KR100296937B1 - Method for manufacturing a mixture that can bond copper powder to fabric - Google Patents
Method for manufacturing a mixture that can bond copper powder to fabric Download PDFInfo
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- KR100296937B1 KR100296937B1 KR1019980034357A KR19980034357A KR100296937B1 KR 100296937 B1 KR100296937 B1 KR 100296937B1 KR 1019980034357 A KR1019980034357 A KR 1019980034357A KR 19980034357 A KR19980034357 A KR 19980034357A KR 100296937 B1 KR100296937 B1 KR 100296937B1
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J1/00—Adhesives based on inorganic constituents
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/085—Copper
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Laminated Bodies (AREA)
Abstract
본 발명은 동(Cu)분말의 혼합물에 관한 것으로 특히, 일정량의 동분에 고무와 헥산 및 케톤 그리고 합성수지와 아세톤의 혼합물로 이루어진 접착제를 첨가한 뒤 신나를 첨가하여 완성된 혼합물을 직물의 표면에 도포하여 접착시킴으로서 동분말의 견고한 부착에 의해 동분말이 직물로 부터 떨어져 나오는 것을 방지하는 동시에 저렴한 가격으로 동분말이 피복된 직물을 공급할 수 있도록 안출된 것으로, 생활문화공간에서 발생되는 수맥파를 차단하기 위하여 약 200-300매쉬 크기의 미립자로 분말화된 약 15-25중량%의 동과, 상기 분말화된 동을 직물에 부착시키기 위하여 동 분말에 혼합되는 약 15-25중량%의 접착제와, 상기 접착제와 동분말의 혼합물이 직물로 쉽게 침투되어 견고하게 접착될 수 있도록 하기 위해 접착제를 녹여 액체화 하는 약 60-70중량%의 신나로 이루어진 것을 특징으로 하는 동분말을 직물에 접착시킬 수 있는 혼합물의 제조방법을 제공한다.The present invention relates to a mixture of copper powder, and in particular, to a certain amount of copper powder by adding an adhesive consisting of a mixture of rubber, hexane and ketone, and a resin and acetone, and then adding a thinner to apply the finished mixture to the surface of the fabric It is designed to prevent copper powder from falling off from the fabric by firm adhesion of copper powder and to supply fabric coated with copper powder at a low price. About 15-25% by weight of copper powdered into fine particles of about 200-300 mesh size, about 15-25% by weight of adhesive mixed with copper powder to adhere the powdered copper to the fabric, and the adhesive About 60-70% by weight of the liquid melted and melted to ensure that the mixture of copper powder can easily penetrate into the fabric and adhere firmly A copper powder, characterized in that made me provides a process for the preparation of mixtures that can be bonded to the fabric.
Description
본 발명은 동(Cu)분말 혼합물에 관한 것으로 특히, 일정량의 동분말에 고무와 헥산 및 케톤 그리고 합성수지와 아세톤의 혼합물로 이루어진 접착제를 첨가한뒤 신나를 혼합하여 완성된 혼합물을 직물의 표면에 도포하여 접착시킴으로서 동분말의 견고한 부착에 의해 동분말이 직물로부터 떨어져 나오는 것을 방지하는 동시에 저렴한 가격으로 동분말이 피복된 직물을 공급할 수 있도록 된 동분말을 직물에 접착시키는 혼합물의 제조방법에 관한 것이다.The present invention relates to a copper powder mixture, and in particular, to a certain amount of copper powder by adding an adhesive consisting of a mixture of rubber, hexane and ketones, a resin and acetone, and then mixing the thinner to apply the finished mixture to the surface of the fabric The present invention relates to a method for preparing a mixture in which copper powder is adhered to a fabric so that copper powder can be supplied at a low price while preventing copper powder from coming off from the fabric by firm adhesion of the copper powder.
일반적으로 동(Cu)은 열을 분산시키는 동시에 인체의 신진대사를 활성화시켜 주는 역할을 하기 때문에 건강보호 차원에서 많이 사용을 하게 된다.In general, copper (Cu) is widely used in terms of health protection because it plays a role of dissipating heat and activating the metabolism of the human body.
