KR100365477B1 - Test board for testing semiconductor device - Google Patents

Abstract

The present invention relates to a test board for inspecting semiconductor devices, and in particular, a plurality of device seating units equipped with semiconductor devices are separately stored in an accommodating block to solve various problems occurring when assembling the test board and to form a test board. Even if some of the parts are damaged, partial repair is possible without disassembling and reassembling the entire test board, which reduces the time required for maintenance and is useful for solving various problems related to assembly.

Description

Test board for testing semiconductor device

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a test board for testing a semiconductor device, and in particular, a device seating unit accommodating cell is formed so that at least one semiconductor device seating unit is individually housed in an accommodating block having a predetermined shape, and the device The present invention relates to a test board for inspecting a semiconductor device that enables partial repair of a semiconductor device seating unit housed in a seating unit accommodating cell, as well as shortening assembly time and eliminating assembly difficulty.

In recent years, the development of technology in most industries, such as the electronics industry, such as the computer industry, the information and communication industry, the aerospace industry, and the mechanical industry, is progressing rapidly. It is a situation that relies on the performance of high-performance, high-density semiconductor devices having industrially necessary functions such as processing in a short time and storing more data per unit area.

The semiconductor device, which plays such an important role, is fabricated with a highly integrated semiconductor chip through a very complicated and precise semiconductor thin film process on a pure silicon substrate, and protects the semiconductor chip from a poor external environment and at the same time provides external devices and signal input / output. After a packaging process that enables it, it is only supplied to a consumer who needs a semiconductor device after a predetermined test.

At this time, a semiconductor chip manufacturing process and a packaging process, which are a process of manufacturing a semiconductor device, are very important, but a test process, which is a process of verifying the reliability of whether a semiconductor device which has undergone a semiconductor chip manufacturing process and a packaging process, operates normally is more important. .

In order to proceed with the test process of the semiconductor device, which plays an important role in manufacturing the semiconductor device, at least one semiconductor device is mounted in a storage container called a "test board", and the test board on which the semiconductor device is mounted is inspected. After the transfer to the facility, and after contacting the inspection probe to the outer lead of the semiconductor device, and after applying the electrical signal for the inspection to the outer lead, a method for checking whether the semiconductor device is operating normally is used.

1 and 2 show an example of a conventional test board used when testing a semiconductor device.

Referring to the accompanying drawings, the conventional test board 100 as a whole, the device seating unit 20 to which the semiconductor device 10 is mounted, the receiving frame 30 to accommodate the plurality of device seating unit 20, the test process The shock absorbing member 40 for cushioning the shock applied to the device seating unit 20, the device seating unit 20 is composed of a departure prevention cover 50 to prevent the departure from the storage frame (30).

Specifically, the device seating unit 20 is formed in a predetermined position of the body 22 and the body 22 in which a clamp 24 for fixing the semiconductor device 10 on both sides is formed in a rectangular plate shape having a thin thickness. And a heat sink not shown for cooling the alignment hole 25 and the semiconductor device 10.

The storage frame 30 is, for example, in the shape of a rectangular box having an upper opening, and more specifically, four edges of a rectangular stainless steel plate having a shape of about 1 mm are orthogonally bent in the same direction, and then some of the bent portions are again The bar is bent inward to form a space therein, and the plurality of device seating units 20 described above are provided in a matrix form in the inner space of the storage frame 30.

On the inner bottom of the storage frame 30 having such a configuration, the device seating unit 20 described above is inserted and disposed in a 5 × 3 matrix, for example, as shown in FIG. 1.

In this case, when the device seating unit 20 is in close contact with the bottom surface of the storage frame 30, an inspection probe (not shown) for inspecting the semiconductor device 10 mounted on the device seating unit 20 may be contacted. When the contact portion is given a constant tension to strengthen the contact between the inspection probe and the contact portion, the inner bottom surface of the frame 30 and the device to prevent the damage of the semiconductor device 10 by the impact of the inspection probe Between the bottom of the seating unit 20, a buffer member 40, such as a spring, is inserted.

Subsequently, in a state in which both the shock absorbing member 40 and the device seating unit 20 are installed in the storage frame 30, the upper surface of the device seating unit 20 is covered with the storage frame cover 50, and then, by the fastening screw 60. The storage frame cover 50 and the storage frame 30 are fastened to complete the assembly of the test board 100.

Thereafter, after the semiconductor device 10 is mounted on the test board 100, the inspection of the semiconductor device 10 is performed by the inspection facility.

However, in the process of assembling the conventional test board 100 for inspecting the semiconductor device 10, the buffer member 40 is first set on the bottom surface of the storage frame 30, and then the buffer member 40 is provided. The device seating unit 20 must be set on the upper surface of the device. If any one of the shock absorbing members 40 falls during the setting of the shock absorbing member 40, the gap between the shock absorbing member 40 and the shock absorbing member 40 is reduced. The problem arises that it is too narrow to continuously fall down to another adjacent buffer member 40.

