JPWO2022176778A1 - - Google Patents
Info
- Publication number
- JPWO2022176778A1 JPWO2022176778A1 JP2023500805A JP2023500805A JPWO2022176778A1 JP WO2022176778 A1 JPWO2022176778 A1 JP WO2022176778A1 JP 2023500805 A JP2023500805 A JP 2023500805A JP 2023500805 A JP2023500805 A JP 2023500805A JP WO2022176778 A1 JPWO2022176778 A1 JP WO2022176778A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F22/00—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides or nitriles thereof
- C08F22/10—Esters
- C08F22/12—Esters of phenols or saturated alcohols
- C08F22/14—Esters having no free carboxylic acid groups
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
- B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/46—Polymerisation initiated by wave energy or particle radiation
- C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
- C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
- C08F222/10—Esters
- C08F222/1006—Esters of polyhydric alcohols or polyhydric phenols
- C08F222/102—Esters of polyhydric alcohols or polyhydric phenols of dialcohols, e.g. ethylene glycol di(meth)acrylate or 1,4-butanediol dimethacrylate
- C08F222/1025—Esters of polyhydric alcohols or polyhydric phenols of dialcohols, e.g. ethylene glycol di(meth)acrylate or 1,4-butanediol dimethacrylate of aromatic dialcohols
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2067/00—Use of polyesters or derivatives thereof, as moulding material
- B29K2067/04—Polyesters derived from hydroxycarboxylic acids
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Polymerisation Methods In General (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2021022605 | 2021-02-16 | ||
PCT/JP2022/005427 WO2022176778A1 (ja) | 2021-02-16 | 2022-02-10 | インプリント用硬化性組成物、硬化物、インプリントパターンの製造方法及びデバイスの製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPWO2022176778A1 true JPWO2022176778A1 (ja) | 2022-08-25 |
Family
ID=82931681
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2023500805A Pending JPWO2022176778A1 (ja) | 2021-02-16 | 2022-02-10 |
Country Status (4)
Country | Link |
---|---|
US (1) | US20230383027A1 (ja) |
JP (1) | JPWO2022176778A1 (ja) |
TW (1) | TW202239775A (ja) |
WO (1) | WO2022176778A1 (ja) |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5196933B2 (ja) * | 2006-09-27 | 2013-05-15 | 富士フイルム株式会社 | 光ナノインプリントリソグラフィ用硬化性組成物およびそれを用いたパターン形成方法 |
JP2010114209A (ja) * | 2008-11-05 | 2010-05-20 | Fujifilm Corp | 光ナノインプリント用硬化性組成物、硬化物およびその製造方法 |
TW201339744A (zh) * | 2012-03-20 | 2013-10-01 | Ind Tech Res Inst | 圖案化層狀材料與形成轉印模的方法 |
JP5978761B2 (ja) * | 2012-05-23 | 2016-08-24 | 旭硝子株式会社 | インプリント用光硬化性組成物および微細パターンを表面に有する成形体の製造方法 |
US10578965B2 (en) * | 2016-03-31 | 2020-03-03 | Canon Kabushiki Kaisha | Pattern forming method |
JPWO2020175301A1 (ja) * | 2019-02-27 | 2021-11-25 | 富士フイルム株式会社 | インプリント用の硬化性組成物、キット、パターン製造方法、および半導体素子の製造方法 |
-
2022
- 2022-02-10 WO PCT/JP2022/005427 patent/WO2022176778A1/ja active Application Filing
- 2022-02-10 TW TW111104977A patent/TW202239775A/zh unknown
- 2022-02-10 JP JP2023500805A patent/JPWO2022176778A1/ja active Pending
-
2023
- 2023-08-15 US US18/450,039 patent/US20230383027A1/en active Pending
Also Published As
Publication number | Publication date |
---|---|
US20230383027A1 (en) | 2023-11-30 |
TW202239775A (zh) | 2022-10-16 |
WO2022176778A1 (ja) | 2022-08-25 |