JPWO2019021981A1 - 押圧センサ及び電子機器 - Google Patents
押圧センサ及び電子機器 Download PDFInfo
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- JPWO2019021981A1 JPWO2019021981A1 JP2019532580A JP2019532580A JPWO2019021981A1 JP WO2019021981 A1 JPWO2019021981 A1 JP WO2019021981A1 JP 2019532580 A JP2019532580 A JP 2019532580A JP 2019532580 A JP2019532580 A JP 2019532580A JP WO2019021981 A1 JPWO2019021981 A1 JP WO2019021981A1
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- 239000000463 material Substances 0.000 claims abstract description 41
- 229920005989 resin Polymers 0.000 claims description 29
- 239000011347 resin Substances 0.000 claims description 29
- 239000000758 substrate Substances 0.000 claims description 9
- 238000010030 laminating Methods 0.000 claims description 5
- 229920000106 Liquid crystal polymer Polymers 0.000 claims description 3
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 claims description 3
- 239000004642 Polyimide Substances 0.000 claims description 3
- 239000003822 epoxy resin Substances 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- 229920001721 polyimide Polymers 0.000 claims description 3
- 239000004626 polylactic acid Substances 0.000 description 13
- 238000010586 diagram Methods 0.000 description 12
- 229920000747 poly(lactic acid) Polymers 0.000 description 12
- 230000035945 sensitivity Effects 0.000 description 11
- 238000003825 pressing Methods 0.000 description 10
- 239000002390 adhesive tape Substances 0.000 description 6
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 5
- 239000002033 PVDF binder Substances 0.000 description 4
- 229920000642 polymer Polymers 0.000 description 4
- 229920002981 polyvinylidene fluoride Polymers 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000003475 lamination Methods 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000005616 pyroelectricity Effects 0.000 description 2
- 229920001609 Poly(3,4-ethylenedioxythiophene) Polymers 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/16—Measuring force or stress, in general using properties of piezoelectric devices
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0414—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means using force sensing means to determine a position
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/30—Piezoelectric or electrostrictive devices with mechanical input and electrical output, e.g. functioning as generators or sensors
- H10N30/302—Sensors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/704—Piezoelectric or electrostrictive devices based on piezoelectric or electrostrictive films or coatings
- H10N30/706—Piezoelectric or electrostrictive devices based on piezoelectric or electrostrictive films or coatings characterised by the underlying bases, e.g. substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/85—Piezoelectric or electrostrictive active materials
- H10N30/857—Macromolecular compositions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/87—Electrodes or interconnections, e.g. leads or terminals
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/88—Mounts; Supports; Enclosures; Casings
- H10N30/883—Additional insulation means preventing electrical, physical or chemical damage, e.g. protective coatings
