KR100258661B1 - Microwave device having stripline structure and manufacturing method thereof - Google Patents

Abstract

PURPOSE: A microwave element having a strip line structure and a manufacturing method thereof are provided to miniaturize the microwave element by uniting the microwave element with a multiple structure using a plurality of sintered dielectric substrates. CONSTITUTION: Upper and lower ceramic dielectric substrates(1a,1b) are sintered by a dielectric composition in which an additive is not included. Conductive patterns(2) are formed by a conductive material between the upper and lower ceramic dielectric substrates(1a,1b) in order to form a circuit of a microwave element. Contact areas(3a-3d) are arranged at empty space in which the conductive patterns(2) are not formed in order to contact adjacent substrates with each other. Upper and lower ground surfaces(5a,5b) are formed by conductive material between an uppermost surface and a lowest surface of the upper and lower ceramic dielectric substrates(1a,1b). Connecting plates(8a,8b) connect the upper and lower ground surfaces(5a,5b) to each other and contact the upper and lower ceramic dielectric substrates(1a,1b). A pair of input and output terminal areas are electrically insulated from the upper and lower ground surfaces(5a,5b).

Description

Microwave device with strip line structure and manufacturing method thereof

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a microwave device having a strip line structure and a method for manufacturing the same. Particularly, the microwave device can be partially bonded to a multilayer structure using a pre-sintered dielectric substrate, thereby minimizing the cost and reducing the cost of the microwave device. A microwave device having a strip line structure capable of realizing an effective dielectric constant and a quality factor, and a method of manufacturing the same.

Conventional microwave parts were mostly parts using metal cavities. It has since been proposed to use high frequency dielectric materials to achieve miniaturization and weight reduction of these components. Teflon, alumina, and high frequency dielectric ceramics are typical examples of such high frequency dielectric materials. Such dielectrics may be directly component parts or may be applied to manufacturing a substrate using the same.

Among them, the most commonly used structure as a microwave component is a substrate type, a stacked type and a resonator type. High frequency dielectric ceramics for microwave components are mostly used for miniaturization, weight reduction and temperature stability of components.

Such high frequency dielectric ceramics are mainly applied to microwave components and are used for the purpose of miniaturization thereof. Examples of such microwave components include filters, directional couplers, dielectric antennas, and the like, and have a wide range of applications. Looking at the example applied to the filter, it can be divided into two types. One of them is a resonator filter and the other is a multilayer filter using ceramic chip stacking technology for simultaneous sintering.

Looking at the development of the filter as an example of such high-frequency components, most of the initial use of the metal cavity, such as existing air cavity type / comline / interdigital filter. For the purpose of miniaturization, a filter was mainly formed using a microstrip on a single plate substrate.

Since then, dielectric resonator filter with high dielectric constant has been made to reduce strip line structure, high dielectric constant and miniaturization of components. Such a filter has a structure in which a plurality of dielectric resonators having a hole in the center are connected in parallel. In this structure, each one of the dielectrics acts as a resonator. This allows the size of the air to be significantly reduced by the effect of filling the air with a high dielectric constant in the conventional air cavity filter.

Subsequent to the above dielectric resonator filter, an integrated monoblock resonator filter has been developed. This is a structure in which several resonators are formed on one dielectric block, rather than one resonator attached. Such a filter has the advantage of reducing the manufacturing process somewhat. However, this structure has a disadvantage in that the size must be large to reduce the loss.

On the other hand, as a structure different from the resonator type filter described above, a multilayer LC filter having a reduced filter size using a ceramic sintering technology for simultaneous sintering has been developed. The multilayer LC filter is a method of printing a filter pattern on a dielectric film having an arbitrary thickness in the same manner as the fabrication of a conventional multilayer chip capacitor and then compressing and sintering the dielectric film by covering the dielectric film again. Such a stacked LC filter can bring about more reduction in size than the above-described resonator type filter.

