KR100441517B1 - Manufacturing method of plasma display panel - Google Patents

Abstract

Provided are a method of manufacturing a plasma display panel which minimizes the thickness distribution of the dielectric layer and simultaneously forms the dielectric layer and the electrode on the substrate. A method of manufacturing a plasma display panel according to the present invention includes the steps of preparing a dielectric film having a predetermined thickness with flat upper and lower surfaces; Forming a plurality of electrode grooves corresponding to the electrode patterns on one surface of the dielectric film; Filling an electrode material into the electrode groove; Stacking a dielectric film over the substrate such that one side of the dielectric film filled with the electrode material contacts the substrate; Firing the electrode material and the dielectric film simultaneously to fix the electrode and the dielectric film on the substrate.

Description

Manufacturing Method of Plasma Display Panel {MANUFACTURING METHOD OF PLASMA DISPLAY PANEL}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a plasma display panel, and more particularly, to a method of manufacturing a plasma display panel that can uniformly form a dielectric layer and simultaneously form a dielectric layer and an electrode on a substrate.

In general, a plasma display panel (hereinafter referred to as a 'PDP' for convenience) is a display device that emits a phosphor by vacuum ultraviolet rays generated by gas discharge and implements a predetermined image. It is attracting attention as the next generation thin display device.

FIG. 8 is an exploded perspective view of a PDP according to the prior art, in which a plurality of address electrodes 3 are arranged in a stripe pattern along the X-axis direction of the PDP rear substrate 1, covering the address electrodes 3. White dielectric layer 5 is formed. A plurality of partitions 7 are arranged in a stripe pattern between each address electrode 3 on the white dielectric layer 5, and R, G, and B fluorescent layers 9 are positioned between the two partitions 7.

On the inner surface of the front substrate 11 facing the rear substrate 1, a plurality of transparent electrodes 13 and bus electrodes 15 are arranged in a stripe pattern along the Y-axis direction of the drawing, and the transparent electrodes 13 and The transparent dielectric layer 17 and the MgO protective layer 19 are positioned while covering the bus electrodes 15.

At this time, the transparent electrode 13 is a conventional indium tin oxide (ITO) film having a large surface area is used in order to enlarge the discharge region and increase the transmittance of visible light, the bus electrode 15 is conductive Made of good silver (Ag) paste to complement the conductivity of the transparent electrode 13.

The front and rear substrates 1 and 11 are filled with a discharge gas into a space partitioned by the partition wall 7 after assembly, and any one of the address electrodes 3 facing the discharge space therebetween, and the address electrodes 3 ), A pair of transparent electrodes 13 perpendicular to each other serve as a display electrode and a scan electrode to form a PDP cell.

As a method of forming the white dielectric layer 5 and the transparent dielectric layer 17 among the above-mentioned PDPs, a printing method of printing glass frit using a known printing machine and a screen mask, and film formation of the glass frit A so-called green sheet method is used in which a film is coated on a substrate using a dry film resist (DFR) laminating film.

However, both the printing method and the green sheet method are affected by the dielectric layer quality by the thickness of the electrode pre-formed on the substrate. That is, as shown in FIG. 9, the front substrate 11 is taken as an example. In the transparent dielectric layer 17 formed on the front substrate 11, the part where the bus electrode 15 is located is particularly the part where the bus electrode 15 is not present. It is formed thicker, causing a thickness dispersion (d) of about ± 3 μm or more.

In accordance with the thickness distribution of the transparent dielectric layer 17, the stable discharge inherent in the dielectric layer accumulating surface charges is inhibited, and the voltage margin and withstand voltage characteristics are lowered. When the PDP cell is turned on, the thickness distribution of the transparent dielectric layer 17 is caused. The appearance of spots, etc., greatly reduces the display quality of the PDP.

In addition, the conventional PDP manufacturing method first forms an electrode on the substrate, and then the dielectric layer is manufactured by the printing method or the green sheet method described above. In particular, the printing method described above is performed several times in several printing, drying and firing processes to obtain a desired dielectric layer thickness. PDP production process, such as have to go through has a disadvantage.

