JPWO2020175619A1 - Package for mounting electronic components, electronic devices and light emitting devices - Google Patents

Abstract

The electronic component mounting package includes a substrate including a base having a first surface, a protrusion having a second surface protruding from the first surface and contacting the first surface, and a wiring board located on the second surface. The protrusion has a protrusion on the second surface, and at least a part of the protrusion is located so as to overlap the wiring board when viewed from a direction perpendicular to the second surface.

Description

The present disclosure relates to electronic component mounting packages, electronic devices and light emitting devices.

There is a package for mounting electronic components, which comprises a substrate and a wiring board on which electronic components are mounted. As shown in JP-A-2007-150182, an adjusting plate or the like may be sandwiched between a wiring board and a substrate, and the wiring board may be bonded at an appropriate height from the substrate by a bonding material.

One aspect of the present disclosure is
A substrate comprising a base having a first surface and a projecting portion having a second surface protruding from the first surface and in contact with the first surface.
The wiring board located on the second surface and
Equipped with
The protrusion has a protrusion on the second surface, and the protrusion has a protrusion.
At least a part of the protrusion is located so as to overlap the wiring board when viewed from a direction perpendicular to the second surface.
It is a package for mounting electronic components.

In addition, another aspect of the present disclosure is
With the above package for mounting electronic components,
Electronic components mounted on the wiring board and
It is an electronic device provided with.

In addition, another aspect of the present disclosure is
With the above package for mounting electronic components,
The light emitting element mounted on the wiring board and
It is a light emitting device provided with.

It is an overall perspective view of the electronic device of this embodiment. It is a figure which shows the cross section of the package for mounting an electronic component. It is a figure which shows the cross section of the package for mounting an electronic component. It is a figure which shows the modification 1 of the protrusion. It is a figure which shows the modification 2 of the protrusion. It is a figure which shows the modification 3 of the protrusion. It is a figure which shows the modification 4 of the protrusion. It is a figure which shows the modification 5 of the protrusion.

Hereinafter, embodiments will be described with reference to the drawings.
FIG. 1 is an overall perspective view of the electronic device 1 of the present embodiment.

The electronic device 1 includes an electronic component mounting package 100 and an electronic component 500.
The package 100 for mounting electronic components includes a substrate 11, a signal line 12, a wiring board 14, a bonding material 16, a conductive bonding material 17, a lid 20, and the like.

The substrate 11 is a conductive metal. As the substrate 11, a substrate 11 having high thermal conductivity and heat dissipation may be used. The substrate 11 includes a base 111 and a protrusion 112. Here, the base 111 has, for example, a disk shape having a diameter of 3 to 10 mm and a thickness of 0.5 to 2 mm, but is not limited thereto. The base 111 has a plurality of through holes 111a and a first surface 111b. In FIG. 1, two through holes 111a are shown. One end 1111 of the through hole 111a is on the first surface 111b. The inside of the through hole 111a is occupied by the insulating member 113. The insulating member 113 is, for example, a glass or ceramic material. The material of the insulating member 113 and the size of the through hole 111a may be determined according to a desired characteristic impedance related to signal transmission by the signal line 12. The base 111 and the protrusion 112 may be integral. The substrate 11 may be electrically connected to the ground wire of the signal lines 12 to be in a grounded state.

The protruding portion 112 protrudes in the X direction from the first surface 111b of one of the surfaces including the end of the through hole 111a in the base portion 111. The protrusion 112 of the substrate 11 has a second surface 112a in contact with the first surface 111b. The protrusion 112 has a protrusion on the plane of the second surface 112a as described later. The wiring board 14 is located above the second surface 112a via the joining material 16. Above and above the surface of an object means the side of the outward normal vector of the surface.

