JPWO2022201258A1 - - Google Patents
Info
- Publication number
- JPWO2022201258A1 JPWO2022201258A1 JP2023508178A JP2023508178A JPWO2022201258A1 JP WO2022201258 A1 JPWO2022201258 A1 JP WO2022201258A1 JP 2023508178 A JP2023508178 A JP 2023508178A JP 2023508178 A JP2023508178 A JP 2023508178A JP WO2022201258 A1 JPWO2022201258 A1 JP WO2022201258A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/18—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form
- G05B19/4097—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form characterised by using design data to control NC machines, e.g. CAD/CAM
- G05B19/4099—Surface or curve machining, making 3D objects, e.g. desktop manufacturing
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/048—Interaction techniques based on graphical user interfaces [GUI]
- G06F3/0481—Interaction techniques based on graphical user interfaces [GUI] based on specific properties of the displayed interaction object or a metaphor-based environment, e.g. interaction with desktop elements like windows or icons, or assisted by a cursor's changing behaviour or appearance
- G06F3/04817—Interaction techniques based on graphical user interfaces [GUI] based on specific properties of the displayed interaction object or a metaphor-based environment, e.g. interaction with desktop elements like windows or icons, or assisted by a cursor's changing behaviour or appearance using icons
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/14—Digital output to display device ; Cooperation and interconnection of the display device with other functional units
-
- G—PHYSICS
- G08—SIGNALLING
- G08B—SIGNALLING OR CALLING SYSTEMS; ORDER TELEGRAPHS; ALARM SYSTEMS
- G08B21/00—Alarms responsive to a single specified undesired or abnormal condition and not otherwise provided for
- G08B21/18—Status alarms
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/31—From computer integrated manufacturing till monitoring
- G05B2219/31103—Configure parameters of controlled devices
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/45—Nc applications
- G05B2219/45031—Manufacturing semiconductor wafers
Landscapes
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Theoretical Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Human Computer Interaction (AREA)
- Automation & Control Theory (AREA)
- Business, Economics & Management (AREA)
- Emergency Management (AREA)
- Quality & Reliability (AREA)
- Liquid Crystal (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Chemical Vapour Deposition (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2021/011786 WO2022201258A1 (ja) | 2021-03-22 | 2021-03-22 | 半導体装置の製造方法、表示方法、基板処理装置およびプログラム |
Publications (1)
Publication Number | Publication Date |
---|---|
JPWO2022201258A1 true JPWO2022201258A1 (ja) | 2022-09-29 |
Family
ID=83396441
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2023508178A Pending JPWO2022201258A1 (ja) | 2021-03-22 | 2021-03-22 |
Country Status (6)
Country | Link |
---|---|
US (1) | US20240006184A1 (ja) |
JP (1) | JPWO2022201258A1 (ja) |
KR (1) | KR20230159410A (ja) |
CN (1) | CN117043916A (ja) |
TW (1) | TWI821793B (ja) |
WO (1) | WO2022201258A1 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2024149274A (ja) * | 2023-04-07 | 2024-10-18 | 株式会社Kokusai Electric | 制御装置、基板処理装置、半導体装置の製造方法、及びプログラム |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001189248A (ja) * | 2000-01-06 | 2001-07-10 | Hitachi Kokusai Electric Inc | 半導体製造装置 |
KR100863011B1 (ko) * | 2004-09-15 | 2008-10-13 | 가부시키가이샤 히다치 고쿠사이 덴키 | 반도체 제조장치 및 반도체장치의 제조방법 |
JP2006093494A (ja) * | 2004-09-27 | 2006-04-06 | Hitachi Kokusai Electric Inc | 基板処理装置 |
JP5802691B2 (ja) * | 2013-02-15 | 2015-10-28 | 東京エレクトロン株式会社 | 基板処理装置、シミュレーション装置、プログラムおよびシミュレーション方法 |
JP2017002353A (ja) * | 2015-06-09 | 2017-01-05 | 株式会社日立国際電気 | 基板処理装置及び半導体装置の製造方法 |
KR102210582B1 (ko) * | 2017-09-25 | 2021-02-02 | 가부시키가이샤 후지킨 | 밸브장치, 유량 조정방법, 유체 제어장치, 유량 제어방법, 반도체 제조장치 및 반도체 제조방법 |
-
2021
- 2021-03-22 WO PCT/JP2021/011786 patent/WO2022201258A1/ja active Application Filing
- 2021-03-22 KR KR1020237031198A patent/KR20230159410A/ko active Search and Examination
- 2021-03-22 JP JP2023508178A patent/JPWO2022201258A1/ja active Pending
- 2021-03-22 CN CN202180094756.5A patent/CN117043916A/zh active Pending
- 2021-11-18 TW TW110142886A patent/TWI821793B/zh active
-
2023
- 2023-09-19 US US18/469,679 patent/US20240006184A1/en active Pending
Also Published As
Publication number | Publication date |
---|---|
KR20230159410A (ko) | 2023-11-21 |
TW202238668A (zh) | 2022-10-01 |
US20240006184A1 (en) | 2024-01-04 |
WO2022201258A1 (ja) | 2022-09-29 |
TWI821793B (zh) | 2023-11-11 |
CN117043916A (zh) | 2023-11-10 |
Similar Documents
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