Accordingly, the present invention is to solve the above problems, an object of the present invention is to solve the thickness variation of the dielectric layer to implement a stable discharge characteristics, to improve the display quality of the plasma display panel, such as securing voltage margin and withstand voltage characteristics The present invention provides a method for manufacturing a plasma display panel.

Another object of the present invention is to provide a method of manufacturing a plasma display panel which can simplify the manufacturing process of a plasma display panel by simultaneously forming an electrode and a dielectric layer on a substrate.

1 is a process flowchart showing a method of manufacturing a plasma display panel according to the present invention.

2 to 7 are schematic views at each step for explaining a method for manufacturing a plasma display panel according to the present invention.

8 is an exploded perspective view of a plasma display panel according to the prior art.

9 is a partially enlarged view of the front substrate shown in FIG. 8;

In order to achieve the above object, the present invention,

Preparing a dielectric film having a predetermined thickness having a flat upper and lower surface, forming a plurality of electrode grooves corresponding to an electrode pattern on one surface of the dielectric film, filling an electrode material inside the electrode groove, and Stacking a dielectric film on the substrate such that one surface of the material-filled dielectric film is in contact with the substrate, and simultaneously firing the electrode material and the dielectric film to fix the electrode and the dielectric film on the substrate to manufacture the plasma display panel. Provide a method.

And forming an electrode groove in the dielectric film includes preparing a mold having a plurality of iron portions corresponding to the electrode pattern, placing the mold on the dielectric film so that the iron portions of the mold face the dielectric film, and placing the mold on the dielectric film at a predetermined pressure. After pressing on the film, the mold is separated from the dielectric film.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is a flowchart illustrating a method of manufacturing a plasma display panel (hereinafter, referred to as 'PDP' for convenience) according to an embodiment of the present invention, and FIGS. 2 to 8 illustrate a method of manufacturing a PDP according to the present embodiment. As a schematic diagram at each step, the present invention particularly provides a method of forming an electrode and a dielectric layer over a substrate.

First, as illustrated in FIG. 2, a dielectric film 2 having a predetermined thickness having both upper and lower surfaces is prepared. The dielectric film 2 is preferably a DFR laminating film obtained by laminating glass frit several times.

In this case, when manufacturing a transparent dielectric layer formed on the front substrate, a dielectric film made of transparent glass frit is used, and when producing a white dielectric layer formed on the rear substrate, a dielectric film made of white opaque glass frit is used.

Although the thickness T of the dielectric film 2 is somewhat different depending on the desired dielectric layer thickness, the dielectric film for preparing the transparent dielectric layer is about 60 to 70 μm and the dielectric film for producing the white dielectric layer is about 20 to 30 μm. It is preferable to consist of thickness.

And as shown in FIG. 3, the metal mold | die 4 for forming an electrode groove in the dielectric film 2 is prepared. The mold 4 has a plurality of convex portions 6 corresponding to the electrode patterns, and the convex portions 6 correspond to the electrode patterns of the bus electrodes in the front substrate and the address electrodes in the rear substrate. It is formed to have a similar height, width, and spacing.

Thus, the mold 4 is placed on the dielectric film 2 so that the convex portion 6 of the mold 4 faces the dielectric film 2, and the mold 4 is pressed onto the dielectric film 2 at a predetermined pressure. Next, when the mold 4 is removed, a plurality of electrode grooves 2a corresponding to the convex portions 6 of the mold 4 are constantly formed on the surface of the dielectric film 2.

At this time, the depth t of the electrode groove 2a is preferably formed to be approximately 10 to 15 µm in consideration of the height of the electrode and the dielectric layer after the firing step described below.

Next, as shown in FIG. 4, a predetermined amount of an electrode material 8, for example, silver (Ag) paste, is injected into the electrode groove 2a of the dielectric film 2 to form the electrode groove 2a. Fill with). A well-known dispenser (not shown) may be used to inject the electrode material 8, and the electrode material 8 is filled, and then dried.

The dielectric film 2 includes a plurality of electrode materials 8 to be electrodes later on one surface where the electrode grooves 2a are formed through the above-described process, and one surface of the dielectric film 2 on which the electrode materials 8 are formed. The dielectric film 2 is laminated on the substrate so as to contact the front substrate or the back substrate so that the electrode and the dielectric layer are formed at the same time.