The wiring board 14 has a third surface 14a and a fourth surface 14b. The wiring pattern 141 is located on the third surface 14a. The fourth surface 14b is a surface opposite to the third surface 14a. The ground layer 142 is located on the fourth surface 14b. Here, the wiring board 14 is used, for example, as a high-frequency line board. The wiring board 14 is a flat plate-shaped insulating board, for example, a resin or ceramic board. The shape of the wiring pattern 141 and the thickness and material of the wiring board 14, particularly the relative permittivity of the wiring board 14, may be appropriately determined according to the desired characteristic impedance related to signal transmission. The third surface 14a and the fourth surface 14b of the wiring board 14 are in contact with the first surface 111b of the base 111 of the substrate 11, respectively. Here, the first surface 111b is located along the Z direction, and the third surface 14a and the fourth surface 14b are perpendicular to the first surface 111b. That is, the third surface 14a and the fourth surface 14b are located along the X direction.

The ground layer 142 may be, for example, a gold (Au) thin film layer. The ground layer 142 does not have to cover the entire surface of the fourth surface 14b. The ground layer 142 may have various shapes, for example, surrounding the range of the wiring pattern 141 when viewed from above the third surface 14a along the Y direction.

The bonding material 16 is located between the fourth surface 14b of the grounding layer 142 of the wiring board 14 and the second surface 112a of the protrusion 112, and is bonded to each of them. Here, the joining material 16 has an appropriate viscosity in the state before joining. This makes it possible to appropriately adjust the thickness of the layer of the joining material 16 to join and solidify. Here, the bonding material 16 is a nanoparticle sintered bonding material paste. The nanoparticle sintered bonding material paste is a mixture of nano-sized metal particles covered with a surface stabilizer, such as silver or copper, and an organic solvent. In the nanoparticle sintered bonding material paste, the metal particles are activated and the metal particles react with each other to bond with each other, and the metal particles also react with the metal surface to be fixed. In the nanoparticle sintered bonding material paste, the organic solvent is volatilized after it is fixed. Here, the thermal conductivity of the bonding material 16 is larger than the thermal conductivity of the substrate 11. Further, the bonding material 16 may be an epoxy resin-based adhesive containing metal particles or the like.

The wiring pattern 141 is electrically connected to the electronic component 500 to supply electric power and a signal to the electronic component 500. The wiring pattern 141 may be a conductor metal film having a small resistance, in this case, a gold thin film. The wiring pattern 141 is bonded to the signal line 12 at two points here via the conductive bonding material 17. The shape, length, and position of the wiring pattern 141 may be appropriately determined according to the size and terminal position of the electronic component 500 to be connected. The wiring pattern 141 is separated from the ground layer 142 by the wiring board 14. That is, a signal is transmitted on the wiring board 14 by the microstrip line structure.

The signal line 12 is a rod-shaped conductor. The signal line 12 may project on the side of the surface 111c opposite to the first surface 111b of the base 111. The protruding signal line 12 is electrically connected to an external wiring or the like and is used as a lead electrode. The diameter of the signal line 12 may be, for example, about 0.1 to 1.0 mm. At least one of the signal lines 12 is a ground wire of the substrate 11 and is directly bonded to the base 111. The other signal lines 12, here the two signal lines 12, penetrate different through holes 111a of the base 111, and their tips are exposed on the first surface 111b. The signal line 12 does not protrude from the first surface 111b. The tip may be in the same plane as the first surface 111b or may be recessed from the first surface 111b.

The two signal lines 12 are located substantially in the center of the insulating member 113 occupying the separate through holes 111a, and penetrate the insulating member 113 in the extending direction of the through holes 111a. Inside the insulating member 113, the signal line 12 is separated from the outer base portion 111 by the insulating member 113, and a signal is transmitted inside the base portion 111 by a coaxial line structure.

The conductive bonding material 17 electrically connects the signal line 12 exposed from the first surface 111b and the wiring pattern 141 of the third surface 14a. The conductive bonding material 17 may be capable of bonding not only to the signal line 12 and the wiring pattern 141 but also to the insulating insulating member 113 and the wiring board 14 in the through hole 111a. Here, the conductive bonding material 17 is, for example, a nanoparticle sintered bonding material paste. The above-mentioned nanoparticle sintered bonding material paste has conductivity due to the bonding between metal particles at the time of fixing.

