JPWO2017170167A1 - Surface treatment method and surface treatment liquid - Google Patents
Surface treatment method and surface treatment liquid Download PDFInfo
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- JPWO2017170167A1 JPWO2017170167A1 JP2018509206A JP2018509206A JPWO2017170167A1 JP WO2017170167 A1 JPWO2017170167 A1 JP WO2017170167A1 JP 2018509206 A JP2018509206 A JP 2018509206A JP 2018509206 A JP2018509206 A JP 2018509206A JP WO2017170167 A1 JPWO2017170167 A1 JP WO2017170167A1
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- surface treatment
- resin
- formula
- functional
- Prior art date
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- 238000004381 surface treatment Methods 0.000 title claims abstract description 100
- 238000000034 method Methods 0.000 title claims abstract description 46
- 239000007788 liquid Substances 0.000 title claims description 71
- 239000011347 resin Substances 0.000 claims abstract description 91
- 229920005989 resin Polymers 0.000 claims abstract description 91
- 125000000524 functional group Chemical group 0.000 claims abstract description 69
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims abstract description 44
- 239000002253 acid Substances 0.000 claims abstract description 41
- 239000010408 film Substances 0.000 claims abstract description 35
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims abstract description 34
- 125000004093 cyano group Chemical group *C#N 0.000 claims abstract description 28
- 125000001165 hydrophobic group Chemical group 0.000 claims abstract description 28
- 239000002904 solvent Substances 0.000 claims abstract description 23
- 239000010409 thin film Substances 0.000 claims abstract description 9
- -1 siloxane compound Chemical class 0.000 claims description 44
- 125000004432 carbon atom Chemical group C* 0.000 claims description 43
- 238000000576 coating method Methods 0.000 claims description 31
- 239000011248 coating agent Substances 0.000 claims description 29
- 239000000178 monomer Substances 0.000 claims description 23
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 19
- 125000000217 alkyl group Chemical group 0.000 claims description 16
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 16
- 239000000463 material Substances 0.000 claims description 8
- 125000005373 siloxane group Chemical group [SiH2](O*)* 0.000 claims description 8
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- 125000003277 amino group Chemical group 0.000 claims description 6
- 239000011368 organic material Substances 0.000 claims description 6
- 125000000542 sulfonic acid group Chemical group 0.000 claims description 5
- 125000003808 silyl group Chemical group [H][Si]([H])([H])[*] 0.000 claims description 4
- 229910052783 alkali metal Chemical group 0.000 claims description 2
- 150000001340 alkali metals Chemical group 0.000 claims description 2
- 125000001183 hydrocarbyl group Chemical group 0.000 claims 7
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- 125000006575 electron-withdrawing group Chemical group 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- 125000001153 fluoro group Chemical group F* 0.000 description 3
- 125000003709 fluoroalkyl group Chemical group 0.000 description 3
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 3
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 3
- 125000000449 nitro group Chemical group [O-][N+](*)=O 0.000 description 3
- BKIMMITUMNQMOS-UHFFFAOYSA-N nonane Chemical compound CCCCCCCCC BKIMMITUMNQMOS-UHFFFAOYSA-N 0.000 description 3
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- GKNWQHIXXANPTN-UHFFFAOYSA-N 1,1,2,2,2-pentafluoroethanesulfonic acid Chemical compound OS(=O)(=O)C(F)(F)C(F)(F)F GKNWQHIXXANPTN-UHFFFAOYSA-N 0.000 description 2
- AUHZEENZYGFFBQ-UHFFFAOYSA-N 1,3,5-trimethylbenzene Chemical compound CC1=CC(C)=CC(C)=C1 AUHZEENZYGFFBQ-UHFFFAOYSA-N 0.000 description 2
- VKPSKYDESGTTFR-UHFFFAOYSA-N 2,2,4,6,6-pentamethylheptane Chemical compound CC(C)(C)CC(C)CC(C)(C)C VKPSKYDESGTTFR-UHFFFAOYSA-N 0.000 description 2
- MSXVEPNJUHWQHW-UHFFFAOYSA-N 2-methylbutan-2-ol Chemical compound CCC(C)(C)O MSXVEPNJUHWQHW-UHFFFAOYSA-N 0.000 description 2
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- 229920002799 BoPET Polymers 0.000 description 2
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- BDJSOPWXYLFTNW-UHFFFAOYSA-N methyl 3-methoxypropanoate Chemical compound COCCC(=O)OC BDJSOPWXYLFTNW-UHFFFAOYSA-N 0.000 description 1
- GYNNXHKOJHMOHS-UHFFFAOYSA-N methyl-cycloheptane Natural products CC1CCCCCC1 GYNNXHKOJHMOHS-UHFFFAOYSA-N 0.000 description 1
- 125000001570 methylene group Chemical group [H]C([H])([*:1])[*:2] 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- AJFDBNQQDYLMJN-UHFFFAOYSA-N n,n-diethylacetamide Chemical compound CCN(CC)C(C)=O AJFDBNQQDYLMJN-UHFFFAOYSA-N 0.000 description 1
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 229940094933 n-dodecane Drugs 0.000 description 1
- 125000003136 n-heptyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000001280 n-hexyl group Chemical group C(CCCCC)* 0.000 description 1
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000001971 neopentyl group Chemical group [H]C([*])([H])C(C([H])([H])[H])(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 125000001209 o-nitrophenyl group Chemical group [H]C1=C([H])C(*)=C(C([H])=C1[H])[N+]([O-])=O 0.000 description 1
- 150000002892 organic cations Chemical class 0.000 description 1
- 125000000962 organic group Chemical group 0.000 description 1
- 125000006353 oxyethylene group Chemical group 0.000 description 1
- 125000004430 oxygen atom Chemical group O* 0.000 description 1
- 229930004008 p-menthane Natural products 0.000 description 1
- 125000000538 pentafluorophenyl group Chemical group FC1=C(F)C(F)=C(*)C(F)=C1F 0.000 description 1
- JYVLIDXNZAXMDK-UHFFFAOYSA-N pentan-2-ol Chemical compound CCCC(C)O JYVLIDXNZAXMDK-UHFFFAOYSA-N 0.000 description 1
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 1
- 125000006551 perfluoro alkylene group Chemical group 0.000 description 1
- 125000005010 perfluoroalkyl group Chemical group 0.000 description 1
- QZHDEAJFRJCDMF-UHFFFAOYSA-N perfluorohexanesulfonic acid Chemical compound OS(=O)(=O)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)F QZHDEAJFRJCDMF-UHFFFAOYSA-N 0.000 description 1
- NKIFVPLJBNCZFN-UHFFFAOYSA-N phenacyl(diphenyl)sulfanium Chemical compound C=1C=CC=CC=1C(=O)C[S+](C=1C=CC=CC=1)C1=CC=CC=C1 NKIFVPLJBNCZFN-UHFFFAOYSA-N 0.000 description 1
- 125000001792 phenanthrenyl group Chemical group C1(=CC=CC=2C3=CC=CC=C3C=CC12)* 0.000 description 1
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N phenylbenzene Natural products C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 1
- 125000000843 phenylene group Chemical group C1(=C(C=CC=C1)*)* 0.000 description 1
- 229930006728 pinane Natural products 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920000768 polyamine Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 229910001414 potassium ion Inorganic materials 0.000 description 1
- HWDDJFFLFNQAFQ-UHFFFAOYSA-M potassium;4-ethenylbenzenesulfonate Chemical compound [K+].[O-]S(=O)(=O)C1=CC=C(C=C)C=C1 HWDDJFFLFNQAFQ-UHFFFAOYSA-M 0.000 description 1
- YLQIJFPHMPTBGU-UHFFFAOYSA-M potassium;ethenesulfonate Chemical compound [K+].[O-]S(=O)(=O)C=C YLQIJFPHMPTBGU-UHFFFAOYSA-M 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 238000007761 roller coating Methods 0.000 description 1
- 125000002914 sec-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- QPRQEDXDYOZYLA-UHFFFAOYSA-N sec-pentyl alcohol Natural products CCC(C)CO QPRQEDXDYOZYLA-UHFFFAOYSA-N 0.000 description 1
- 125000003548 sec-pentyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 125000004469 siloxy group Chemical group [SiH3]O* 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 229910001415 sodium ion Inorganic materials 0.000 description 1
- XFTALRAZSCGSKN-UHFFFAOYSA-M sodium;4-ethenylbenzenesulfonate Chemical compound [Na+].[O-]S(=O)(=O)C1=CC=C(C=C)C=C1 XFTALRAZSCGSKN-UHFFFAOYSA-M 0.000 description 1
- BWYYYTVSBPRQCN-UHFFFAOYSA-M sodium;ethenesulfonate Chemical compound [Na+].[O-]S(=O)(=O)C=C BWYYYTVSBPRQCN-UHFFFAOYSA-M 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- HXJUTPCZVOIRIF-UHFFFAOYSA-N sulfolane Chemical compound O=S1(=O)CCCC1 HXJUTPCZVOIRIF-UHFFFAOYSA-N 0.000 description 1
- 150000003457 sulfones Chemical class 0.000 description 1
- 150000003462 sulfoxides Chemical class 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000012756 surface treatment agent Substances 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 150000003505 terpenes Chemical class 0.000 description 1
- 235000007586 terpenes Nutrition 0.000 description 1
- 229930006978 terpinene Natural products 0.000 description 1
- 150000003507 terpinene derivatives Chemical class 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- ISXSCDLOGDJUNJ-UHFFFAOYSA-N tert-butyl prop-2-enoate Chemical group CC(C)(C)OC(=O)C=C ISXSCDLOGDJUNJ-UHFFFAOYSA-N 0.000 description 1
- 125000001981 tert-butyldimethylsilyl group Chemical group [H]C([H])([H])[Si]([H])(C([H])([H])[H])[*]C(C([H])([H])[H])(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 125000001973 tert-pentyl group Chemical group [H]C([H])([H])C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- TXEYQDLBPFQVAA-UHFFFAOYSA-N tetrafluoromethane Chemical group FC(F)(F)F TXEYQDLBPFQVAA-UHFFFAOYSA-N 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- JLGLQAWTXXGVEM-UHFFFAOYSA-N triethylene glycol monomethyl ether Chemical compound COCCOCCOCCO JLGLQAWTXXGVEM-UHFFFAOYSA-N 0.000 description 1
- 125000000025 triisopropylsilyl group Chemical group C(C)(C)[Si](C(C)C)(C(C)C)* 0.000 description 1
- 125000003258 trimethylene group Chemical group [H]C([H])([*:2])C([H])([H])C([H])([H])[*:1] 0.000 description 1
- 125000000026 trimethylsilyl group Chemical group [H]C([H])([H])[Si]([*])(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- WLOQLWBIJZDHET-UHFFFAOYSA-N triphenylsulfonium Chemical compound C1=CC=CC=C1[S+](C=1C=CC=CC=1)C1=CC=CC=C1 WLOQLWBIJZDHET-UHFFFAOYSA-N 0.000 description 1
- 239000012953 triphenylsulfonium Substances 0.000 description 1
- QKFJVDSYTSWPII-UHFFFAOYSA-N tris(4-methylphenyl)sulfanium Chemical compound C1=CC(C)=CC=C1[S+](C=1C=CC(C)=CC=1)C1=CC=C(C)C=C1 QKFJVDSYTSWPII-UHFFFAOYSA-N 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- RSJKGSCJYJTIGS-UHFFFAOYSA-N undecane Chemical compound CCCCCCCCCCC RSJKGSCJYJTIGS-UHFFFAOYSA-N 0.000 description 1
- NLVXSWCKKBEXTG-UHFFFAOYSA-N vinylsulfonic acid Chemical compound OS(=O)(=O)C=C NLVXSWCKKBEXTG-UHFFFAOYSA-N 0.000 description 1
- 239000004034 viscosity adjusting agent Substances 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/06—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to radiation
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/18—Materials not provided for elsewhere for application to surfaces to minimize adherence of ice, mist or water thereto; Thawing or antifreeze materials for application to surfaces
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/075—Silicon-containing compounds
- G03F7/0757—Macromolecular compounds containing Si-O, Si-C or Si-N bonds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/40—Treatment after imagewise removal, e.g. baking
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/42—Stripping or agents therefor
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Plasma & Fusion (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Combustion & Propulsion (AREA)
- Materials For Photolithography (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Materials Applied To Surfaces To Minimize Adherence Of Mist Or Water (AREA)
- Paints Or Removers (AREA)
Abstract
被処理体の表面の良好な親水化又は疎水化を行うことができ、被処理体上に表面処理効果が高い領域と、表面処理効果が低い領域とを形成できる表面処理方法と、当該表面処理方法に好適に使用される表面処理液とを提供すること。
露光及びベークを施された感光性表面処理液からなる塗布膜に対して、リンスを行って、膜厚10nm以下の表面改質機能を有する薄膜を形成する表面処理方法において、感光性表面処理液に、(A)樹脂と、(B)光酸発生剤と、(C)溶媒とを含有させ、(A)樹脂として、水酸基、シアノ基、及びカルボキシ基からなる群より選択される1以上の基である官能基Iと、官能基I以外の親水性基又は疎水性基である官能基IIとを有する樹脂を用い、且つ、(B)光酸発生剤として、光の作用によりpKaが1以下の強酸を発生させる化合物を用いる。A surface treatment method capable of forming a region having a high surface treatment effect and a region having a low surface treatment effect on the object to be treated, and capable of forming a hydrophilic or hydrophobic surface on the surface to be treated, and the surface treatment. A surface treatment solution preferably used for the method.