That is, as shown in FIG. 5, when the dielectric film 2 is attached to the front substrate 10, a plurality of patterned transparent electrodes 12 are previously formed on one surface of the front substrate 10, and the front substrate ( When the dielectric film 2 is laminated on the front substrate 10 so that the transparent electrode 12 of the 10 and the dielectric film 2 come into contact with each other, the electrode material 8 of the dielectric film 2 functions as a bus electrode. .

In addition, as shown in FIG. 6, when the dielectric film 2 ′ is attached to the rear substrate 14, the electrode material 8 ′ of the dielectric film 2 ′ contacts the surface of the rear substrate 14. When the dielectric film 2 'is laminated on the back substrate 14, the electrode material 8' of the dielectric film 2 'functions as an address electrode.

Finally, the substrate on which the dielectric film 2 is laminated is put into a firing furnace of approximately 550 to 580 ° C. for 15 to 20 minutes to simultaneously fire the electrode material 8 and the dielectric film 2. This fixes the electrode material 8 and the dielectric film 2 on the substrate to complete the electrode and dielectric layer.

For example, when the transparent dielectric layer 16 is formed on the front substrate 10 as shown in FIG. 7, the thickness of the transparent dielectric layer 16 after firing is 30 to 35 μm, and the thickness of the bus electrode 18 is 5. In and out of the micrometer, a desired thickness can be easily secured.

Since the transparent dielectric layer and the white dielectric layer manufactured as described above have almost no thickness distribution by the electrode, the transparent dielectric layer and the white dielectric layer are formed to have a uniform thickness over the entire surface of the substrate, and minimize surface roughness to improve surface uniformity.

Although the preferred embodiments of the present invention have been described above, the present invention is not limited thereto, and various modifications and changes can be made within the scope of the claims and the detailed description of the invention and the accompanying drawings. Naturally, it belongs to the range of.

As described above, according to the present invention, it is possible to easily fabricate a dielectric layer having a uniform thickness with little thickness distribution by the electrode. Accordingly, the quality of the PDP is improved by stabilizing charge movement in the dielectric layer, thereby stabilizing the discharge of the PDP cell, and improving voltage margin and withstand voltage characteristics. In addition, the present invention has the advantage that the PDP fabrication process is simplified by simultaneously forming the electrode and the dielectric layer on the substrate.

Claims (9)

Preparing a dielectric film having a predetermined thickness on which upper and lower surfaces are flat; Forming a plurality of electrode grooves corresponding to an electrode pattern on one surface of the dielectric film; Filling an electrode material into the electrode groove and drying the electrode material to form an electrode; Stacking a dielectric film on a substrate such that one surface of the dielectric film on which the electrode is formed is in contact with the substrate; And Firing the electrode and the dielectric film simultaneously to fix the electrode and the dielectric film on a substrate. The method of claim 1, A method of manufacturing a plasma display panel wherein the dielectric film is made of transparent glass frit. The method of claim 1, A method of manufacturing a plasma display panel wherein the dielectric film is made of opaque white glass frit. The method of claim 2, A method of manufacturing a plasma display panel wherein the dielectric film has a thickness of 60 to 70 µm. The method of claim 3, wherein A method of manufacturing a plasma display panel wherein the dielectric film has a thickness of 20 to 30 µm. The method of claim 1, Forming an electrode groove in the dielectric film, Preparing a mold having a plurality of convex portions corresponding to the electrode patterns; Placing the mold over the dielectric film such that the convex portions of the mold oppose the dielectric film; Pressing the mold onto a dielectric film at a predetermined pressure; And Separating the mold from the dielectric film. The method of claim 1, A method of manufacturing a plasma display panel in which electrode grooves of the dielectric film are formed to have a depth of 10 to 15 μm. The method of claim 1, A method of manufacturing a plasma display panel, wherein the electrode material is made of silver (Ag) paste. The method of claim 1, And the firing step is performed for 10 to 15 minutes in a calcination furnace at 550 to 580 ° C.