JPWO2023281775A1 - - Google Patents
Info
- Publication number
- JPWO2023281775A1 JPWO2023281775A1 JP2023533044A JP2023533044A JPWO2023281775A1 JP WO2023281775 A1 JPWO2023281775 A1 JP WO2023281775A1 JP 2023533044 A JP2023533044 A JP 2023533044A JP 2023533044 A JP2023533044 A JP 2023533044A JP WO2023281775 A1 JPWO2023281775 A1 JP WO2023281775A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
- C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/16—Electroplating with layers of varying thickness
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electroplating Methods And Accessories (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2021114582 | 2021-07-09 | ||
PCT/JP2022/001218 WO2023281775A1 (en) | 2021-07-09 | 2022-01-14 | Surface-treated copper foil, copper-clad laminate, and printed wiring board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPWO2023281775A1 true JPWO2023281775A1 (en) | 2023-01-12 |
Family
ID=84801729
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2023533044A Pending JPWO2023281775A1 (en) | 2021-07-09 | 2022-01-14 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JPWO2023281775A1 (en) |
KR (1) | KR20230113357A (en) |
CN (1) | CN117062943A (en) |
TW (1) | TWI802225B (en) |
WO (1) | WO2023281775A1 (en) |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102224281B (en) * | 2008-11-25 | 2014-03-26 | 吉坤日矿日石金属株式会社 | Copper foil for printed circuit |
SG183311A1 (en) * | 2010-05-07 | 2012-09-27 | Jx Nippon Mining & Metals Corp | Copper foil for printed circuit |
JP2012112009A (en) | 2010-11-26 | 2012-06-14 | Hitachi Cable Ltd | Copper foil, and method for producing copper foil |
JP2014152352A (en) * | 2013-02-06 | 2014-08-25 | Sh Copper Products Corp | Composite copper foil and production method thereof |
CN107614760B (en) * | 2015-07-03 | 2018-07-13 | 三井金属矿业株式会社 | Roughening treatment copper foil, copper-clad laminated board and printed circuit board |
JP6200042B2 (en) * | 2015-08-06 | 2017-09-20 | Jx金属株式会社 | Copper foil with carrier, laminate, printed wiring board manufacturing method and electronic device manufacturing method |
JP7356209B2 (en) * | 2017-03-31 | 2023-10-04 | Jx金属株式会社 | Surface-treated copper foil, surface-treated copper foil with resin layer, copper foil with carrier, laminate, method for manufacturing printed wiring boards, and method for manufacturing electronic devices |
JP7114499B2 (en) * | 2019-01-30 | 2022-08-08 | Jx金属株式会社 | Surface treated copper foil, copper clad laminate and printed wiring board |
US10581081B1 (en) * | 2019-02-01 | 2020-03-03 | Chang Chun Petrochemical Co., Ltd. | Copper foil for negative electrode current collector of lithium ion secondary battery |
JP6816193B2 (en) * | 2019-03-26 | 2021-01-20 | 古河電気工業株式会社 | Surface-treated copper foil, and copper-clad laminates and printed wiring boards using this |
JP7300976B2 (en) * | 2019-12-13 | 2023-06-30 | Jx金属株式会社 | Surface treated copper foil, copper clad laminate and printed wiring board |
JP2021095596A (en) * | 2019-12-13 | 2021-06-24 | Jx金属株式会社 | Surface-treated copper foil, copper-clad laminate, and printed wiring board |
-
2022
- 2022-01-14 JP JP2023533044A patent/JPWO2023281775A1/ja active Pending
- 2022-01-14 CN CN202280010387.1A patent/CN117062943A/en active Pending
- 2022-01-14 WO PCT/JP2022/001218 patent/WO2023281775A1/en active Application Filing
- 2022-01-14 TW TW111101711A patent/TWI802225B/en active
- 2022-01-14 KR KR1020237021472A patent/KR20230113357A/en unknown
Also Published As
Publication number | Publication date |
---|---|
CN117062943A (en) | 2023-11-14 |
WO2023281775A1 (en) | 2023-01-12 |
TW202304268A (en) | 2023-01-16 |
TWI802225B (en) | 2023-05-11 |
KR20230113357A (en) | 2023-07-28 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20240130 |