KR100461725B1 - Chip type gps module - Google Patents

Abstract

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip-type GPS module, wherein a GPS module mounted on a main board of a small communication device includes at least one semiconductor IC mounted on an upper and a lower surface, and formed with connection grooves formed on left and right sides thereof. ; A protective cover having an opening having a lower opening to cover and protect the module substrate and protruding from left and right sides of the connecting piece assembled to the connecting groove; And a block-shaped lead portion having a rectangular cross section disposed parallel to each of the left and right sides of the semiconductor IC, one end of which is soldered to one side of the module substrate, and the other end of which is soldered to the upper surface of the main substrate.

According to the present invention, it is possible to reduce the space occupied by the module board mounted on the main board of a small communication device such as a cellular phone and a portable transceiver, thereby miniaturizing the device and reducing the manufacturing cost, thereby improving the price competitiveness.

Description

Chip type GPS module {CHIP TYPE GPS MODULE}

The present invention relates to a chip-type GPS module, and more particularly, to reduce the occupied space of the module board mounted on the main board of a small communication device such as a mobile phone and a portable transceiver device, to miniaturize the device, and to reduce the manufacturing cost The present invention relates to a chip-type GPS module capable of improving price competitiveness.

In general, the GPS (Global Positioning System) finds the time when the radio waves from satellites that are around 24 thousand kilometers above the ground reach the receiving device equipped with GPS module on the ground. Finding the exact location by measuring the current position and distance of the target.

Since the GPS is mounted on a vehicle and performs an independent function, the GPS is composed of one assembly including various parts such as various power supply units, monitor terminals, and receiver units. The GPS assembly of this structure is shown in FIG.

1 is a perspective view illustrating a GPS assembly equipped with a conventional GPS module. As illustrated, the GPS assembly 100 provided in a small communication device includes various terminals mounted thereon, and a main circuit 112 having various circuit patterns formed thereon. And a GPS module 120 mounted on an upper surface thereof, and the GPS module 120 includes a module substrate 121 on which a semiconductor IC 123, which is a GPS signal component, is mounted on a front or rear surface thereof and protects the same. It consists of a protective cover 122 and a fixed bar (125) extending downward from the protective cover to be fixed to the fixing groove (not shown) of the main substrate 112.

The upper and lower portions of the main board 112 are protected by upper and lower covers, which are not shown, and the power supply and the connection terminal with other devices are formed on the main board of the product such as a terminal.

The conventional GPS module 120 as described above has been conventionally used for a vehicle, but recently, it is being used in a small communication device such as a mobile communication terminal as well as a vehicle, and recently used mobile communication terminals have been miniaturized and multifunctional. In accordance with the trend of the trend has become a complex product with the addition of a GPS system module. The GPS module 120 has been installed in the mobile communication terminal in accordance with this trend, and accordingly a more compact GPS module This is required.

2 (a) and 2 (b) are a front view and a longitudinal cross-sectional view of a conventional GPS module, in which semiconductor ICs 123a are mounted on front and rear surfaces thereof, respectively, and a GPS antenna 126 is mounted at a position adjacent thereto. GPS module 120a composed of a module substrate 121a and a protective cover 122a protecting the same.

3 (a) and 3 (b) are a front view and a longitudinal cross-sectional view of another conventional GPS module, in which a semiconductor IC 123b is mounted on a front surface thereof and a lead part electrically connected to a main board at a position adjacent thereto. Another GPS module 120b composed of a module substrate 121b on which 127 is mounted and a protective cover 122b protecting the same.

However, in order to reduce the volume of the finished communication device in the structure of the conventional GPS module (120a) (120b) to reduce the size, the semiconductor IC (123a) mounted on the substrate the size of the module substrate (121a, 121b) provided in the GPS module (123b) should be reduced to the size of the module board 121a, 121b, the sufficient space occupied by the GPS antenna 126 or the lead unit 127 is installed on the module board (121a) (121b), so as not to interfere with the module Since the semiconductor ICs 123a and 123b must be mounted on the substrates 121a and 121b, there is a limit in miniaturizing the GPS module 120a and 120b to the size of the semiconductor IC.

