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JPWO2022102458A1 - - Google Patents

Info

Publication number
JPWO2022102458A1
JPWO2022102458A1 JP2022561835A JP2022561835A JPWO2022102458A1 JP WO2022102458 A1 JPWO2022102458 A1 JP WO2022102458A1 JP 2022561835 A JP2022561835 A JP 2022561835A JP 2022561835 A JP2022561835 A JP 2022561835A JP WO2022102458 A1 JPWO2022102458 A1 JP WO2022102458A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022561835A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022102458A1 publication Critical patent/JPWO2022102458A1/ja
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/02—Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means therefor; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surface
    • B05C11/08—Spreading liquid or other fluent material by manipulating the work, e.g. tilting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C9/00—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important
    • B05C9/08—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation
    • B05C9/12—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation the auxiliary operation being performed after the application
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP2022561835A 2020-11-13 2021-11-01 Pending JPWO2022102458A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020189273 2020-11-13
PCT/JP2021/040266 WO2022102458A1 (ja) 2020-11-13 2021-11-01 現像処理装置及び現像処理方法

Publications (1)

Publication Number Publication Date
JPWO2022102458A1 true JPWO2022102458A1 (ja) 2022-05-19

Family

ID=81602238

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022561835A Pending JPWO2022102458A1 (ja) 2020-11-13 2021-11-01

Country Status (2)

Country Link
JP (1) JPWO2022102458A1 (ja)
WO (1) WO2022102458A1 (ja)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002057088A (ja) * 2000-08-09 2002-02-22 Tokyo Electron Ltd 基板処理装置および現像処理装置
JP2012191168A (ja) * 2011-02-24 2012-10-04 Tokyo Electron Ltd 有機溶剤を含有する現像液を用いた現像処理方法及び現像処理装置
JP2018041928A (ja) * 2016-09-09 2018-03-15 東京エレクトロン株式会社 処理液供給装置及び処理液供給装置の運用方法並びに記憶媒体

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002057088A (ja) * 2000-08-09 2002-02-22 Tokyo Electron Ltd 基板処理装置および現像処理装置
JP2012191168A (ja) * 2011-02-24 2012-10-04 Tokyo Electron Ltd 有機溶剤を含有する現像液を用いた現像処理方法及び現像処理装置
JP2018041928A (ja) * 2016-09-09 2018-03-15 東京エレクトロン株式会社 処理液供給装置及び処理液供給装置の運用方法並びに記憶媒体

Also Published As

Publication number Publication date
WO2022102458A1 (ja) 2022-05-19

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