즉, 상기의 동을 이용해 동판을 만든 뒤 침대의 내부나 매트 등에 깔아서 사용을 하게 된다.In other words, the copper plate is made using the above copper, and then used on the inside of the bed or mat.
그러나, 상기의 동판은 가격이 매우 비싸기 때문에 동판이 삽입된 침대나 매트 등의 가격이 매우 높게 설정되는 것이 보통이므로 서민들의 사용은 엄두도 못내고 있는 실정이다.However, since the copper plate is very expensive, the price of the bed or mat in which the copper plate is inserted is usually set very high, so the use of the common people is unavoidable.
또한, 상기 동판의 무게가 무겁기 때문에 설치 및 시공이 매우 불편하고 번거로운 문제점도 가지고 있었다.In addition, since the weight of the copper plate is heavy, the installation and construction was very inconvenient and cumbersome.
이러한 종래의 문제점등을 해결 보완하기 위한 본 발명의 목적은, 직물의 표면에 동분말을 견고하게 부착시켜 인체 신진대사의 활성화를 기대할 수 있고, 상기 직물에 부착되어 있는 동(Cu)의 인체에 유익한 효과를 누구나 느낄 수 있도록 매우 저렴한 가격으로 공급할 수 있으며, 상기 동분말이 부착된 직물지를 사용하여 침대를 구성하거나 방바닥 그리고 벽면 등에 간편하게 설치 및 시공할 수 있도록 한 동분말을 직물에 접착시키는 혼합물의 제조방법을 제공함에 그 목적이 있다.An object of the present invention for solving the conventional problems and the like, can be expected to activate the metabolism of the human body by firmly attaching the copper powder to the surface of the fabric, and to the human body of copper (Cu) attached to the fabric It can be supplied at a very low price so that anyone can feel the beneficial effect, and the mixture of bonding the copper powder to the fabric can be easily installed and installed on the floor or on the wall using the fabric paper with the copper powder attached thereto. The purpose is to provide a manufacturing method.
상기의 목적을 달성하기 위한 본 발명은, 일정량의 동분말에 고무분말, 합성수지분말, 헥산 및 케톤, 아세톤으로 혼합되어 있는 일정량의 접착제에 일정량의 신나를 첨가 혼합하여 액체상태로 만든 뒤, 상기 액체상태의 동분말 혼합물을 직물의 표면에 도포하여 건조시키도록 하였다.In order to achieve the above object, the present invention is a rubber powder, synthetic resin powder, hexane and ketone, acetone mixed with a certain amount of thinner by adding a certain amount of thinner to make a liquid state, The copper powder mixture in the state was applied to the surface of the fabric and allowed to dry.
본 발명의 제조방법을 설명하면 다음과 같다.Referring to the manufacturing method of the present invention.
200-300매쉬로 분말화 된 15-25중량%의 동분말과, 상기 동분말을 직물에 부착시키기 위하여 혼합되는 15-25중량%의 접착제와, 상기 접착제와 동분말의 혼합물이 직물로 쉽게 침투되어 견고하게 접착될 수 있도록 상기 접착제를 액체화하는 60-70중량%의 신나로 이루어진 것이다.15-25% by weight of the powder powdered into 200-300 mesh, 15-25% by weight of the adhesive mixed to adhere the powder to the fabric, and the mixture of the adhesive and the copper powder easily penetrates into the fabric It consists of 60-70% by weight of the thinner to liquefy the adhesive to be firmly bonded.
그리고, 상기의 접착제는 접착력을 생성시키기 위하여 고체상태로 첨가되는 2-3중량%의 고무분말과, 상기 고무분말의 접착력 보강을 위해 고체상태로 첨가되는 2-3중량%의 합성수지분말과, 상기의 고무분말을 액체화하기 위하여 첨가되는 5-12중량%의 헥산 및 케톤 혼합물과, 상기 합성수지 분말을 녹여서 액체화하기 위해 첨가되는 2.5-4중량%의 아세톤으로 이루어진 것이다.And, the adhesive is 2-3% by weight of the rubber powder is added to the solid state to create an adhesive force, 2-3% by weight of the synthetic resin powder added to the solid state to reinforce the adhesive strength of the rubber powder, and 5-12% by weight of hexane and ketone mixtures added to liquefy the rubber powder, and 2.5-4% by weight of acetone, added to melt and liquefy the synthetic resin powder.