However, such a stacked LC filter requires a dielectric ceramic material lower than the melting point of the metal pattern to form a metal pattern between the ceramic dielectrics. Such ceramics can lower the sintering temperature by adding additives to existing dielectric materials. Such ceramics are referred to as "low temperature sintering ceramics". However, these additives not only lower the sintering temperature, but also lower the dielectric constant of the dielectric and lower the dielectric loss, thereby lowering the quality factor. That is, high frequency dielectric ceramics having high dielectric constant and high quality coefficient used in the resonator type filter should be replaced with the above co-sintered ceramic materials when applied to the multilayer filter requiring the internal electrode. The quality factor falls.

This co-sintered ceramic material is used in a lamination method for fabricating microwave filters, directional couplers, and the like to form metal patterns between laminated dielectric materials. However, this method has a problem of developing a ceramic lamination process and a printing and cutting process for stacking a plurality of ceramic dielectrics.

In general, microwave components use a single-layer microstrip structure for miniaturization. In such a structure, the effective dielectric constant of the dielectric material is small, thereby increasing the limit and loss of miniaturization. As a structure that overcomes these shortcomings, the multilayer strip line structure is often used because of its higher effective dielectric constant and higher quality coefficient than the microstrip structure. However, such a multilayer strip line structure is not only difficult to tune after making a part, but also makes the manufacturing process of the substrate difficult.

For this reason, the multi-layered strip line structure is a material that is easy to join, and uses a low dielectric constant Teflon and glass-based substrate. In this case, the dielectric constant is small, so that a small size can be achieved, but the quality factor is degraded. do.

In addition, in the case of a multilayer strip line structure, it is essential to develop a co-sintered ceramic that can withstand the sintering temperature of the ceramic in order to form a metal pattern. This results in a decrease in permittivity and quality factor. Moreover, the difficulty of alignment and multi-step processes incurred in lamination, which makes it difficult to develop products for miniaturization and low loss of microwave component devices.

On the other hand, in the case of the resonator type filter, it is difficult to increase the size in order to reduce the loss value, thereby limiting the miniaturization.

In addition, when a plurality of conventional substrates are made of components having a multilayer structure by using an adhesive, there is a problem in that overall dielectric properties are deteriorated because the glass-based material and other materials having low dielectric properties are used as the adhesive.

Accordingly, the present invention has been made in view of the problems of the prior art, and its object is to provide a microwave device by partially or partially joining a multilayer structure using a plurality of pre-sintered dielectric substrates while maintaining an existing dielectric composition. The present invention provides a microwave device having a strip line structure capable of miniaturizing and lowering the cost and realizing a high effective dielectric constant and quality factor, and a method of manufacturing the same.

1 is a perspective view showing an example applied to an annular resonator having a two-layer ceramic dielectric substrate as a microwave device having a strip line structure according to the first embodiment of the present invention;

2A and 2B are X-X-ray cross-sectional view and Y-Y-ray cross section of the annular resonator shown in FIG.

3A to 3F are cross-sectional views illustrating a manufacturing process of the first embodiment;

4 is a sectional view showing a modification to the side ground structure of the first embodiment;

5 is a cross-sectional view showing a modification to the bonding structure of the first embodiment,

6 is a cross-sectional view showing a microwave device made of a three-layer ceramic dielectric substrate according to a second embodiment of the present invention;

7 is a perspective view illustrating an example in which a partial strip line is formed as a microwave device having a strip line structure according to a third embodiment of the present invention;

8 is a perspective view illustrating a connection structure of an input / output terminal and a ground of a dielectric ceramic substrate.

