JPWO2022045157A1 - - Google Patents
Info
- Publication number
- JPWO2022045157A1 JPWO2022045157A1 JP2022545649A JP2022545649A JPWO2022045157A1 JP WO2022045157 A1 JPWO2022045157 A1 JP WO2022045157A1 JP 2022545649 A JP2022545649 A JP 2022545649A JP 2022545649 A JP2022545649 A JP 2022545649A JP WO2022045157 A1 JPWO2022045157 A1 JP WO2022045157A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J109/00—Adhesives based on homopolymers or copolymers of conjugated diene hydrocarbons
- C09J109/06—Copolymers with styrene
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J125/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Adhesives based on derivatives of such polymers
- C09J125/02—Homopolymers or copolymers of hydrocarbons
- C09J125/04—Homopolymers or copolymers of styrene
- C09J125/08—Copolymers of styrene
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020143253 | 2020-08-27 | ||
| PCT/JP2021/031051 WO2022045157A1 (en) | 2020-08-27 | 2021-08-24 | Adhesive composition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2022045157A1 true JPWO2022045157A1 (en) | 2022-03-03 |
Family
ID=80353964
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022545649A Pending JPWO2022045157A1 (en) | 2020-08-27 | 2021-08-24 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPWO2022045157A1 (en) |
| WO (1) | WO2022045157A1 (en) |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11340593A (en) * | 1998-05-29 | 1999-12-10 | Shin Etsu Polymer Co Ltd | Laminate for printed wiring board and its manufacture |
| JP6284094B2 (en) * | 2013-08-23 | 2018-02-28 | 国立研究開発法人産業技術総合研究所 | Resin composition for dielectric and high frequency dielectric device |
| JP6828242B2 (en) * | 2016-01-26 | 2021-02-10 | 昭和電工マテリアルズ株式会社 | Thermosetting resin composition, prepreg, film with resin, laminated board and multilayer printed wiring board |
| JP6142961B1 (en) * | 2016-03-08 | 2017-06-07 | 東洋インキＳｃホールディングス株式会社 | LAMINATE, MANUFACTURING METHOD THEREOF, AND RESIN FILM WITH ADHESIVE LAYER |
| JP6561153B2 (en) * | 2017-02-20 | 2019-08-14 | 株式会社有沢製作所 | Resin composition, adhesive film, coverlay film, laminate, copper foil with resin and copper clad laminate with resin |
| JP7202690B2 (en) * | 2018-10-02 | 2023-01-12 | ナミックス株式会社 | Resin composition, film with substrate, metal/resin laminate and semiconductor device |
-
2021
- 2021-08-24 JP JP2022545649A patent/JPWO2022045157A1/ja active Pending
- 2021-08-24 WO PCT/JP2021/031051 patent/WO2022045157A1/en active Application Filing
Also Published As
| Publication number | Publication date |
|---|---|
| TW202214808A (en) | 2022-04-16 |
| WO2022045157A1 (en) | 2022-03-03 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20231114 |