In a surface treatment method for forming a thin film having a surface modification function with a film thickness of 10 nm or less by rinsing the exposed and baked photosensitive surface treatment solution, the photosensitive surface treatment solution (A) a resin, (B) a photoacid generator, and (C) a solvent, and (A) one or more selected from the group consisting of a hydroxyl group, a cyano group, and a carboxy group as the resin A resin having a functional group I which is a group and a functional group II which is a hydrophilic group or a hydrophobic group other than the functional group I, and (B) as a photoacid generator, the pKa is 1 by the action of light. The following compounds that generate strong acids are used.
Description
本発明は、表面処理方法、及び当該表面処方法において好適に使用される表面処理液に関する。 The present invention relates to a surface treatment method and a surface treatment liquid suitably used in the surface treatment method.
従来より、様々な表面処理液を用いて、種々の物品の表面の性質の改質が行われている。表面改質の中でも、物品の表面の親水化又は疎水化についての要求は大きく、親水化又は疎水化を行う表面処理方法や、当該方法において用いられる表面処理液について多数提案されている。 Conventionally, surface properties of various articles have been modified using various surface treatment liquids. Among surface modification, there is a great demand for hydrophilization or hydrophobization of the surface of articles, and many surface treatment methods for hydrophilization or hydrophobization and surface treatment liquids used in the method have been proposed.
かかる表面処方法に関して、例えば、少なくともアクリルアミドモノマーと、特定の骨格のシロキシ基含有モノ(メタ)アクリレートモノマーとが共重合された、重量平均分子量1500〜50000の共重合物を含む表面調整剤を用いて、被膜表面に親水性と防汚性とを付与する方法が提案されている(特許文献1)。 With respect to such a surface treatment method, for example, a surface conditioner containing a copolymer having a weight average molecular weight of 1500 to 50000, which is a copolymer of at least an acrylamide monomer and a siloxy group-containing mono (meth) acrylate monomer having a specific skeleton, is used. A method for imparting hydrophilicity and antifouling properties to the coating surface has been proposed (Patent Document 1).
しかしながら、特許文献1に記載の表面調整剤を用いて親水化処理を行う場合、表面調整剤のみを含む溶液を用いて被処理体の表面を処理しても、表面調整剤が被処理体の表面に付着しにくく、所望する親水化効果を得にくい。
このため、特許文献1に記載の方法では、表面調整剤の溶液に、アクリル樹脂、ポリエステル樹脂、ウレタン樹脂、アルキッド樹脂、エポキシ樹脂、ポリアミン樹脂等の樹脂を被膜形成成分として配合した液を、表面処理液として用いている。However, when the hydrophilic treatment is performed using the surface conditioning agent described in Patent Document 1, even if the surface of the object to be treated is treated with a solution containing only the surface conditioning agent, the surface conditioning agent is not treated. It is difficult to adhere to the surface, and it is difficult to obtain a desired hydrophilic effect.
For this reason, in the method described in Patent Document 1, a liquid in which a resin such as an acrylic resin, a polyester resin, a urethane resin, an alkyd resin, an epoxy resin, or a polyamine resin is blended as a film forming component in the surface conditioner solution, Used as a processing solution.
そして、特許文献1に記載の表面調整剤と、被膜形成成分とを含む表面処理液を用いる場合、被処理体の表面が樹脂を含む被膜により被覆されてしまうため、良好な親水化はできても、被処理体が有する有用な表面特性まで損なわれてしまう。
また、表面処理された材料の用途によっては、表面処理されるべき箇所と、表面処理されるべきでない箇所とにおいて、表面処理の効果に差をつける必要がある場合がある。理想的には、表面処理された箇所と、表面処理されていない箇所とが、微細にパターン化されているのが好ましい。
しかし、特許文献1に記載の方法で使用される表面調整剤を用いる方法では、部位ごとに表面処理の効果に差をつけることも、表面処理剤を微細且つ精密に塗り分けて表面処理された箇所と表面処理されていない箇所とを設けることも困難である。その結果、特許文献1に記載の方法では、表面処理されるべき箇所と、表面処理されるべきでない箇所とにおいて、表面処理の効果に差をつけることは困難である。And when using the surface treatment liquid containing the surface conditioning agent of patent document 1, and a film formation component, since the surface of a to-be-processed body will be coat | covered with the film containing resin, favorable hydrophilization can be performed. However, even useful surface properties of the object to be processed are impaired.
Further, depending on the use of the surface-treated material, it may be necessary to make a difference in the effect of the surface treatment between a portion that should be surface-treated and a portion that should not be surface-treated. Ideally, it is preferable that the portion subjected to the surface treatment and the portion not subjected to the surface treatment are finely patterned.
However, in the method using the surface conditioning agent used in the method described in Patent Document 1, it is possible to make a difference in the effect of the surface treatment for each part, or the surface treatment agent is finely and precisely coated and surface-treated. It is also difficult to provide places and places that are not surface-treated. As a result, in the method described in Patent Document 1, it is difficult to make a difference in the effect of the surface treatment between a portion that should be surface-treated and a portion that should not be surface-treated.
本発明は、上記の課題に鑑みなされたものであって、被膜形成性の樹脂を含んでいなくても、被処理体の表面の良好な親水化又は疎水化を行うことができ、且つ、被処理体上に表面処理効果が高い領域と、表面処理効果が低い領域とを形成できる表面処理方法と、当該表面処理方法に好適に使用される表面処理液とを提供することを目的とする。 The present invention has been made in view of the above-described problems, and even if it does not contain a film-forming resin, the surface of the object to be treated can be made hydrophilic or hydrophobic, and It is an object of the present invention to provide a surface treatment method capable of forming a region having a high surface treatment effect and a region having a low surface treatment effect on an object to be treated, and a surface treatment liquid suitably used for the surface treatment method. .
本発明者らは、露光及びベークを施された感光性表面処理液からなる塗布膜に対して、リンスを行って、膜厚10nm以下の表面改質機能を有する薄膜を形成する表面処理方法において、感光性表面処理液に、(A)樹脂と、(B)光酸発生剤と、(C)溶媒とを含有させ、(A)樹脂として、水酸基、シアノ基、及びカルボキシ基からなる群より選択される1以上の基である官能基Iと、官能基I以外の親水性基又は疎水性基である官能基IIとを有する樹脂を用い、且つ、(B)光酸発生剤として、光の作用によりpKaが1以下の強酸を発生させる化合物を用いることにより、上記の課題を解決できることを見出し、本発明を完成するに至った。具体的には、本発明は以下のものを提供する。 In the surface treatment method of forming a thin film having a surface modification function with a film thickness of 10 nm or less by rinsing the exposed and baked photosensitive surface treatment liquid. The photosensitive surface treatment liquid contains (A) a resin, (B) a photoacid generator, and (C) a solvent, and (A) the resin is selected from the group consisting of a hydroxyl group, a cyano group, and a carboxy group. A resin having a functional group I that is one or more selected groups and a functional group II that is a hydrophilic group or a hydrophobic group other than the functional group I; and (B) a photoacid generator, By using a compound that generates a strong acid having a pKa of 1 or less by the action of the above, it has been found that the above problems can be solved, and the present invention has been completed. Specifically, the present invention provides the following.
