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JPWO2020175538A1 - - Google Patents

Info

Publication number
JPWO2020175538A1
JPWO2020175538A1 JP2021502312A JP2021502312A JPWO2020175538A1 JP WO2020175538 A1 JPWO2020175538 A1 JP WO2020175538A1 JP 2021502312 A JP2021502312 A JP 2021502312A JP 2021502312 A JP2021502312 A JP 2021502312A JP WO2020175538 A1 JPWO2020175538 A1 JP WO2020175538A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021502312A
Other languages
Japanese (ja)
Other versions
JP7513587B2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2020175538A1 publication Critical patent/JPWO2020175538A1/ja
Priority to JP2024103476A priority Critical patent/JP2024129074A/en
Application granted granted Critical
Publication of JP7513587B2 publication Critical patent/JP7513587B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F257/00Macromolecular compounds obtained by polymerising monomers on to polymers of aromatic monomers as defined in group C08F12/00
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/04Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/04Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/082Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising vinyl resins; comprising acrylic resins
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/20Layered products comprising a layer of metal comprising aluminium or copper
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/30Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F212/00Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring
    • C08F212/34Monomers containing two or more unsaturated aliphatic radicals
    • C08F212/36Divinylbenzene
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F222/00Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
    • C08F222/36Amides or imides
    • C08F222/40Imides, e.g. cyclic imides
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/04Reinforcing macromolecular compounds with loose or coherent fibrous material
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/01Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013Fillers, pigments or reinforcing additives
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/16Nitrogen-containing compounds
    • C08K5/34Heterocyclic compounds having nitrogen in the ring
    • C08K5/3412Heterocyclic compounds having nitrogen in the ring having one nitrogen atom in the ring
    • C08K5/3415Five-membered rings
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L25/00Compositions of, homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Compositions of derivatives of such polymers
    • C08L25/02Homopolymers or copolymers of hydrocarbons
    • C08L25/04Homopolymers or copolymers of styrene
    • C08L25/08Copolymers of styrene
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L35/00Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical, and containing at least one other carboxyl radical in the molecule, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L35/06Copolymers with vinyl aromatic monomers
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0313Organic insulating material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2305/00Condition, form or state of the layers or laminate
    • B32B2305/07Parts immersed or impregnated in a matrix
    • B32B2305/076Prepregs
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00Electrical equipment
    • B32B2457/08PCBs, i.e. printed circuit boards

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Reinforced Plastic Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Laminated Bodies (AREA)
JP2021502312A 2019-02-28 2020-02-26 Resin composition, prepreg, metal foil-clad laminate, resin composite sheet, and printed wiring board Active JP7513587B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2024103476A JP2024129074A (en) 2019-02-28 2024-06-27 Resin composition, prepreg, metal foil-clad laminate, resin composite sheet, and printed wiring board

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019035457 2019-02-28
JP2019035457 2019-02-28
PCT/JP2020/007687 WO2020175538A1 (en) 2019-02-28 2020-02-26 Resin composition, prepreg, metal foil-clad laminated sheet, composite resin sheet, and printed wiring board

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2024103476A Division JP2024129074A (en) 2019-02-28 2024-06-27 Resin composition, prepreg, metal foil-clad laminate, resin composite sheet, and printed wiring board

Publications (2)

Publication Number Publication Date
JPWO2020175538A1 true JPWO2020175538A1 (en) 2020-09-03
JP7513587B2 JP7513587B2 (en) 2024-07-09

Family

ID=72239974

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2021502312A Active JP7513587B2 (en) 2019-02-28 2020-02-26 Resin composition, prepreg, metal foil-clad laminate, resin composite sheet, and printed wiring board
JP2024103476A Pending JP2024129074A (en) 2019-02-28 2024-06-27 Resin composition, prepreg, metal foil-clad laminate, resin composite sheet, and printed wiring board

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2024103476A Pending JP2024129074A (en) 2019-02-28 2024-06-27 Resin composition, prepreg, metal foil-clad laminate, resin composite sheet, and printed wiring board

Country Status (5)