The electronic component 500 shown by the broken line is mounted on the wiring board 14. The electronic component 500 is located on the third surface 14a and is directly and / or bonded to the wiring pattern 141 by wire bonding or the like to be electrically connected to each other. The electronic component 500 is, for example, a laser diode, and in this case, the electronic device 1 is, for example, a light emitting device used as a light source. Alternatively, as the electronic component 500, various elements such as a light receiving element such as a photodiode, a light emitting element other than the laser diode such as an LED (Light Emitting Diode), a Pelche element, or various sensor elements may be used.

The lid 20 shown by the dotted line is joined to the first surface 111b, covers the protrusion 112, the wiring board 14, the wiring pattern 141, and the electronic component 500, and separates them from the outside. The lid 20 has a window portion 21. The window portion 21 is a material that transmits the wavelength of the emitted light emitted from the electronic component 500. Further, the window portion 21 has a lens structure here (see FIG. 2B). The window portion 21 may appropriately collect the emitted light from the electronic component 500, that is, the laser diode, or at least may not diffuse the emitted light.

FIG. 2A is a diagram showing a cross section of the electronic component mounting package 100 in a plane parallel to the first plane 111b. FIG. 2B is a diagram showing a cross section of the grounding layer 142 of the electronic component mounting package 100 at the lower surface position. That is, FIG. 2A is a cross section perpendicular to the X direction, and FIG. 2B is a cross section perpendicular to the Y direction. Here, the side of the protruding portion 112 in the X direction perpendicular to the first surface 111b is the front side of the electronic component mounting package 100, that is, the upper side. Further, the side of the wiring board 14 is the upper side of the electronic component mounting package 100 in the Y direction perpendicular to the second surface 112a. That is, FIG. 2A is a cross section in a front view, and FIG. 2B is a cross section in a plan view.

As shown in FIG. 2A, the protrusion 112 has a protrusion 1121 on a portion of the second surface 112a. At least a part of the protrusion 1121 is positioned so as to overlap the wiring board 14 when viewed in a plan view. Here, the protrusion 1121 is higher than the portion of the second surface 112a other than the above-mentioned part. In addition, "the protrusion 1121 is higher than the portion other than the part of the second surface 112a" as used herein means that the protrusion 1121 is more electronic than the part other than the part of the second surface 112a in the Y direction. It means that it is located on the upper side of the component mounting package 100, that is, close to the wiring board 14. The highest part of the protrusion 1121 is referred to as the apex of the protrusion 1121. The vertices of the protrusions 1121 are below the wiring board 14 in the Y direction, respectively. That is, the apex of the protrusion 1121 is hidden by the wiring board 14 when viewed in a plan view from the upper side of the electronic component mounting package 100 in the Y direction. The protrusion 1121 may be in direct contact with the fourth surface 14b of the grounding layer 142 of the wiring board 14, or the protrusion 1121 may be in direct contact with the wiring board 14 via a bonding material 16 which is very thin as compared with other parts other than the apex of the protrusion 1121. It may be joined to the ground layer 142 of. The space between the portion other than the apex of the protrusion 1121 and the wiring board 14 is occupied by the joining material 16. The thickness of the joining material 16 referred to here is, for example, the dimension of the joining material 16 along the Y direction.

The height of the protrusion 1121 can define the position of the wiring pattern 141. The height of the protrusion 1121 may be set so that the wiring pattern 141 on the third surface 14a of the wiring board 14 overlaps the through hole 111a and the insulating member 113 when viewed from the X direction. Further, the protrusion 1121 does not have to overlap with either the through hole 111a or the insulating member 113 when viewed from the X direction. Further, the protrusion 1121 is a range between the through holes 111a (first through hole and the second through hole) at both ends and the outer position of the insulating member 113 in the Z direction along the first surface 111b of the second surface 112a as a whole. It may be located at W. Here, since there are two through holes 111a, the protrusion 1121 is located in the range W between the outer positions of the two through holes 111a.
The height of the protrusion 1121 here means, for example, the protrusion length of the protrusion 1121 from the plane portion of the second surface 112a. More specifically, the height of the protrusion 1121 can be, for example, the distance from the plane portion of the second surface 112a to the apex of the protrusion 1121 in the Y direction.

