[go: up one dir, main page]
More Web Proxy on the site http://driver.im/

KR100393890B1 - Method and device for cutting non-metallic panel by laser beam using synchronization technology - Google Patents

Method and device for cutting non-metallic panel by laser beam using synchronization technology Download PDF

Info

Publication number
KR100393890B1
KR100393890B1 KR1020020065542A KR20020065542A KR100393890B1 KR 100393890 B1 KR100393890 B1 KR 100393890B1 KR 1020020065542 A KR1020020065542 A KR 1020020065542A KR 20020065542 A KR20020065542 A KR 20020065542A KR 100393890 B1 KR100393890 B1 KR 100393890B1
Authority
KR
South Korea
Prior art keywords
laser beam
conveying
speed
conveying speed
predetermined
Prior art date
Application number
KR1020020065542A
Other languages
Korean (ko)
Inventor
Ki Yong You
Choon Taek Kim
Min Young An
Mi Jee Kim
Original Assignee
Rorze Systems Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rorze Systems Corp filed Critical Rorze Systems Corp
Priority to KR1020020065542A priority Critical patent/KR100393890B1/en
Application granted granted Critical
Publication of KR100393890B1 publication Critical patent/KR100393890B1/en

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/09Severing cooled glass by thermal shock
    • C03B33/091Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/08Severing cooled glass by fusing, i.e. by melting through the glass
    • C03B33/082Severing cooled glass by fusing, i.e. by melting through the glass using a focussed radiation beam, e.g. laser
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/38Removing material by boring or cutting
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/02Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P40/00Technologies relating to the processing of minerals
    • Y02P40/50Glass production, e.g. reusing waste heat during processing or shaping
    • Y02P40/57Improving the yield, e-g- reduction of reject rates

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Optics & Photonics (AREA)
  • Toxicology (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Thermal Sciences (AREA)
  • Laser Beam Processing (AREA)

Abstract

PURPOSE: A method and a device for cutting a non-metallic panel, such as a glass panel by laser beam is provided to obtain uniform and high-quality cut section from the starting point to the end point and to completely separate the cut parts. CONSTITUTION: The method for cutting a non-metallic panel comprises the steps of: forming an initial crack at a starting point to be cut in a desired direction, conveying a cutter along a predetermined cut line at a conveying speed coincided with a first constant velocity zone of a predetermined speed curve, and performing scribing and breaking by using laser beam synchronized with the conveying speed; conveying the cutter along a predetermined line at a conveying speed coincided with an acceleration zone of a predetermined speed curve, and performing scribing and breaking by using laser beam synchronized with the conveying speed and having gradually increasing output; and conveying the cutter along a predetermined line at a conveying speed coincided with a second constant velocity zone having a speed higher than that of the first zone, and performing scribing and breaking by using high-output laser beam synchronized with the conveying speed.
KR1020020065542A 2002-10-25 2002-10-25 Method and device for cutting non-metallic panel by laser beam using synchronization technology KR100393890B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020020065542A KR100393890B1 (en) 2002-10-25 2002-10-25 Method and device for cutting non-metallic panel by laser beam using synchronization technology

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020020065542A KR100393890B1 (en) 2002-10-25 2002-10-25 Method and device for cutting non-metallic panel by laser beam using synchronization technology

Publications (1)

Publication Number Publication Date
KR100393890B1 true KR100393890B1 (en) 2003-08-06

Family

ID=37422032

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020020065542A KR100393890B1 (en) 2002-10-25 2002-10-25 Method and device for cutting non-metallic panel by laser beam using synchronization technology

Country Status (1)

Country Link
KR (1) KR100393890B1 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7642483B2 (en) 2003-01-06 2010-01-05 Rorze Systems Corporation Glass-plate cutting machine
KR100962823B1 (en) 2007-10-16 2010-06-09 로체 시스템즈(주) Glass-plate cutting method with partially-reinforced beam profile and device thereof
KR101024086B1 (en) * 2008-11-28 2011-03-22 (주)하드램 Apparatus for Cutting Substrate Using a Laser

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5750296A (en) * 1980-09-12 1982-03-24 Mitsubishi Electric Corp Laser working device
JPS60231587A (en) * 1984-04-27 1985-11-18 Matsushita Electric Ind Co Ltd Laser working device
JPS6224885A (en) * 1985-07-24 1987-02-02 Mitsubishi Electric Corp Laser beam machine
JPH07236985A (en) * 1994-02-28 1995-09-12 Mitsubishi Electric Corp Laser beam cutting method and device therefor
JPH07251278A (en) * 1994-03-16 1995-10-03 Fanuc Ltd Laser beam machine
JPH08132788A (en) * 1994-11-09 1996-05-28 Graphtec Corp Plotter with laser cutting function
JPH09267187A (en) * 1996-03-29 1997-10-14 Nippei Toyama Corp Laser beam machining method
KR20010065390A (en) * 1999-12-29 2001-07-11 구자홍 A apparatus for cut-off of glass by laser beam
KR20010095501A (en) * 2000-04-10 2001-11-07 윤종용 Apparatus for cutting non-metal substrate and method for cutting thereof
KR20020009070A (en) * 2000-07-24 2002-02-01 김영민 Cutting method of non-metal material and cutting apparatus
KR20020043314A (en) * 2000-12-01 2002-06-10 구자홍 A Glass Cutting Device and a Method

