JPWO2022004583A1 - - Google Patents
Info
- Publication number
- JPWO2022004583A1 JPWO2022004583A1 JP2022533951A JP2022533951A JPWO2022004583A1 JP WO2022004583 A1 JPWO2022004583 A1 JP WO2022004583A1 JP 2022533951 A JP2022533951 A JP 2022533951A JP 2022533951 A JP2022533951 A JP 2022533951A JP WO2022004583 A1 JPWO2022004583 A1 JP WO2022004583A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1046—Polyimides containing oxygen in the form of ether bonds in the main chain
- C08G73/1053—Polyimides containing oxygen in the form of ether bonds in the main chain with oxygen only in the tetracarboxylic moiety
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/40—High-molecular-weight compounds
- C08G18/64—Macromolecular compounds not provided for by groups C08G18/42 - C08G18/63
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1003—Preparatory processes
- C08G73/1035—Preparatory processes from tetracarboxylic acids or derivatives and diisocyanates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1075—Partially aromatic polyimides
- C08G73/1082—Partially aromatic polyimides wholly aromatic in the tetracarboxylic moiety
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020111578 | 2020-06-29 | ||
JP2020211917 | 2020-12-22 | ||
PCT/JP2021/024103 WO2022004583A1 (ja) | 2020-06-29 | 2021-06-25 | イソシアネート変性ポリイミド樹脂、樹脂組成物及びその硬化物 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPWO2022004583A1 true JPWO2022004583A1 (ja) | 2022-01-06 |
Family
ID=79316047
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2022533951A Pending JPWO2022004583A1 (ja) | 2020-06-29 | 2021-06-25 |
Country Status (6)
Country | Link |
---|---|
US (1) | US20230331915A1 (ja) |
JP (1) | JPWO2022004583A1 (ja) |
KR (1) | KR20230029931A (ja) |
CN (1) | CN115777003B (ja) |
TW (1) | TW202219116A (ja) |
WO (1) | WO2022004583A1 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2023147328A (ja) | 2022-03-30 | 2023-10-13 | 藤森工業株式会社 | 接着剤付金属基材及び積層体 |
JP2023147329A (ja) | 2022-03-30 | 2023-10-13 | 藤森工業株式会社 | 接着剤付金属基材及び積層体 |
WO2024075744A1 (ja) * | 2022-10-05 | 2024-04-11 | 株式会社レゾナック | 樹脂組成物及びその製造方法、並びに樹脂組成物の硬化物 |
WO2024201211A1 (ja) * | 2023-03-29 | 2024-10-03 | 藤森工業株式会社 | 接着剤付金属基材及び積層体 |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL130570C (ja) * | 1963-12-12 | |||
JPS5361392A (en) | 1976-11-12 | 1978-06-01 | Yamatake Honeywell Co Ltd | Densitometer |
JP3889865B2 (ja) * | 1997-09-17 | 2007-03-07 | サカタインクス株式会社 | ポリウレタン樹脂系光硬化性組成物 |
JP4016226B2 (ja) * | 1998-01-14 | 2007-12-05 | 味の素株式会社 | 変成ポリイミド樹脂及びこれを含有する熱硬化性樹脂組成物 |
KR100930937B1 (ko) * | 2002-01-31 | 2009-12-10 | 디아이씨 가부시끼가이샤 | 열경화성 폴리이미드 수지 조성물 및 폴리이미드 수지의제조 방법 |
JP4355838B2 (ja) * | 2003-01-10 | 2009-11-04 | Dic株式会社 | 熱硬化性ポリイミド樹脂組成物、ポリイミド樹脂の製造方法およびポリイミド樹脂 |
JP5208399B2 (ja) * | 2006-10-24 | 2013-06-12 | ニッタ株式会社 | ポリイミド樹脂 |
KR101472941B1 (ko) * | 2007-04-19 | 2014-12-16 | 가부시키가이샤 가네카 | 신규한 폴리이미드 전구체 조성물 및 그 이용 |
JP2009179697A (ja) * | 2008-01-30 | 2009-08-13 | Dic Corp | ポリイミド樹脂、ポリイミド樹脂組成物およびポリイミド樹脂の製造方法 |
KR101597146B1 (ko) * | 2008-05-20 | 2016-02-24 | 가부시키가이샤 가네카 | 신규한 폴리이미드 전구체 조성물, 그 이용 및 그들의 제조 방법 |
WO2010107045A1 (ja) * | 2009-03-18 | 2010-09-23 | Dic株式会社 | ポリイミド樹脂、硬化性樹脂組成物及びその硬化物 |
JP2012214670A (ja) * | 2011-03-30 | 2012-11-08 | Sanyo Chem Ind Ltd | ポリイミド樹脂 |
JP5304954B2 (ja) * | 2011-05-31 | 2013-10-02 | 東洋紡株式会社 | カルボキシル基含有ポリイミド |
KR102287501B1 (ko) * | 2013-12-17 | 2021-08-11 | 에보닉 피브레 게엠베하 | 블록 코폴리이미드로 이루어진, 증가된 투과도를 갖는 높은 선택성의 폴리이미드 막 |
CN103980491B (zh) * | 2014-05-23 | 2016-04-06 | 哈尔滨工业大学 | 一种快速响应的热固性形状记忆聚酰亚胺及其制备方法 |
JP6568715B2 (ja) * | 2014-07-04 | 2019-08-28 | 太陽インキ製造株式会社 | 感光性熱硬化性樹脂組成物、ドライフィルムおよびプリント配線板 |
JP2016113498A (ja) * | 2014-12-11 | 2016-06-23 | Japan Valuable Provider株式会社 | ポリイミド及びそれを含む印刷用組成物 |
JP6635403B2 (ja) | 2014-12-26 | 2020-01-22 | 荒川化学工業株式会社 | 樹脂付銅箔、銅張積層板、プリント配線板及び多層配線板 |
JP6488170B2 (ja) | 2015-03-31 | 2019-03-20 | 日鉄ケミカル&マテリアル株式会社 | 回路基板 |
JP6082439B2 (ja) | 2015-07-08 | 2017-02-15 | 新日鉄住金化学株式会社 | カバーレイフィルムの接着剤層形成用原料ポリイミド樹脂 |
-
2021
- 2021-06-24 TW TW110123169A patent/TW202219116A/zh unknown
- 2021-06-25 US US18/013,334 patent/US20230331915A1/en active Pending
- 2021-06-25 KR KR1020237003139A patent/KR20230029931A/ko active Search and Examination
- 2021-06-25 CN CN202180046713.XA patent/CN115777003B/zh active Active
- 2021-06-25 JP JP2022533951A patent/JPWO2022004583A1/ja active Pending
- 2021-06-25 WO PCT/JP2021/024103 patent/WO2022004583A1/ja active Application Filing
Also Published As
Publication number | Publication date |
---|---|
TW202219116A (zh) | 2022-05-16 |
CN115777003A (zh) | 2023-03-10 |
CN115777003B (zh) | 2024-11-05 |
WO2022004583A1 (ja) | 2022-01-06 |
US20230331915A1 (en) | 2023-10-19 |
KR20230029931A (ko) | 2023-03-03 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A821 Effective date: 20220701 |
|
A529 | Written submission of copy of amendment under article 34 pct |
Free format text: JAPANESE INTERMEDIATE CODE: A5211 Effective date: 20231225 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20231225 |