Here, as shown in FIG. 2B, there are three or more, for example, four protrusions 1121 dispersed so as not to ride on one straight line on the second surface 112a in a plan view. When the wiring board 14 and the protrusion 1121 are in contact with each other at three or more points, the support surface of the wiring board 14, that is, the fixed position of the wiring board 14 is determined. Here, the heights of the protrusions 1121 are equal to each other and the support surfaces are perpendicular to the Y direction. The shape of the protrusion 1121 is not particularly limited, but here, it may be a curved convex portion close to a hemisphere. As shown in FIG. 2B, these protrusions 1121 may be positioned so as not to overlap with the mounting position of the electronic component 500 when viewed from above the third surface 14a of the wiring board 14 along the Y direction. As described above, the thermal conductivity of the bonding material 16 is larger than the thermal conductivity of the substrate 11. Therefore, when the mounting position of the electronic component 500 on the wiring board 14 comes into contact with the protruding portion 112 of the substrate 11 via the bonding material 16, the heat of the electronic component 500 is efficiently diffused and transmitted over a wide range of the substrate 11. When the thermal conductivity of the bonding material 16 is not larger than the thermal conductivity of the substrate 11, or regardless of the magnitude of the thermal conductivity, the mounting position of the electronic component 500 and the protrusion 1121 are viewed from above the third surface 14a. It may overlap with the position.
It should be noted that "the heights of the protrusions 1121 are equal to each other" as used herein means that the heights of the plurality of protrusions 1121 are substantially equal to each other, and the heights of the plurality of protrusions 1121 do not have to be exactly the same. ..

The protrusion 1121 may be formed, for example, by driving a mold having a recess corresponding to the protrusion 1121 into the second surface 112a. Alternatively, the protrusion 1121 may be obtained by forming irregularities on the second surface 112a with a cutting tool or the like. The through hole 111a may also be formed by a mold. At this time, the through hole 111a and the protrusion 1121 may be arranged so as not to overlap each other in the front view seen from the X direction perpendicular to the first surface 111b. In this case, it is possible to process the second surface 112a while easily controlling the mold so that it does not hit the protrusion 1121. The position of the protrusion 1121 may overlap with the position of the through hole 111a in the front view. For example, when the protrusion 1121 and the through hole 111a are formed by a cutting tool or the like, the positional relationship between the protrusion 1121 and the through hole 111a does not necessarily affect the difficulty of processing. Further, the height of the protrusion 1121 may be appropriately determined and arranged so that the wiring pattern 141 and the third surface 14a of the wiring board 14 and the through hole 111a overlap each other in a front view. In this case, the signal line 12 and It is possible to reduce a local change in the characteristic impedance at the connection portion with the wiring pattern 141, particularly an increase in the characteristic impedance, and reduce a loss due to signal reflection or the like.

When the protrusion 1121 is formed, the portion of the second surface 112a lower than the apex of the protrusion 1121 is filled with the joining material 16, and then the wiring substrate 14 is placed on the upper side of the joining material 16 and the protrusion 1121 and heated. Then, the bonding material 16 is fixed. At this time, the bonding material 16 to be fixed shrinks due to heat, but the wiring board 14 is reduced from the position defined by the protrusion 1121 by the protrusion 1121.

3A to 3B are views showing deformation examples 1 to 3 of the protrusions, respectively. These figures show the same cross section as FIG. 2B.
The protrusion 1121a of the first modification shown in FIG. 3A has a linear first portion linearly connected at a constant height. The constant height of the first portion referred to here means that the height of the highest portion (vertex) of the protrusion 1121a is constant. In this modification, the protrusions 1121a are a plurality of (two) linear protrusions located in parallel. The cross section of the front view is the same as that of FIG. 2A. According to this modification, the wiring board 14 can be supported more stably than the support at four points by the four protrusions 1121.