또한, 상기 동과 접착체 그리고 신나의 혼합물을 직물의 표면에 도포한 뒤 약 5분동안 음지에서 자연건조 시키고, 상기 자연건조된 직물을 건조로 에서 약 100-150℃로 약5분간을 강제건조하고, 상기 자연건조 및 강제건조를 약 2-5회정도 반복하여 동분말이 적층된 직물을 얻을 수 있도록 하였다.In addition, after applying the mixture of the copper, adhesive and thinner to the surface of the fabric and then naturally dried in the shade for about 5 minutes, the dried fabric is forced to dry for about 5 minutes at about 100-150 ℃ in a drying furnace In addition, the natural drying and forced drying were repeated about 2-5 times to obtain a fabric in which copper powder was laminated.
이와 같이된 본 발명의 실시예를 상세히 설명하기로 한다.An embodiment of the present invention as described above will be described in detail.
먼저, 동(CU)을 약 200-300매쉬 크기로 분말화 시킨다.First, copper (CU) is powdered to a size of about 200-300 mesh.
그리고, 약 15-25중량%의 동분말에 약 15-25중량%의 접착제를 혼합한다.Then, about 15-25% by weight of the adhesive is mixed with about 15-25% by weight of copper powder.
그리고, 상기 동분말에 혼합된 접착제에는 약 60-70중량%의 신나를 혼합한다.Then, about 60-70% by weight of the thinner is mixed with the adhesive mixed in the copper powder.
상기와 같이 혼합된 동분말과 접착제 그리고 신나를 서서히 교반시키면 동분말과 접착제가 고르게 혼합된다.Slowly stirring the mixed copper powder, the adhesive and the thinner as described above, the copper powder and the adhesive are mixed evenly.
이때, 상기의 접착제는 신나에 의해 액체화되어 직물지 등에 도포할 경우, 강한 접착력으로 동분말을 부착시킬 수 있게 된다.At this time, when the adhesive is liquefied by the thinner and applied to the woven paper, it is possible to attach the copper powder with a strong adhesive force.
따라서, 상기의 동분말 혼합물을 방바닥이나 벽면 그리고 침대커버나 매트커버 등에 도포하면 동의 효과 즉, 인체 신진대사의 활성화 효과 등을 얻을 수 있게 된다.Therefore, when the copper powder mixture is applied to the floor or the wall, the bed cover or the mat cover, etc., it is possible to obtain a synergistic effect, that is, activation of human metabolism.
한편, 상기의 접착제는 2-3중량%의 고무분말, 2-3중량%의 합성수지분말, 5-12중량%의 헥산 및 케톤혼합물, 2.5-4중량%의 아세톤이 혼합된 상태로 이루어져 있다.On the other hand, the adhesive is composed of a mixture of 2-3% by weight of rubber powder, 2-3% by weight of synthetic resin powder, 5-12% by weight of hexane and ketone mixture, 2.5-4% by weight of acetone.
즉, 상기의 고무분말은 접착력을 생성시키기 위한 것으로, 고체상태로 첨가되어 헥산 및 케톤 혼합물의 혼합에 의해 용해된다.That is, the rubber powder is to create an adhesive force, is added in a solid state is dissolved by mixing the hexane and ketone mixture.
또한, 상기 고무분말의 접착력 보강을 위해 고체상태의 합성수지분말이 첨가되고, 상기 합성수지 분말을 녹여서 용해하기 위해 아세톤이 첨가된다.In addition, a synthetic resin powder in a solid state is added to reinforce the adhesive strength of the rubber powder, and acetone is added to dissolve and dissolve the synthetic resin powder.
따라서, 상기의 접착제 혼합물은 매우 강력한 접착력을 가지기 때문에 직물에 부착되는 동분말이 떨어져 나가는 것을 방지하게 된다.Thus, the adhesive mixture has a very strong adhesive force to prevent the copper powder attached to the fabric from falling off.
한편, 상기의 동분말 혼합물을 직물의 표면이나 이면 또는 표면과 이면 모두에 도포를 한 뒤에는 건조를 하게 된다.On the other hand, the same copper powder mixture is applied to the surface or the back of the fabric or both the surface and the back and then dried.