本発明の第一の態様は、感光性表面処理液を用いる表面処理方法であって、
被処理体の表面に感光性表面処理液を塗布して、塗布膜を形成することと、
塗布膜の少なくとも一部を露光することと、
露光された塗布膜をベークすることと、
ベークされた塗布膜をリンスして、被処理体の表面の露光された箇所に膜厚10nm以下の薄膜を形成することと、を含み、
感光性表面処理液が、(A)樹脂と、(B)光酸発生剤と、(C)溶媒とを含み、
(A)樹脂が、水酸基、シアノ基、及びカルボキシ基からなる群より選択される1以上の基である官能基Iと、官能基I以外の親水性基又は疎水性基である官能基IIとを有し、
(B)光酸発生剤が、pKaが1以下の強酸を発生させる、表面処理方法である。A first aspect of the present invention is a surface treatment method using a photosensitive surface treatment liquid,
Applying a photosensitive surface treatment liquid to the surface of the object to be processed to form a coating film;
Exposing at least a portion of the coating film;
Baking the exposed coating film;
Rinsing the baked coating film, and forming a thin film having a thickness of 10 nm or less on the exposed portion of the surface of the object to be processed,
The photosensitive surface treatment liquid contains (A) a resin, (B) a photoacid generator, and (C) a solvent.
(A) the resin is a functional group I that is one or more groups selected from the group consisting of a hydroxyl group, a cyano group, and a carboxy group; and a functional group II that is a hydrophilic group or a hydrophobic group other than the functional group I; Have
(B) The photoacid generator is a surface treatment method in which a strong acid having a pKa of 1 or less is generated.
本発明の第二の態様は、第一の態様にかかる表面処理方法において用いられる感光性表面処理液であって、
(A)樹脂と、(B)光酸発生剤と、(C)溶媒とを含み、
(A)樹脂が、水酸基、シアノ基、及びカルボキシ基からなる群より選択される1以上の基である官能基Iと、官能基I以外の親水性基又は疎水性基である官能基IIとを有し、
(B)光酸発生剤が、pKaが1以下の強酸を発生させる、感光性表面処理液である。A second aspect of the present invention is a photosensitive surface treatment liquid used in the surface treatment method according to the first aspect,
(A) a resin, (B) a photoacid generator, and (C) a solvent,
(A) the resin is a functional group I that is one or more groups selected from the group consisting of a hydroxyl group, a cyano group, and a carboxy group; and a functional group II that is a hydrophilic group or a hydrophobic group other than the functional group I; Have
(B) The photoacid generator is a photosensitive surface treatment liquid that generates a strong acid having a pKa of 1 or less.
本発明の第三の態様は、(A)樹脂と、(B)光酸発生剤と、(C)溶媒とを含み、
(A)樹脂が、水酸基、シアノ基、及びカルボキシ基からなる群より選択される1以上の基である官能基Iと、官能基I以外の親水性基又は疎水性基である官能基IIとを有し、
(B)光酸発生剤が、pKaが1以下の強酸を発生させる、感光性表面処理液である。The third aspect of the present invention includes (A) a resin, (B) a photoacid generator, and (C) a solvent,
(A) the resin is a functional group I that is one or more groups selected from the group consisting of a hydroxyl group, a cyano group, and a carboxy group; and a functional group II that is a hydrophilic group or a hydrophobic group other than the functional group I; Have
(B) The photoacid generator is a photosensitive surface treatment liquid that generates a strong acid having a pKa of 1 or less.
本発明によれば、被膜形成性の樹脂を含んでいなくても、被処理体の表面の良好な親水化又は疎水化を行うことができ、被処理体上に表面処理効果が高い領域と、表面処理効果が低い領域とを形成できる。 According to the present invention, even if it does not contain a film-forming resin, the surface of the object to be treated can be well hydrophilized or hydrophobized, and the surface treatment effect is high on the object to be treated. , A region having a low surface treatment effect can be formed.
≪表面処理方法≫
以下、感光性表面処理液を用いる表面処理方法について説明する。
当該表面処理方法は、
被処理体の表面に感光性表面処理液を塗布して、塗布膜を形成することと、
塗布膜の少なくとも一部を露光することと、
露光された塗布膜をベークすることと、
ベークされた塗布膜をリンスして、被処理体の表面の露光された箇所に膜厚10nm以下の薄膜を形成することと、を含む方法である。≪Surface treatment method≫
Hereinafter, a surface treatment method using a photosensitive surface treatment liquid will be described.
The surface treatment method is as follows:
Applying a photosensitive surface treatment liquid to the surface of the object to be processed to form a coating film;
Exposing at least a portion of the coating film;
Baking the exposed coating film;
Rinsing the baked coating film, and forming a thin film having a thickness of 10 nm or less on the exposed portion of the surface of the object to be processed.
感光性表面処理液(以下、「処理液」とも記す。)としては、(A)樹脂と、(B)光酸発生剤と、(C)溶媒とを含み、
(A)樹脂が、水酸基、シアノ基、及びカルボキシ基からなる群より選択される1以上の基である官能基Iと、官能基I以外の親水性基又は疎水性基である官能基IIとを有し、
(B)光酸発生剤が、pKaが1以下の強酸を発生させる、処理液が使用される。The photosensitive surface treatment liquid (hereinafter also referred to as “treatment liquid”) includes (A) a resin, (B) a photoacid generator, and (C) a solvent.
(A) the resin is a functional group I that is one or more groups selected from the group consisting of a hydroxyl group, a cyano group, and a carboxy group; and a functional group II that is a hydrophilic group or a hydrophobic group other than the functional group I; Have
(B) A processing solution in which the photoacid generator generates a strong acid having a pKa of 1 or less is used.
以下、感光性表面処理液と、表面処理方法に含まれる各工程とについて説明する。 Hereinafter, the photosensitive surface treatment liquid and each step included in the surface treatment method will be described.
<感光性表面処理液>
以下、感光性表面処理液が含む、必須、又は任意の成分について説明する。<Photosensitive surface treatment solution>
Hereinafter, essential or optional components contained in the photosensitive surface treatment liquid will be described.
〔(A)樹脂〕
(A)樹脂は、水酸基、シアノ基、及びカルボキシ基からなる群より選択される1以上の基である官能基Iを有する。後述する(B)光酸発生剤が発生させるpKa1以下の強酸により、官能基Iと非処理体表面との反応性、又は相互作用が高められることによって、(A)樹脂が被処理体表面に結合ないし付着する。[(A) Resin]
(A) The resin has a functional group I that is one or more groups selected from the group consisting of a hydroxyl group, a cyano group, and a carboxy group. The reactivity or interaction between the functional group I and the surface of the non-treated body is enhanced by (B) a strong acid of pKa1 or less generated by the (B) photoacid generator, which will be described later. Bond or adhere.
(A)樹脂は、官能基I以外の親水性基又は疎水性基である官能基IIを有する。親水性基を有する(A)樹脂を含む処理液を用いると親水化処理でき、疎水性基を有する(A)樹脂を含む処理液を用いると疎水化処理できる。
親水性基又は疎水性基は、従来から、当業者に親水性基又は疎水性基であると認識されている官能基であれば特に限定されず、その中から適宜選択できる。(A) The resin has a functional group II which is a hydrophilic group or a hydrophobic group other than the functional group I. Hydrophilic treatment can be performed using a treatment liquid containing a hydrophilic group-containing (A) resin, and hydrophobic treatment can be performed using a treatment liquid containing a hydrophobic group-containing (A) resin.
The hydrophilic group or the hydrophobic group is not particularly limited as long as it is a functional group conventionally recognized as a hydrophilic group or a hydrophobic group by those skilled in the art, and can be appropriately selected from the functional groups.
(A)樹脂の種類は、(A)樹脂が、所定の官能基を有し、且つ(C)溶媒に可溶である限り特に限定されない。(A)樹脂の例としては、(メタ)アクリル樹脂、ノボラック樹脂、ポリエステル樹脂、ポリアミド樹脂、ポリイミド樹脂、ポリアミドイミド樹脂、及びシリコーン樹脂等が挙げられる。これらの樹脂の中では、官能基の導入や、官能基を有する単位の含有比率の調整が容易である事から(メタ)アクリル樹脂が好ましい。 The type of (A) resin is not particularly limited as long as (A) the resin has a predetermined functional group and is soluble in (C) the solvent. Examples of (A) resin include (meth) acrylic resin, novolac resin, polyester resin, polyamide resin, polyimide resin, polyamideimide resin, and silicone resin. Among these resins, a (meth) acrylic resin is preferable because it is easy to introduce a functional group and adjust the content ratio of units having a functional group.
親水性基の具体例としては、ポリオキシアルキレン基(例えば、ポリオキシエチレン基、ポリオキシプロピレン基、オキシエチレン基とオキシプロピレン基がブロック又はランダム結合したポリオキシアルキレン基等)、アミノ基、カルボキシ基、水酸基、スルホン酸基等があげられる。また、これらの基を含む有機基も親水性基として好ましい。
親水性基が酸性基である場合、当該酸性基は塩を形成してもよい。塩を構成するカチオンは特に限定されず、金属イオンであっても、有機カチオンであってもよい。カチオンとしては、金属イオンが好ましく、アルカリ金属イオンがより好ましい、ナトリウムイオン又はカリウムイオンが特に好ましい。Specific examples of the hydrophilic group include polyoxyalkylene groups (for example, polyoxyethylene groups, polyoxypropylene groups, polyoxyalkylene groups in which oxyethylene groups and oxypropylene groups are blocked or randomly bonded), amino groups, carboxy groups, and the like. Group, hydroxyl group, sulfonic acid group and the like. Moreover, the organic group containing these groups is also preferable as a hydrophilic group.
When the hydrophilic group is an acidic group, the acidic group may form a salt. The cation constituting the salt is not particularly limited, and may be a metal ion or an organic cation. The cation is preferably a metal ion, more preferably an alkali metal ion, and particularly preferably a sodium ion or a potassium ion.
(A)樹脂が、官能基IIとして、水酸基、シアノ基、及びカルボキシ基を含む親水性基又は疎水性基を有する場合、当該親水性基又は疎水性基に含まれる水酸基、シアノ基、又はカルボキシ基は、官能基Iとしての役割も果たす。
このため、(A)樹脂が、官能基IIとして、水酸基、シアノ基、及びカルボキシ基を含む親水性基又は疎水性基を有する場合、(A)樹脂は、官能基Iを有していなくてもよい。
なお、水酸基、及びカルボキシ基を含む親水性基には、水酸基そのもの、及びカルボキシ基そのものが含まれる。(A) When the resin has a hydrophilic group or a hydrophobic group containing a hydroxyl group, a cyano group, and a carboxy group as the functional group II, the hydroxyl group, cyano group, or carboxy contained in the hydrophilic group or hydrophobic group The group also serves as the functional group I.
Therefore, when (A) the resin has a hydrophilic group or a hydrophobic group containing a hydroxyl group, a cyano group, and a carboxy group as the functional group II, the (A) resin does not have the functional group I. Also good.
The hydrophilic group including a hydroxyl group and a carboxy group includes the hydroxyl group itself and the carboxy group itself.
