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KR0155594B1 - Package buffer structure of electronic manufactures - Google Patents

Package buffer structure of electronic manufactures Download PDF

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Publication number
KR0155594B1
KR0155594B1 KR1019960002845A KR19960002845A KR0155594B1 KR 0155594 B1 KR0155594 B1 KR 0155594B1 KR 1019960002845 A KR1019960002845 A KR 1019960002845A KR 19960002845 A KR19960002845 A KR 19960002845A KR 0155594 B1 KR0155594 B1 KR 0155594B1
Authority
KR
South Korea
Prior art keywords
electronic product
present
packaging
cushioning material
buffer
Prior art date
Application number
KR1019960002845A
Other languages
Korean (ko)
Other versions
KR970061719A (en
Inventor
김동룡
Original Assignee
구자홍
엘지전자주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 구자홍, 엘지전자주식회사 filed Critical 구자홍
Priority to KR1019960002845A priority Critical patent/KR0155594B1/en
Publication of KR970061719A publication Critical patent/KR970061719A/en
Application granted granted Critical
Publication of KR0155594B1 publication Critical patent/KR0155594B1/en

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D81/00—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents
    • B65D81/02—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents specially adapted to protect contents from mechanical damage
    • B65D81/05—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents specially adapted to protect contents from mechanical damage maintaining contents at spaced relation from package walls, or from other contents
    • B65D81/107—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents specially adapted to protect contents from mechanical damage maintaining contents at spaced relation from package walls, or from other contents using blocks of shock-absorbing material
    • B65D81/113—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents specially adapted to protect contents from mechanical damage maintaining contents at spaced relation from package walls, or from other contents using blocks of shock-absorbing material of a shape specially adapted to accommodate contents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
    • B65D85/68—Containers, packaging elements or packages, specially adapted for particular articles or materials for machines, engines or vehicles in assembled or dismantled form
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D2585/00—Containers, packaging elements or packages specially adapted for particular articles or materials
    • B65D2585/68—Containers, packaging elements or packages specially adapted for particular articles or materials for machines, engines, or vehicles in assembled or dismantled form

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Buffer Packaging (AREA)

Abstract

본 발명은 전자 제품을 포장할 때 외부 충격으로부터 전자 제품을 보호하기 위한 완충재 구조에 관한 것으로서 특히, 재활용이 가능한 종이로 골격을 구성하고, 전자제품이 결합 고정되는 다수의 리브와 홈을 가지며, 보강을 위한 완충재를 조립하여 사용할 수 있도록 한 전자제품의 포장 완충재 구조에 관한 것이다.The present invention relates to a shock absorber structure for protecting an electronic product from external impact when packaging the electronic product. In particular, the present invention relates to a shock absorber structure for protecting an electronic product from external shocks. The present invention relates to a packaging cushioning material structure of an electronic product that can be used by assembling the cushioning material.

종래의 전자제품의 포장 완충재 구조는 전자제품의 형상에 대응하는 결합 구조를 가지는 합성수지재의 완충재를 사용하고 있기 때문에, 합성수지재의 완충재 사용에 따른 환경 오염과 재활용 불가의 단점이 있다.Conventional packaging cushioning material for electronic products has a disadvantage of environmental pollution and non-recyclable due to the use of the cushioning material of the synthetic resin material having a coupling structure corresponding to the shape of the electronic product.

본 발명은 재활용이 가능하고 또 환경 오염을 유발하지 않는 종이재로 완충재 골격(1)을 구성하고, 이 종이 완충재(1)에 전자 제품(7)의 결합 구조에 대응하는 형상의 리브(2, 3, 4) 및 홈(5)을 형성하여 전자제품(7)을 포장할 수 있게하며, 보강이 필요한 개소에는 별도로 보강재(8)를 삽입하여 전자제품의 완충에 만전을 기 할 수 있도록 한 전자제품의 포장 완충재 구조를 제공 한다.The present invention constitutes a buffer frame 1 made of paper material which is recyclable and does not cause environmental pollution, and the ribs 2 having a shape corresponding to the coupling structure of the electronic product 7 to the paper buffer material 1 are provided. 3, 4) and grooves (5) to form the electronics (7) can be packaged, and the reinforcement (8) is inserted separately in the place where the reinforcement is needed to ensure that the electronic product fully buffered Provide product packaging cushion structure.

Description

전자제품의 포장 완충재 구조Packaging buffer structure of electronic products

제1도는 종래의 전자제품의 포장 완충재 구조를 나타낸 사시도.1 is a perspective view showing a structure of a packaging buffer of a conventional electronic product.

제2도는 본 발명의 전자제품의 포장 완충재 구조를 나타낸 사시도.2 is a perspective view showing the structure of the packaging buffer of the electronic product of the present invention.