In addition, even if the setting of the shock absorbing member 40 proceeds successfully, the frequency of the shock absorbing member 40 falls again during setting the device seating unit 20 on the upper surface of the shock absorbing member 40 is frequent, and the assembly is started again from the beginning. Another problem arises that must proceed.

In addition, even if the setting of the shock absorbing member 40 and the device seating unit 20 proceeds successfully, when an assembly mistake occurs in the process of assembling the storage frame cover 50, the shock absorbing member 40 and the device seating unit 20 Another problem arises that requires the assembly of the assembly from scratch.

In addition, when any one of the buffer member 40 or the device seating unit 20 is damaged or broken during the assembly of the conventional test board 100 and the semiconductor test is in progress, the test board 100 may be After removing the storage frame cover 50, it is necessary to replace or repair the component that failed, and once the storage frame cover 50 is removed, all the cushioning members 40 and the device are seated because the parts cannot be partially replaced or repaired. A problem arises in that the unit 20 needs to be reassembled, and another problem arises in that the same problem occurs as in the initial assembly.

In addition, since the storage frame 30 of the conventional test board 100 is made of a thin iron plate having a predetermined rigidity, the warpage of the test board 100 occurs after repeated use, and thus the semiconductor seated on the device seating unit 20. Since the contact between the device 10 and the inspection probe is not made accurately, a test failure occurs.

Accordingly, the present invention takes into account such various problems of the conventional test board, and an object of the present invention is to prevent any one of the cushioning members from falling down while installing the cushioning member between the bottom of the device seating unit and the bottom of the storage container. It is to prevent the adjacent cushion member which is already installed from falling down in series.

Another object of the present invention is to prevent adjacent buffer members from falling down serially even if assembly failure occurs while the device seating unit is installed on the upper surface of the buffer member.

It is a further object of the present invention to facilitate the partial repair and reassembly of the group of shock absorbing members and the device seating unit that caused the breakage or failure by individually fixing a predetermined number of device seating units.

Still another object of the present invention is to prevent a test defect of a semiconductor device by preventing distortion of the test board.

1 is an exploded perspective view of a conventional test board.

2 is a cut along the line I-I after assembling the conventional test board of FIG.

Cross-section.

3 is an exploded perspective view of a test board according to the present invention.

4 is a partial cross-sectional view taken along line IV-IV in the assembled state of FIG. 3;

5 is an exploded perspective view showing another embodiment of the present invention.

FIG. 6 is a partial cross-sectional view taken along VI-VI in the assembled state of FIG. 5; FIG.

The test board for semiconductor device inspection for realizing the object of the present invention is a plurality of devices by having a device seating unit for clamping the semiconductor device to be inspected in the form of a plate, and a predetermined depth so that the device seating unit is inserted and slides up and down An accommodating block comprising a plurality of device seating unit storage cells arranged so that the seating units are separated from each other in a lattice form, a cushioning means interposed between the bottom surface of the device seating unit storage cell and the bottom of the device seating unit, and an upper surface of the device seating unit. Device seating unit securing means for pressing the edge.

Hereinafter, the operation according to a more specific configuration and configuration of a semiconductor device inspection test board according to the present invention having a unique effect that cannot be derived by a conventional test board will be described below with reference to FIG. 3.

The test board 300 for inspecting a semiconductor device according to the present invention generally includes a device seating unit 200, a housing block 310, a device seating unit fixing means 410, and a buffer member 500.

Specifically, the device seating unit 200 is preferably formed of an electrically insulating material, the body 210 having a thin rectangular plate shape, at least two or more alignment holes formed on the upper surface of the body 210 ( 220, the clamp 240 is formed on the upper surface of the body 210 except for the alignment hole 220 to temporarily fix the semiconductor device 230.

On the other hand, the storage block 310 is formed of a high strength and light weight duralumin material and is precisely processed by die casting or extrusion molding and cutting bar, such that forming the storage block 310 to the block type of duralumin material This is to prevent the storage block 310 from being easily twisted or deformed by an external force.

The storage block 310 formed of a duralumin material as described above can easily assemble and partially repair the device seating unit 200 and the shock absorbing member 500 to be described later, as well as the warping and deformation preventing functions. Should be considered to have a shape.

The shape of the storage block 310 having such a function will be described in detail with reference to FIG. 3.

Specifically, the storage block 310 has a rectangular parallelepiped shape as a whole, and a plurality of device seating unit storage cells (hereinafter referred to as "storage cells") having a groove shape on the upper surface of the storage block 310 are referred to as a matrix form. Is formed.

