JPWO2020175538A1 - - Google Patents
Info
- Publication number
- JPWO2020175538A1 JPWO2020175538A1 JP2021502312A JP2021502312A JPWO2020175538A1 JP WO2020175538 A1 JPWO2020175538 A1 JP WO2020175538A1 JP 2021502312 A JP2021502312 A JP 2021502312A JP 2021502312 A JP2021502312 A JP 2021502312A JP WO2020175538 A1 JPWO2020175538 A1 JP WO2020175538A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F257/00—Macromolecular compounds obtained by polymerising monomers on to polymers of aromatic monomers as defined in group C08F12/00
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/082—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising vinyl resins; comprising acrylic resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F212/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring
- C08F212/34—Monomers containing two or more unsaturated aliphatic radicals
- C08F212/36—Divinylbenzene
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
- C08F222/36—Amides or imides
- C08F222/40—Imides, e.g. cyclic imides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/04—Reinforcing macromolecular compounds with loose or coherent fibrous material
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/013—Fillers, pigments or reinforcing additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/34—Heterocyclic compounds having nitrogen in the ring
- C08K5/3412—Heterocyclic compounds having nitrogen in the ring having one nitrogen atom in the ring
- C08K5/3415—Five-membered rings
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L25/00—Compositions of, homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Compositions of derivatives of such polymers
- C08L25/02—Homopolymers or copolymers of hydrocarbons
- C08L25/04—Homopolymers or copolymers of styrene
- C08L25/08—Copolymers of styrene
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L35/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical, and containing at least one other carboxyl radical in the molecule, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
- C08L35/06—Copolymers with vinyl aromatic monomers
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2305/00—Condition, form or state of the layers or laminate
- B32B2305/07—Parts immersed or impregnated in a matrix
- B32B2305/076—Prepregs
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Reinforced Plastic Materials (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Laminated Bodies (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2024103476A JP2024129074A (en) | 2019-02-28 | 2024-06-27 | Resin composition, prepreg, metal foil-clad laminate, resin composite sheet, and printed wiring board |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019035457 | 2019-02-28 | ||
JP2019035457 | 2019-02-28 | ||
PCT/JP2020/007687 WO2020175538A1 (en) | 2019-02-28 | 2020-02-26 | Resin composition, prepreg, metal foil-clad laminated sheet, composite resin sheet, and printed wiring board |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2024103476A Division JP2024129074A (en) | 2019-02-28 | 2024-06-27 | Resin composition, prepreg, metal foil-clad laminate, resin composite sheet, and printed wiring board |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2020175538A1 true JPWO2020175538A1 (en) | 2020-09-03 |
JP7513587B2 JP7513587B2 (en) | 2024-07-09 |
Family
ID=72239974
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2021502312A Active JP7513587B2 (en) | 2019-02-28 | 2020-02-26 | Resin composition, prepreg, metal foil-clad laminate, resin composite sheet, and printed wiring board |
JP2024103476A Pending JP2024129074A (en) | 2019-02-28 | 2024-06-27 | Resin composition, prepreg, metal foil-clad laminate, resin composite sheet, and printed wiring board |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2024103476A Pending JP2024129074A (en) | 2019-02-28 | 2024-06-27 | Resin composition, prepreg, metal foil-clad laminate, resin composite sheet, and printed wiring board |
Country Status (5)
Country | Link |
---|---|
JP (2) | JP7513587B2 (en) |
KR (1) | KR20210133974A (en) |
CN (1) | CN113490596A (en) |
TW (1) | TW202039596A (en) |
WO (1) | WO2020175538A1 (en) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7190649B2 (en) * | 2018-04-27 | 2022-12-16 | パナソニックIpマネジメント株式会社 | Resin composition, prepreg, resin-coated film, resin-coated metal foil, metal-clad laminate, and wiring board |
WO2022054867A1 (en) * | 2020-09-11 | 2022-03-17 | パナソニックIpマネジメント株式会社 | Resin composition, prepreg, resin-coated film, resin-coated metal foil, metal-cladded laminate board, and wiring board |