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04107—Shielding in digitiser, i.e. guard or shielding arrangements, mostly for capacitive touchscreens, e.g. driven shields, driven grounds
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Force Measurement Appropriate To Specific Purposes (AREA)
- Pressure Sensors (AREA)
- Measuring Fluid Pressure (AREA)
Abstract
Description
10…圧電フィルム
11…第1電極
12…第2電極
14…第1主面
15…第2主面
16…第3主面
17…第4主面
21…基準電極パターン
22,23,32…樹脂基材
24,34…シールド電極
41…接合材料
42,43…ビア電極
100…電子機器
Claims (11)
- 第1主面及び第2主面を有する圧電フィルムと、
前記圧電フィルムの前記第1主面に設けられた第1電極と、
前記圧電フィルムの前記第2主面に設けられた第2電極と、
を備え、
前記第1電極又は前記第2電極の少なくともいずれか一方は、弾性率60GPa以上の材料で形成され、且つ、積層方向の厚みと弾性率との積が4MPa・m以上である、
押圧センサ。 - 前記第1電極又は前記第2電極の少なくともいずれか一方は、積層方向の厚みと弾性率との積が5MPa・m以上である、
請求項1に記載の押圧センサ。 - シールド電極を備え、
前記第1電極は、前記圧電フィルムと対向する第3主面と、該第3主面の反対側の第4主面と、を備え、
前記シールド電極は、前記第4主面に対向して配置され、
前記シールド電極は、弾性率60GPa以上の材料で形成され、
前記シールド電極は、積層方向の厚みと弾性率との積が4MPa・m以上である、
請求項1に記載の押圧センサ。 - 前記シールド電極は、積層方向の厚みと弾性率との積が5MPa・m以上である、
請求項3に記載の押圧センサ。 - 前記シールド電極は、複数の電極の層で形成され、
前記複数の電極の層を構成する各電極の積層方向の厚みと弾性率との積の和が4MPa・m以上である、
請求項3に記載の押圧センサ。 - 前記複数の電極の層を構成する各電極の積層方向の厚みと弾性率との積の和が5MPa・m以上である、
請求項5に記載の押圧センサ。 - 樹脂基材と、ビア電極と、を備え、
前記樹脂基材、前記シールド電極、前記ビア電極、及び前記第1電極は、プリント配線板で形成され、
前記ビア電極は、前記シールド電極と前記第1電極とを接続し、
前記樹脂基材は、エポキシ樹脂、ポリイミド、又は液晶ポリマー、の少なくともいずれか一つを含む、
請求項3乃至請求項6のいずれか1項に記載の押圧センサ。 - 樹脂基材と、ビア電極と、基準電極パターンと、を備え、
前記樹脂基材、前記シールド電極、前記ビア電極、前記基準電極パターン、及び前記第1電極は、プリント配線板で形成され、
前記基準電極パターンは、前記第1電極と同一面に配置され、
前記ビア電極は、前記シールド電極と前記基準電極パターンとを接続され、
前記第2電極は、導電テープで形成され、前記基準電極パターンに接続し、
前記樹脂基材は、エポキシ樹脂、ポリイミド、又は液晶ポリマー、の少なくともいずれか一つを含む、
請求項3乃至請求項6のいずれか1項に記載の押圧センサ。 - 前記導電テープは両面テープである、
請求項8に記載の押圧センサ。 - 前記圧電フィルムと前記第1電極とを接合する接合材料を備え、
前記接合材料の弾性率は10MPa以上である、
請求項1乃至請求項請求項9のいずれか1項に記載の押圧センサ。 - 請求項1乃至請求項10のいずれか1項に記載の押圧センサと、
弾性率が1MPa以下の基材と、
を備えた電子機器。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017144110 | 2017-07-26 | ||
JP2017144110 | 2017-07-26 | ||
PCT/JP2018/027418 WO2019021981A1 (ja) | 2017-07-26 | 2018-07-23 | 押圧センサ及び電子機器 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2019021981A1 true JPWO2019021981A1 (ja) | 2020-02-06 |
JP6795097B2 JP6795097B2 (ja) | 2020-12-02 |
Family
ID=65039834
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019532580A Active JP6795097B2 (ja) | 2017-07-26 | 2018-07-23 | 押圧センサ及び電子機器 |
Country Status (4)
Country | Link |
---|---|
US (1) | US11906373B2 (ja) |
JP (1) | JP6795097B2 (ja) |
CN (1) | CN110945331A (ja) |
WO (1) | WO2019021981A1 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102555984B1 (ko) * | 2018-07-27 | 2023-07-14 | 삼성디스플레이 주식회사 | 압력 센서를 갖는 표시 장치 |
CN114981614A (zh) * | 2020-07-30 | 2022-08-30 | 株式会社村田制作所 | 变形检测传感器 |
CN115769044A (zh) * | 2021-06-17 | 2023-03-07 | 株式会社村田制作所 | 传感器以及传感器处理装置 |
Citations (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5799140U (ja) * | 1980-12-10 | 1982-06-18 | ||
US4954811A (en) * | 1988-11-29 | 1990-09-04 | Pennwalt Corporation | Penetration sensor |
JPH0634454A (ja) * | 1992-07-17 | 1994-02-08 | Fujikura Ltd | 圧電型振動センサ装置とその製法 |
JPH07280672A (ja) * | 1994-04-05 | 1995-10-27 | Nec Corp | 力の検出表示装置 |
JPH08201424A (ja) * | 1995-01-27 | 1996-08-09 | Matsushita Electric Ind Co Ltd | 圧電振動センサおよびその製造方法 |
JP2005156531A (ja) * | 2003-11-05 | 2005-06-16 | Sony Corp | 圧力センサおよび生体情報処理装置 |
WO2008013049A1 (fr) * | 2006-07-24 | 2008-01-31 | Kawasaki Jukogyo Kabushiki Kaisha | Capteur de contrainte et système de capteur de contrainte |