(Code description for main part of drawing)

1a, 1b, 11a-11c, 21a, 21b, 31a, 31b; Ceramic dielectric substrate

2,2a; Conductive patterns 3a-3d, 13a-13d, 23a, 23b; Junction Area

4a, 4b, 34a, 34b; Input / output terminal areas 5a, 5b15a, 15b, and 25; Ground plane

6a, 6b, 16a, 16b, 26; Side adhesive layers 8a, 8b; Connecting plate

In order to achieve the above object, the present invention provides a plurality of ceramic dielectric substrates pre-sintered in a ceramic composition containing no additive for low temperature sintering, and formed of a conductive material between the substrates to form a circuit of a microwave device. A plurality of conductive patterns, a plurality of bonding regions disposed in empty spaces in which the conductive patterns are not formed, to bond adjacent substrates between the substrates, and the top and bottom surfaces of the plurality of ceramic dielectric substrates. The first and second ground planes formed of a conductive material and both sides of the stacked ceramic dielectric substrates to cover the first and second ground planes to interconnect the first and second ground planes, and simultaneously to bond and secure the plurality of substrates. First and second connecting conductors formed of a material, and the first and second ground planes disposed on any one of the first and second ground planes. Provided is a microwave device having a strip line structure, comprising a pair of input and output electrodes electrically isolated from a ground plane.

Each of the first and second connection conductors may be formed of a plastic coating of a highly conductive metal paste or a metal thin plate fixed at both ends of the first and second ground planes, and at least one of the plurality of ceramic dielectric substrates may be formed. The size can be made smaller with respect to other substrates.

In addition, according to another feature of the present invention, the method of manufacturing the microwave device comprises the steps of preparing a plurality of ceramic dielectric substrate by pre-sintering with a ceramic composition containing no additives for low temperature sintering, and the circuit of the microwave device Forming a plurality of conductive patterns using a conductive metal on the upper surface of the remaining substrate except the top substrate to form, and a plurality of bonding materials for mutually bonding the substrate adjacent to the empty space where the conductive pattern is not formed Forming a pattern, and using a conductive metal on the top and bottom surfaces of the plurality of ceramic dielectric substrates and disposed on any one of the first and second ground planes and the first and second ground planes. Forming a pair of input and output terminal regions spaced apart from the first and second ground planes and pressing the plurality of substrates; Bonding the plurality of substrates to each other by high temperature drying and firing, and covering both sides of the stacked plurality of ceramic dielectric substrates to interconnect the first and second ground planes, and simultaneously joining the plurality of substrates. Forming first and second side adhesive layers using conductive material to secure them.

In this case, the conductive metal is preferably 100% Ag paste or Cu, and the bonding material pattern is formed by screen printing using any one of a conductive metal paste, a glass-based binder, and a silver epoxy binder.

In addition, the plurality of conductive patterns and the bonding material pattern may be simultaneously formed in one step by screen printing using a metal paste, for example, 100% Ag paste, and the first and second side adhesive layers may be soldered or brazed. It may be formed by or by printing and firing of a metal paste.

Furthermore, after forming a plurality of conductive patterns for forming the circuit in the fabrication process, forming a conductive pattern having a width narrower than that of the conductive pattern on the lower surface of the upper substrate corresponding to the conductive pattern. The strength can be further increased.

In addition, when one of the plurality of ceramic dielectric substrates uses a smaller size with respect to the other substrate, it may have a partial stripline structure. In this case, the input / output terminal region may be formed on the upper surface of the exposed substrate.

As described above, in the present invention, a plurality of sintered in advance while maintaining the existing dielectric composition in order to reduce the dielectric constant and quality factor caused by the conventional multilayer bonding technology and the multilayered multilayer structure to achieve miniaturization and low loss of components. All / partly bonding in a multi-layer structure using a dielectric substrate of the present invention enables the miniaturization and low cost of microwave devices, and high effective dielectric constant and quality factor. In addition, by using a metal paste and a conductive bonding agent as the adhesive material that does not lower the dielectric properties at the time of bonding, it is possible to ground the part and the side and improve the dielectric properties by bonding.

(Example)

Hereinafter, the present invention will be described in more detail with reference to the accompanying drawings.