The protrusion 1121b of the modification 2 shown in FIG. 3B has a single linear shape and is bent at two points so as to surround the electronic component 500. That is, the three sides of the area surrounded by the four projections 1121 are supported, and the wiring board 14 is supported more stably. Further, the protrusion 1121c of the modification 3 shown in FIG. 3C is a combination of a linear portion and a dotted portion.

FIG. 4A is a diagram showing a modified example 4 of the protrusion. FIG. 4B is a diagram showing a modified example 5 of the protrusion. These figures have the same cross section as FIG. 2A.
The protrusion 1121d of the modification 4 shown in FIG. 4A has a two-row linear shape at the highest portion as in the projection 1121a of the modification 1. The height of the portion D between these two rows of linear portions is lower than those of the two rows of linear portions and higher than the outside of the linear portions. That is, the protrusion 1121d has a multi-step protrusion shape in which the highest portion protrudes outward as the top of the second step from the planar, here-planar, first-step protrusion portion. In other words, the protrusion 1121d has a second portion of a planar first step and a top of two rows of linear second steps. In this case, the portion D forming the flat portion of the first stage does not support the wiring board 14. In this portion D, the joining material 16 is thinner than the outside of the linear portion of the second stage. The height of this portion D may change depending on the distance from the first surface 111b.

In the protrusion 1121e of the modification 5 shown in FIG. 4B, the highest apex portion extends in a plane at a constant height. That is, a part of the ground layer 142 of the wiring board 14 is in contact with the apex portion of the planar protrusion 1121e. In this case, the flat apex portion and the wiring board 14 may be in direct contact with each other, or a very thin film of the bonding material 16 may be present between the flat apex portion and the wiring board 14. A bonding material 16 is located between the wiring board 14 and the second surface 112a in a portion other than the planar apex portion of the protrusion 1121e, and the wiring board 14 and the second surface 112a are bonded via the bonding material 16. ing.

As described above, the electronic component mounting package 100 of the present embodiment includes a base portion 111 having a first surface 111b, a protruding portion 112 having a second surface 112a protruding from the first surface 111b and in contact with the first surface 111b. A substrate 11 including the above, and a wiring board 14 located on the second surface 112a are provided. The protrusion 112 has a protrusion 1121 on the second surface 112a, and at least a part of the protrusion 1121 is positioned so as to overlap the wiring board 14 when viewed from a direction perpendicular to the second surface 112a.
Since the protrusion 112 has the protrusions 1121 to 1121e as described above on the second surface 112a, the position of the wiring board 14 remains even if the joint material 16 shrinks due to heating or the like when the joint material 16 is fixed. The deviation is reduced as defined by the protrusions 1121 to 1121e. Especially when the bonding material 16 is thick, such an effect becomes remarkable. Therefore, the position of the wiring board 14 is fixed at a desired position, and the misalignment of the electronic component 500 mounted on the wiring board 14 is also reduced accordingly. When the electronic component 500 is a light emitting element such as a laser diode, particularly one having strong directivity, the emission direction of light is accurately determined by this. That is, according to the electronic component mounting package 100, the position accuracy of the electronic component can be further improved.

Further, the protruding portion 112 may have three or more protrusions 1121.
The position of the wiring board 14 is accurately defined by these protrusions 1121, and the wiring board 14 is stably supported.

Further, as in the first and second modifications, the protrusion 112 may include linear protrusions 1121a and 1121b. By supporting the wiring board 14 with wires in this way, distortion can be further reduced, and the position of the wiring board 14 can be stably maintained.

Further, a plurality of linear protrusions 1121a may be included as in the first modification. As a result, the wiring board 14 can be supported more stably.

Further, a plurality of (here, two) linear protrusions 1121a may be located parallel to each other on the protrusion 112. In this case, the protrusion 1121a can be easily formed with the mold. As a result, in the electronic component mounting package 100, the wiring board 14 can be efficiently held at a desired position with higher accuracy while reducing the cost increase.

Further, as in the modified examples 4 and 5, the protrusion may include a portion of planar protrusions 1121d and 1121e having a constant height. In this case, by increasing the total volume of the protrusions, the wiring board 14 can be held at a desired position with higher accuracy while reducing the amount of the bonding material 16 used.