JP2011043442A (ja) * | 2009-08-21 | 2011-03-03 | Hiroshima Univ | 変動荷重検出パッド及びこれを用いた変動荷重検出板、分布型変動荷重検出板、並びに変動荷重検出装置 |
JP2011059281A (ja) * | 2009-09-08 | 2011-03-24 | Sharp Corp | 画像無効化装置、画像形成装置および画像形成方法 |
JP2011185681A (ja) * | 2010-03-05 | 2011-09-22 | National Institute Of Advanced Industrial Science & Technology | 圧電センサ |
JP2012138194A (ja) * | 2010-12-24 | 2012-07-19 | Hitachi Vehicle Energy Ltd | リチウムイオン二次電池 |
JP2017058344A (ja) * | 2015-09-18 | 2017-03-23 | 積水化学工業株式会社 | 圧電センサ構造 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03214062A (ja) * | 1990-01-18 | 1991-09-19 | Fujikura Ltd | 圧電型加速度センサ |
JP4822769B2 (ja) * | 2005-08-29 | 2011-11-24 | 京セラ株式会社 | 加速度センサ |
JP5945469B2 (ja) * | 2012-07-18 | 2016-07-05 | キヤノン化成株式会社 | 感圧センサ |
JP6096036B2 (ja) * | 2013-04-01 | 2017-03-15 | 日本写真印刷株式会社 | 圧力センサ |
EP2998716B1 (en) * | 2013-05-16 | 2018-07-04 | Mitsui Chemicals, Inc. | Pressing-detection device and touch panel |
JP2015046072A (ja) | 2013-08-28 | 2015-03-12 | 住友電気工業株式会社 | タッチセンサパネル |
CN105556267B (zh) * | 2013-09-20 | 2018-11-16 | 株式会社村田制作所 | 按压检测传感器 |
WO2015080109A1 (ja) * | 2013-11-27 | 2015-06-04 | 株式会社村田製作所 | 圧電センサおよび携帯端末 |
US10048141B2 (en) * | 2014-12-24 | 2018-08-14 | Nippon Mektron, Ltd. | Pressure sensing element and pressure sensor |
WO2016136522A1 (ja) * | 2015-02-25 | 2016-09-01 | 富士フイルム株式会社 | 構造体および電気音響変換器 |
US9683138B2 (en) * | 2015-06-26 | 2017-06-20 | Nitto Denko Corporation | Pressure-sensitive adhesive sheet and magnetic disk drive |
-
2018
- 2018-07-23 WO PCT/JP2018/027418 patent/WO2019021981A1/ja active Application Filing
- 2018-07-23 CN CN201880048716.5A patent/CN110945331A/zh active Pending
- 2018-07-23 JP JP2019532580A patent/JP6795097B2/ja active Active
-
2019
- 2019-12-06 US US16/705,758 patent/US11906373B2/en active Active
Patent Citations (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5799140U (ja) * | 1980-12-10 | 1982-06-18 | ||
US4954811A (en) * | 1988-11-29 | 1990-09-04 | Pennwalt Corporation | Penetration sensor |
JPH0634454A (ja) * | 1992-07-17 | 1994-02-08 | Fujikura Ltd | 圧電型振動センサ装置とその製法 |
JPH07280672A (ja) * | 1994-04-05 | 1995-10-27 | Nec Corp | 力の検出表示装置 |
JPH08201424A (ja) * | 1995-01-27 | 1996-08-09 | Matsushita Electric Ind Co Ltd | 圧電振動センサおよびその製造方法 |
JP2005156531A (ja) * | 2003-11-05 | 2005-06-16 | Sony Corp | 圧力センサおよび生体情報処理装置 |
WO2008013049A1 (fr) * | 2006-07-24 | 2008-01-31 | Kawasaki Jukogyo Kabushiki Kaisha | Capteur de contrainte et système de capteur de contrainte |
JP2011043442A (ja) * | 2009-08-21 | 2011-03-03 | Hiroshima Univ | 変動荷重検出パッド及びこれを用いた変動荷重検出板、分布型変動荷重検出板、並びに変動荷重検出装置 |
JP2011059281A (ja) * | 2009-09-08 | 2011-03-24 | Sharp Corp | 画像無効化装置、画像形成装置および画像形成方法 |
JP2011185681A (ja) * | 2010-03-05 | 2011-09-22 | National Institute Of Advanced Industrial Science & Technology | 圧電センサ |
JP2012138194A (ja) * | 2010-12-24 | 2012-07-19 | Hitachi Vehicle Energy Ltd | リチウムイオン二次電池 |
JP2017058344A (ja) * | 2015-09-18 | 2017-03-23 | 積水化学工業株式会社 | 圧電センサ構造 |
Also Published As
Publication number | Publication date |
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WO2019021981A1 (ja) | 2019-01-31 |
JP6795097B2 (ja) | 2020-12-02 |
US11906373B2 (en) | 2024-02-20 |
US20200109995A1 (en) | 2020-04-09 |
CN110945331A (zh) | 2020-03-31 |
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