JPWO2022176338A1 - - Google Patents
Info
- Publication number
- JPWO2022176338A1 JPWO2022176338A1 JP2023500563A JP2023500563A JPWO2022176338A1 JP WO2022176338 A1 JPWO2022176338 A1 JP WO2022176338A1 JP 2023500563 A JP2023500563 A JP 2023500563A JP 2023500563 A JP2023500563 A JP 2023500563A JP WO2022176338 A1 JPWO2022176338 A1 JP WO2022176338A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D7/00—Control of flow
- G05D7/06—Control of flow characterised by the use of electric means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/3065—Plasma etching; Reactive-ion etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Plasma & Fusion (AREA)
- Automation & Control Theory (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021023083 | 2021-02-17 | ||
| JP2021149626 | 2021-09-14 | ||
| PCT/JP2021/045330 WO2022176338A1 (ja) | 2021-02-17 | 2021-12-09 | 静電チャック装置用のガス供給システム、ガス供給方法及びガス供給システム用プログラム |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2022176338A1 true JPWO2022176338A1 (ja) | 2022-08-25 |
Family
ID=82931384
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023500563A Pending JPWO2022176338A1 (ja) | 2021-02-17 | 2021-12-09 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPWO2022176338A1 (ja) |
| TW (1) | TW202234026A (ja) |
| WO (1) | WO2022176338A1 (ja) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118424532B (zh) * | 2024-07-03 | 2024-10-29 | 无锡展硕科技有限公司 | 一种半导体晶圆静电吸盘吸附力检测装置及检测方法 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3965258B2 (ja) * | 1999-04-30 | 2007-08-29 | 日本碍子株式会社 | 半導体製造装置用のセラミックス製ガス供給構造 |
| JP5331519B2 (ja) * | 2008-03-11 | 2013-10-30 | 日本碍子株式会社 | 静電チャック |
| JP2016136554A (ja) * | 2015-01-23 | 2016-07-28 | 株式会社日立ハイテクノロジーズ | プラズマ処理装置 |
| JP2018096848A (ja) * | 2016-12-13 | 2018-06-21 | 株式会社堀場エステック | 流量特性関数同定方法、流量特性関数同定装置、流量特性関数同定用プログラム、及び、これらを用いた流量センサ又は流量制御装置 |
| JP2019067846A (ja) * | 2017-09-29 | 2019-04-25 | 東京エレクトロン株式会社 | 温度制御方法 |
| JP7073098B2 (ja) * | 2017-12-27 | 2022-05-23 | 株式会社日立ハイテク | ウエハ処理方法およびウエハ処理装置 |
| KR102124303B1 (ko) * | 2018-10-15 | 2020-06-18 | 세메스 주식회사 | 기판 처리 장치, 기판 지지 유닛 및 기판 처리 방법 |
| JP7529664B2 (ja) * | 2019-07-08 | 2024-08-06 | 株式会社堀場エステック | 流量制御装置、流量測定方法、及び、流量制御装置用プログラム |
-
2021
- 2021-12-09 JP JP2023500563A patent/JPWO2022176338A1/ja active Pending
- 2021-12-09 WO PCT/JP2021/045330 patent/WO2022176338A1/ja active Application Filing
- 2021-12-16 TW TW110147079A patent/TW202234026A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| TW202234026A (zh) | 2022-09-01 |
| WO2022176338A1 (ja) | 2022-08-25 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20241118 |