KR100406450B1 - Picker block of ball bumping system for manufacturing semiconductor package - Google Patents

Abstract

PURPOSE: A picker block of a ball bumping system for manufacturing a semiconductor package is provided to be capable of independently moving picker units and needles for constantly optimizing bumping condition regardless of the height of a ball. CONSTITUTION: A picker block of a ball bumping system is provided with a cover plate(2) fixed to a transfer part, a block tension part(4) fixed to the cover plate as one piece, a plurality of unit tension parts(6) fixed to the lower surface of the block tension part for independently supplying pressure, and a vacuum suction pipe(10) at the lower portion of all the unit tension parts for supplying vacuum force. The picker block further includes an array block(16) formed on the lower surface of the vacuum suction pipe, and a plurality of needles(18) inserted to through holes(16a) of the array block corresponding to all the unit tension parts. At this time, a micro spring is installed at the upper portion of each needle.

Description

Picker Block of Ball Bumping System for Semiconductor Package

The present invention relates to a picker block of a ball bumping system for manufacturing a semiconductor package. More specifically, the picker unit and the needle of the picker block can be moved up and down independently to always be optimal regardless of the height of the ball to be bumped. The present invention relates to a picker block of a ball bumping system for manufacturing a bumpable semiconductor package.

In general, a ball bumping system for manufacturing a semiconductor package is a thin film of sticky flux on a predetermined area of a substrate, for example, a land, which is a component of a ball grid array semiconductor package, and then picks the balls there. It refers to a system for seating using needles. After the ball is bumped, the substrate is placed in a hot furnace, whereby the flux is volatilized and the ball is fused to the land there.

The ball bumping system includes an on-loader unit that sequentially provides a substrate on a rail, a flux dotting unit for dotting a sticky flux on the substrate, and a ball bumping system that picks up and bumps the ball with a picker block where the flux is doped. The unloading part is configured to transfer the sub-bump bumped into the furnace.

Ball bumping using the ball bumping system is generally performed using a picker block as shown in FIGS. 1A and 1B. The picker block has a plurality of picker units formed in a strip form as shown in FIG. 1B. In the following description, since the picker block is formed by gathering picker units having the same structure, the structure and operation will be described based on one picker unit.

As shown in FIG. 1A, the conventional picker unit 100 ′ has a plurality of needles 18 that pick up balls 22 b ′ from a ball expansion portion 40 ′ on which a plurality of balls 22 b ′ are flat. '), The array block 16' on which one end of the needle 18 'is fixed, and the needle 18' and the array block 16 'are picked up when picking up and bumping the ball 22b'. It consists of a block tension portion 6 'which provides elasticity and a cover plate 2' on which the block tension portion 6 'is supported and fixed. Of course, the cover plate 2 'is connected to a conveying means (not shown) and moves in a desired direction. Here, the needle 18 'is formed with a through hole 20a', and is not vacuumed so that the ball 22b 'does not fall from the needle 18' when the ball 22b 'is picked up by a vacuum providing means (not shown). Keep it.

The picker unit 100 'of this structure is first lowered to the ball expansion portion 40' so that the balls 22b 'come into contact with each needle 18'. Then, a vacuum state is maintained between the needle 18 'and the ball 22b' so that the ball 22b 'is picked up at the end of the needle 18'. The picker unit 100 'is then placed on a substrate 24', which is a component of the semiconductor package. Here, a land 26 'is formed on the substrate 24', and a sticky flux 28 'is pre-dotted on the land 26'. In this state, the picker unit 100 'is lowered toward the substrate 24' so that the block tension portion 6 'receives the elastic force, and each needle 18' contacts each land 26 '. Do it. In more detail, the ball 22b 'stuck to the end of the needle 18' comes into contact with the land 26 'of the substrate 24' under constant pressure, and in this state the needle 18 ') The vacuum inside is released and the cover plate 2' is raised so that the ball 22b 'is bumped into the land 26'. The flux 28 'doted on the land 26' serves to fix the ball 22b 'to the land 26' until the bumped ball 22b 'is fused.

