JPWO2020151932A5

JPWO2020151932A5 -

Info

Publication number: JPWO2020151932A5
Application number: JP2021542331A
Authority: JP
Publication date: 2023-01-11
Anticipated expiration: 2040-01-03

Description

装置１００は、さらに、加熱アセンブリ１１４を備える。加熱アセンブリ１１４は、回転可能チャック１０２にマウントされたウエハに照射するよう構成されたＬＥＤ１１６のアレイを備える。ＬＥＤ１１６は、回転可能チャックによって受け入れられたウエハ（例えば、ウエハ１０１）を加熱するための発光加熱素子として機能する。この例において、ＬＥＤは、３８０ｎｍ～６５０ｎｍの波長範囲の光を放射するよう構成されている。例えば、ＬＥＤ１１６は、３８０ｎｍ～６５０ｎｍの波長範囲で最大強度を有する光を放射してよい。発明者は、この波長範囲が半導体ウエハを加熱するのに適することを見出した。透明プレート１１２は、ＬＥＤ１１６によって放射された波長に対して実質的に透過的であるよう構成されており、すなわち、ＬＥＤ１１６によって放射された光のすべてまたは大部分が、透明プレート１１２によって伝達される。 Apparatus 100 further comprises heating assembly 114 . Heating assembly 114 includes an array of LEDs 116 configured to illuminate a wafer mounted on rotatable chuck 102 . LEDs 116 function as light emitting heating elements for heating a wafer (eg, wafer 101) received by the rotatable chuck. In this example, the LED is configured to emit light in the wavelength range of 380nm to 650nm. For example, LED 116 may emit light having a maximum intensity in the wavelength range of 380 nm to 650 nm. The inventors have found that this wavelength range is suitable for heating semiconductor wafers. Transparent plate 112 is configured to be substantially transparent to wavelengths emitted by LED 116 , ie, all or most of the light emitted by LED 116 is transmitted by transparent plate 112 .

加熱アセンブリ３１４は、さらに、プレート３１８を備える。ＬＥＤ３１６は、プレート３１８の上面に取り付けられている。プレート３１８は、ＬＥＤ３１６のアレイのためのヒートシンクとして機能することで、ＬＥＤ３１６によって生成された熱を放散させる。例えば、プレート３１８は、アルミニウムなどの金属で形成されてよい。ＬＥＤ３１６のための駆動回路（図示せず）を備えた回路基板３２０が、プレート３１８の下面上に提供されている。ＬＥＤ３１６のアレイと回路基板上の駆動回路との間の相互接続が、プレート３１８を通してなされる。プレート３１８は、固定ポスト３２２に取り付けられている。固定ポスト３２２は、チャック本体３０４と共に回転しないように、チャック本体３０４に接続されていない。プレート３１８は、透明プレート３１２と実質的に平行である。 Heating assembly 314 further comprises plate 318 . LED 316 is attached to the top surface of plate 318 . Plate 318 dissipates heat generated by LEDs 316 by acting as a heat sink for the array of LEDs 316 . For example, plate 318 may be formed of a metal such as aluminum. A circuit board 320 with drive circuitry (not shown) for the LEDs 316 is provided on the underside of the plate 318 . Interconnection between the array of LEDs 316 and the drive circuitry on the circuit board is made through plate 318 . Plate 318 is attached to fixed post 322 . Fixed post 322 is not connected to chuck body 304 so that it does not rotate with chuck body 304 . Plate 318 is substantially parallel to transparent plate 312 .

装置３００は、さらに、ＬＥＤ３１６に供給される電力を制御するため、および、光センサ３２４からの測定値出力（例えば、出力信号）を受信するために、コントローラ（図示せず）を備えてよい。コントローラは、要求された機能を実行するためにソフトウェアをインストールされた任意の適切なコンピュータデバイスであってよい。例えば、コントローラは、ＬＥＤ３１６のアレイに供給される電力の量を制御するため、および、光センサ３２４からの測定値出力を受信するために、通信インターフェース（例えば、ＵＳＢ、イーサネット、など）を介して、回路基板３２０に接続されてよい。コントローラは、ＬＥＤ１１６のアレイのための様々な制御パラメータ（例えば、電力レベル）が格納されているメモリを備えてよい。コントローラは、光センサ３２４から受信された測定データも格納してよい。 Device 300 may further comprise a controller (not shown) for controlling the power supplied to LED 316 and for receiving the measurement output (eg, output signal) from light sensor 324 . The controller may be any suitable computing device installed with software to perform the required functions. For example, the controller can control the amount of power supplied to the array of LEDs 316 and receive the measurement output from the light sensor 324 via a communication interface (eg, USB, Ethernet, etc.). , may be connected to the circuit board 320 . The controller may include memory in which various control parameters (eg, power levels) for the array of LEDs 116 are stored. The controller may also store measurement data received from optical sensor 324 .

