JPWO2022202653A1 - - Google Patents
Info
- Publication number
- JPWO2022202653A1 JPWO2022202653A1 JP2023509120A JP2023509120A JPWO2022202653A1 JP WO2022202653 A1 JPWO2022202653 A1 JP WO2022202653A1 JP 2023509120 A JP2023509120 A JP 2023509120A JP 2023509120 A JP2023509120 A JP 2023509120A JP WO2022202653 A1 JPWO2022202653 A1 JP WO2022202653A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/06—Interconnection of layers permitting easy separation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021053518 | 2021-03-26 | ||
| PCT/JP2022/012565 WO2022202653A1 (en) | 2021-03-26 | 2022-03-18 | Wafer treatment method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2022202653A1 true JPWO2022202653A1 (en) | 2022-09-29 |
Family
ID=83395832
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023509120A Pending JPWO2022202653A1 (en) | 2021-03-26 | 2022-03-18 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPWO2022202653A1 (en) |
| TW (1) | TW202249102A (en) |
| WO (1) | WO2022202653A1 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023074536A1 (en) * | 2021-10-27 | 2023-05-04 | 東洋紡株式会社 | Protective film-equipped laminate of inorganic substrate and heat-resistant polymer film |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104520974B (en) * | 2012-08-10 | 2016-02-10 | 积水化学工业株式会社 | The processing method of wafer |
| JP2014072445A (en) * | 2012-09-28 | 2014-04-21 | Nitto Denko Corp | Semiconductor device manufacturing method |
| JP6502824B2 (en) * | 2015-10-19 | 2019-04-17 | 信越化学工業株式会社 | Wafer processed body, temporary adhesive for wafer processing, and method for manufacturing thin wafer |
| JP7045765B2 (en) * | 2018-04-16 | 2022-04-01 | 信越化学工業株式会社 | Substrate processing body with circuit and substrate processing method with circuit |
| JP7035915B2 (en) * | 2018-09-03 | 2022-03-15 | 信越化学工業株式会社 | Manufacturing method of thin wafer |
-
2022
- 2022-03-18 WO PCT/JP2022/012565 patent/WO2022202653A1/en active Application Filing
- 2022-03-18 JP JP2023509120A patent/JPWO2022202653A1/ja active Pending
- 2022-03-24 TW TW111111169A patent/TW202249102A/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| TW202249102A (en) | 2022-12-16 |
| WO2022202653A1 (en) | 2022-09-29 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20230724 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20240709 |
|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20240926 |