제3도는 본 발명의 포장 완충재 결합 상태를 나타낸 도면.Figure 3 is a view showing a packaging cushioning state of the present invention.

제4도는 본 발명의 포장 완충재에 제품을 결합한 상태의 사시도.Figure 4 is a perspective view of the product bonded to the packaging buffer of the present invention.

* 도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings

1 : 종이 완충재 골격 2 : 전면 수직 리브1: paper cushioning material skeleton 2: front vertical rib

3 : 후면 수직 리브 4 : 이중 완충용 리브3: rear vertical rib 4: double buffer rib

5 : 이중 완충용 홈 8 : 보강재5: double buffer groove 8: reinforcement

본 발명은 전자 제품을 포장할 때 외부 충격으로부터 전자 제품을 보호하기 위한 완충재 구조에 관한 것으로서 특히, 재활용이 가능한 종이로 골격을 구성하고, 전자제품이 결합 고정되는 다수의 리브와 홈을 가지며, 보강을 위한 완충재를 조립하여 사용할 수 있도록한 전자제품의 포장 완충재 구조에 관한 것이다.The present invention relates to a shock absorber structure for protecting an electronic product from external impact when packaging the electronic product. In particular, the present invention relates to a shock absorber structure for protecting an electronic product from external shocks. The present invention relates to a packaging buffer material structure of an electronic product that can be used to assemble a buffer material.

종래의 전자제품의 포장 완충재 구조는 제1도에 도시된 바와같이, 전자제품(100)의 형상에 대응하는 결합 구조를 가지는 합성수지재의 완충재(200)(300)를 사용하고 있기 때문에, 합성수재지의 완충재 사용에 따른 환경 오염과 재활용 불가의 단점이 있다.Since the conventional packaging cushioning material for electronic products uses a cushioning material (200, 300) of synthetic resin material having a coupling structure corresponding to the shape of the electronic product 100, as shown in Figure 1, There is a disadvantage of environmental pollution and non-recyclable by using the buffer material.

본 발명은 재활용이 가능하고 또 환경 오염을 유발하지 않는 종이재로 완충재 골격을 구성하고, 이 종이 완충재에 전자 제품의 결합 구조에 대응하는 형상의 리브 및 홈을 형성하여 전자제품을 포장할 수 있게하며, 보강이 필요한 개소에는 별도의 보강재를 삽입하여 전자 제품의 완중에 만전을 기 할 수 있도록 한 전자제품의 포장 완충재 구조를 제공함을 목적으로 한다.The present invention constitutes a buffer frame made of paper material which is recyclable and does not cause environmental pollution, and ribs and grooves having a shape corresponding to the coupling structure of the electronic product are formed on the paper buffer material so as to package the electronic product. It is an object of the present invention to provide a packaging buffer structure for electronic products in which additional reinforcement materials are inserted to ensure perfection in electronic products.

상기의 목적을 달성하기 위한 본 발명의 전자제품의 포장 완충재 구조는 제2도에 도시된 바와같이, 종이재로 골격이 이루어지는 종이 완충재(11)의 전후면으로 전자제품(7)이 결합 고정되는 전면 수직리브(2)와 후면 수직 리브(3)를 다수개 형성하고, 또 이중 완충용 리브(4) 및 홈(5)을 다수개 형성하며, 완충 효과를 극대화시키기 위하여 전면 수직 리브(2) 사이로 상하 및 좌우 충격을 2차적으로 완충하는 보강재(8)를 결합하여 전자 제품(7)을 완충 포장함을 특징으로 하는 전자제품의 포장 완충재 구조 이다.As shown in FIG. 2, the packaging cushioning structure of the electronic product of the present invention for achieving the above object is coupled to and fixed to the front and rear surfaces of the paper cushioning material 11 formed of a paper material. In order to form a plurality of front vertical ribs (2) and rear vertical ribs (3), and to form a plurality of double buffer ribs (4) and grooves (5), the front vertical ribs (2) It is a packaging cushioning material structure of an electronic product, characterized in that the electronic product 7 is buffered by combining the reinforcing material (8) for secondary shock absorbing up, down, left and right shocks.

도면에서 부호 6은 꼭지점 홈이고, 상기 보강재(8)는 완충 효과가 뛰어난 발포성 수지 등으로 형성하여 필요한 부위에 삽입하게 하였다.In the drawing, reference numeral 6 denotes a vertex groove, and the reinforcement 8 is formed of a foaming resin having excellent buffering effect and the like, and inserted into a required portion.

상기한 바와같이 구성된 본 발명의 완충재 구조에서 보강재(8)를 결합한 상태를 도면 제3도에 도시하였으며, 전자 제품(7)을 완충 포장한 구조를 도면 제4도에 도시하였다.The state in which the reinforcing material 8 is coupled to the shock absorber structure of the present invention configured as described above is shown in FIG. 3, and the structure in which the electronic product 7 is buffer-packed is shown in FIG.