Referring to the shape of each of the storage cells 311 in more detail, the upper surface of the storage block 310 has a planar area slightly larger than the planar surface of the device seating unit 200, and as shown in FIG. By having a depth of t as shown, the device seating unit 200 is a groove which can be vertically slid movement inside the storage block 310 is formed.

As shown in FIG. 3 attached to the accommodation block 310, the storage cell 311 having such a shape may be formed in a 6 × 3 matrix, or may be modified in various ways, such as an 8 × 4 matrix. It is possible.

At this time, it is important that the storage cells 311 and the storage cells 311 adjacent to each other are formed to be spaced apart from each other by a predetermined distance even though the number of the storage cells 311 is different, that is, the storage cells 311 and the storage cells 311 adjacent to each other. This is to be isolated from each other so that the assembly of the device seating unit 200 or the buffer member 500 is to be made only in the interior of the receiving cell (311).

In the present invention, a wall extending in the vertical direction among the walls surrounding the storage cell 311 in the storage block 310 will be defined as a first separation wall 320 and a wall extending in the horizontal direction as a second separation wall 330. .

On the other hand, at least one or more four buffer members 500 are accommodated on the base surface of the storage cell 311 formed in the storage block 310 so as to be spaced apart from each other at a predetermined interval.

At this time, the shock absorbing member 500 may use a coil spring or a leaf spring. In the present invention, a coil spring is used as a preferred embodiment.

At this time, when using one coil spring, which is a buffer member 500, it is preferable to increase the diameter of the coil spring so that it fits snugly in the accommodating cell 311. The diameter of the coil spring increases as the number of coil springs increases. By making it small, the impact force generated when the inspection probe (not shown) contacts with the device seating unit 200 is minimized while stably supporting the storage cell 311 even when at least one buffer member 500 is used. It is desirable to.

In addition, when the shock absorbing member 500 is accommodated on the bottom surface of the accommodating block 310, the shock absorbing member 500 has a predetermined depth on the bottom face of the accommodating block 300 so that the shock absorbing member 500 is easily installed on the bottom face of the accommodating block 310. It is also possible to form the buffer member receiving groove 510.

As described above, the bottom surface of the device seating unit 200 described above is seated on the upper surface of the shock absorbing member 500 in a state where the shock absorbing member 500 is installed in the storage block 310.

As illustrated in FIG. 4, when the test process of the semiconductor device 230 is performed in the state where the shock absorbing member 500 and the device seating unit 200 are coupled to the inside of the accommodating block 310, the shock absorbing member 500 may be used. The device seating unit 200 may be detached to the outside during the compression and expansion process of the device, so that the device seating unit 200 is coupled to the housing block 310 in a state in which the device seating unit 200 is coupled to the housing block 310. The fixing means 400 is to be installed.

The device seating unit fixing means 400 shown in FIG. 3 is partially repaired when some of the plurality of buffer members 500 and the plurality of device seating units 200 stored in the storage block 310 are damaged. Has a particularly advantageous configuration.

The device seating unit fixing means 500 presses only two corners of the four corners of the device seating unit 200 to prevent the device seating unit 200 from being separated from the receiving cell 311.

In order to implement this, a screw hole 345 is formed at an arbitrary intersection point between the intersection points 340 of the first separation wall 320 and the second separation wall 330 intersected in a lattice shape, and the screw hole 345 is formed. The threaded hole 345 is formed at another intersection 340 having a diagonal relationship with the intersection point 340, and the threaded hole is not formed in a zigzag form at the remaining intersection.

Screw holes are formed in a zigzag shape at all intersections, and the device is seated at the intersections where the screw holes are formed while both the buffer member 500 and the device seating unit 200 are seated in the storage cell 311 as shown in FIG. 4. A fixing piece which is an embodiment of the device seating unit fixing means 400 that presses only the edge of the unit 200 is seated.

Hereinafter, the device seating unit fixing means 400 will be referred to as a fixing piece.

In this case, the fixing piece 400 may have any shape such as a square plate, a circular plate, a triangular plate, and the like, in which a through hole 410 for screwing in the center thereof is formed, and the semiconductor device 230 mounted on the device seating unit 200 only. Any shape that does not overlap with may be used.

In the present invention, a fixed plate 400 having a circular plate shape is used as a preferred embodiment.

At this time, the fixing piece 400 is firmly fixed to the storage block 310 via the fastening screw 430.

On the other hand, when the fixing piece 400 having a predetermined thickness is seated in the upper portion of the intersection of the storage block 310 as it is, the fixing piece 400 protrudes from the upper surface of the storage block 310 by the height of the fixing piece 400. Since the fixing piece 400 protrudes from the storage block 310, it is preferable to form grooves at the intersections so that the fixing piece 400 does not protrude from the upper portion of the storage block 310.

In such a case, if any device seating unit 200 or shock absorbing member 500 is broken, the partial repair can be quickly performed by selectively separating only the device seating unit 200 or the fixing piece 400 in which the damage has occurred. Can proceed.

