JPWO2020245985A1 - - Google Patents
Info
- Publication number
- JPWO2020245985A1 JPWO2020245985A1 JP2021524605A JP2021524605A JPWO2020245985A1 JP WO2020245985 A1 JPWO2020245985 A1 JP WO2020245985A1 JP 2021524605 A JP2021524605 A JP 2021524605A JP 2021524605 A JP2021524605 A JP 2021524605A JP WO2020245985 A1 JPWO2020245985 A1 JP WO2020245985A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
- H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
- H05K13/0069—Holders for printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/083—Quality monitoring using results from monitoring devices, e.g. feedback loops
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Operations Research (AREA)
- Supply And Installment Of Electrical Components (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2022147261A JP7398531B2 (ja) | 2019-06-06 | 2022-09-15 | 対基板作業機および対基板作業機システム |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2019/022562 WO2020245985A1 (ja) | 2019-06-06 | 2019-06-06 | 対基板作業機 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2022147261A Division JP7398531B2 (ja) | 2019-06-06 | 2022-09-15 | 対基板作業機および対基板作業機システム |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2020245985A1 true JPWO2020245985A1 (ja) | 2020-12-10 |
JP7169446B2 JP7169446B2 (ja) | 2022-11-10 |
Family
ID=73653066
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2021524605A Active JP7169446B2 (ja) | 2019-06-06 | 2019-06-06 | 対基板作業機および対基板作業システム |
JP2022147261A Active JP7398531B2 (ja) | 2019-06-06 | 2022-09-15 | 対基板作業機および対基板作業機システム |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2022147261A Active JP7398531B2 (ja) | 2019-06-06 | 2022-09-15 | 対基板作業機および対基板作業機システム |
Country Status (5)
Country | Link |
---|---|
US (1) | US11917766B2 (ja) |
EP (1) | EP3982705B1 (ja) |
JP (2) | JP7169446B2 (ja) |
CN (1) | CN113906839B (ja) |
WO (1) | WO2020245985A1 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN118635881B (zh) * | 2024-08-15 | 2024-12-10 | 南通创亿达新材料股份有限公司 | 一种显示器集成板的高效组装设备 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20040255455A1 (en) * | 2003-06-21 | 2004-12-23 | Yu Won-Keun | Apparatus and method for positioning back-up pins for supporting substrate |
JP2008211051A (ja) * | 2007-02-27 | 2008-09-11 | Yamaha Motor Co Ltd | バックアップピン配設位置決定装置、バックアップユニット形成装置、及び基板処理装置 |
JP2013038114A (ja) * | 2011-08-04 | 2013-02-21 | Panasonic Corp | 実装部品検査装置及び実装部品検査方法 |
JP2014120670A (ja) * | 2012-12-18 | 2014-06-30 | Hitachi High-Tech Instruments Co Ltd | 基板を支持するバックアップピンの管理装置 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003204198A (ja) | 2002-01-04 | 2003-07-18 | Hitachi Communication Technologies Ltd | プリント回路板のバックアップピン自動配置装置 |
JP4124001B2 (ja) * | 2003-03-24 | 2008-07-23 | 富士ゼロックス株式会社 | 画像処理装置、画像処理方法、及び画像処理プログラム |
JP4452686B2 (ja) | 2003-05-16 | 2010-04-21 | 富士機械製造株式会社 | バックアップ装置における支持部位置決定方法およびその装置 |
JP2008004856A (ja) * | 2006-06-26 | 2008-01-10 | Matsushita Electric Ind Co Ltd | 部材支持方法 |
JP4835573B2 (ja) | 2007-10-26 | 2011-12-14 | パナソニック株式会社 | 基板搬送装置および基板搬送方法 |
CN104956788B (zh) * | 2013-01-30 | 2017-09-01 | 松下知识产权经营株式会社 | 下支撑销的配置确定辅助装置及配置确定辅助方法 |
JP5911899B2 (ja) * | 2014-02-17 | 2016-04-27 | Ckd株式会社 | 基板検査装置及び部品実装装置 |
CN105848463A (zh) * | 2015-02-02 | 2016-08-10 | Juki株式会社 | 电子部件安装装置以及基板支撑构件的排序方法 |
-
2019
- 2019-06-06 WO PCT/JP2019/022562 patent/WO2020245985A1/ja active Application Filing
- 2019-06-06 US US17/611,631 patent/US11917766B2/en active Active
- 2019-06-06 CN CN201980096863.4A patent/CN113906839B/zh active Active
- 2019-06-06 EP EP19931591.2A patent/EP3982705B1/en active Active
- 2019-06-06 JP JP2021524605A patent/JP7169446B2/ja active Active
-
2022
- 2022-09-15 JP JP2022147261A patent/JP7398531B2/ja active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20040255455A1 (en) * | 2003-06-21 | 2004-12-23 | Yu Won-Keun | Apparatus and method for positioning back-up pins for supporting substrate |
JP2008211051A (ja) * | 2007-02-27 | 2008-09-11 | Yamaha Motor Co Ltd | バックアップピン配設位置決定装置、バックアップユニット形成装置、及び基板処理装置 |
JP2013038114A (ja) * | 2011-08-04 | 2013-02-21 | Panasonic Corp | 実装部品検査装置及び実装部品検査方法 |
JP2014120670A (ja) * | 2012-12-18 | 2014-06-30 | Hitachi High-Tech Instruments Co Ltd | 基板を支持するバックアップピンの管理装置 |
Also Published As
Publication number | Publication date |
---|---|
EP3982705B1 (en) | 2024-01-17 |
EP3982705A1 (en) | 2022-04-13 |
JP7169446B2 (ja) | 2022-11-10 |
EP3982705A4 (en) | 2022-06-08 |
US11917766B2 (en) | 2024-02-27 |
JP7398531B2 (ja) | 2023-12-14 |
CN113906839B (zh) | 2023-06-20 |
US20220248577A1 (en) | 2022-08-04 |
JP2022168306A (ja) | 2022-11-04 |
WO2020245985A1 (ja) | 2020-12-10 |
CN113906839A (zh) | 2022-01-07 |
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