventional general solder balls and the solder balls colored by the present invention are reflowed or fused to the circuit board are shown in the following table.
상기 표와 같이 종래 일반 솔더볼의 전단응력 평균은 1880.2이고, 본 발명의 솔더볼의 전단응력 평균은 1879로서 별 차이가 없음을 알 수 있다. 또한, 신뢰지수에 있어서도 종래는 2.35이고, 본 발명은 2.11로서 별 차이가 없음을 알 수 있다. 따라서, 본 발명에 의한 착색된 솔더볼도 리플로우 후에 전단 응력 테스트를 쉽게 통과할 수 있음을 알 수 있다.As shown in the above table, the shear stress average of the conventional general solder ball is 1880.2, and the shear stress average of the solder ball of the present invention is 1879. In addition, in the confidence index, the prior art is 2.35, and the present invention is 2.11. Therefore, it can be seen that the colored solder balls according to the present invention can also pass the shear stress test easily after reflow.
더불어, 도4에 도시된 바와 같이 본 발명에 의한 솔더볼(2')의 리플로우 후에는, 그 솔더볼(2')의 내측에 어떠한 보이드(void)도 형성되지 않음을 확인 할 수 있다. 따라서, 본 발명에 의한 솔더볼(2')은 비록 착색이 되어 있다고 해도 품질면에서는 종래에 비해 떨어지지 않음을 알 수 있다.In addition, as shown in FIG. 4, after the reflow of the solder ball 2 'according to the present invention, it can be confirmed that no voids are formed inside the solder ball 2'. Therefore, it can be seen that the solder ball 2 'according to the present invention does not deteriorate compared to the conventional one even though it is colored.
도면중 미설명 부호 8은 구리 배선패턴이고, 10은 구리 배선패턴과 솔더볼 사이의 계면(10)을 도시한 것이다.In the figure, reference numeral 8 is a copper wiring pattern, and 10 is an interface 10 between the copper wiring pattern and the solder ball.
한편, 이러한 본 발명에 의한 솔더볼의 제조 방법을 설명하면 다음과 같다.On the other hand, when describing the manufacturing method of the solder ball according to the present invention.
먼저, 종래와 같이 주석, 납 또는 주석만을 이용하여 대략 원형으로 솔더볼을 융용하여 냉각시킨다.First, the solder balls are melted and cooled in an approximately circular shape using only tin, lead, or tin as in the related art.
그런후, 상기 원형의 솔더볼을 유기화합물과 염료가 혼합된 대략 25~50℃의 온도를 갖는 착색제에, 대략 1~5분 정도 담근 후 빼내어 건조시킴으로써, 솔더볼의 표면이 소정 색채로 착색되도록 한다.Thereafter, the circular solder ball is immersed in a colorant having a temperature of about 25 to 50 ° C. in which an organic compound and a dye are mixed, and then removed by drying for about 1 to 5 minutes, so that the surface of the solder ball is colored in a predetermined color.
물론, 이러한 착색은 솔더볼의 종류 즉, 솔더볼의 크기, 금속 조성에 따라 각각 다른 색채로 착색함으로써, 일견하여 솔더볼의 종류를 알 수 있도록 한다.Of course, such coloration is colored by different colors depending on the type of solder ball, that is, the size of the solder ball and the metal composition, so that the type of the solder ball can be seen at a glance.
계속해서, 본 발명에 의한 착색된 솔더볼의 이베포레이션 방법을 설명하면 다음과 같다.Next, the evaporation method of the colored solder ball by this invention is demonstrated.
먼저, 상술한 바와 같이 대략 구체의 솔더볼 표면에 착색제가 입혀지도록 한다. 즉, 유기화합물에 소정 색채의 염료 또는 안료가 함유되어 이루어진 착색제가 솔더볼의 표면에 입혀지도록 한다.First, as described above, the colorant is coated on the surface of the solder ball of the sphere. That is, the colorant made by containing the dye or pigment of a predetermined color in the organic compound is coated on the surface of the solder ball.