JP7255765B1 (en) * | 2021-08-25 | 2023-04-11 | 三菱瓦斯化学株式会社 | Resin composition, cured product, prepreg, metal foil-clad laminate, resin sheet, and printed wiring board |
JP7380943B2 (en) * | 2021-09-27 | 2023-11-15 | 三菱瓦斯化学株式会社 | Resin compositions, prepregs, metal foil laminates, resin composite sheets, printed wiring boards, and semiconductor devices |
JP7380944B2 (en) * | 2021-09-27 | 2023-11-15 | 三菱瓦斯化学株式会社 | Resin compositions, prepregs, metal foil laminates, resin composite sheets, printed wiring boards, and semiconductor devices |
TW202317678A (en) * | 2021-09-30 | 2023-05-01 | 日商三菱瓦斯化學股份有限公司 | Prepreg, laminate and printed wiring board |
TW202348646A (en) * | 2022-03-11 | 2023-12-16 | 日商三菱瓦斯化學股份有限公司 | Resin composition, cured product, prepreg, metal-foil-clad laminate, resin composite sheet, printed circuit board, and semiconductor device |
TW202342605A (en) * | 2022-03-11 | 2023-11-01 | 日商三菱瓦斯化學股份有限公司 | Resin composition, cured product, prepreg, metal-foil-clad laminate, resin composite sheet, printed circuit board, and semiconductor device |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH036293A (en) * | 1989-05-31 | 1991-01-11 | Hitachi Chem Co Ltd | Flame-retardant resin composition and prepreg |
JP2002363232A (en) * | 2001-06-01 | 2002-12-18 | Nof Corp | Curable composition, polymer insulating material, method for producing the same, and substrate |
JP2007262191A (en) * | 2006-03-28 | 2007-10-11 | Nippon Steel Chem Co Ltd | Flame-retardant curable resin composition |
WO2016072404A1 (en) * | 2014-11-06 | 2016-05-12 | 三菱瓦斯化学株式会社 | Resin composition, prepreg, metal-foil-clad laminated board, resin composite sheet, and printed circuit board |
US20160148719A1 (en) * | 2013-03-18 | 2016-05-26 | Iteq Corporation | Low dielectric materials |
JP2016190899A (en) * | 2015-03-30 | 2016-11-10 | 新日鉄住金化学株式会社 | Terminal-modified soluble poly-functional vinyl aromatic copolymer, and production method thereof |
JP2017115020A (en) * | 2015-12-24 | 2017-06-29 | 日立化成株式会社 | Thermosetting resin composition, prepreg, copper-clad laminate and printed wiring board |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CA2013018A1 (en) * | 1989-03-31 | 1990-09-30 | Isao Kaneko | Imide prepolymers, cured products, method for making, laminate preparation, and encapsulating compositions |
JP5233710B2 (en) | 2008-02-12 | 2013-07-10 | 三菱瓦斯化学株式会社 | Resin composition, prepreg and metal foil-clad laminate |
JP7190649B2 (en) | 2018-04-27 | 2022-12-16 | パナソニックIpマネジメント株式会社 | Resin composition, prepreg, resin-coated film, resin-coated metal foil, metal-clad laminate, and wiring board |
-
2020
- 2020-02-26 JP JP2021502312A patent/JP7513587B2/en active Active
- 2020-02-26 CN CN202080016910.2A patent/CN113490596A/en active Pending
- 2020-02-26 TW TW109106269A patent/TW202039596A/en unknown
- 2020-02-26 WO PCT/JP2020/007687 patent/WO2020175538A1/en active Application Filing
- 2020-02-26 KR KR1020217028420A patent/KR20210133974A/en not_active Application Discontinuation
-
2024
- 2024-06-27 JP JP2024103476A patent/JP2024129074A/en active Pending
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH036293A (en) * | 1989-05-31 | 1991-01-11 | Hitachi Chem Co Ltd | Flame-retardant resin composition and prepreg |
JP2002363232A (en) * | 2001-06-01 | 2002-12-18 | Nof Corp | Curable composition, polymer insulating material, method for producing the same, and substrate |
JP2007262191A (en) * | 2006-03-28 | 2007-10-11 | Nippon Steel Chem Co Ltd | Flame-retardant curable resin composition |
US20160148719A1 (en) * | 2013-03-18 | 2016-05-26 | Iteq Corporation | Low dielectric materials |
WO2016072404A1 (en) * | 2014-11-06 | 2016-05-12 | 三菱瓦斯化学株式会社 | Resin composition, prepreg, metal-foil-clad laminated board, resin composite sheet, and printed circuit board |
JP2016190899A (en) * | 2015-03-30 | 2016-11-10 | 新日鉄住金化学株式会社 | Terminal-modified soluble poly-functional vinyl aromatic copolymer, and production method thereof |
JP2017115020A (en) * | 2015-12-24 | 2017-06-29 | 日立化成株式会社 | Thermosetting resin composition, prepreg, copper-clad laminate and printed wiring board |
Also Published As
Publication number | Publication date |
---|---|
JP7513587B2 (en) | 2024-07-09 |
CN113490596A (en) | 2021-10-08 |
TW202039596A (en) | 2020-11-01 |
WO2020175538A1 (en) | 2020-09-03 |
JP2024129074A (en) | 2024-09-26 |
KR20210133974A (en) | 2021-11-08 |
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