상기 제2도 내지 제4도에 도시된 바와 같이, 종이 완충재(1)로 골격이 이루어지기 때문에 환경 오염을 유발하지 않으며, 또한 재활용이 가능하게 되고, 전면 수직 리브(2)와 후면 수직 리브(3)가 완충재(1)의 전후면에서 일정한 높이와 간격을 가지고 서로 엇갈리게 다수 형성되어 있기 때문에 전자 제품(7)을 포장하였을 때 견고하게 완충하여 결합할 수 있다.As shown in FIG. 2 to FIG. 4, since the skeleton is made of the paper buffer 1, it does not cause environmental pollution and is also recyclable, and the front vertical rib 2 and the rear vertical rib ( Since 3) is formed in a plurality of staggered mutually at a constant height and spacing on the front and rear surfaces of the cushioning material (1) can be firmly cushioned and combined when the electronic product (7) is packaged.

또한, 보강재(8)는 완충 효과가 뛰어난 발포성 수지로서 강도 보강이 필요한 부위마다 삽입하여 사용하기 때문에 외부 충격으로부터 전자 제품(7)을 잘 보호할 수 있고, 또 충격 흡수와 완충 효과도 극대화시킬 수 있게 된다.In addition, since the reinforcing material 8 is a foamable resin having excellent buffering effect, the reinforcing material 8 is inserted into each part requiring strength reinforcement, so that the electronic product 7 can be well protected from external shock, and the shock absorbing and shock absorbing effect can also be maximized. Will be.

도면에서 완충재의 완충 방향은 화살표로 표기된 바와같다.The buffer direction of the cushioning material in the figure is as indicated by the arrow.

또한, 상기의 완충재 구조에서는 이중 완충용 리브(4)와 홈(5)이 형성되어 있기 때문에 이 리브(4)와 홈(5)에 의해서 전자제품(7)은 더욱 안정되게 포장될 수 있다.In addition, since the double buffer rib 4 and the groove 5 are formed in the above buffer member structure, the electronic product 7 can be more stably packaged by the ribs 4 and the groove 5.

상기한 바와같이 본 발명의 전자제품의 포장 완충재 구조에 의하면, 재활용이 가능한 종이 완충재로 구성되므로 환경 오염의 문제를 해소할 수 있고, 또 그 강도의 보강이 용이하며, 전자제품의 상하좌우 어느 방향으로부터의 충격도 용이하게 흡수 및 완충시킬 수 있는 구조를 제공한다.As described above, according to the structure of the packaging buffer of the electronic product of the present invention, since it is composed of recyclable paper buffer material, it is possible to solve the problem of environmental pollution, and to reinforce the strength of the electronic product in any direction up, down, left, and right. It provides a structure that can easily absorb and cushion an impact from the same.

Claims (1)

종이재로 골격이 이루어지는 종이 완충재(1)의 전후면으로 전자제품(7)이 결합 고정되는 전면 수직리브(2)와 후면 수직 리브(3)를 다수개 형성하고, 또 이중 완충용 리브(4) 및 홈(5)을 다수개 형성하며, 완충 효과를 극대화시키기 위하여 전면 수직 리브(2) 사이로 상하 및 좌우 충격을 2차적으로 완충하는 보강재(8)를 결합하여 전자 제품(7)을 완충 포장함을 특징으로 하는 전자제품의 포장 완충재 구조.A plurality of front vertical ribs 2 and rear vertical ribs 3 are formed on the front and rear surfaces of the paper cushioning material 1, which is made of paper material, and the electronic product 7 is fixedly coupled thereto. ) And a plurality of grooves (5), and in order to maximize the buffer effect, the electronic product (7) is cushioned and packed by combining a reinforcement (8) which secondaryly absorbs the vertical and horizontal shocks between the front vertical ribs (2). The packaging buffer structure of the electronic product, characterized in that.
KR1019960002845A 1996-02-06 1996-02-06 Package buffer structure of electronic manufactures KR0155594B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019960002845A KR0155594B1 (en) 1996-02-06 1996-02-06 Package buffer structure of electronic manufactures

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019960002845A KR0155594B1 (en) 1996-02-06 1996-02-06 Package buffer structure of electronic manufactures

Publications (2)

Publication Number Publication Date
KR970061719A KR970061719A (en) 1997-09-12
KR0155594B1 true KR0155594B1 (en) 1999-02-18

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Application Number Title Priority Date Filing Date
KR1019960002845A KR0155594B1 (en) 1996-02-06 1996-02-06 Package buffer structure of electronic manufactures

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Publication number Publication date
KR970061719A (en) 1997-09-12

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