In addition, the protective covers 122a and 122b mounted to protect the semiconductor ICs 123a and 123b provided on the front surfaces of the module substrates 121a and 121b are provided with fixed bars extending a predetermined length from their lower ends. This was assembled in the fixing groove of the main substrate 112. However, during the assembling process of coupling the main board 112 and the GPS module 120a and 120b to each other, there is a difficulty in assembling the fixing bar to be accurately fitted into the fixing groove of the main board 112. Due to the bending of the bar, problems such as unexpected contact failures occur.

In addition, when the fault bars 125a and 125b of the GPS module 120a and 120b are bent at right angles and soldered to the main board 112, the fixing bars 125a and 125b are bent. Since the reverse bending process is very difficult and the reverse banding mold has to be added, there is a problem of increasing the manufacturing cost of the GPS module product.

The present invention is to solve the above problems, miniaturization of the GPS module by improving the lead portion mounted on the module substrate so that the size of the module substrate mounted on the main substrate can be miniaturized to the size of the semiconductor IC mounted on the module substrate It is possible to provide a chip-type GPS module which can simplify the process of mounting the GPS module on the main board of the small communication device, and the mounting process is more easily performed, and at the same time reduce the manufacturing cost.

1 is a perspective view showing a GPS assembly equipped with a conventional GPS module,

2 shows a conventional GPS module,

a) is a front view,

b) section,

3 shows another embodiment of the conventional GPS module,

a) is a front view,

b) section,

4 illustrates a chip type GPS module according to the present invention.

a) is a side view,

b) a top view;

c) is the rear view

d) is a longitudinal cross-sectional view,

5 is an assembly view showing a chip-type GPS module according to the present invention,

6 is an exploded perspective view showing a chip-type GPS module according to the present invention;

FIG. 7 illustrates a lead unit employed in a chip type GPS module according to the present invention.

a) is a perspective view,

b) rear view

c) partial detail.

Explanation of symbols on the main parts of the drawings

10 ..... Module board 12a, 12b ... Connecting groove

15 ..... Semiconductor IC 20 ..... Protective Cover

22a, 22b ... Connecting part 22 ..... Embossing

24 ..... Protrusion 30a, 30b ... Lead

33 ..... Grooves 112 .... Main Board

As a construction means for achieving the above object, the present invention

In the GPS module mounted on the main board of the small communication device,

A module substrate having at least one semiconductor IC mounted on upper and lower surfaces, and having connection grooves formed at right and left sides thereof;

A protective cover having an opening having a lower opening to cover and protect the module substrate and protruding from left and right sides of the connecting piece assembled to the connecting groove; And

And a block-shaped lead portion having a rectangular cross section disposed parallel to each of the left and right sides of the semiconductor IC and having one end soldered to one side surface of the module substrate and the other end soldered to the upper surface of the main substrate. By providing a GPS module.

Hereinafter, the present invention will be described in more detail with reference to the accompanying drawings.

Figure 4 (a) (b) (c) (d) is a side view, a plan view, a rear view and a longitudinal view showing a chip-type GPS module according to the present invention, Figure 5 shows a chip-type GPS module according to the present invention 6 is an exploded perspective view showing a chip-type GPS module according to the present invention.

4 to 6, the GPS module 1 according to the present invention, the module substrate 10 is mounted on the upper and lower, respectively, various GPS components, a protective cover 20 to cover and protect the module and the module It includes a lead portion (30a, 30b) interposed to electrically connect between the substrate 10 and the main substrate 112.

That is, the module substrate 10 has at least one semiconductor IC 15 is mounted on the front or back and both sides, the connecting grooves (12a) (12a) is assembled to the connecting pieces (22a, 22a) described later on both sides It is constituted by forming a material inward.

The module substrate 10 is a printed circuit board of a conventional material, the components mounted on the substrate 10 is a double-sided mounting board mounted at the same time on the upper and lower surfaces of the substrate 10, the module substrate 10 is It is usually constructed in the form of a rectangle.

In addition, the protective cover 20 is the upper surface is sealed in a rectangular rectangular box like the module substrate 10 while the lower surface is removed, that is, the opening 23 is formed in the lower, the opening ( 23, a module substrate 10 in which the semiconductor IC 15 is mounted on one side of the semiconductor IC 15 in a ball grid array (BGA) manner is inserted.