処理液の親水化効果が優れる点で、親水性基としては、下記式(A1):
−NH−R1・・・(A1)
(式(A1)中、R1は、アミノ基、スルホン酸基、及び水酸基からなる群より選択される1以上の基で置換された炭素原子数1〜4のアルキル基、又は水素原子である。)
で表される基が好ましい。As the hydrophilic group, the following formula (A1):
-NH-R 1 (A1)
(In Formula (A1), R 1 is an alkyl group having 1 to 4 carbon atoms substituted with one or more groups selected from the group consisting of an amino group, a sulfonic acid group, and a hydroxyl group, or a hydrogen atom. .)
The group represented by these is preferable.
式(A1)で表される親水性基中のR1の具体例としては、アミノ基と、下記式で表される基と、が挙げられる。
上記の式(A1)で表される親水性基中のR1の具体例のうち、より好ましい基としては、以下の基が挙げられる。
上記の式(A1)で表される親水性基中のR1の具体例のうち、特に好ましい基としては、以下の基が挙げられる。
疎水性基の具体例としては、例えば、フッ素化炭化水素基、シリル基、シロキサン基、炭素原子数6〜20のアルキル基、及び炭素原子数10〜20の芳香族炭化水素基等が挙げられる。
フッ素化炭化水素基としては、式(A3)について後述する基が好ましい。
シリル基の好適な例としては、後述する式(A4)で表され、nが0である基が挙げられる。シリル基の具体例としては、例えば、トリメチルシリル基、トリエチルシリル基、トリプロピルシリル基、トリイソプロピルシリル基、tert−ブチルジメチルシリル基、及びトリフェニルシリル基等が挙げられる。
シロキサン基は、直鎖状であっても、分岐鎖状であってもよい。シロキサン基は、1価の基であってもよく、2価以上の多価基であってもよい。このため、所謂、オルガノシロキサン化合物は、疎水性基としてシロキサン基を有する化合物に該当する。シロキサン基の好適な例としては、後述する式(A4)で表され、nが1以上である基が挙げられる。Specific examples of the hydrophobic group include a fluorinated hydrocarbon group, a silyl group, a siloxane group, an alkyl group having 6 to 20 carbon atoms, and an aromatic hydrocarbon group having 10 to 20 carbon atoms. .
As the fluorinated hydrocarbon group, a group described later for the formula (A3) is preferable.
Preferable examples of the silyl group include a group represented by the formula (A4) described later and n is 0. Specific examples of the silyl group include a trimethylsilyl group, a triethylsilyl group, a tripropylsilyl group, a triisopropylsilyl group, a tert-butyldimethylsilyl group, and a triphenylsilyl group.
The siloxane group may be linear or branched. The siloxane group may be a monovalent group or a divalent or higher polyvalent group. For this reason, so-called organosiloxane compounds correspond to compounds having a siloxane group as a hydrophobic group. Preferable examples of the siloxane group include a group represented by the formula (A4) described later and n is 1 or more.
(A)樹脂としては、種々の官能基を導入しやすく、官能基量の調整が容易である事から、不飽和結合を有する単量体の重合体であるのが好ましい。かかる重合体は、ホモポリマーであっても、コポリマーであってもよい。 The resin (A) is preferably a monomer polymer having an unsaturated bond because various functional groups can be easily introduced and the amount of the functional groups can be easily adjusted. Such polymers may be homopolymers or copolymers.
この場合、(A)樹脂が有する官能基Iは、下式(A2):
CH2=CR2−(R3)a−CO−R4・・・(A2)
(式(A2)中、R2は水素原子又はメチル基であり、R3は2価の炭化水素基であり、aは0又は1であり、R4は、−OH、−O−R5、又は−NH−R5であり、R5は、水酸基、シアノ基、及びカルボキシ基からなる群より選択される1以上の官能基で置換された炭化水素基である。)
又は下式(A2−1):
CH2=CR2−(R3)a−SO3X・・・(A2−1)
(式(A2−1)中、R2、R3、及びaは、式(A2)と同様であり、Xは、水素原子、又はアルカリ金属である。)
で表される単量体に由来する基であるのが好ましい。In this case, the functional group I of the resin (A) has the following formula (A2):
CH 2 = CR 2 - (R 3) a -CO-R 4 ··· (A2)
(In Formula (A2), R 2 is a hydrogen atom or a methyl group, R 3 is a divalent hydrocarbon group, a is 0 or 1, and R 4 is —OH, —O—R 5. Or —NH—R 5 , wherein R 5 is a hydrocarbon group substituted with one or more functional groups selected from the group consisting of a hydroxyl group, a cyano group, and a carboxy group.
Or the following formula (A2-1):
CH 2 = CR 2 - (R 3) a -SO 3 X ··· (A2-1)
(In Formula (A2-1), R 2 , R 3 , and a are the same as in Formula (A2), and X is a hydrogen atom or an alkali metal.)
It is preferably a group derived from a monomer represented by
上記式(A2)中、R3は2価の炭化水素基である。2価の炭化水素基の炭素原子数は、本発明の目的を阻害しない範囲で特に限定されない。(A)樹脂の入手や調製が容易である事から、R3としての2価の炭化水素基の炭素原子数は、1〜20が好ましく、1〜12がより好ましく、1〜10が特に好ましく、1〜6が最も好ましい。In the above formula (A2), R 3 is a divalent hydrocarbon group. The number of carbon atoms of the divalent hydrocarbon group is not particularly limited as long as the object of the present invention is not impaired. (A) The number of carbon atoms of the divalent hydrocarbon group as R 3 is preferably 1 to 20, more preferably 1 to 12, and particularly preferably 1 to 10 because it is easy to obtain and prepare the resin. 1 to 6 are most preferable.
R3としての2価の炭化水素基は、脂肪族基でも、芳香族基でも、脂肪族部分と芳香族部分とを含む炭化水素基であってもよい。2価の炭化水素基が、脂肪族基である場合、当該脂肪族基は、飽和脂肪族基でも不飽和脂肪族基でもよい。また、当該脂肪族基の構造は、直鎖状でも、分岐鎖状でも、環状でも、これらの構造の組み合わせであってもよい。The divalent hydrocarbon group as R 3 may be an aliphatic group, an aromatic group, or a hydrocarbon group including an aliphatic portion and an aromatic portion. When the divalent hydrocarbon group is an aliphatic group, the aliphatic group may be a saturated aliphatic group or an unsaturated aliphatic group. The structure of the aliphatic group may be linear, branched, cyclic, or a combination of these structures.
R3の好適な具体例としては、メチレン基、エタン−1,2−ジイル基、エタン−1,1−ジイル基、プロパン−1,3−ジイル基、プロパン−1,1−ジイル基、プロパン−2,2−ジイル基、n−ブタン−1,4−ジイル基、n−ペンタン−1,5−ジイル基、n−ヘキサン−1,6−ジイル基、n−ヘプタン−1,7−ジイル基、n−オクタン−1,8−ジイル基、n−ノナン−1,9−ジイル基、n−デカン−1,10−ジイル基、o−フェニレン基、m−フェニレン基、p−フェニレン基、ナフタレン−2,6−ジイル基、ナフタレン−2,7−ジイル基、ナフタレン−1,4−ジイル基、ビフェニル−4,4’−ジイル基等が挙げられる。Preferable specific examples of R 3 include methylene group, ethane-1,2-diyl group, ethane-1,1-diyl group, propane-1,3-diyl group, propane-1,1-diyl group, propane -2,2-diyl group, n-butane-1,4-diyl group, n-pentane-1,5-diyl group, n-hexane-1,6-diyl group, n-heptane-1,7-diyl Group, n-octane-1,8-diyl group, n-nonane-1,9-diyl group, n-decane-1,10-diyl group, o-phenylene group, m-phenylene group, p-phenylene group, Naphthalene-2,6-diyl group, naphthalene-2,7-diyl group, naphthalene-1,4-diyl group, biphenyl-4,4′-diyl group and the like can be mentioned.
R4は、−OH、−O−R5、又は−NH−R5であり、R5は、水酸基、シアノ基、及びカルボキシ基からなる群より選択される1以上の官能基で置換された炭化水素基である。
R5の基の主骨格を構成する炭化水素基は、直鎖状、分岐鎖状、又は環状の脂肪族基であってもよく、芳香族炭化水素基であってもよい。
直鎖状、分岐鎖状、又は環状の脂肪族基の炭素原子数は1〜20が好ましく、1〜12がより好ましい。
直鎖状、又は分岐鎖状の脂肪族基の好適な例としては、メチル基、エチル基、n−プロピル基、イソプロピル基、n−ブチル基、イソブチル基、sec−ブチル基、tert−ブチル基、n−ペンチル基、イソペンチル基、ネオペンチル基、sec−ペンチル基、tert−ペンチル基、n−ヘキシル基、n−ヘプチル基、n−オクチル基、n−ノニル基、n−デシル基等が挙げられる。
環状の脂肪族基の好適な例としては、シクロプロピル基、シクロブチル基、シクロペンチル基、シクロヘキシル基、シクロヘプチル基、及びシクロオクチル基等のシクロアルキル基や、アダマンタン、ノルボルナン、イソボルナン、トリシクロデカン、及びテトラシクロドデカン等のポリシクロアルカンから1個の水素原子を除いた基や、これらのポリシクロアルカンのC1−C4アルキル置換体から1個の水素原子を除いた基が挙げられる。
芳香族炭化水素基の好適な例としては、フェニル基、ナフチル基、アントラニル基、フェナントレニル基、及びビフェニリル基等が挙げられる。芳香族炭化水素基は、メチル基、エチル基等のC1−C4アルキル基で置換されていてもよい。R 4 is —OH, —O—R 5 , or —NH—R 5 , and R 5 is substituted with one or more functional groups selected from the group consisting of a hydroxyl group, a cyano group, and a carboxy group. It is a hydrocarbon group.
The hydrocarbon group constituting the main skeleton of the R 5 group may be a linear, branched or cyclic aliphatic group, or an aromatic hydrocarbon group.
1-20 are preferable and, as for carbon number of a linear, branched, or cyclic aliphatic group, 1-12 are more preferable.
Preferred examples of the linear or branched aliphatic group include a methyl group, an ethyl group, an n-propyl group, an isopropyl group, an n-butyl group, an isobutyl group, a sec-butyl group, and a tert-butyl group. N-pentyl group, isopentyl group, neopentyl group, sec-pentyl group, tert-pentyl group, n-hexyl group, n-heptyl group, n-octyl group, n-nonyl group, n-decyl group and the like. .
Suitable examples of the cyclic aliphatic group include cycloalkyl groups such as cyclopropyl group, cyclobutyl group, cyclopentyl group, cyclohexyl group, cycloheptyl group, and cyclooctyl group, adamantane, norbornane, isobornane, tricyclodecane, And a group obtained by removing one hydrogen atom from a polycycloalkane such as tetracyclododecane, and a group obtained by removing one hydrogen atom from a C1-C4 alkyl substituent of these polycycloalkanes.
