JPWO2019164867A5 - - Google Patents
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- JPWO2019164867A5 JPWO2019164867A5 JP2020566538A JP2020566538A JPWO2019164867A5 JP WO2019164867 A5 JPWO2019164867 A5 JP WO2019164867A5 JP 2020566538 A JP2020566538 A JP 2020566538A JP 2020566538 A JP2020566538 A JP 2020566538A JP WO2019164867 A5 JPWO2019164867 A5 JP WO2019164867A5
- Authority
- JP
- Japan
- Prior art keywords
- circuit
- circuit configuration
- lower portion
- pixel
- voltage transistor
- Prior art date
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Claims (10)
少なくとも1つの低電圧トランジスタを備える低電圧回路構成と、少なくとも1つのトレンチキャパシタを備えるデータ記憶回路構成とを具備する下側部分と、
少なくとも1つの高電圧トランジスタと、第1の有機発光ダイオード(OLED)を駆動するように構成されたピクセル駆動回路構成とを備え前記下側部分の上方に配置される上側部分であって、第1のシリコン貫通ビア(TSV)と少なくとも1つの高電圧トランジスタとを含む、上側部分と
を備え、
前記上側部分および前記下側部分は、前記第1のTSVを含む単一の電気的接続点を介して電気的に接続される、垂直に積層された回路。 It is a vertically stacked pixel circuit.
A lower portion with a low voltage circuit configuration with at least one low voltage transistor and a data storage circuit configuration with at least one trench capacitor .
A first portion comprising at least one high voltage transistor and a pixel drive circuit configuration configured to drive a first organic light emitting diode (OLED) and located above the lower portion . It features an upper portion, including a silicon through via (TSV) and at least one high voltage transistor .
A vertically stacked circuit in which the upper portion and the lower portion are electrically connected via a single electrical connection point including the first TSV .
3ボルト以下の動作電圧を有する少なくとも1つの低電圧トランジスタを備える低電圧回路構成と、少なくとも1つのトレンチキャパシタを備えるデータ記憶回路構成とを具備する下側部分と、
第1の有機発光ダイオード(OLED)および前記第1のOLEDを駆動するように構成されるピクセル駆動回路構成を備え前記下側部分の上方に配置される上側部分であって、第1のシリコン貫通ビア(TSV)と3ボルトより大きい動作電圧を有する少なくとも1つの高電圧トランジスタを備えた高電圧回路構成とを具備する、上側部分と
を備え、
前記上側部分および下側部分は、前記第1のTSVを含む単一の電気的接続点を介して電気的に接続される、垂直に積層されたピクセル回路。 It is a vertically stacked pixel circuit.
A lower portion with a low voltage circuit configuration with at least one low voltage transistor with an operating voltage of 3 volts or less and a data storage circuit configuration with at least one trench capacitor .
An upper portion located above the lower portion with a pixel drive circuit configuration configured to drive the first organic light emitting diode (OLED) and the first OLED , the first silicon penetration. A high voltage circuit configuration with vias (TSVs) and at least one high voltage transistor with an operating voltage greater than 3 volts, with an upper portion ,
The upper and lower portions are vertically stacked pixel circuits that are electrically connected via a single electrical connection point that includes the first TSV .
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201862632920P | 2018-02-20 | 2018-02-20 | |
US62/632,920 | 2018-02-20 | ||
US16/279,809 US10950178B2 (en) | 2018-02-20 | 2019-02-19 | Microdisplay with reduced pixel size and method of forming same |
US16/279,809 | 2019-02-19 | ||
PCT/US2019/018671 WO2019164867A1 (en) | 2018-02-20 | 2019-02-20 | 3d pixel circuit for microdisplay with reduced pixel size and method of forming same |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2021514494A JP2021514494A (en) | 2021-06-10 |
JPWO2019164867A5 true JPWO2019164867A5 (en) | 2022-03-01 |
JP7371025B2 JP7371025B2 (en) | 2023-10-30 |
Family
ID=67616936
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2020566538A Active JP7371025B2 (en) | 2018-02-20 | 2019-02-20 | Microdisplay with reduced pixel size and method of forming it |
Country Status (7)
Country | Link |
---|---|
US (2) | US10950178B2 (en) |
EP (1) | EP3756218A1 (en) |
JP (1) | JP7371025B2 (en) |
KR (1) | KR102429648B1 (en) |
CN (1) | CN111819680B (en) |
TW (1) | TWI791772B (en) |
WO (1) | WO2019164867A1 (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2021154690A1 (en) | 2020-01-28 | 2021-08-05 | OLEDWorks LLC | Stacked oled microdisplay with low-voltage silicon backplane |
KR20230052785A (en) | 2020-08-19 | 2023-04-20 | 오엘이디워크스 엘엘씨 | Pixel Circuit for Crosstalk Reduction |