On the other hand, the ball 22b 'used for the bumping is usually performed by receiving balls of various sizes having a predetermined standard deviation. Too large or too small sizes of the balls 22b 'can be filtered by a certain filtering system, but when the balls 22b' are formed of elliptical balls 22a ', the elliptical balls 22a' are difficult to filter. 40 ') are often located together. Therefore, the elliptical ball 22a 'causes various problems when bumping the ball as shown in FIG. That is, the pressure that the needle 18 'presses the upper portion of the land 26' by the tension block part 6 'is calculated based on the height of the ball 22b' of the standard size, which is the elliptical ball 22a '. ) Is greater than the height of the standard size ball 22b ', more pressure acts on the elliptical ball 22a'. As a result, the elliptical ball 22a 'may be broken and bumped or dislodged to another position, or may be completely fixed to the needle 18'. In addition, even when the size of the elliptical ball 22a 'is smaller than the standard size of the ball 22b', the oval ball 22a 'is not in contact with the land 26', thereby causing a problem of falling to another position during bumping and causing a defect. .

Accordingly, the present invention has been made to solve the above-mentioned conventional problems, and each picker unit and the needle of the picker block can be independently movable to provide an optimal bumping environment at all times regardless of the height of the ball to be bumped. To provide a picker block of a ball bumping system for manufacturing a semiconductor package.

Figure 1a is a cross-sectional view showing one picker unit of the picker block of the ball bumping system for manufacturing a conventional semiconductor package, Figure 1b is a partial bottom view of the entire picker block.

2 is a cross-sectional view illustrating a state in which a ball is bumped into a picker block of a ball bumping system for manufacturing a conventional semiconductor package.

Figure 3 is a cross-sectional view showing one picker unit of the picker block of the ball bumping system for manufacturing a semiconductor package according to the present invention.

4 is a cross-sectional view showing main parts of a picker block of a ball bumping system for manufacturing a semiconductor package according to the present invention.

Figure 5 is a state diagram showing the needle and its upper structure in the picker block of the ball bumping system for semiconductor package manufacturing according to the present invention.

-Explanation of symbols for the main parts of the drawings-

PB '; Picker Block 100; Picker Unit

2 ; Cover Plate 4; Block Tension

6; A unit tension unit 8; O-Ring

10; Vacuum suction tube

12; Micro Spring 14; Step

16; Array Block 18; Needle

20a, 16a; Through holes 22a, 22b; ball

24; Substrate 26; Land

28; Flux

According to an aspect of the present invention for achieving the above object, in the picker block of the ball bumping system for semiconductor package manufacturing for bumping the ball on the land of the substrate for the substrate, the transfer means for transporting on the land of the substrate A flat cover plate fixed to the cover plate; A block tension unit integrally fixed to the entire bottom of the cover plate to provide a constant pressure; A unit tension unit fixed to a plurality of units below the block tension unit to apply independent pressure; A vacuum suction tube positioned below all of the unit tension portions to provide a vacuum state; An array block having a plurality of through holes formed on a bottom surface of the vacuum suction pipe; It characterized in that it comprises a plurality of needles are coupled to each of the micro-springs interposed therebetween so as to be able to move up and down independently at the position corresponding to all the unit tension portion in the through hole of the array block.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings such that those skilled in the art may easily implement the present invention.

Figure 3 is a cross-sectional view showing one picker unit of the picker block of the ball bumping system for semiconductor package manufacturing according to the present invention, Figure 4 is a picker block of the ball bumping system for semiconductor package manufacturing according to the present invention pick up the ball land Figure 5 is a state diagram showing a state of bumping, Figure 5 is an enlarged state diagram showing the needle and its upper structure in the picker block of the ball bumping system for semiconductor package manufacturing according to the present invention.

As shown, the picker unit 100 forming the picker block of the ball bumping system for manufacturing a semiconductor package according to the present invention has a flat plate on a conveying means (not shown) for transferring onto the land 26 of the substrate 24 at the top. The cover plate 2 is fixed, and the block tension unit 4 is fixed to the entire bottom of the cover plate 2 so as to provide a constant pressure or tension. The lower part of 4) is fixed to a plurality of unit tension portion 6 to apply each independent pressure or tension (tension), the lower portion of all the unit tension portion 6 during the operation a vacuum state for a certain time In order to provide a vacuum suction tube 10 is formed, the array block 16 is fixed to the bottom surface of the vacuum suction tube 10 is formed with a plurality of through holes (20a), the through hole of the array block (16) All the above on 16a) While bumping the ball 22b on the land 26 of the substrate 24 at a position corresponding to the tension portion 6, the micros may be independently moved up and down to suit the size of the ball 22b. The spring 12 includes a plurality of needles 18 coupled to the upper portion is interposed.