1 is a perspective view showing an example of applying to an annular resonator having a two-layer ceramic dielectric substrate as a microwave device having a strip line structure according to the first embodiment of the present invention, FIGS. 2A and 2B are shown in FIG. XX and YY cross-sectional views of the annular resonator, FIGS. 3A to 3F are process cross-sectional views showing the manufacturing process of the first embodiment, FIG. 4 is a cross-sectional view showing a modification to the side ground structure of the first embodiment, and FIG. 6 is a cross-sectional view showing a modification of the junction structure of one embodiment, Figure 6 is a cross-sectional view showing a microwave device made of a three-layer ceramic dielectric substrate according to a second embodiment of the present invention, Figure 7 is a third embodiment of the present invention A perspective view showing an example of forming a partial strip line as a microwave device having a strip line structure according to the present invention, FIG. 8 is in contact with an input / output terminal of a dielectric ceramic substrate. A perspective view illustrating a connection structure for a.

First, referring to FIGS. 1, 2A and 2B, and FIGS. 3A to 3F, an example of applying a two-layer ceramic dielectric substrate to an annular resonator as a microwave device having a strip line structure according to a first embodiment of the present invention and The manufacturing process will be described.

As shown in FIG. 3A, in the first embodiment, the upper and lower ceramic dielectric substrates 1a and 1b sintered at a high temperature in advance while maintaining the existing dielectric composition, that is, the dielectric composition containing no additive for lowering the sintering temperature, is maintained. Prepare.

The upper and lower ceramic dielectric substrates 1a and 1b each use a substrate having a high dielectric constant of 20-80.

Subsequently, an inner conductive pattern 2 for forming an annular resonator circuit between the upper and lower substrates 1a and 1b is used in a microwave band using 100% Ag paste, Cu, etc., which is a highly conductive metal, as shown in FIG. 3B. 100% Ag paste for bonding and fixing the upper / lower substrates 1a and 1b to the empty space inside, preferably 4 corners, after forming and drying by screen printing in an annulus to a thickness of 10-15 μm as possible, A junction region 3a-3d made of a metal paste such as Cu or a bonding material such as glass-based or silver epoxy is formed to have a thickness of 10-20 μm. In this case, the Ag pattern may be used to simultaneously print the conductive pattern 2 and the junction regions 3a-3d for the convenience of the process.

Thereafter, after drying, the upper and lower surfaces of the upper and lower substrates 1a and 1b are formed with the conductive surfaces 5a and 5b as shown in FIG. 3c, respectively, and the upper surface of the upper substrate 1a. On both sides, a pair of input / output terminal areas 4a and 4b, which are separated from the upper ground plane 5a as a conductive material and form a small square island electrically insulated, are formed by the screen printing method. In this case, if necessary, the pair of input / output terminal areas 4a and 4b may be formed on the lower substrate 1b, or may be divided into upper and lower substrates one by one.

Subsequently, after the drying process, the upper and lower substrates 1a and 1b are adhered by pressing using the adhesive force of the bonding material as shown in FIG. 3d, and then the viscosity and the adhesive force of the screen printed paste are increased as shown in FIG. 3e. In order to remove the organic matter, the substrate is dried at a high temperature for 30 minutes at 100 ° C. and then calcined at about 850 ° C. to fix the upper and lower substrates 1a and 1b.

Finally, the upper and lower ground planes 5a and 5b are interconnected with respect to the other two sides of the four side surfaces of the upper and lower substrates 1a and 1b in which the input / output terminal regions 4a and 4b are not formed, as shown in FIG. 3F. The left and right side adhesive layers 6a and 6b are formed by soldering or brazing.

In addition, the side adhesive layers 6a and 6b may be formed by baking after forming the conductive paste as described above after the pressing step illustrated in FIG. 3D.

On the other hand, the connection structure for interconnecting the upper and lower ground planes 5a and 5b uses connection plates 8a and 8b using thin metal plates instead of the side adhesive layers 6a and 6b as shown in FIG. It is also possible to fix and join. In this case, the connecting plates 8a and 8b may use a silver plate having good conductivity or a metal plate having a thickness of 0.2 to 0.3 mm in which a plating film for preventing corrosion is formed.