Further, the protrusion 1121d may have a top portion that further protrudes outward from the second portion, which is a planar protrusion. In this way, by supporting the wiring board 14 with wires and / or points and projecting other parts in a planar manner, the position accuracy of the wiring board 14 can be improved and the amount of the bonding material 16 used can be reduced. Can be done.

Further, the protruding portion 112 may have a plurality of protrusions 1121, and the heights of the protrusions 1121 may be equal to each other. By locating the wiring board 14 so as to be in contact with these protrusions 1121, the wiring board 14 becomes parallel to the flat surface portion of the second surface 112a excluding the protrusion 1121. In particular, if the second surface 112a is perpendicular to the first surface 111b, the orientation of the wiring board 14, that is, the orientation of the electronic component 500 can be easily and accurately determined according to the posture of the first surface 111b of the base 111. ..

Further, the substrate 11 may include a base portion 111 having a first surface 111b and a protruding portion 112 having a second surface 112a protruding from the first surface 111b and in contact with the first surface 111b. The base portion 111 has a through hole 111a having one end 1111 on the first surface 111b, and the protrusion 1121a is located so as not to overlap the through hole 111a when viewed from a direction perpendicular to the first surface 111b.
As a result, the protrusion 1121 does not become an obstacle when the through hole 111a is formed by the mold, and the increase in cost and labor can be reduced.

Further, the base portion 111 has a plurality of through holes 111a, and the plurality of through holes 111a include first through holes and second through holes at both ends in a direction along the first surface 111b of the second surface 112a, and protrusions. 1121 may be located between the first through hole and the second through hole on the second surface 112a in the direction along the first surface 111b. Since the protrusion 1121 does not protrude outward with respect to the through hole 111a and the signal line 12, it is not necessary to make the protrusion 112 larger than necessary, thereby providing a space for joining the lid 20 to the first surface 111b. Can be maintained. Therefore, the electronic component mounting package 100 can obtain high position accuracy of the electronic component 500 while maintaining compactness.

Further, the wiring board 14 may be located at a position overlapping the through hole 111a when viewed from a direction perpendicular to the first surface 111b.
That is, in this arrangement, the distance between the signal line 12 penetrating the through hole 111a and the ground layer 142 is appropriately shortened, and the local characteristic impedance change at the connection portion between the signal line 12 and the wiring pattern 141, particularly the characteristic impedance. Can be reduced. Also in this case, since the positional relationship between the signal line 12 and the wiring board 14 can be accurately defined by the protrusion 1121, the signal loss can be effectively reduced. Further, by adjusting the height of the wiring board 14 by the protrusion 1121, the positional relationship between the wiring board 14 and the signal line 12 can be more easily determined, that is, the thickness of the bonding material 16 that shrinks at the time of fixing. It is troublesome to adjust the position of the wiring board 14 only, or to change the thickness of the wiring board 14 and the positional relationship between the signal line 12 and the through hole 111a and the second surface 112a to change the characteristic impedance setting. Does not have to be required.

Further, the wiring board 14 may be joined to the second surface 112a via a joining material 16 containing metal. Further, the metal contained in the bonding material 16 may be metal particles at a stage before bonding. As a result, the bonding material 16 having high thermal conductivity can be obtained, and the heat at the time of bonding and the heat generated by the electronic component 500 can be effectively dissipated. Further, a nanoparticle sintered bonding material paste containing nanoparticles and an epoxy resin adhesive in which metal particles are dispersed in an epoxy resin can reduce the temperature rise during bonding. As a result, the influence of the heat load on other parts of the electronic component mounting package 100 can be reduced.

Moreover, the said metal may be silver or copper. By including these metals in the bonding material 16, the thermal conductivity and conductivity of the bonding material 16 can be appropriately obtained.

Further, the bonding material 16 may be a nanoparticle sintered bonding material paste. This is because the nanoparticle sintered bonding material paste has an appropriate viscosity before fixing, so that the gaps between the protrusions 1121 can be appropriately filled. Further, in the nanoparticle sintered bonding material paste containing silver or copper, it is not necessary to raise the heating temperature at the time of fixing as compared with other metals and the like, so that it can be applied to other parts of the package 100 for mounting electronic components. The influence of heat load can be reduced.