Preferable examples of the aromatic hydrocarbon group include a phenyl group, a naphthyl group, an anthranyl group, a phenanthrenyl group, and a biphenylyl group. The aromatic hydrocarbon group may be substituted with a C1-C4 alkyl group such as a methyl group or an ethyl group.
式(A2)で表される単量体に由来する単位の特に好ましい具体例としては、下記a2−1〜a2−9の単位が挙げられる。下記a2−1〜a2−9の単位の中では、a2−1〜a2−4の単位がより好ましい。
式(A2−1)で表される単量体の好適な例としては、p−ビニルベンゼンスルホン酸、p−ビニルベンゼンスルホン酸ナトリウム、p−ビニルベンゼンスルホン酸カリウム、m−ビニルベンゼンスルホン酸、m−ビニルベンゼンスルホン酸ナトリウム、m−ビニルベンゼンスルホン酸カリウム、ビニルスルホン酸、ビニルスルホン酸ナトリウム、及びビニルスルホン酸カリウムが挙げられる。 Suitable examples of the monomer represented by the formula (A2-1) include p-vinylbenzenesulfonic acid, sodium p-vinylbenzenesulfonate, potassium p-vinylbenzenesulfonate, m-vinylbenzenesulfonic acid, Examples include sodium m-vinylbenzenesulfonate, potassium m-vinylbenzenesulfonate, vinylsulfonic acid, sodium vinylsulfonate, and potassium vinylsulfonate.
(A)樹脂が、官能基IIとして疎水性基を有する場合、官能基IIは下式(A3):
CH2=CR2−(CO−O)b−R6・・・(A3)
(式(A3)中、R2は水素原子又はメチル基であり、bは0又は1であり、R6は、フッ素化炭化水素基、又は下式(A4):
−SiR7R8−(−O−SiR7R8−)n−R9・・・(A4)
で表される基であり、R7、R8、及びR9は、それぞれ独立に炭素原子数1〜6の炭化水素基であり、nは0以上の整数である。)
で表される単量体に由来するのが好ましい。(A) When the resin has a hydrophobic group as the functional group II, the functional group II is represented by the following formula (A3):
CH 2 = CR 2 - (CO -O) b -R 6 ··· (A3)
(In formula (A3), R 2 is a hydrogen atom or a methyl group, b is 0 or 1, R 6 is a fluorinated hydrocarbon group, or the following formula (A4):
-SiR 7 R 8 - (- O -SiR 7 R 8 -) n -R 9 ··· (A4)
R 7 , R 8 , and R 9 are each independently a hydrocarbon group having 1 to 6 carbon atoms, and n is an integer of 0 or more. )
It is preferably derived from a monomer represented by
式(A3)中、R6がフッ素化炭化水素基である場合、当該フッ素化炭化水素基の主骨格を構成する炭化水素基は、前述のR5の基の主骨格を構成する炭化水素基と同様である。当該フッ素化炭化水素基は、炭化水素基が有する水素原子の全てがフッ素原子で置換された基でもよい。
R6としてのフッ素化炭化水素基の具体例としては、−CF3、−CF2CF3、−(CF2)2CF3、−(CF2)3CF3、−(CF2)4CF3、−(CF2)5CF3、−(CF2)6CF3、−(CF2)7CF3、−(CF2)8CF3、−(CF2)9CF3、−CH2CF3、−CH2CF2CF3、−CH2(CF2)2CF3、−CH2(CF2)3CF3、−CH2(CF2)4CF3、−CH2(CF2)5CF3、−CH2(CF2)6CF3、−CH2(CF2)7CF3、−CH2(CF2)8CF3、−CH2CH2CF3、−CH2CH2CF2CF3、−CH2CH2(CF2)2CF3、−CH2CH2(CF2)3CF3、−CH2CH2(CF2)4CF3、−CH2CH2(CF2)5CF3、−CH2CH2(CF2)6CF3、−CH2CH2(CF2)7CF3、−CH2CF2H、−CH2CF2CF2H、−CH2(CF2)2CF2H、−CH2(CF2)3CF2H、−CH2(CF2)4CF2H、−CH2(CF2)5CF2H、−CH2(CF2)6CF2H、−CH2(CF2)7CF2H、−CH2(CF2)8CF2H、−CH2CH2CF2H、−CH2CH2CF2CF2H、−CH2CH2(CF2)2CF2H、−CH2CH2(CF2)3CF2H、−CH2CH2(CF2)4CF2H、−CH2CH2(CF2)5CF2H、−CH2CH2(CF2)6CF2H、−CH2CH2(CF2)7CF2H、及び−CH(CF3)2等の鎖状フッ素化アルキル基;ペンタフルオロフェニル基、o−トリフルオロメチルフェニル基、m−トリフルオロメチルフェニル基、p−トリフルオロメチルフェニル基等のフッ素化芳香族炭化水素基;オクタフルオロアダマンチル基等のフッ素化脂環式基が挙げられる。In the formula (A3), when R 6 is a fluorinated hydrocarbon group, the hydrocarbon group constituting the main skeleton of the fluorinated hydrocarbon group is the hydrocarbon group constituting the main skeleton of the group of R 5 described above. It is the same. The fluorinated hydrocarbon group may be a group in which all hydrogen atoms of the hydrocarbon group are substituted with fluorine atoms.
Specific examples of the fluorinated hydrocarbon group as R 6 include —CF 3 , —CF 2 CF 3 , — (CF 2 ) 2 CF 3 , — (CF 2 ) 3 CF 3 , — (CF 2 ) 4 CF 3, - (CF 2) 5 CF 3, - (CF 2) 6 CF 3, - (CF 2) 7 CF 3, - (CF 2) 8 CF 3, - (CF 2) 9 CF 3, -CH 2 CF 3 , —CH 2 CF 2 CF 3 , —CH 2 (CF 2 ) 2 CF 3 , —CH 2 (CF 2 ) 3 CF 3 , —CH 2 (CF 2 ) 4 CF 3 , —CH 2 (CF 2 ) 5 CF 3 , —CH 2 (CF 2 ) 6 CF 3 , —CH 2 (CF 2 ) 7 CF 3 , —CH 2 (CF 2 ) 8 CF 3 , —CH 2 CH 2 CF 3 , —CH 2 CH 2 CF 2 CF 3 , —CH 2 CH 2 (CF 2 ) 2 CF 3 , — CH 2 CH 2 (CF 2) 3 CF 3, -CH 2 CH 2 (CF 2) 4 CF 3, -CH 2 CH 2 (CF 2) 5 CF 3, -CH 2 CH 2 (CF 2) 6 CF 3 , —CH 2 CH 2 (CF 2 ) 7 CF 3 , —CH 2 CF 2 H, —CH 2 CF 2 CF 2 H, —CH 2 (CF 2 ) 2 CF 2 H, —CH 2 (CF 2 ) 3 CF 2 H, -CH 2 (CF 2) 4 CF 2 H, -CH 2 (CF 2) 5 CF 2 H, -CH 2 (CF 2) 6 CF 2 H, -CH 2 (CF 2) 7 CF 2 H, —CH 2 (CF 2 ) 8 CF 2 H, —CH 2 CH 2 CF 2 H, —CH 2 CH 2 CF 2 CF 2 H, —CH 2 CH 2 (CF 2 ) 2 CF 2 H, —CH 2 CH 2 (CF 2 ) 3 CF 2 H, —CH 2 CH 2 (C F 2 ) 4 CF 2 H, —CH 2 CH 2 (CF 2 ) 5 CF 2 H, —CH 2 CH 2 (CF 2 ) 6 CF 2 H, —CH 2 CH 2 (CF 2 ) 7 CF 2 H, And a chain fluorinated alkyl group such as —CH (CF 3 ) 2 ; a fluorinated aromatic group such as a pentafluorophenyl group, an o-trifluoromethylphenyl group, an m-trifluoromethylphenyl group, and a p-trifluoromethylphenyl group. Group hydrocarbon group; fluorinated alicyclic group such as octafluoroadamantyl group.
式(A3)中、R6が式(A4)で表される基である場合、R7、R8、及びR9は、それぞれ独立に、メチル基、エチル基、又はフェニル基であるのが好ましく、R7、R8、及びR9が全てメチル基であるのがより好ましい。
式(A4)中、nの上限は、本発明の目的を阻害しない範囲で特に限定されない。nは、0以上35以下の整数であるのが好ましく、0以上10以下の整数であるのがより好ましい。In the formula (A3), when R 6 is a group represented by the formula (A4), R 7 , R 8 , and R 9 are each independently a methyl group, an ethyl group, or a phenyl group. Preferably, R 7 , R 8 and R 9 are all methyl groups.
In formula (A4), the upper limit of n is not particularly limited as long as the object of the present invention is not impaired. n is preferably an integer of 0 or more and 35 or less, and more preferably an integer of 0 or more and 10 or less.
式(A3)で表される単量体に由来する、疎水性基を有する単位の特に好ましい具体例としては、下記a3−1〜a3−24の単位が挙げられる。下記の単位の中では、a3−8、a3−12、a3−18、a3−19、及びa3−22の単位がより好ましい。
また、(A)樹脂が、官能基IIとして親水性基を有する場合、官能基IIは下式(A5):
CH2=CR2−CO−NH−R1・・・(A5)
(式(A5)中、R1は、アミノ基、スルホン酸基、及び水酸基からなる群より選択される1以上の基で置換された炭素原子数1〜4のアルキル基、又は水素原子であり、R2は水素原子又はメチル基である。)
で表される単量体に由来するのが好ましい。When (A) the resin has a hydrophilic group as the functional group II, the functional group II is represented by the following formula (A5):
CH 2 = CR 2 -CO-NH -R 1 ··· (A5)
(In Formula (A5), R 1 is an alkyl group having 1 to 4 carbon atoms substituted with one or more groups selected from the group consisting of an amino group, a sulfonic acid group, and a hydroxyl group, or a hydrogen atom. R 2 is a hydrogen atom or a methyl group.)
It is preferably derived from a monomer represented by
式(A5)中、R1については、前述した通りである。In formula (A5), R 1 is as described above.