As described above, the annular resonator made of the two-layer ceramic dielectric substrate according to the first embodiment uses a high-temperature sintered ceramic substrate to bond the conductive patterns and substrates required for various microwave devices to and from the substrate. It is formed by using a conductive paste and by bonding it by firing to complete the multi-layer structure can maintain the unique characteristics of the existing ceramic substrate, through which low loss and miniaturization can be easily achieved.

As a result, the dielectric substrate of the first embodiment has a dielectric constant quality factor (Q × f) of about 50,000 to 100,000 in the microwave band, and can be widely used in the microwave band, unlike conventional high-k dielectric ceramics. have.

Meanwhile, in the modified example of the bonding structure of the first embodiment shown in FIG. 5, after forming the inner conductive pattern 2 for forming the annular resonator circuit for the lower substrate 1b, the upper substrate ( The conductive pattern 2a is formed on the lower surface of 1a but corresponds to the conductive pattern 2 but narrower than the conductive pattern 2, and the upper / lower substrates 1a and 1b are compressed to be treated. , Shows an example of improved mechanical strength.

Meanwhile, while the first embodiment has described the two-layer multilayer ceramic dielectric substrate structure, the multilayered multilayer structure can be realized in a similar manner. For example, FIG. 6 is a cross-sectional view illustrating a three-layer ceramic dielectric substrate having a strip line structure for microwave devices according to a second embodiment of the present invention. The second embodiment is laminated using three ceramic dielectric substrates 11a, 11b, 11c having a high dielectric constant by sintering at a high temperature in advance without containing any additives and maintaining the dielectric composition in the same manner as in the first embodiment. .

The circuit forming conductive patterns 12 and 12a are formed between the substrates, and the junction regions 13a, 13b, 13c, and 13d for bonding the substrates together to empty spaces in which the conductive patterns 12 and 12a are not formed. This conductive paste or the like is formed by screen printing, and ground planes 15a and 15b are formed on the upper and lower surfaces of the upper and lower substrates 11a and 11c, respectively.

The upper surface of the upper substrate 11a is separated from the ground surface 15a, and an input / output terminal region (not shown) is formed, and side adhesive layers for interconnecting the upper / lower ground surfaces 15a and 15b to both sides of the three substrates. 16a and 16b are formed.

As described above, according to the second embodiment, a multilayer ceramic dielectric substrate can be obtained without causing degradation of the dielectric constant and quality coefficient.

FIG. 7 is an exploded perspective view illustrating a two-layer ceramic dielectric substrate having a strip line structure for microwave devices according to a third embodiment of the present invention. In the first embodiment, the upper and lower substrates have the same size. The third embodiment is an example in which the upper / lower substrates 21a and 21b have different sizes and only partially form the stripline structure.

In the third embodiment, after the conductive pattern 22 for circuit formation is formed on the lower substrate 21b, the lower substrate is formed only on portions corresponding to both left and right sides of the upper substrate 21a to form only a portion of the stripline structure. The joining regions 23a and 23b are formed in a straight line at 21b. In this case, the input / output terminal areas 24a and 24b are formed in a straight line pattern directed to both upper and lower sides where the junction areas 23a and 23b are not formed. In this case, the ground plane 25 is formed on the upper and lower surfaces of the substrates 21a and 21b, and the side adhesive layer 26 is formed on the left and right sides thereof.

8 illustrates a modified example of the input / output terminal region, wherein the input / output terminal regions 34a and 34b extend to the upper and lower side surfaces and have a structure connected to circuit portions inside the upper and lower substrates 31a and 31b or the lower substrate. It may have a structure connected to another input and output terminal formed in (31b).

Hereinafter, the manufacturing method and the characteristics of the ceramic dielectric substrate according to the present invention will be described in comparison with the conventional structure.

Example 1

Example 1 is made according to Figures 3a to 3f, in this case, for example an annular resonator was produced.