Further, the electronic component mounting package 100 has a lid 20 that covers the wiring board 14 (and the protrusion 112). As a result, the wiring board 14 and the electronic component 500 can be isolated from the outside air, and the electronic component 500 can be operated stably. The lid 20 may be handled in combination with the substrate 11 without being bonded to the substrate 11 as a product of the electronic component mounting package 100 on which the electronic component 500 is not mounted.

Further, the lid 20 may have a window portion 21 through which light is transmitted. When the electronic component 500 is a laser diode and / or a photodiode, the light can be appropriately emitted and emitted by having the window portion 21. Further, by improving the positional accuracy of the wiring board 14 and the electronic component 500 by the above configuration, it becomes easy to accurately match the positional relationship between the electronic component 500, particularly the laser diode, and the window portion 21, particularly the lens structure. As a result, it becomes possible to easily emit light in a more appropriate condensed state.

Further, the electronic device 1 of the present embodiment includes the above-mentioned electronic component mounting package 100 and the electronic component 500 mounted on the wiring board 14. In this electronic device 1, since the positional accuracy of the electronic component 500 is improved more easily, it becomes easy to match the positional relationship between the electronic device 1 and other electronic devices and / or components.

Further, the electronic component 500 includes a light emitting element, particularly a laser diode. As a result, it is possible to easily and more appropriately reduce the optical axis deviation of the light emitted from the light emitting element of the electronic device 1 as the light emitting device, and to obtain a small light source having excellent mountability.

The present invention is not limited to the above embodiment, and various modifications can be made.
For example, the plurality of protrusions do not have to have the same height as long as the plane is defined as a whole. That is, the portions of the wiring board 14 other than the protrusions on the fourth surface 14b and the second surface 112a do not have to be parallel. In this case, depending on the shape of the protrusion, the highest position of the protrusion may not be in contact with the wiring board 14.

Further, although the protrusion 1121 has been described as having a curved convex portion, it may have various shapes such as a cylinder (including an ellipse), a prism, a truncated cone, or a truncated cone. Alternatively, the protrusion may be a cone or a pyramid, and the apex of the cone or the pyramid may be in contact with the ground layer 142 of the wiring board 14. The inclination angle of the inclined portion in the protrusion having a shape such as a curved surface, a cone, a truncated cone, a pyramid, or a pyramid may be appropriately determined, and may be different depending on the direction from the apex. Further, the plurality of protrusions do not have to be separated from each other. The plurality of protrusions may have the same shape or different shapes from each other.

Further, in the above embodiment, two linear protrusions 1121a and two curved protrusions 1121b have been described as examples as linear protrusions, but the number of protrusions may be three or more. It may also be curved. Further, the plurality of linear protrusions may not be parallel to each other, and may be positioned so that the distance between them becomes wider as the distance from the first surface 111b increases. Further, one or a plurality of linear protrusions may be connected in an annular shape or a frame shape. The highest portion of the linear protrusion may have a width, which may not be constant.

Further, in the above-described embodiment, the two-stage structure in which the planar projection portion is further provided with linear or dot-like projections has been described, but the structure may be three or more stages. It is also possible to have further point-shaped protrusions on the linear protrusions.

Further, in the above embodiment, the protrusion 1121 has been described as being in the range W, but the lid body does not have to change the size of each part according to the wiring pattern 141 and the positions of the signal line 12 and the through hole 111a. If there is no problem in joining the 20s, the protrusion 1121 may be outside the range W.

Further, in the above embodiment, the nanoparticle sintered type bonding material paste has been described as an example as the bonding material 16, but the present invention is not limited to this. The bonding material 16 may not have conductivity.

Further, in the above embodiment, the electronic component mounting package 100 having the lid 20 has been described, but the electronic component mounting package 100 may not have the lid 20. Further, depending on the electronic component 500, the window portion 21 may not have a lens structure but may be a simple window that does not converge light.