Country Link
JP (2) JP7513587B2 (en)
KR (1) KR20210133974A (en)
CN (1) CN113490596A (en)
TW (1) TW202039596A (en)
WO (1) WO2020175538A1 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7190649B2 (en) * 2018-04-27 2022-12-16 パナソニックIpマネジメント株式会社 Resin composition, prepreg, resin-coated film, resin-coated metal foil, metal-clad laminate, and wiring board
WO2022054867A1 (en) * 2020-09-11 2022-03-17 パナソニックIpマネジメント株式会社 Resin composition, prepreg, resin-coated film, resin-coated metal foil, metal-cladded laminate board, and wiring board
JP7255765B1 (en) * 2021-08-25 2023-04-11 三菱瓦斯化学株式会社 Resin composition, cured product, prepreg, metal foil-clad laminate, resin sheet, and printed wiring board
JP7380943B2 (en) * 2021-09-27 2023-11-15 三菱瓦斯化学株式会社 Resin compositions, prepregs, metal foil laminates, resin composite sheets, printed wiring boards, and semiconductor devices
JP7380944B2 (en) * 2021-09-27 2023-11-15 三菱瓦斯化学株式会社 Resin compositions, prepregs, metal foil laminates, resin composite sheets, printed wiring boards, and semiconductor devices
TW202317678A (en) * 2021-09-30 2023-05-01 日商三菱瓦斯化學股份有限公司 Prepreg, laminate and printed wiring board
TW202348646A (en) * 2022-03-11 2023-12-16 日商三菱瓦斯化學股份有限公司 Resin composition, cured product, prepreg, metal-foil-clad laminate, resin composite sheet, printed circuit board, and semiconductor device
TW202342605A (en) * 2022-03-11 2023-11-01 日商三菱瓦斯化學股份有限公司 Resin composition, cured product, prepreg, metal-foil-clad laminate, resin composite sheet, printed circuit board, and semiconductor device

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH036293A (en) * 1989-05-31 1991-01-11 Hitachi Chem Co Ltd Flame-retardant resin composition and prepreg
JP2002363232A (en) * 2001-06-01 2002-12-18 Nof Corp Curable composition, polymer insulating material, method for producing the same, and substrate
JP2007262191A (en) * 2006-03-28 2007-10-11 Nippon Steel Chem Co Ltd Flame-retardant curable resin composition
WO2016072404A1 (en) * 2014-11-06 2016-05-12 三菱瓦斯化学株式会社 Resin composition, prepreg, metal-foil-clad laminated board, resin composite sheet, and printed circuit board
US20160148719A1 (en) * 2013-03-18 2016-05-26 Iteq Corporation Low dielectric materials
JP2016190899A (en) * 2015-03-30 2016-11-10 新日鉄住金化学株式会社 Terminal-modified soluble poly-functional vinyl aromatic copolymer, and production method thereof
JP2017115020A (en) * 2015-12-24 2017-06-29 日立化成株式会社 Thermosetting resin composition, prepreg, copper-clad laminate and printed wiring board

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2013018A1 (en) * 1989-03-31 1990-09-30 Isao Kaneko Imide prepolymers, cured products, method for making, laminate preparation, and encapsulating compositions
JP5233710B2 (en) 2008-02-12 2013-07-10 三菱瓦斯化学株式会社 Resin composition, prepreg and metal foil-clad laminate
JP7190649B2 (en) 2018-04-27 2022-12-16 パナソニックIpマネジメント株式会社 Resin composition, prepreg, resin-coated film, resin-coated metal foil, metal-clad laminate, and wiring board

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH036293A (en) * 1989-05-31 1991-01-11 Hitachi Chem Co Ltd Flame-retardant resin composition and prepreg
JP2002363232A (en) * 2001-06-01 2002-12-18 Nof Corp Curable composition, polymer insulating material, method for producing the same, and substrate
JP2007262191A (en) * 2006-03-28 2007-10-11 Nippon Steel Chem Co Ltd Flame-retardant curable resin composition
US20160148719A1 (en) * 2013-03-18 2016-05-26 Iteq Corporation Low dielectric materials
WO2016072404A1 (en) * 2014-11-06 2016-05-12 三菱瓦斯化学株式会社 Resin composition, prepreg, metal-foil-clad laminated board, resin composite sheet, and printed circuit board
JP2016190899A (en) * 2015-03-30 2016-11-10 新日鉄住金化学株式会社 Terminal-modified soluble poly-functional vinyl aromatic copolymer, and production method thereof
JP2017115020A (en) * 2015-12-24 2017-06-29 日立化成株式会社 Thermosetting resin composition, prepreg, copper-clad laminate and printed wiring board

Also Published As

Publication number Publication date
JP7513587B2 (en) 2024-07-09
CN113490596A (en) 2021-10-08
TW202039596A (en) 2020-11-01
WO2020175538A1 (en) 2020-09-03
JP2024129074A (en) 2024-09-26
KR20210133974A (en) 2021-11-08

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