First, as shown in FIG. 3A, ZnO + Nb ₂ O ₅ + Ta ₂ O ₅ has a size of 10 × 10 × 1 mm, a dielectric constant of 35, a quality factor (Q × f) of 55,000 at 10 GHz, and a sintering temperature of A pair of high dielectric constant micro-ceramic substrates 1a and 1b at 1300 ° C are prepared by sintering.

Thereafter, as shown in FIG. 3B, the conductive pattern 2 for the annular resonator is formed in the center of the upper surface of the one lower ceramic dielectric substrate 1b by screen printing with a thickness of 10 μm using 100% Ag paste. In this case, the radius of the conductive pattern 2 was 3.15 mm, and the line width was 0.5 mm. In addition, the upper and lower surfaces of each of the substrates 1a and 1b are printed with the grounding patterns 5a and 5b and the input / output terminal areas 4a and 4b as shown in FIG. 3C.

After drying of the substrate, the bonding region 3a-3d is printed in an empty space of the lower substrate by using an Ag paste with a thickness of 10 μm, and after the drying, pressure is applied to the upper / lower substrate. Then hot dried at 100 ° C for 30 minutes and calcined Ag paste at 850 ° C.

Finally, the side adhesive layers 6a and 6b were formed by brazing the left and right sides, thereby completing the two-layer ceramic dielectric substrate of Example 1.

Thereafter, the finished two-layer substrate of Example 1 measured the quality factor and the effective dielectric constant of the resonator at the center frequency of 2.87 GHz, and the measurement results are shown in Table 1 below.

Conventional Example 1 (Microstrip Resonator)

In order to know the microstrip resonance characteristics, an annular resonator having the same shape and size was manufactured using the same ceramic dielectric substrate as used in Example 1, and the quality coefficient and effective dielectric constant of the resonator were measured at the center frequency of 3.12 GHz. It is shown in Table 1 below.

Conventional Example 2 (Ceramic Dielectric for Simultaneous Sintering)

It is a low-temperature sintering dielectric used to manufacture a multilayered multi-layer substrate, and using the same kind of dielectric as in Example 1 above, by adding an additive which enables co-sintering with Ag, dielectric constant: 25, quality factor: 20,000, Sintering temperature: 875 ℃ was made of a ceramic dielectric for co-sintering. The dielectric constant was used to measure the quality factor and effective dielectric constant of the resonator, and the measurement results are shown in Table 1 below.

Quality factor (Q × f) Effective permittivity Example 1 230 (f = 2.87 GHz) 30 Conventional Example 1 170 (f = 3.12 GHz) 24 Conventional Example 2 120 21

As shown in Table 1, in the case of the conventional example 1 having the microstrip structure and the example 1 of the present invention, when the same substrate is used, the dielectric constant and the quality factor of Example 1 are high. This means that miniaturization and low loss of the device can be easily achieved.

Conventional example 2 of the co-sintering ceramic dielectric is in a state where the quality factor and the dielectric constant of the additive are reduced, and thus it is not significant to directly compare the two structures. In this case, for the simultaneous sintering ceramic laminate structure, there are difficulties in the process of stacking multiple layers, printing techniques, and cutting techniques.

In contrast, the multilayered multilayer substrate according to the present invention not only simplifies the manufacturing process as described above, but also reduces the difficulty of the process, thereby facilitating the standardization process, and as a result, the mass productivity is increased at low cost. In addition, it can be bonded in a multi-layer structure without degrading the dielectric properties, it is possible to realize a high effective dielectric constant and quality coefficient, resulting in miniaturization and low loss of the microwave device.

As described above, in the present invention, a plurality of dielectric substrates that are pre-sintered at a high temperature while maintaining the existing dielectric composition are used to form a circuit in a multi-layer structure, and simultaneously or partially join the circuits, thereby miniaturizing and lowering the cost of the microwave device. At the same time, it is possible to realize high effective permittivity and quality factor.