KR20220144264A (en) | 2021-04-19 | 2022-10-26 | 삼성전자주식회사 | Small size pixel and display device including the same |
KR20230096300A (en) | 2021-12-23 | 2023-06-30 | 삼성전자주식회사 | Display driver integrated circuit and display device including the same |
CN117460292A (en) * | 2023-03-29 | 2024-01-26 | 武汉华星光电半导体显示技术有限公司 | Display panel |
Family Cites Families (22)
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JP2004247373A (en) * | 2003-02-12 | 2004-09-02 | Semiconductor Energy Lab Co Ltd | Semiconductor device |
US20070145367A1 (en) | 2005-12-27 | 2007-06-28 | Taiwan Semiconductor Manufacturing Company, Ltd. | Three-dimensional integrated circuit structure |
US7385283B2 (en) | 2006-06-27 | 2008-06-10 | Taiwan Semiconductor Manufacturing Co., Ltd. | Three dimensional integrated circuit and method of making the same |
US7808028B2 (en) * | 2007-04-18 | 2010-10-05 | International Business Machines Corporation | Trench structure and method of forming trench structure |
US7897428B2 (en) * | 2008-06-03 | 2011-03-01 | International Business Machines Corporation | Three-dimensional integrated circuits and techniques for fabrication thereof |
JP5985136B2 (en) * | 2009-03-19 | 2016-09-06 | ソニー株式会社 | SEMICONDUCTOR DEVICE, ITS MANUFACTURING METHOD, AND ELECTRONIC DEVICE |
US8748288B2 (en) * | 2010-02-05 | 2014-06-10 | International Business Machines Corporation | Bonded structure with enhanced adhesion strength |
JP5760923B2 (en) * | 2011-10-04 | 2015-08-12 | ソニー株式会社 | Method for manufacturing solid-state imaging device |
US9859348B2 (en) * | 2011-10-14 | 2018-01-02 | Diftek Lasers, Inc. | Electronic device and method of making thereof |
TW201324760A (en) | 2011-12-07 | 2013-06-16 | Chunghwa Picture Tubes Ltd | Pixel structure and manufacturing method of the same |
US20130168674A1 (en) | 2011-12-28 | 2013-07-04 | Rambus Inc. | Methods and Systems for Repairing Interior Device Layers in Three-Dimensional Integrated Circuits |
US8773562B1 (en) * | 2013-01-31 | 2014-07-08 | Apple Inc. | Vertically stacked image sensor |
US9691760B2 (en) * | 2013-03-12 | 2017-06-27 | Monolithic 3D Inc | Semiconductor device and structure |
US9184041B2 (en) * | 2013-06-25 | 2015-11-10 | Taiwan Semiconductor Manufacturing Co., Ltd. | Integrated circuit with backside structures to reduce substrate warp |
US9653342B2 (en) * | 2014-11-19 | 2017-05-16 | Texas Instruments Incorporated | Trench having thick dielectric selectively on bottom portion |
JP3197990U (en) | 2015-03-31 | 2015-06-11 | セイコーエプソン株式会社 | Electro-optical device and electronic apparatus |
US9461131B1 (en) * | 2015-06-15 | 2016-10-04 | Texas Instruments Incorporated | High quality deep trench oxide |
DE112016003966T5 (en) | 2015-09-01 | 2018-06-14 | Sony Corporation | Stacked body |
CN106876419B (en) * | 2015-12-10 | 2019-07-30 | 中芯国际集成电路制造(上海)有限公司 | Cmos image sensor and forming method thereof |
US9627371B1 (en) * | 2016-04-04 | 2017-04-18 | Pdf Solutions, Inc. | Integrated circuit containing standard logic cells and library-compatible, NCEM-enabled fill cells, including at least via-open-configured, GATE-short-configured, GATECNT-short-configured, and AA-short-configured, NCEM-enabled fill cells |
CN105914202B (en) * | 2016-06-13 | 2018-11-13 | 上海珏芯光电科技有限公司 | Display driving backboard, display and manufacturing method |
CN107680958B (en) * | 2016-08-02 | 2020-01-24 | 上海珏芯光电科技有限公司 | Radio frequency microsystem packaging module and manufacturing method thereof |
-
2019
- 2019-02-19 US US16/279,809 patent/US10950178B2/en active Active
- 2019-02-20 KR KR1020207027113A patent/KR102429648B1/en active IP Right Grant
- 2019-02-20 TW TW108105687A patent/TWI791772B/en active
- 2019-02-20 WO PCT/US2019/018671 patent/WO2019164867A1/en unknown
- 2019-02-20 JP JP2020566538A patent/JP7371025B2/en active Active
- 2019-02-20 CN CN201980014394.7A patent/CN111819680B/en active Active
- 2019-02-20 EP EP19709603.5A patent/EP3756218A1/en active Pending
-
2021
- 2021-02-16 US US17/177,007 patent/US11410606B2/en active Active
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