The vacuum suction tube 10 is extended to the outside of the picker block to receive a vacuum from the outside, and the O-ring 8 is formed on the upper portion of the microspring 12 coupled to the upper portion of the needle 18. It is installed to prevent the micro spring 12 from being separated, and the vacuum suction pipe 10 is in communication with all the through holes 20a of the plurality of needles 18 located in the lower portion of the needle 18 to maintain a constant vacuum state. It is provided to the inside, the needle 18 is formed so that the step 14 is formed on the upper portion of the combined portion of the through hole 16a of the array block 16 to prevent the needle 18 from being separated. It is.

Referring to the operation of the present invention having such a configuration as follows.

First, the picker block (only one picker unit 100 of the picker block is shown in FIGS. 3 to 5) is positioned above the ball expansion part by a conveying means, and then the balls 22a contact each end of the needle 18. Descend as much as you can. Subsequently, a vacuum state is provided to the vacuum suction tube 10, and this vacuum state acts up to the through hole 10a in the needle 18 so that the ball 22a is firmly attached to the end of the needle 18.

The picker block is then placed on top of the substrate 24, which is one of the semiconductor package components, by the transfer means so that the position of each land 26 and needle 18 formed on the substrate 24 is different. Set the position to match exactly.

In this state, the picker block is lowered such that the ball 22a attached to the end of the needle 18 is brought into contact with a constant pressure on the land 26 of the substrate 24 by the transfer means. At this time, the flux 28 of the sticky state is put on the land 26 so that the contact ball 22a cannot move to another place.

In more detail, as shown in FIG. 4, the shape of the ball may be microscopically disposed on the upper surface of the needle 18 even when the ball 22b of the standard size or the elliptical ball 22a having different heights is picked up. Since the spring 12 is interposed, the height from the end of the needle 18 to the substrate 24 varies depending on the height of the balls 22a and 22b, respectively. In addition, since the unit tension portion 6 is independently formed on the microspring 12, the needle 18 can be height-adjusted more individually. In addition, the unit tension unit 6 is provided with a block tension unit 4 so that the entire picker block has a constant pressure or tension under the cover plate 2 and moves up and down, so that the picker unit 100 of the picker block itself is also provided. Each height can be adjusted. Therefore, the height of the needle 18, the picker unit 100, the picker block, etc. is individually adjusted according to the height of each of the balls 22a and 22b, so that the ball is smaller than the standard size or larger than the standard size. All the balls 22a and 22b are to be bumped.

Subsequently, when the vacuum state provided to the vacuum suction tube is released, the vacuum state of the needle 18 is also released. In this state, the entire picker block including the needle 18 is moved upward by the transfer means, and the balls 22a, Bumping is completed by freeing 22b) at the end of the needle 18, and the picker block moves back to the ball extension part to repeat the above operation.

As described above, although the present invention has been described with reference to the above embodiments, various modifications may be made by those skilled in the art without departing from the scope and spirit of the present invention.

Therefore, according to the picker block of the ball bumping system for manufacturing a semiconductor package according to the present invention, bumping is provided by a microspring, a unit tension part, a block tension part, and the like, which are coupled to the array block of the picker block so as to be movable up and down. Irrespective of the height of the ball to be pressed, the ball can be pressurized to the land of the substrate at an optimum pressure, thereby increasing the production yield and reliability of the semiconductor package to be manufactured.

Claims (3)

1. A picker block of a ball bumping system for semiconductor package manufacturing, which bumps a ball onto a land of a substrate for semiconductor package, comprising: a flat cover plate fixed to a conveying means for transferring onto the land of the substrate; A block tension unit integrally fixed to the entire bottom of the cover plate to provide a constant pressure; A unit tension unit fixed to a plurality of units below the block tension unit to apply independent pressure; A vacuum suction tube positioned below all of the unit tension portions to provide a vacuum state; An array block having a plurality of through holes formed on a bottom surface of the vacuum suction pipe; The semiconductor package for manufacturing a semiconductor package comprising a plurality of needles are coupled to each of the micro block is interposed on the upper portion so as to be able to move up and down independently at the position corresponding to all the unit tension portion in the through hole of the array block Picker block of ball bumping system. The picker block of the ball bumping system for manufacturing a semiconductor package according to claim 1, wherein the vacuum suction tube communicates with a plurality of needles located at a lower portion thereof to provide a constant vacuum state to the needles. The picker block of the ball bumping system for manufacturing a semiconductor package according to claim 1, wherein the needle is formed by a step formed on an upper portion of the array block.

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