이어서, 상기 솔더볼을 회로기판에 플럭스로 범핑하여 임시 고정시킨다.Subsequently, the solder ball is temporarily fixed by bumping the circuit board with flux.
이어서, 상기와 같이 솔더볼이 범핑된 회로기판을 대략 150~260℃의 온도를 갖는 퍼니스(furnace)에 투입하고, 대략 30~60초 동안 리플로우(reflow)시킴으로써, 상기 솔더볼의 표면에 착색된 착색제가 모두 이베포레이션되도록 한다.Subsequently, the colorant colored on the surface of the solder ball was put into a furnace having a solder ball bumped circuit board as described above in a furnace having a temperature of approximately 150 to 260 ° C. and reflowed for approximately 30 to 60 seconds. Ensures that all are evaporated.
상기와 같은 이베포레이션에 의해 상기 솔더볼과 회로기판 또는 솔더볼과 외부장치의 전기적 접속에, 상기 착색제가 방해 요인으로 작용하지 않게 된다.By this evaporation, the colorant does not act as an obstacle to the electrical connection between the solder ball and the circuit board or the solder ball and the external device.
이상에서와 같이 본 발명은 비록 상기의 실시예에 한하여 설명하였지만, 본 발명은 이것으로만 한정되는 것은 아니며, 본 발명의 범주와 사상을 벗어나지 않는 범위내에서 여러가지로 변형된 실시예도 가능할 것이다.As described above, the present invention has been described with reference to the above embodiments, but the present invention is not limited thereto, and various modified embodiments may be possible without departing from the scope and spirit of the present invention.
따라서, 본 발명에 의한 반도체패키지용 솔더볼 및 그 제조 방법, 그리고 솔더볼의 이베포레이션 방법에 의하면, 다른 종류의 솔더볼에는 다른 색채가 착색되어 있음으로써, 다른 크기 및 다른 금속 조성의 솔더볼을 쉽게 구분할 수 있는 효과가 있고 또한 솔더의 리플로우 전에는 표면이 착색제로 덮혀 있음으로써, 공기 노출로 인한 산화도 방지할 수 있는 효과가 있다.Therefore, according to the solder ball for semiconductor package according to the present invention, a manufacturing method thereof, and an evaporation method of the solder ball, different types of solder balls are colored, so that solder balls of different sizes and different metal compositions can be easily distinguished. In addition, the surface is covered with a coloring agent before the reflow of the solder, thereby preventing the oxidation due to air exposure.
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KR10-2002-0026778A KR100461949B1 (en) | 2002-05-15 | 2002-05-15 | solder ball for a semiconductor package and its manufacturing method, and evaporation method of solder ball |
TW92112263A TWI229931B (en) | 2002-05-15 | 2003-05-06 | Solder ball and conductive wire for a semiconductor package, and its manufacturing method, and its evaporation method |
JP2003129272A JP3740507B2 (en) | 2002-05-15 | 2003-05-07 | Solder ball for semiconductor package, conductive wire for semiconductor package, and manufacturing method thereof |
US10/437,749 US6888242B2 (en) | 2002-05-15 | 2003-05-14 | Color contacts for a semiconductor package |
US11/038,756 US7145251B2 (en) | 2002-05-15 | 2005-01-19 | Colored conductive wires for a semiconductor package |
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KR20000059112A (en) * | 2000-07-14 | 2000-10-05 | 이충원 | Manufacturing method and equipment of solder ball |
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KR930010438A (en) * | 1991-11-14 | 1993-06-22 | 민화식 | High pyrolysis incinerator of industrial waste |
JP2002026512A (en) * | 2000-07-03 | 2002-01-25 | Anritsu Corp | Printed solder inspection device |
KR20000059112A (en) * | 2000-07-14 | 2000-10-05 | 이충원 | Manufacturing method and equipment of solder ball |
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