Claims

An apparatus for processing wafers, comprising:
a rotatable chuck adapted to receive a wafer;
a heating assembly comprising a light emitting heating element array configured to irradiate the wafer received by the rotatable chuck to heat the wafer;
one or more optical sensors configured to detect light emitted by the luminescent heating element array and output a signal relating to the intensity of the light emitted by the luminescent heating element array ;
wherein the one or more optical sensors include optical sensors located on opposite sides of the luminescent heating element array ;
The optical sensor located opposite the array of luminescent heating elements is located so as to be on the opposite side of the wafer relative to the array of luminescent heating elements when the wafer is received by the rotatable chuck. and
The apparatus , wherein the one or more optical sensors comprise optical sensors configured to detect light from the array of light emitting heating elements reflected from the wafer while the wafer is being received by the rotatable chuck .

2. The apparatus of claim 1 , wherein the optical sensor located opposite the array of luminescent heating elements is located on and/or about an axis of rotation of the rotatable chuck. There is a device.

3. Apparatus according to claim 1 or claim 2, wherein the light sensor located on the opposite side of the luminescent heating element array is located at a predetermined fixed position with respect to the luminescent heating element array. Device.

4. A device according to any one of claims 1 to 3 , wherein the device is arranged to prevent stray light from reaching the light sensor located on the opposite side of the luminescent heating element array. an apparatus comprising a fitted cover.

5. Apparatus according to claim 4 , wherein the light sensor located opposite the array of light emitting heating elements is located or attached to the inside of the cover.

6. Apparatus according to claim 4 or claim 5 , wherein the cover is attachable to a frame of a process chamber of the apparatus.

7. A device according to any one of the preceding claims, wherein the device comprises only one photosensor arranged opposite the array of luminescent heating elements.

2. The device of claim 1 , wherein the optical sensor configured to detect the reflected light and the array of luminescent heating elements are integrated in the same substrate of the device.

9. The apparatus of claim 1 or claim 8 , wherein the apparatus is adapted to detect light from the array of light emitting heating elements reflected from the wafer while the wafer is being received by the rotatable chuck. An apparatus comprising a plurality of configured optical sensors.

10. A device according to any one of claims 1 to 9 ,
said luminous heating element is an LED configured to emit light having a predetermined wavelength or a wavelength within a predetermined wavelength range;
The apparatus, wherein the one or more light sensors are adapted to detect light having the predetermined wavelength or wavelengths within the predetermined wavelength range.

11. The device of claim 10 , wherein the device comprises an optical filter configured to selectively transmit light having the predetermined wavelength or wavelengths within the predetermined wavelength range.

12. The apparatus of any one of claims 1-11 , further comprising controlling power supplied to the array of luminescent heating elements and measuring output of the one or more photosensors. An apparatus comprising a controller configured to receive a

13. The apparatus of claim 12 , wherein the controller compares the measurement output of the one or more optical sensors, or information derived from the measurement output, to a reference value and, based on the comparison, hand,
determining information about the operating state of one or more of the luminescent heating elements included in the luminescent heating element array; and/or
An apparatus configured to adjust the power supplied to one or more of the luminescent heating elements included in the luminescent heating element array.

14. A device according to claim 12 or claim 13 , wherein
wherein the luminescent heating element array is composed of a plurality of individually controllable groups of luminescent heating elements;
The apparatus of claim 1, wherein the controller is configured to individually control power supplied to each of the plurality of groups of light emitting heating elements.

15. The apparatus of claim 14 , wherein the controller comprises:
receiving from the one or more photosensors a measurement output indicative of the illuminance of one of the plurality of groups of luminescent heating elements;
comparing the measurement output or information derived from the measurement output for that group of luminescent heating elements to a reference value for that group;
Based on said comparison,
determining information about the operating state of the group of light emitting heating elements; and/or
An apparatus configured to control power supplied to the group of light emitting heating elements.

16. An apparatus as claimed in any one of claims 13 to 15, wherein said reference value is a previous measurement output from said one or more optical sensors or said previous measurement A device, derived from the output .

A method of controlling a device according to any one of claims 1 to 16 , comprising:
powering the array of light emitting heating elements;
receiving measurements output from the one or more optical sensors;
comparing the measurement output, or information derived from the measurement output, to a reference value;
Based on said comparison,
determining information about the operating state of the array of light-emitting heating elements; and/or
controlling power supplied to the array of light emitting heating elements;
A method.

18. The method of claim 17 , wherein
selectively powering one or more of the light emitting heating elements;
determining information about the operating state of the one or more of the light emitting heating elements;
A method.