式(A5)で表される単量体に由来する、親水性基を有する単位の特に好ましい具体例としては、下記a5−1〜a5−5の単位が挙げられる。下記の単位の中では、a5−1〜a5−4の単位がより好ましい。
(A)樹脂が不飽和結合を有する単量体の重合体である場合、かかる重合体は、本発明の目的を阻害しない範囲で、前述の式(A2)で表される単量体に由来する単位、式(A3)で表される単量体に由来する単位、及び式(A5)で表される単量体に由来する単位以外のその他の構成単位を含んでいてもよい。 (A) When the resin is a polymer of a monomer having an unsaturated bond, the polymer is derived from the monomer represented by the formula (A2) as long as the object of the present invention is not impaired. Other structural units other than the unit derived from the monomer represented by Formula (A3) and the unit derived from the monomer represented by Formula (A5) may be included.
その他の構成単位としては、例えば、(メタ)アクリル酸メチル、(メタ)アクリル酸エチル、(メタ)アクリル酸イソプロピル、(メタ)アクリル酸−n−プロピル、(メタ)アクリル酸−n−ブチル、(メタ)アクリル酸イソブチル、(メタ)アクリル酸−tert−ブチル、(メタ)アクリル酸−n−ペンチル、(メタ)アクリル酸イソペンチル、(メタ)アクリル酸フェニル、N−メチル(メタ)アクリルアミド、N−エチル(メタ)アクリルアミド、N−n−プロピル(メタ)アクリルアミド、N−イソプロピル(メタ)アクリルアミド、N−n−ブチル(メタ)アクリルアミド、N−n−ペンチル(メタ)アクリルアミド、N−イソペンチル(メタ)アクリルアミド、N−フェニル(メタ)アクリルアミド、N,N−ジメチル(メタ)アクリルアミド、N,N−ジエチル(メタ)アクリルアミド、N,N−ジ−n−プロピル(メタ)アクリルアミド、N,N−ジ−n−ブチル(メタ)アクリルアミド、N,N−ジ−n−ペンチル(メタ)アクリルアミド、スチレン、α−メチルスチレン、β−メチルスチレン、o−メチルスチレン、m−メチルスチレン、p−メチルスチレン、及びクロルスチレン等の単量体に由来する構成単位が挙げられる。 Other structural units include, for example, methyl (meth) acrylate, ethyl (meth) acrylate, isopropyl (meth) acrylate, (meth) acrylate-n-propyl, (meth) acrylate-n-butyl, (Meth) acrylic acid isobutyl, (meth) acrylic acid-tert-butyl, (meth) acrylic acid-n-pentyl, (meth) acrylic acid isopentyl, (meth) acrylic acid phenyl, N-methyl (meth) acrylamide, N -Ethyl (meth) acrylamide, Nn-propyl (meth) acrylamide, N-isopropyl (meth) acrylamide, Nn-butyl (meth) acrylamide, Nn-pentyl (meth) acrylamide, N-isopentyl (meta ) Acrylamide, N-phenyl (meth) acrylamide, N, N-dimethyl ( T) acrylamide, N, N-diethyl (meth) acrylamide, N, N-di-n-propyl (meth) acrylamide, N, N-di-n-butyl (meth) acrylamide, N, N-di-n- Examples include structural units derived from monomers such as pentyl (meth) acrylamide, styrene, α-methylstyrene, β-methylstyrene, o-methylstyrene, m-methylstyrene, p-methylstyrene, and chlorostyrene.
(A)樹脂が不飽和結合を有する単量体の重合体である場合、かかる重合体に含まれる全構成単位中の式(A2)で表される単量体に由来する構成単位のモル比率は、0.1〜50モル%が好ましく、1〜20モル%がより好ましく、1〜15モル%が特に好ましい。 (A) When the resin is a polymer of a monomer having an unsaturated bond, the molar ratio of the structural unit derived from the monomer represented by the formula (A2) in all the structural units contained in the polymer Is preferably 0.1 to 50 mol%, more preferably 1 to 20 mol%, and particularly preferably 1 to 15 mol%.
(A)樹脂が不飽和結合を有する単量体の重合体である場合、かかる重合体に含まれる全構成単位中の式(A3)又は(A5)で表される単量体に由来する構成単位のモル比率は、50〜99.9モル%が好ましく、60〜99モル%がより好ましく、70〜99モル%が特に好ましい。
ただし、式(A5)で表される単量体に由来する構成単位が水酸基、シアノ基、カルボキシ基のいずれか1つの基を含む場合、重合体に含まれる全構成単位中の式(A5)で表される単量体に由来する構成単位の比率は100%であってもよい。(A) When resin is a polymer of the monomer which has an unsaturated bond, the structure derived from the monomer represented by Formula (A3) or (A5) in all the structural units contained in this polymer The molar ratio of the units is preferably 50 to 99.9 mol%, more preferably 60 to 99 mol%, and particularly preferably 70 to 99 mol%.
However, when the structural unit derived from the monomer represented by the formula (A5) contains any one of a hydroxyl group, a cyano group, and a carboxy group, the formula (A5) in all the structural units contained in the polymer The ratio of the structural unit derived from the monomer represented by may be 100%.
また、下記式(A6):
A1−SiR10R11−O−(−SiR10A2−O−)p−SiR10R11A3
・・・(A6)
(式(A6)中、R10及びR11は、それぞれ独立に炭素原子数1〜6の炭化水素基であり、A1、A2、及びA3は、それぞれ独立に、水酸基、シアノ基、カルボキシ基、又は炭素原子数1〜6の炭化水素基であり、A1、A2、及びA3の少なくとも1つは水酸基、シアノ基、又はカルボキシ基であり、pは0以上の整数である。)
で表されるシロキサン化合物も、(A)樹脂として好適である。式(A6)で表されるシロキサン化合物は、疎水性基としてシロキサン基を有する(A)樹脂に該当する。
式(A6)に、それぞれ複数存在するR10は、同一であっても異なってもよい。また、式(A6)に、それぞれ複数存在するR11は、同一であっても異なってもよい。Moreover, following formula (A6):
A 1 -SiR 10 R 11 -O - (- SiR 10 A 2 -O-) p -SiR 10 R 11 A 3
... (A6)
(In Formula (A6), R 10 and R 11 are each independently a hydrocarbon group having 1 to 6 carbon atoms, and A 1 , A 2 , and A 3 are each independently a hydroxyl group, a cyano group, A carboxy group or a hydrocarbon group having 1 to 6 carbon atoms, wherein at least one of A 1 , A 2 and A 3 is a hydroxyl group, a cyano group or a carboxy group, and p is an integer of 0 or more. .)
Is also suitable as the resin (A). The siloxane compound represented by the formula (A6) corresponds to the (A) resin having a siloxane group as a hydrophobic group.
A plurality of R 10 present in the formula (A6) may be the same or different. In the formula (A6), a plurality of R 11 s may be the same or different.
R10及びR11は、それぞれ独立に、メチル基、エチル基、又はフェニル基であるのが好ましく、R10及びR11が全てメチル基であるのがより好ましい。
また、A1、A2、及びA3が、炭素原子数1〜6の炭化水素基である場合、A1、A2、及びA3は、それぞれ独立に、メチル基、エチル基、又はフェニル基であるのが好ましく、メチル基であるのがより好ましい。R 10 and R 11 are each independently preferably a methyl group, an ethyl group, or a phenyl group, and more preferably, R 10 and R 11 are all methyl groups.
In addition, when A 1 , A 2 , and A 3 are hydrocarbon groups having 1 to 6 carbon atoms, A 1 , A 2 , and A 3 are each independently a methyl group, an ethyl group, or a phenyl group It is preferably a group, and more preferably a methyl group.
処理液に含まれる(A)樹脂の量は、本発明の目的を阻害しない範囲で特に限定されず、処理液の塗布性等を勘案して適宜定められる。典型的には、処理液中の(A)樹脂の量は、処理液中の(A)樹脂の量と、後述する(C)溶媒の量との関係は、以下の関係である量が好ましい。
処理液中の樹脂の質量を100質量部とする場合に、後述する(C)溶媒の量が100〜100000質量部であるのが好ましく、500〜80000質量部であるのがより好ましく、1000〜60000質量部であるのが特に好ましい。The amount of the resin (A) contained in the treatment liquid is not particularly limited as long as the object of the present invention is not impaired, and is appropriately determined in consideration of the application property of the treatment liquid. Typically, the amount of the (A) resin in the treatment liquid is preferably the following relationship between the amount of the (A) resin in the treatment liquid and the amount of the (C) solvent described later. .
When the mass of the resin in the treatment liquid is 100 parts by mass, the amount of the solvent (C) described later is preferably 100 to 100000 parts by mass, more preferably 500 to 80000 parts by mass, and 1000 to 1000 parts by mass. The amount is particularly preferably 60000 parts by mass.
〔(B)光酸発生剤〕
処理液は、(B)光酸発生剤を含む。(B)光酸発生剤は、光の作用によりpKa1以下の強酸を発生させる。なお、pKaは水中での値である。
(B)光発生剤が発生させる強酸は、(A)樹脂が有する官能基Iに作用することで、(A)樹脂の被処理体の表面への付着又は結合を促進させる。
(B)光酸発生剤の種類は、光の作用によりpKaが1以下である強酸を発生させる化合物であれば特に限定されない。(B)光酸発生剤は、2種以上を組み合わせて用いることができる。[(B) Photoacid generator]
The treatment liquid contains (B) a photoacid generator. (B) The photoacid generator generates a strong acid of pKa1 or less by the action of light. Note that pKa is a value in water.
(B) The strong acid generated by the photogenerating agent acts on the functional group I of the (A) resin, thereby promoting (A) adhesion or bonding of the resin to the surface of the object to be processed.
The type of (B) photoacid generator is not particularly limited as long as it is a compound that generates a strong acid having a pKa of 1 or less by the action of light. (B) A photo-acid generator can be used in combination of 2 or more types.
(B)光酸発生剤が発生させる強酸の好適な例としては、フッ素化脂肪族カルボン酸(例えばトリフルオロ酢酸等)、フルオロスルホン酸、炭素原子数1〜30のアルカンスルホン酸(例えばメタンスルホン酸、ドデカンスルホン酸等)、アリールスルホン酸(例えばベンゼンスルホン酸、p−トルエンスルホン酸等)、炭素原子数1〜30のフルオロアルカンスルホン酸(例えばトリフルオロメタンスルホン酸、ペンタフルオロエタンスルホン酸、ヘプタフルオロプロパンスルホン酸、ノナフルオロブタンスルホン酸、ウンデカフルオロペンタンスルホン酸及びトリデカフルオロヘキサンスルホン酸)、ビススルホニルイミド化合物、2つのスルホニル基がフルオロアルキレン基で連結された環状スルホニルイミド化合物、及びN−アシルフルオロアルカンスルホン酸アミド等が挙げられる。 (B) As a suitable example of the strong acid which a photo-acid generator generates, fluorinated aliphatic carboxylic acid (for example, trifluoroacetic acid etc.), fluorosulfonic acid, C1-C30 alkanesulfonic acid (for example, methane sulfone) Acid, dodecanesulfonic acid, etc.), arylsulfonic acid (eg, benzenesulfonic acid, p-toluenesulfonic acid, etc.), fluoroalkanesulfonic acid having 1 to 30 carbon atoms (eg, trifluoromethanesulfonic acid, pentafluoroethanesulfonic acid, hepta) Fluoropropanesulfonic acid, nonafluorobutanesulfonic acid, undecafluoropentanesulfonic acid and tridecafluorohexanesulfonic acid), bissulfonylimide compound, cyclic sulfonylimide compound in which two sulfonyl groups are linked by a fluoroalkylene group, and N -Acyl Le Oro alkanesulfonic acid amide.
