KR100290158B1 - 대면적 평면 안테나를 이용한 플라즈마 가공장치 - Google Patents
대면적 평면 안테나를 이용한 플라즈마 가공장치 Download PDFInfo
- Publication number
- KR100290158B1 KR100290158B1 KR1019980014578A KR19980014578A KR100290158B1 KR 100290158 B1 KR100290158 B1 KR 100290158B1 KR 1019980014578 A KR1019980014578 A KR 1019980014578A KR 19980014578 A KR19980014578 A KR 19980014578A KR 100290158 B1 KR100290158 B1 KR 100290158B1
- Authority
- KR
- South Korea
- Prior art keywords
- antenna
- plasma processing
- processing apparatus
- radiation structure
- plasma
- Prior art date
Links
- 230000005672 electromagnetic field Effects 0.000 claims abstract description 10
- 230000005855 radiation Effects 0.000 claims abstract description 9
- 239000004020 conductor Substances 0.000 claims abstract description 4
- 230000001939 inductive effect Effects 0.000 claims description 6
- 230000005670 electromagnetic radiation Effects 0.000 abstract description 4
- 230000005684 electric field Effects 0.000 description 13
- 239000007789 gas Substances 0.000 description 12
- 239000000758 substrate Substances 0.000 description 7
- 239000003990 capacitor Substances 0.000 description 6
- 238000001020 plasma etching Methods 0.000 description 6
- 230000005686 electrostatic field Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000005240 physical vapour deposition Methods 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 239000002826 coolant Substances 0.000 description 2
- 239000003574 free electron Substances 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
- H01J37/321—Radio frequency generated discharge the radio frequency energy being inductively coupled to the plasma
- H01J37/3211—Antennas, e.g. particular shapes of coils
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
- H01J37/32174—Circuits specially adapted for controlling the RF discharge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
- H01J37/32174—Circuits specially adapted for controlling the RF discharge
- H01J37/32183—Matching circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
- H01J37/321—Radio frequency generated discharge the radio frequency energy being inductively coupled to the plasma
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Drying Of Semiconductors (AREA)
- Plasma Technology (AREA)
Abstract
Description
Claims (6)
- 전원을 공급하는 전원공급수단, 내부에 기체가 들어있는 진공용기, 상기 진공용기 내부의 기체에 전자기파를 유기하는 안테나를 구비한 플라즈마 가공장치에 있어서, 상기 안테나는, 상기 진공용기 내부에 균일한 전자기장을 유도하도록, 상기 전원공급수단으로부터 인가된 전기에너지를 공급받는 하나의 입력단자와 그 입력단자로부터 각기 다른 나선방향으로 분기되는 도체의 끝단에 접속되며 상기 입력단자로부터 동일한 거리만큼 떨어진 복수개의 출력단자로 이루어진 하나 이상의 방사구조물로 마련되며, 각 방사구조물은 다른 방사구조물에 대하여 미러 이미지를 갖는 것을 특징으로 하는 대면적 평면 안테나를 이용한 플라즈마 가공장치.
- 제1항에 있어서, 상기 안테나는 상기 진공용기 내부에 위치한 것을 특징으로 하는 플라즈마 가공장치.
- 제1항에 있어서, 상기 방사구조물은 네 개로 마련된 것을 특징으로 하는 플라즈마 가공장치.
- 제1항에 있어서, 상기 방사구조물은 부채꼴 나선모양으로 마련된 것을 특징으로 하는 플라즈마 가공장치.
- 제1항에 있어서, 상기 방사구조물은 사각형 나선모양으로 마련된 것을 특징으로 하는 플라즈마 가공장치.
- 제1항에 있어서, 상기 전원공급수단은 임피던스 매치 회로망, 무선주파수 전력원 그리고 상기 무선 주파수 전력원과 상기 안테나 사이에 설치된 스위치를 포함하는 것을 특징으로 하는 플라즈마 가공장치.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019980014578A KR100290158B1 (ko) | 1998-04-23 | 1998-04-23 | 대면적 평면 안테나를 이용한 플라즈마 가공장치 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019980014578A KR100290158B1 (ko) | 1998-04-23 | 1998-04-23 | 대면적 평면 안테나를 이용한 플라즈마 가공장치 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR19990080959A KR19990080959A (ko) | 1999-11-15 |
KR100290158B1 true KR100290158B1 (ko) | 2001-05-15 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019980014578A KR100290158B1 (ko) | 1998-04-23 | 1998-04-23 | 대면적 평면 안테나를 이용한 플라즈마 가공장치 |
Country Status (1)
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KR (1) | KR100290158B1 (ko) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101473371B1 (ko) | 2013-05-07 | 2014-12-16 | 한국표준과학연구원 | 유도 결합 플라즈마 발생용 안테나 구조체 |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100581858B1 (ko) * | 2002-12-17 | 2006-05-22 | 삼성에스디아이 주식회사 | 유도결합형 플라즈마 처리장치 |
KR100581859B1 (ko) * | 2003-02-19 | 2006-05-22 | 삼성에스디아이 주식회사 | 플라즈마 처리 장치용 안테나 및, 그것을 구비한 플라즈마처리 장치 |
KR100523851B1 (ko) | 2003-05-07 | 2005-10-27 | 학교법인 성균관대학 | 대면적처리용 내장형 선형안테나를 구비하는 유도결합플라즈마 처리장치 |
US8974630B2 (en) | 2003-05-07 | 2015-03-10 | Sungkyunkwan University | Inductively coupled plasma processing apparatus having internal linear antenna for large area processing |
KR100647779B1 (ko) * | 2004-05-14 | 2006-11-23 | 에이피티씨 주식회사 | 플라즈마 챔버에서의 균일한 플라즈마 형성을 위한플라즈마 소스 |
KR101246848B1 (ko) * | 2011-01-10 | 2013-03-25 | 엘아이지에이디피 주식회사 | 플라즈마 처리장치 및 이를 위한 서셉터 |
KR102316591B1 (ko) | 2015-04-30 | 2021-10-25 | 에스케이하이닉스 주식회사 | 유도결합형 플라즈마 발생장치용 안테나 및 그의 제어방법과 그를 포함하는 유도결합 플라즈마 발생장치 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08195296A (ja) * | 1995-01-13 | 1996-07-30 | Matsushita Electric Ind Co Ltd | プラズマ処理装置 |
-
1998
- 1998-04-23 KR KR1019980014578A patent/KR100290158B1/ko not_active IP Right Cessation
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08195296A (ja) * | 1995-01-13 | 1996-07-30 | Matsushita Electric Ind Co Ltd | プラズマ処理装置 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101473371B1 (ko) | 2013-05-07 | 2014-12-16 | 한국표준과학연구원 | 유도 결합 플라즈마 발생용 안테나 구조체 |
Also Published As
Publication number | Publication date |
---|---|
KR19990080959A (ko) | 1999-11-15 |
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