In addition, the left and right sides of the protective cover 20 are connected to the openings 23 to the connecting pieces 22a and 22b which are assembled to correspond to the connection grooves 12a and 12b formed on the left and right sides of the module substrate 10. Each of the embossing 22 is formed to extend to a predetermined length, the inner side of the connecting piece (22a, 22b) is elastically fixed to the connecting grooves (12a, 12b), and soldered to the module substrate (10) Protruding to form, the embossing 22 is soldered so that the module substrate 10 and the protective cover 20 is firmly fixed.

Here, the upper inner surface of the protective cover 20 and the upper surface of the component mounted on the module substrate 110 should not be in contact with each other, which is the module substrate ( This is to protect the parts on the top 10). To this end, the module substrate 10 when the connecting pieces 22a and 22b and the connecting grooves 12a and 12b are coupled to the left and right sides of the protective cover 20 which are not formed of the connecting pieces 22a and 22b. At least one or more height regulating protrusions 24 on the mountain cross section are formed to protrude from the lower end portion on the surface of the module substrate 10 to regulate the height between the surface of the module substrate 10 and the upper inner surface of the protective cover 20. .

Meanwhile, lead portions 30a and 30b electrically connecting the module substrate 10 and the main substrate 112 may be formed on both left and right sides of the semiconductor IC 15 mounted on the upper surface of the module substrate 10. They are arranged in parallel to each other and one end is soldered to the upper surface of the module substrate 10, and the opposite end of the opposite end is formed in a block shape on the square end surface soldered to the upper surface of the main substrate 112. In this case, the lead portions 30a and 30b may be formed on the left and right sides of the semiconductor IC 15 such that the outer surfaces thereof form a predetermined size interval which does not come into contact with each side of the corresponding semiconductor IC 15. Each is installed.

In this case, the module substrate 10 may be formed by block-type lead portions 30a and 30b on a rectangular cross-section arranged side by side without interference on the left and right sides of the semiconductor IC 15 mounted on the upper surface of the module substrate 10. Since the space occupied by the leads 30a and 30b can be minimized on the upper surface, the size of the module substrate 10 can be reduced to almost close to the semiconductor IC 15. Therefore, the GPS module 1 provided in a small communication device is provided. By reducing the size of the finished product can be made smaller.

The lead portions 30a and 30b, which are arranged side by side on both sides of the semiconductor IC 15 and soldered to the upper surface of the module substrate 10 once, are mounted on the upper surface of the main substrate in the most accurate chip mount manner. You can do it.

In addition, the module substrate 10 on which the semiconductor IC 15 and the protective cover 20 are mounted is easily mounted on the main board by soldering the other end of the lead portions 30a and 30b, one end of which is soldered to its main surface. It can be. This is the same as mounting a general chip, and provides a structure that can handle a GPS module like a general chip.

In this case, the GPS module can be easily and quickly assembled in the same way as forming a solder ball to mount several chip components on the main board and mounting the chip thereon, while simplifying the structure of the main board. Can be.

Meanwhile, the height H from the upper surface of the module substrate 10 on which the semiconductor IC 15 is mounted to the upper end of the lead portions 30a and 30b is measured by the upper end of the semiconductor IC 15 and the main substrate. In order to prevent damage to components due to contact between the upper surfaces, it is preferable that the height of the module substrate 10 is greater than the height h from the upper surface of the semiconductor IC 15.

The length L of the lead portions 30a and 30b is preferably shorter than the length L1 of the side of the semiconductor IC 15 so as not to protrude to both ends of the semiconductor IC 15.

7 (a), (b) and (c) are a perspective view, a rear view, and a partial detail view of a lid unit employed in the chip type GPS module according to the present invention.

As shown in FIGS. 7A, 7B and 7C, the lead portions 30a and 30b have grooves 33 having arc-shaped cross sections so as to easily plate conductive lines for mask connection on both sides of the length side. ) Form a plurality of compounds at equal intervals.

In this case, the circuit pattern formed on the upper surface of the main substrate and the circuit pattern and the plurality of portions formed on the upper side mask M of the lead portions 30a and 30b soldered on the plurality of portions and the upper surface of the module substrate 10. The mask connection is plated on the surfaces of the grooves 33 formed on the left and right sides of the lead portions 30a and 30b, respectively, between the lower side masks M of the lead portions 30a and 30b to be soldered at It is electrically connected to each other by a conductive line.

Here, the width W of the groove 33 is a mask connection conductive line for electrically connecting the upper and lower masks M formed on the upper and lower surfaces of the lead portions 30a and 30b. It is preferable to form wider than the width (W1) of the mask (M) so that the plating operation can be performed more easily.