5 is a view illustrating another embodiment of a test board for inspecting a semiconductor device according to the present invention.

5 is similar to the embodiment of FIG. 3, a plurality of accommodating cells 311 in a matrix form for separately storing the device seating unit 200 and the shock absorbing member 500 in the accommodating block 310. Is formed, and an opening 652 is provided on the upper surface of the housing block 310 so that only the remaining portion except for the semiconductor device 230 mounted on the device seating unit 200 is opened to the coupling block 310. The storage block cover 650 coupled thereto is shown.

At this time, the coupling of the storage block cover 650 and the storage block 310 is formed in the storage block cover 650 corresponding to the screw hole 380 to form a screw hole 380 at a predetermined position of the storage block 310. In the state in which the hole 654 is formed, a method of fastening the storage block cover 650 and the storage block 310 with the fastening screw 656 or a locking protrusion 390 is formed on the outer surface of the storage block 300. As illustrated in FIG. 5, a hook 658 may be formed in the storage block cover 650 so that the locking protrusion 390 may be coupled to the storage block cover 650 and the storage block 310.

At this time, the method of screwing the storage block cover 650 and the storage block 300 takes time to fasten the screw 656, but the fastening of the storage block cover 650 and the storage block 310 is very firm, The method of combining the housing block cover 650 and the housing block 310 with the engaging protrusion 390-the hook 658 is very short in the time required for assembly and disassembly, but the fastening force is weak. It is also okay.

5, the device seating unit 200 or the shock absorbing member 500 may be individually repaired, as in the embodiment of FIG. 3. In addition, in the embodiment of FIG. 400) there is an advantage that can greatly shorten the time required to assemble.

As described in detail above, the test board for testing a plurality of semiconductor devices that have completed the semiconductor process and the packaging process at one time can prevent warpage or distortion of the semiconductor device by preventing warpage and distortion from occurring by a repeated test process. Can be.

Further, according to the present invention, damage to adjacent buffer members and device seating units is minimized even if an assembly mistake occurs during assembly of the shock absorbing member that shocks the semiconductor device during testing and the device seating unit seating the semiconductor device. To make it easier to assemble the test board.

In addition, according to the present invention, when a part of the device seating unit or a part of the shock absorbing member causes an error, only the device seating unit and the shock absorbing member which caused the fault can be replaced, thereby greatly reducing the time required for assembly. It can have various effects.

Claims (10)

A device seating unit for clamping the semiconductor device to be inspected in a plate shape; A storage block having a planar area larger than that of the device seating unit so that the device seating unit is inserted and sliding, and the plurality of device seating unit receiving cells having a predetermined depth are isolated from each other in a lattice form; Buffer means interposed between a bottom surface of the device seating unit and a bottom surface of the device seating unit accommodating cell accommodated in the device seating unit accommodating cell; Device seating unit fixing means for pressing an upper edge of the device seating unit accommodated in the device seating unit receiving cell of the storage block; Test board for semiconductor device inspection comprising a. The method of claim 1, wherein the device seating unit receiving cell, A plurality of first partition walls extending in a first direction in the storage block, and a plurality of second partition walls extending in a second direction at right angles to the first direction and intersecting the first partition walls; Test board for semiconductor device inspection. delete The screw fastening hole of claim 2, wherein a screw fastening hole is formed in a zigzag shape at the intersection points which are not adjacent to each other among a plurality of intersection points formed by the first and second separation walls crossing each other. And a device seating unit fixing means for pressing the upper edge of the device seating unit as a medium. The device mounting unit of claim 4, wherein the device seating unit fixing unit has a shape in which a screw fastening hole is formed at a center thereof and does not overlap with the semiconductor device seated on the device mounting unit in a state in which a screw fastening hole is formed at the center. Test board for semiconductor device inspection, which is a fixed plate for pressing part of the edge of the unit. The test board of claim 5, wherein the fixing plate is a disc having a screw fastening hole formed at the center thereof. The test board of claim 5, wherein a fixing plate fastening groove is further formed at an intersection point of the first and second separation walls on which the fixing plate is seated, the fixing plate fastening groove being dug by the height of the fixing plate. 2. A device according to claim 1, wherein the device seating unit fixing means is opened so as to expose the semiconductor device seated in all the device seating units and the edge of the device seating unit is formed such that an opening for pressing opposes the device seating unit receiving cell. A test board for testing a semiconductor device, which is a housing block cover coupled to the housing block so as to cover the entire housing block by a coupling means. The test board according to claim 8, wherein the coupling means is a fastening screw fastened to a screw fastening hole formed in the accommodating block cover and the accommodating block. The test board of claim 8, wherein the coupling unit comprises a locking protrusion protruding from a side of the storage block and a hook protruding from the storage block cover to be coupled to the locking protrusion.