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5750296A (en) * 1980-09-12 1982-03-24 Mitsubishi Electric Corp Laser working device
JPS60231587A (en) * 1984-04-27 1985-11-18 Matsushita Electric Ind Co Ltd Laser working device
JPS6224885A (en) * 1985-07-24 1987-02-02 Mitsubishi Electric Corp Laser beam machine
JPH07236985A (en) * 1994-02-28 1995-09-12 Mitsubishi Electric Corp Laser beam cutting method and device therefor
JPH07251278A (en) * 1994-03-16 1995-10-03 Fanuc Ltd Laser beam machine
JPH08132788A (en) * 1994-11-09 1996-05-28 Graphtec Corp Plotter with laser cutting function
JPH09267187A (en) * 1996-03-29 1997-10-14 Nippei Toyama Corp Laser beam machining method
KR20010065390A (en) * 1999-12-29 2001-07-11 구자홍 A apparatus for cut-off of glass by laser beam
KR20010095501A (en) * 2000-04-10 2001-11-07 윤종용 Apparatus for cutting non-metal substrate and method for cutting thereof
KR20020009070A (en) * 2000-07-24 2002-02-01 김영민 Cutting method of non-metal material and cutting apparatus
KR20020043314A (en) * 2000-12-01 2002-06-10 구자홍 A Glass Cutting Device and a Method

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7642483B2 (en) 2003-01-06 2010-01-05 Rorze Systems Corporation Glass-plate cutting machine
KR100962823B1 (en) 2007-10-16 2010-06-09 로체 시스템즈(주) Glass-plate cutting method with partially-reinforced beam profile and device thereof
KR101024086B1 (en) * 2008-11-28 2011-03-22 (주)하드램 Apparatus for Cutting Substrate Using a Laser

Similar Documents

Publication Publication Date Title
EP1635390A3 (en) Substrate dividing method
EP2216128A3 (en) Method of cutting object to be processed
MY195478A (en) Laser Cutting of Display Glass Compositions
TW200802570A (en) Laser scribing method, laser scribing apparatus and substrate cut by using such method or apparatus
TW200615070A (en) Method and apparatus for cutting substrate using femtosecond laser
WO2010062873A3 (en) Glass sheet stabilizing system, glass manufacturing system and method for making a glass sheet
TW200420511A (en) Method of cutting a glass substrate
MY140517A (en) Semiconductor substrate cutting method
TW200702310A (en) Method of mechanically breaking a scribed workpiece of brittle fracturing material
FR2819505B1 (en) PROCESS FOR CUTTING THE EDGES OF A CONTINUOUS GLASS TAPE, IMPLEMENTATION DEVICE, GLASS TRAY CUT ACCORDING TO THIS PROCEDURE
KR20100135661A (en) Method for dividing brittle material substrate
CN100493815C (en) Laser cutting method for hard brittle non-metallic material
CN103962731B (en) The method of the thick metal material of optical-fiber laser negative pressure cutting more than 8mm
ATE539861T1 (en) CUTTING DEVICE AND CUTTING METHOD AND APPARATUS AND METHOD FOR PRODUCING A LABIA MAJORA INTERMEDIATE PAD
KR100393890B1 (en) Method and device for cutting non-metallic panel by laser beam using synchronization technology
CN107520541B (en) Method for laser cutting brittle material
ES8609167A1 (en) Ultra-high pressure abrasive jet cutting of glass
CN103658995A (en) Laser cutting machine for reflective strip production
EP1334953A3 (en) Method and apparatus for severing sheets of glass
CN108406129B (en) Laser processing method of hard and brittle material
CN115401342B (en) Crack induction method for laser cutting of transparent brittle material
EP2005924A8 (en) Device for forming cross-sections in a transparent material
Furumoto et al. Thermal stress cleavage of a single-crystal round sapphire bar by carbon dioxide laser
ES2177173T3 (en) PROCEDURE TO CUT BEZELS IN Y.
CN101234850B (en) Laser cutting method for glass substrate

Legal Events

Date Code Title Description
A201 Request for examination
A302 Request for accelerated examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20130702

Year of fee payment: 11

FPAY Annual fee payment

Payment date: 20140702

Year of fee payment: 12

FPAY Annual fee payment

Payment date: 20150702

Year of fee payment: 13

FPAY Annual fee payment

Payment date: 20160711

Year of fee payment: 14

FPAY Annual fee payment

Payment date: 20170622

Year of fee payment: 15

FPAY Annual fee payment

Payment date: 20190620

Year of fee payment: 17