これらの強酸が、フルオロアルキル基、又はフルオロアルキレン基を含む場合、これらの基は、部分的にフッ素化されたフルオロアルキル基、又はフルオロアルキレン基であってもよく、完全にフッ素化されたパーフルオロアルキル基、又はパーフルオロアルキレン基であってもよい。 When these strong acids contain fluoroalkyl groups or fluoroalkylene groups, these groups may be partially fluorinated fluoroalkyl groups or fluoroalkylene groups and are fully fluorinated perfluorocarbon groups. It may be a fluoroalkyl group or a perfluoroalkylene group.
これらの強酸の中では、フルオロスルホン酸、炭素原子数1〜30のアルカンスルホン酸、炭素原子数1〜30のフルオロアルカンスルホン酸、ビス(フルオロアルキルスルホニル)イミド酸、2つのスルホニル基がフルオロアルキレン基で連結された環状スルホンイミド酸、及びN−アシルフルオロアルカンスルホン酸アミドが好ましく、炭素原子数1〜30のフルオロアルカンスルホン酸、ビススルホニルイミド化合物、2つのスルホニル基がフルオロアルキレン基で連結された環状スルホニルイミド化合物、及びN−アシルフルオロアルカンスルホン酸アミドが好ましい。 Among these strong acids, fluorosulfonic acid, alkanesulfonic acid having 1 to 30 carbon atoms, fluoroalkanesulfonic acid having 1 to 30 carbon atoms, bis (fluoroalkylsulfonyl) imidic acid, and two sulfonyl groups are fluoroalkylene. Preferred are cyclic sulfonimidic acid linked by a group and N-acylfluoroalkanesulfonic acid amide, fluoroalkanesulfonic acid having 1 to 30 carbon atoms, bissulfonylimide compound, and two sulfonyl groups linked by a fluoroalkylene group. Cyclic sulfonylimide compounds and N-acylfluoroalkanesulfonic acid amides are preferred.
炭素原子数1〜30のフルオロアルカンスルホン酸としては、トリフルオロメタンスルホン酸、ペンタフルオロエタンスルホン酸、ヘプタフルオロプロパンスルホン酸、及びノナフルオロブタンスルホン酸等が好ましい。 As the fluoroalkanesulfonic acid having 1 to 30 carbon atoms, trifluoromethanesulfonic acid, pentafluoroethanesulfonic acid, heptafluoropropanesulfonic acid, nonafluorobutanesulfonic acid and the like are preferable.
ビススルホニルイミド化合物としては、下式(B1)で表される化合物が好ましい。
電子吸引性基で置換された炭化水素基としては、フッ素化アルキル基、ニトロ基を有するアリール基が好ましい。フッ素化アルキル基は、直鎖状でも、分岐鎖状でも、環状でもよい。フッ素化アルキル基は、完全にフッ素化されたパーフルオロアルキル基であるのが好ましい。ニトロ基を有するアリール基としては、o−ニトロフェニル基、m−ニトロフェニル基、及びp−ニトロフェニル基が好ましく、p−ニトロフェニル基がより好ましい。As the bissulfonylimide compound, a compound represented by the following formula (B1) is preferable.
The hydrocarbon group substituted with an electron-withdrawing group is preferably an aryl group having a fluorinated alkyl group or a nitro group. The fluorinated alkyl group may be linear, branched or cyclic. The fluorinated alkyl group is preferably a fully fluorinated perfluoroalkyl group. As an aryl group having a nitro group, an o-nitrophenyl group, an m-nitrophenyl group, and a p-nitrophenyl group are preferable, and a p-nitrophenyl group is more preferable.
式(B1)で表される化合物の好適な具体例としては、下式の化合物が挙げられる。
2つのスルホニル基がフルオロアルキレン基で連結された環状スルホニルイミド化合物としては、下式(B2)で表される化合物が好ましい。
式(B2)で表される化合物の好適な具体例としては、下式の化合物が挙げられる。
N−アシルフルオロアルカンスルホン酸アミドとしては、下式(B3)で表される化合物が好ましい。
X5は、炭化水素基である。炭化水素基について、前述のR5の基の主骨格を構成する炭化水素基と同様である。As the N-acylfluoroalkanesulfonic acid amide, a compound represented by the following formula (B3) is preferable.
X 5 is a hydrocarbon group. The hydrocarbon group is the same as the hydrocarbon group constituting the main skeleton of the aforementioned R 5 group.
式(B3)で表される化合物の好適な具体例としては、下式の化合物が挙げられる。
(B)光酸発生剤としては、以上説明した好ましい強酸を発生させることができる化合物が好ましい。
かかる化合物としては、上記の強酸に由来するアニオンと、オニウムイオンとからなるオニウム塩化合物が好ましい。オニウムイオンとしては、ヨードニウムイオン及びスルホニウムイオンが好ましく、スルホニウムイオンがより好ましい。(B) As a photo-acid generator, the compound which can generate | occur | produce the preferable strong acid demonstrated above is preferable.
As such a compound, an onium salt compound comprising an anion derived from the above strong acid and an onium ion is preferable. As an onium ion, an iodonium ion and a sulfonium ion are preferable, and a sulfonium ion is more preferable.
オニウムイオンの好適な例としては、トリフェニルスルホニウム、トリ−p−トリルスルホニウム、4−(フェニルチオ)フェニルジフェニルスルホニウム、ビス[4−(ジフェニルスルホニオ)フェニル]スルフィド、ビス〔4−{ビス[4−(2−ヒドロキシエトキシ)フェニル]スルホニオ}フェニル〕スルフィド、ビス{4−[ビス(4−フルオロフェニル)スルホニオ]フェニル}スルフィド、4−(4−ベンゾイル−2−クロロフェニルチオ)フェニルビス(4−フルオロフェニル)スルホニウム、7−イソプロピル−9−オキソ−10−チア−9,10−ジヒドロアントラセン−2−イルジ−p−トリルスルホニウム、7−イソプロピル−9−オキソ−10−チア−9,10−ジヒドロアントラセン−2−イルジフェニルスルホニウム、2−[(ジフェニル)スルホニオ]チオキサントン、4−[4−(4−tert−ブチルベンゾイル)フェニルチオ]フェニルジ−p−トリルスルホニウム、4−(4−ベンゾイルフェニルチオ)フェニルジフェニルスルホニウム、ジフェニルフェナシルスルホニウム、4−ヒドロキシフェニルメチルベンジルスルホニウム、2−ナフチルメチル(1−エトキシカルボニル)エチルスルホニウム、4−ヒドロキシフェニルメチルフェナシルスルホニウム、フェニル[4−(4−ビフェニルチオ)フェニル]4−ビフェニルルスルホニウム、フェニル[4−(4−ビフェニルチオ)フェニル]3−ビフェニルスルホニウム、[4−(4−アセトフェニルチオ)フェニル]ジフェニルスルホニウム、オクタデシルメチルフェナシルスルホニウム、ジフェニルヨードニウム、ジ−p−トリルヨードニウム、ビス(4−ドデシルフェニル)ヨードニウム、ビス(4−メトキシフェニル)ヨードニウム、(4−オクチルオキシフェニル)フェニルヨードニウム、ビス(4−デシルオキシ)フェニルヨードニウム、4−(2−ヒドロキシテトラデシルオキシ)フェニルフェニルヨードニウム、4−イソプロピルフェニル(p−トリル)ヨードニウム、又は4−イソブチルフェニル(p−トリル)ヨードニウム、等が挙げられる。 Preferable examples of onium ions include triphenylsulfonium, tri-p-tolylsulfonium, 4- (phenylthio) phenyldiphenylsulfonium, bis [4- (diphenylsulfonio) phenyl] sulfide, bis [4- {bis [4 -(2-hydroxyethoxy) phenyl] sulfonio} phenyl] sulfide, bis {4- [bis (4-fluorophenyl) sulfonio] phenyl} sulfide, 4- (4-benzoyl-2-chlorophenylthio) phenylbis (4- Fluorophenyl) sulfonium, 7-isopropyl-9-oxo-10-thia-9,10-dihydroanthracen-2-yldi-p-tolylsulfonium, 7-isopropyl-9-oxo-10-thia-9,10-dihydro Anthracen-2-yldiphenylsulfur 2-[(diphenyl) sulfonio] thioxanthone, 4- [4- (4-tert-butylbenzoyl) phenylthio] phenyldi-p-tolylsulfonium, 4- (4-benzoylphenylthio) phenyldiphenylsulfonium, diphenylphenacyl Sulfonium, 4-hydroxyphenylmethylbenzylsulfonium, 2-naphthylmethyl (1-ethoxycarbonyl) ethylsulfonium, 4-hydroxyphenylmethylphenacylsulfonium, phenyl [4- (4-biphenylthio) phenyl] 4-biphenylylsulfonium, Phenyl [4- (4-biphenylthio) phenyl] 3-biphenylsulfonium, [4- (4-acetophenylthio) phenyl] diphenylsulfonium, octadecylmethylphenacylsulfur Ni, diphenyliodonium, di-p-tolyliodonium, bis (4-dodecylphenyl) iodonium, bis (4-methoxyphenyl) iodonium, (4-octyloxyphenyl) phenyliodonium, bis (4-decyloxy) phenyliodonium, 4 -(2-Hydroxytetradecyloxy) phenylphenyliodonium, 4-isopropylphenyl (p-tolyl) iodonium, 4-isobutylphenyl (p-tolyl) iodonium, and the like.
また、下式(B4)で表されるスルホニウムイオンも、オニウム塩を構成するオニウムイオンとして好ましい。 Moreover, the sulfonium ion represented by the following formula (B4) is also preferable as the onium ion constituting the onium salt.
