JPWO2020064916A5

JPWO2020064916A5 -

Info

Publication number: JPWO2020064916A5
Application number: JP2021517594A
Authority: JP
Publication date: 2022-09-06
Anticipated expiration: 2039-09-26

Claims

(a) an epoxy resin;
(b) a siloxane-type curing agent of formula C22

[In the formula,
R ^C1 , R ^C2 , R ^C3 are independently selected from methyl, ethyl and 1-propyl;
X ^C31 is a divalent group selected from C ₁₀ -C ₃₀ alkylaryl of formula —X ^C32 —A ^C1 —[X ^C32 —A ^C2 ] _p —X ^C32 —;
A ^C1 is selected from biphenylene, naphthylene, anthracenylene, phenanthrenylene, pyrenylene, and fluorenylene groups, all of which may be unsubstituted or substituted by C ₁ -C ₄ alkyl;
A ^C2 is selected from phenylene groups which may be unsubstituted or substituted by C ₁ -C ₄ alkyl;
p is 0, 1 or 2;
X ^C32 is a chemical bond or C ₁ -C ₄ alkanediyl, preferably a chemical bond or methanediyl;
R ^C31 is H, C ₁ -C ₆ alkyl, C ₆ -C ₃₀ aryl or alkylaryl, and

is selected from
X ^C22 is a divalent group selected from C ₁ -C ₄ alkanediyl, and C ₆ -C ₃₀ aryl or alkylaryl;
m is the average number of repeating units and is between 1.05 and 20 ]
and essentially free of fluoride or bromide.

A ^C1 is selected from a biphenylene group and a naphthylene group, both of which are unsubstituted or optionally substituted by methyl or ethyl; A ^C2 is a phenylene group, which is optionally unsubstituted or substituted by methyl or ethyl; The resin composition of claim 1 , selected from

3. The resin composition according to claim 1, wherein p is 1.

3. The resin composition according to claim 1 , wherein m is 1.5-10.

The siloxane-type curing agent is a compound of formula C22a or C22b

[wherein R ^C1 , R ^C2 , R ^C3 are independently selected from methyl, ethyl and 1-propyl and m is an average number from 2 to 10, especially from 2.5 to 5]
The resin composition according to claim 1 , which is

6. The resin composition of any one of claims 1 to 5 , wherein R ^C1 , R ^C2 and, if applicable, R ^C3 are methyl.

7. The resin composition according to any one of claims 1 to 6 , further comprising an inorganic filler.

8. A method of using the resin composition according to claim 7 for depositing insulating films on circuit boards, in particular for producing printed wiring boards.

8. An insulating layer comprising the resin composition after curing the resin composition according to claim 7 to form an insulating layer, wherein the insulation resistance _Dk is 3 or less and 0.02 or less, especially 0.01 or less. An insulating layer having a loss tangent D _f of .

Formula C22a or C22b

[In the formula ,
R ^C1 , R ^C2 , R ^C3 are independently selected from methyl, ethyl and 1-propyl, most preferably methyl;
m is the average number of repeating units and is between 1.05 and 20, especially between 2 and 10]
compound .

(a) an epoxy resin,
(b) a siloxane-type curing agent of formula C11:

[In the formula,
R ^C1 is selected from methyl and ethyl;
R ^C2 , R ^C3 are independently selected from linear or branched C ₁ -C ₃ alkyl and linear C ₄ -C ₆ alkyl groups, preferably methyl and ethyl;
X ^C11 may be unsubstituted or substituted by C ₁ -C ₆ alkyl, naphthyl group, bipyridyl group, -A ^C1 -X ^C32 -A ^C2 - group, or -X ^C41 -A ^C3 -X ^C42 group A divalent group selected from X ^C11 comprising or consisting of and wherein the A ^C1 , A ^C2 or A ^C3 group is one or more

optionally substituted by a group,
A ^C1 is selected from phenylene, biphenylene, naphthylene, anthracenylene, phenanthrenylene, pyrenylene, and fluorenylene groups, any of which may be unsubstituted or substituted by C ₁ -C ₄ alkyl; ;
A ^C2 is selected from a phenylene group or a naphthylene group, which may be unsubstituted or substituted by C ₁ -C ₄ alkyl;
A ^C3 is selected from methanediyl substituted by C ₆ -C ₂₀ aryl groups which may be unsubstituted or substituted by C ₁ -C ₄ alkyl;
X ^C32 is a chemical bond or C ₁ -C ₄ alkanediyl, preferably a chemical bond or methanediyl,
X ^C41 , X ^C42 are independently selected from C ₁ -C ₆ alkanediyl]
and essentially free of fluoride or bromide.

The siloxane-type curing agent is a compound of formulas C12a and C12b

[In the formula,
R ^C1 , R ^C2 , R ^C3 are independently selected from methyl, ethyl and 1-propyl, preferably methyl;
R ^C11 , R ^C12 are independently selected from methyl, ethyl and 1-propyl, preferably methyl;
R ^CA1 , R ^CA2 are independently selected from H and linear or branched C ₁ -C ₄ alkyl, preferably H, methyl and ethyl]
The resin composition according to claim 16, which is

The siloxane-type curing agent is a compound of formula C13a and C13b

[In the formula,
R ^C1 , R ^C2 , R ^C3 are independently selected from methyl, ethyl and 1-propyl, preferably methyl;
R ^CA1 , R ^CA2 are independently selected from H and linear or branched C ₁ -C ₄ alkyl, preferably H, methyl and ethyl]
The resin composition according to claim 11 , which is

The siloxane-type curing agent is a compound of formula C14

[In the formula,
A ^C4 is unsubstituted or C ₆ -C ₂₀ aryl optionally substituted by linear or branched C ₁ -C ₆ alkyl, preferably unsubstituted or linear or branched C ₁ - selected from C6 _- _C12 aryl optionally substituted by _C4 alkyl;
R ^C1 , R ^C2 , R ^C3 are independently selected from methyl, ethyl and 1-propyl, preferably methyl;
X ^C41 , X ^C42 are independently selected from C ₁ -C ₆ alkanediyl, preferably C ₁ -C ₄ alkanediyl, most preferably methanediyl and ethanediyl;
R ^C4 is selected from H and linear or branched C ₁ -C ₆ alkyl, preferably H and C ₁ -C ₄ alkyl, most preferably H, methyl and ethyl]
The resin composition according to claim 11 , which is

The difunctional siloxane-type curing agent is of formula C14a

[In the formula,
R ^C1 , R ^C2 , R ^C3 are independently selected from methyl, ethyl and 1-propyl, preferably methyl;
X ^C41 , X ^C42 are independently selected from C ₁ -C ₆ alkanediyl, preferably C ₁ -C ₄ alkanediyl, most preferably methanediyl and ethanediyl;
R ^C4 is selected from H and C ₁ -C ₄ alkyl, preferably H, methyl or ethyl, most preferably H or methyl;
R ^CA1 is selected from H and C ₁ -C ₄ alkyl, preferably H, methyl and ethyl, most preferably H]
The resin composition according to claim 14 , which is

16. The resin composition according to any one of claims 11 to 15 , further comprising an inorganic filler.

17. A method of using the resin composition according to claim 16 for depositing insulating films on circuit boards, in particular for producing printed wiring boards.

17. An insulating layer comprising the resin composition after curing the resin composition according to claim 16 to form an insulating layer, wherein the insulation resistance _Dk is 3 or less and 0.02 or less, especially 0.01 or less. An insulating layer having a loss tangent D _f of .