Further, in the above embodiment, the signal line 12 is not projected from the first surface 111b to the outside of the base 111, and the through hole 111a is overlapped with the wiring pattern 141 and the third surface 14a in the front view from the X direction. It was supposed to be located in. However, in front view, the signal line 12 may be located above the wiring pattern 141 and the third surface 14a. In this case, the signal line 12 may project from the first surface 111b to the outside of the base 111.

Further, in the above embodiment, it has been described that there are three signal lines 12, one for grounding the substrate 11, and the other two are connected to the electronic component 500 via the wiring pattern 141. However, it is not limited to this. Three or more signal lines may be connected to the electronic component, or when one of them is grounded, only one signal line may be provided exclusively for the electronic component. When there are two or more electronic components, the electronic component mounting package 100 may have as many signal lines 12 as necessary for each electronic component.
In addition, specific details such as the specific configuration, structure, shape, and arrangement shown in the above embodiment can be appropriately changed without departing from the spirit of the present invention.

The present disclosure can be used for electronic component mounting packages, electronic devices and light emitting devices.

1 Electronic device 11 Base 111 Base 111a Through hole (first through hole, second through hole)
111b 1st surface 112 Projection 112a 2nd surface 113 Insulation member 12 Signal line 14 Wiring board 141 Wiring pattern 142 Ground layer 14a 3rd surface 14b 4th surface 16 Bonding material 17 Conductive bonding material 20 Lid 21 Window part 100 Electronics Package for mounting parts 500 Electronic parts 1121, 1121a to 1121e Protrusions

Claims (18)

A substrate comprising a base having a first surface and a projecting portion having a second surface projecting from the first surface and in contact with the first surface.
The wiring board located on the second surface and
Equipped with
The protrusion has a protrusion on the second surface, and the protrusion has a protrusion.
At least a part of the protrusion is located so as to overlap the wiring board when viewed from a direction perpendicular to the second surface.
Package for mounting electronic components. The electronic component mounting package according to claim 1, wherein the protrusion has three or more protrusions. The electronic component mounting package according to claim 1 or 2, wherein the protrusion includes a linear first portion having a constant height. The electronic component mounting package according to claim 3, wherein the protrusion includes a plurality of the first portions. The electronic component mounting package according to claim 4, wherein the plurality of first portions are located parallel to each other. The electronic component mounting package according to any one of claims 1 to 5, wherein the protrusion includes a planar second portion having a constant height. The electronic component mounting package according to claim 6, wherein the protrusion has a top portion that further protrudes outward from the second portion. The protrusion has a plurality of the protrusions and has a plurality of protrusions.
The electronic component mounting package according to any one of claims 1 to 7, wherein the heights of the protrusions are equal to each other. The base has a through hole having one end on the first surface.
The electronic component mounting package according to any one of claims 1 to 8, wherein the protrusion is located so as not to overlap the through hole when viewed from a direction perpendicular to the first surface. The base has a plurality of the through holes.
The plurality of through holes include a first through hole and a second through hole located at both ends in a direction along the first surface of the second surface.
The electronic component mounting package according to claim 9, wherein the protrusion is located between the first through hole and the second through hole in a direction along the first surface of the second surface. The electronic component mounting package according to claim 9 or 10, wherein the wiring board is located at a position overlapping the through hole when viewed from a direction perpendicular to the first surface. The electronic component mounting package according to any one of claims 1 to 11, wherein the wiring board is joined to the second surface via a metal-containing joining material. The electronic component mounting package according to claim 12, wherein the metal is silver or copper. The package for mounting electronic components according to claim 12 or 13, wherein the bonding material is a nanoparticle sintered bonding material paste. The electronic component mounting package according to any one of claims 1 to 14, further comprising a lid covering the wiring board. The electronic component mounting package according to claim 15, wherein the lid has a window portion through which light is transmitted. The electronic component mounting package according to any one of claims 1 to 16.
Electronic components mounted on the wiring board and
An electronic device equipped with. The electronic component mounting package according to any one of claims 1 to 16.
The light emitting element mounted on the wiring board and
A light emitting device equipped with.

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