즉, 상기 동분말 혼합물이 도포된 직물을 그늘에서 약 5분간 건조를 시킨다.That is, the fabric to which the copper powder mixture is applied is dried in the shade for about 5 minutes.
그리고, 상기 그늘에서 건조된 직물을 건조로에서 100-150℃의 온도로 약 5분동안 강제건조를 시킨다.Then, the fabric dried in the shade is forced to dry for about 5 minutes at a temperature of 100-150 ℃ in a drying furnace.
상기와 같은 자연건조 및 강제건조를 약 2-5회정도 반복적으로 실시함으로서 동분말이 피복된 직물을 얻을 수 있게 된다.By repeatedly performing the above-described natural drying and forced drying about 2-5 times, it is possible to obtain a fabric coated with the same powder.
따라서, 상기 건조를 마친 직물에 피복된 동분말은 사용중 자연적으로 떨어지지 않는 것은 물론 직물을 구기거나 비벼도 동분말은 떨어지지 않게 된다.Therefore, the copper powder coated on the dried fabric does not fall naturally during use, but also the copper powder does not fall even if the fabric is wrinkled or rubbed.
그리고, 본 발명의 동분말 혼합물은 직물외의 재질 즉, 종이나 나무 그리고 콘크리트 벽면 등에 직접 칠하여도 동일한 효과를 얻을 수 있게 된다.In addition, the copper powder mixture of the present invention can obtain the same effect even when directly applied to a material other than the fabric, such as paper, wood and concrete wall.
이와 같이된 본 발명은, 일정량의 동분말에 고무분말, 합성수지분말, 헥산 및 케톤, 아세톤으로 혼합되어 있는 일정량의 접착제와 일정량의 신나를 첨가 혼합하여 액체상태로 만든 뒤 상기 액체상태의 동분 혼합물을 직물의 표면에 도포하여 건조시킴으로서, 직물의 표면에 동분말을 견고하게 부착시켜 인체 신진대사의 활성화를 기대할 수 있고, 상기 직물에 부착되어 있는 인체에 유익한 동(Cu)의 효과를 누구나 느낄 수 있도록 매우 저렴한 가격으로 공급할 수 있으며, 상기 동분말이 부착된 직물지에 의해 침대나 방바닥 그리고 벽면 등에 간편하게 설치 및 시공할 수 있는 유용한 효과를 갖는다.The present invention as described above, by adding a certain amount of the adhesive and a certain amount of thinner mixed with rubber powder, synthetic resin powder, hexane and ketone, acetone to a certain amount of copper powder to make a liquid state and then the mixture of the copper powder in the liquid state By applying it to the surface of the fabric and drying it, it is possible to firmly attach copper powder to the surface of the fabric to expect the activation of human metabolism, so that anyone can feel the beneficial effect of copper (Cu) attached to the fabric. It can be supplied at a very low price, and has a useful effect that can be easily installed and installed on the bed, the floor and the wall by the fabric paper attached to the copper powder.
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Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019980034357A KR100296937B1 (en) | 1998-08-25 | 1998-08-25 | Method for manufacturing a mixture that can bond copper powder to fabric |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019980034357A KR100296937B1 (en) | 1998-08-25 | 1998-08-25 | Method for manufacturing a mixture that can bond copper powder to fabric |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20000014780A KR20000014780A (en) | 2000-03-15 |
| KR100296937B1 true KR100296937B1 (en) | 2001-11-30 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019980034357A KR100296937B1 (en) | 1998-08-25 | 1998-08-25 | Method for manufacturing a mixture that can bond copper powder to fabric |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR100296937B1 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100506691B1 (en) * | 2002-08-19 | 2005-08-08 | 김윤생 | Noxious-waves interception textile goods and that manufacture method |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR970021008A (en) * | 1995-10-11 | 1997-05-28 | 최재학 | Water vein prevention sheet and manufacturing method |
-
1998
- 1998-08-25 KR KR1019980034357A patent/KR100296937B1/en not_active IP Right Cessation
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR970021008A (en) * | 1995-10-11 | 1997-05-28 | 최재학 | Water vein prevention sheet and manufacturing method |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20000014780A (en) | 2000-03-15 |
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