In this case, one end of the lead portions 30a and 30b having the recess 33 is soldered to the upper surface of the module substrate 10, and the other end of the lead portions 30a and 30b is connected to the upper portion of the main substrate. Conductive line for mask connection in order to electrically connect the upper and lower masks M of the lead parts 30a and 30b to each other in a state of being mounted in a chip mount type with a cream solder on the surface. The operation of applying this is more easily performed by the groove 33 having a wider width W.

In addition, the distance (D) between the grooves 33 facing each other at the left and right length sides of the lead portions 30a and 30b may form a wider mask surface when soldering with the main substrate and the module substrate. It is preferable to form so as to be close to the thickness T of the lead portions 30a and 30b.

In this case, one end of the lead portions 30a and 30b having the recess 33 is soldered to the upper surface of the module substrate 10, and the other end of the lead portions 30a and 30b is connected to the upper portion of the main substrate. Soldering in a chip mount type with a cream solder on the surface has a larger mask contact area due to the distance D between the grooves 33 designed to be close to the thickness T of the lead portions 30a and 30b. Therefore, it is possible to solder the main board firmly by increasing the soldering contact property.

According to the present invention as described above, the semiconductor IC is mounted on the module substrate, the block-shaped lead portion of the rectangular cross section in which the upper surface is soldered to the left and right sides of the module substrate and the lower surface is soldered to the upper surface of the main substrate. By arranging in parallel to the left and right sides of the substrate, the size of the module substrate can be reduced to match the size of the semiconductor IC, thereby making it possible to miniaturize a small communication device employing the same.

In addition, the chip mount method allows the GPS module to be mounted on the main board of a small communication device accurately and easily, thereby simplifying the assembly process and making the mounting work easier, thereby reducing manufacturing costs. Is obtained.

While the invention has been shown and described with respect to particular embodiments, it will be understood that various changes and modifications can be made in the art without departing from the spirit or scope of the invention as set forth in the claims below. It will be appreciated that those skilled in the art can easily know.

Claims (8)

In the GPS module mounted on the main board of the small communication device, A module substrate having at least one semiconductor IC mounted on upper and lower surfaces, and having connection grooves formed at right and left sides thereof; A protective cover having an opening having a lower opening to cover and protect the module substrate and protruding from left and right sides of the connecting piece assembled to the connecting groove; And And a block-shaped lead portion having a rectangular cross section disposed parallel to each of the left and right sides of the semiconductor IC and having one end soldered to one side surface of the module substrate and the other end soldered to the upper surface of the main substrate. GPS module. The method of claim 1, Chip-type GPS module, characterized in that the inner surface of the connecting piece is elastically fixed to the connecting groove, each embossing is soldered to the module substrate. The method of claim 1, On the left and right sides of the protective cover, which is not formed with the connecting piece, at least one or more height regulating protrusions 24 are formed on the mountain sectional surface to restrict the height between the surface of the module substrate and the upper inner surface of the protective cover. Chip type GPS module characterized by. The method of claim 1, The height from the upper surface of the module substrate on which the semiconductor IC is mounted to the upper end of the lead portion is greater than the height from the upper surface of the module substrate to the upper end of the semiconductor IC so as to prevent contact between the upper end of the semiconductor IC and the upper surface of the main substrate. Chip type GPS module characterized by. The method of claim 1, The length of the lead portion is chip-shaped GPS module, characterized in that formed shorter than the length of the side of the semiconductor IC so as not to protrude to both ends of the semiconductor IC. The method of claim 1, The lead unit is a chip-type GPS module, characterized in that to form a plurality of grooves on the arc-shaped cross-section at equal intervals so as to easily plate the conductive line for connecting the mask on the left and right sides of the length side. The method of claim 6, The width of the groove is chip-shaped GPS, characterized in that the width of the mask is formed wider than the width of the mask so as to facilitate the plating operation of the mask connection conductive line electrically connecting the upper and lower side masks formed on the upper and lower surfaces of the lead portion module. The method of claim 6, Chip distance GPS module characterized in that the distance between the grooves facing each other at the left and right length sides of the lead portion is designed to be close to the thickness of the lead portion to form a wider mask surface when soldering with the main substrate, the module substrate.