The present invention can be applied to microwave products requiring a general microwave stripline. Such products can be easily manufactured with a filter having a height lower than that of a conventional coaxial filter in a multilayer structure, and due to the small size and low loss, a duplexer composed of two band pass filters, other small directional couplers, and a high quality factor It can be applied to a high resonant circuit used, a small resonator using the same, and a delay line of a transmission line.

In addition, the present invention can be miniaturized by using the present invention in conventional coaxial, monoblock and stacked LC filters. Furthermore, since the miniaturization of a single module of the conventional microwave devices and only a part of the stripline structure can be easily implemented, the part can be used for improving a part of the characteristics.

In the above, the present invention has been illustrated and described with reference to specific preferred embodiments, but the present invention is not limited to the above-described embodiments and is not limited to the spirit of the present invention. Various changes and modifications can be made by those who have

Claims (11)

A plurality of ceramic dielectric substrates pre-sintered with a ceramic composition containing no additives for low temperature sintering, A plurality of conductive patterns formed of a conductive material between the substrates to form a circuit of a microwave device, A plurality of bonding regions disposed in empty spaces in which the conductive patterns are not formed to bond adjacent substrates between the substrates; First and second ground planes formed of a conductive material on top and bottom surfaces of the plurality of ceramic dielectric substrates; First and second connection conductors formed of a conductive material to cover both sides of the plurality of stacked ceramic dielectric substrates to interconnect the first and second ground planes and to simultaneously bond and secure the plurality of substrates; And a pair of input and output electrodes disposed on any one of the first and second ground planes and electrically insulated from the first and second ground planes. The strip line structure as claimed in claim 1, wherein each of the first and second connection conductors is formed of a plastic film or a thin metal plate fixed at both ends of the highly conductive metal paste to the first and second ground planes. Microwave device. The microwave device of claim 1, wherein at least one of the plurality of ceramic dielectric substrates is smaller in size with respect to another substrate. The microwave device according to any one of claims 1 to 3, wherein the microwave device is any one of a dielectric resonator, a dielectric filter, a directional coupler, and a delay line. Preparing a plurality of ceramic dielectric substrates by sintering in advance with a ceramic composition containing no additives for low temperature sintering; Forming a plurality of conductive patterns by using a conductive metal on the upper surface of the substrate except the uppermost substrate to form a circuit of the microwave device, Forming a plurality of bonding material patterns for mutually bonding substrates adjacent to empty spaces in which the conductive patterns are not formed; The first and second ground planes and the first and second ground planes are disposed on one of the first and second ground planes by using a conductive metal on the top and bottom surfaces of the plurality of ceramic dielectric substrates. Forming a pair of input and output terminal areas spaced apart from each other; Pressing the plurality of substrates and fixing the plurality of substrates by high temperature drying and firing; Forming first and second side adhesive layers using conductive materials to cover both sides of the stacked plurality of ceramic dielectric substrates to interconnect the first and second ground planes and simultaneously bond and secure the plurality of substrates. Method for manufacturing a microwave device having a strip line structure, characterized in that consisting of a step. The method of manufacturing a microwave device having a strip line structure according to claim 5, wherein the conductive metal is 100% Ag paste or Cu. The method of claim 5, wherein the bonding material pattern is a microwave device having a strip line structure, characterized in that formed by the screen printing method using any one of a conductive metal paste, a glass-based binder and a silver epoxy binder. Way. The method of claim 5, wherein the plurality of conductive patterns and the bonding material pattern are simultaneously formed in one step by screen printing using a metal paste. The method of claim 5, wherein the first and second side adhesive layers are formed by a soldering or brazing method, or are formed by printing and firing a metal paste. 10. The method according to any one of claims 5 to 9, wherein at least one of the plurality of ceramic dielectric substrates is smaller in size with respect to other substrates. The method of any one of claims 5 to 9, further comprising forming a conductive pattern having a width smaller than that of the conductive pattern on the lower surface of the upper substrate corresponding to the conductive pattern after forming the plurality of conductive patterns for forming the circuit. A method of manufacturing a microwave device having a strip line structure, characterized in that it comprises a.

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