上記式(B4)中、Rb1はそれぞれ独立に水素原子、アルキル、ヒドロキシ、アルコキシ、アルキルカルボニル、アルキルカルボニルオキシ、アルキルオキシカルボニル、ハロゲン原子、置換基を有してもよいアリール、アリールカルボニル、からなる群より選ばれる基を表す。X6は下記式(B5)で表される構造である。In the above formula (B4), R b1 is independently a hydrogen atom, alkyl, hydroxy, alkoxy, alkylcarbonyl, alkylcarbonyloxy, alkyloxycarbonyl, halogen atom, aryl optionally having substituent (s), arylcarbonyl, Represents a group selected from the group consisting of X 6 is a structure represented by the following formula (B5).
上記式(B5)中、X7は炭素原子数1〜8のアルキレン基、炭素原子数6〜20のアリーレン基、又は炭素原子数8〜20の複素環化合物の2価の基を表し、X7は炭素原子数1〜8のアルキル、炭素原子数1〜8のアルコキシ、炭素原子数6〜10のアリール、ヒドロキシ、シアノ、ニトロの各基、及びハロゲンからなる群より選ばれる少なくとも1種で置換されていてもよい。X8は−O−、−S−、−SO−、−SO2−、−NH−、−NRb2−、−CO−、−COO−、−CONH−、炭素原子数1〜3のアルキレン基、又はフェニレン基を表す。hは括弧内の構造の繰り返し単位数を表す。h+1個のX6及びh個のX7はそれぞれ同一であっても異なっていてもよい。Rb2は炭素原子数1〜5のアルキル基又は炭素原子数6〜10のアリール基である。In the above formula (B5), X 7 represents a divalent group of an alkylene group having 1 to 8 carbon atoms, an arylene group having 6 to 20 carbon atoms, or a heterocyclic compound having 8 to 20 carbon atoms, 7 is at least one selected from the group consisting of alkyl having 1 to 8 carbon atoms, alkoxy having 1 to 8 carbon atoms, aryl having 6 to 10 carbon atoms, hydroxy, cyano, nitro groups, and halogen. May be substituted. X 8 is —O—, —S—, —SO—, —SO 2 —, —NH—, —NR b2 —, —CO—, —COO—, —CONH—, an alkylene group having 1 to 3 carbon atoms. Or a phenylene group. h represents the number of repeating units in the structure in parentheses. The h + 1 X 6 and the h X 7 may be the same or different. R b2 is an alkyl group having 1 to 5 carbon atoms or an aryl group having 6 to 10 carbon atoms.
上記式(B4)で表されるスルホニウムイオンの具体例としては、4−(フェニルチオ)フェニルジフェニルスルホニウム、4−(4−ベンゾイル−2−クロロフェニルチオ)フェニルビス(4−フルオロフェニル)スルホニウム、4−(4−ベンゾイルフェニルチオ)フェニルジフェニルスルホニウム、フェニル[4−(4−ビフェニルチオ)フェニル]4−ビフェニルスルホニウム、フェニル[4−(4−ビフェニルチオ)フェニル]3−ビフェニルスルホニウム、[4−(4−アセトフェニルチオ)フェニル]ジフェニルスルホニウム、ジフェニル[4−(p−ターフェニルチオ)フェニル]ジフェニルスルホニウムが挙げられる。 Specific examples of the sulfonium ion represented by the above formula (B4) include 4- (phenylthio) phenyldiphenylsulfonium, 4- (4-benzoyl-2-chlorophenylthio) phenylbis (4-fluorophenyl) sulfonium, 4- (4-benzoylphenylthio) phenyldiphenylsulfonium, phenyl [4- (4-biphenylthio) phenyl] 4-biphenylsulfonium, phenyl [4- (4-biphenylthio) phenyl] 3-biphenylsulfonium, [4- (4 -Acetophenylthio) phenyl] diphenylsulfonium, diphenyl [4- (p-terphenylthio) phenyl] diphenylsulfonium.
また、ナフタレン環を有するカチオン部と、上記の強酸に由来するアニオン部とからなるオニウム塩も(B)光酸発生剤として好ましい。この「ナフタレン環を有する」とは、ナフタレンに由来する構造を有することを意味し、少なくとも2つの環の構造と、それらの芳香族性が維持されていることを意味する。このナフタレン環は炭素原子数1〜6の直鎖状又は分岐状のアルキル基、水酸基、炭素原子数1〜6の直鎖状又は分岐状のアルコキシ基等の置換基を有していてもよい。ナフタレン環に由来する構造は、1価基(遊離原子価が1つ)であっても、2価基(遊離原子価が2つ)以上であってもよいが、1価基であることが望ましい(ただし、このとき、上記置換基と結合する部分を除いて遊離原子価を数えるものとする)。ナフタレン環の数は1〜3が好ましい。 Moreover, the onium salt which consists of a cation part which has a naphthalene ring, and the anion part derived from said strong acid is also preferable as (B) photo-acid generator. This “having a naphthalene ring” means having a structure derived from naphthalene, and means that at least two ring structures and their aromaticity are maintained. The naphthalene ring may have a substituent such as a linear or branched alkyl group having 1 to 6 carbon atoms, a hydroxyl group, or a linear or branched alkoxy group having 1 to 6 carbon atoms. . The structure derived from the naphthalene ring may be a monovalent group (one free valence) or a divalent group (two free valences) or more, but may be a monovalent group. Desirable (however, at this time, the free valence is counted excluding the portion bonded to the substituent). The number of naphthalene rings is preferably 1 to 3.
ナフタレン環を有するオニウムイオンとしては、下記式(B6)で表されるオニウムイオンが好ましい。 As the onium ion having a naphthalene ring, an onium ion represented by the following formula (B6) is preferable.
上記式(B6)中、Rb3、Rb4、Rb5のうち少なくとも1つは下記式(B7)で表される基を表し、残りは炭素原子数1〜6の直鎖状若しくは分岐状のアルキル基、置換基を有していてもよいフェニル基、水酸基、又は炭素原子数1〜6の直鎖状若しくは分岐状のアルコキシ基を表す。あるいは、Rb3、Rb4、Rb5のうちの1つが下記式(B7)で表される基であり、残りの2つはそれぞれ独立に炭素原子数1〜6の直鎖状又は分岐状のアルキレン基であり、これらの末端が結合して環状になっていてもよい。In the above formula (B6), at least one of R b3 , R b4 and R b5 represents a group represented by the following formula (B7), and the rest is a linear or branched group having 1 to 6 carbon atoms. It represents an alkyl group, a phenyl group which may have a substituent, a hydroxyl group, or a linear or branched alkoxy group having 1 to 6 carbon atoms. Alternatively, one of R b3 , R b4 , and R b5 is a group represented by the following formula (B7), and the remaining two are each independently a linear or branched group having 1 to 6 carbon atoms. It is an alkylene group, and these terminals may be bonded to form a ring.
上記式(B7)中、Rb6、Rb7は、それぞれ独立に水酸基、炭素原子数1〜6の直鎖状若しくは分岐状のアルコキシ基、又は炭素原子数1〜6の直鎖状若しくは分岐状のアルキル基を表し、Rb8は、単結合又は置換基を有していてもよい炭素原子数1〜6の直鎖状若しくは分岐状のアルキレン基を表す。l及びmは、それぞれ独立に0〜2の整数を表し、l+mは3以下である。ただし、Rb6が複数存在する場合、それらは互いに同じであっても異なっていてもよい。また、Rb7が複数存在する場合、それらは互いに同じであっても異なっていてもよい。In the formula (B7), R b6 and R b7 are each independently a hydroxyl group, a linear or branched alkoxy group having 1 to 6 carbon atoms, or a linear or branched group having 1 to 6 carbon atoms. R b8 represents a linear or branched alkylene group having 1 to 6 carbon atoms which may have a single bond or a substituent. l and m each independently represent an integer of 0 to 2, and l + m is 3 or less. However, when two or more Rb6 exists, they may be mutually the same or different. Moreover, when two or more Rb7 exists, they may mutually be same or different.
上記Rb3、Rb4、Rb5のうち上記式(B7)で表される基の数は、化合物の安定性の点から好ましくは1つであり、残りは炭素原子数1〜6の直鎖状又は分岐状のアルキレン基であり、これらの末端が結合して環状になっていてもよい。この場合、上記2つのアルキレン基は、硫黄原子を含めて3〜9員環を構成する。環を構成する原子(硫黄原子を含む)の数は、好ましくは5〜6である。Of the R b3 , R b4 , and R b5 , the number of groups represented by the formula (B7) is preferably one from the viewpoint of the stability of the compound, and the rest is a straight chain having 1 to 6 carbon atoms. Or branched alkylene groups, and these ends may be bonded to form a ring. In this case, the two alkylene groups constitute a 3- to 9-membered ring including a sulfur atom. The number of atoms (including sulfur atoms) constituting the ring is preferably 5-6.
また、上記アルキレン基が有していてもよい置換基としては、酸素原子(この場合、アルキレン基を構成する炭素原子とともにカルボニル基を形成する)、水酸基等が挙げられる。 Examples of the substituent that the alkylene group may have include an oxygen atom (in this case, a carbonyl group is formed together with a carbon atom constituting the alkylene group), a hydroxyl group, and the like.
また、フェニル基が有していてもよい置換基としては、水酸基、炭素原子数1〜6の直鎖状又は分岐状のアルコキシ基、炭素原子数1〜6の直鎖状又は分岐状のアルキル基等が挙げられる。 In addition, examples of the substituent that the phenyl group may have include a hydroxyl group, a linear or branched alkoxy group having 1 to 6 carbon atoms, and a linear or branched alkyl group having 1 to 6 carbon atoms. Groups and the like.
これらのカチオン部として好適なものとしては、下記式(B8)、(B9)で表されるもの等を挙げることができ、特に下記式(B9)で表される構造が好ましい。 Suitable examples of these cationic moieties include those represented by the following formulas (B8) and (B9), and the structure represented by the following formula (B9) is particularly preferred.
処理液中の(B)光酸発生剤の含有量は、処理液による表面処理を良好に行うことが出来る限り特に限定されない。処理液中の(B)光酸発生剤の含有量は、(A)樹脂100質量部に対して、0.1〜20質量部が好ましく、0.1〜10質量部がより好ましく、0.1〜5質量部が特に好ましい。 The content of the (B) photoacid generator in the treatment liquid is not particularly limited as long as the surface treatment with the treatment liquid can be performed satisfactorily. The content of the (B) photoacid generator in the treatment liquid is preferably 0.1 to 20 parts by mass, more preferably 0.1 to 10 parts by mass with respect to 100 parts by mass of the (A) resin. 1 to 5 parts by mass is particularly preferable.
〔(C)溶媒〕
(C)溶媒は、(A)樹脂と、(B)光酸発生剤とが可溶である溶媒であれば特に限定されない。処理液中に、(A)樹脂と、(B)光酸発生剤とが、所定量溶解していれば、処理液は、溶解していない状態の(A)樹脂と、(B)光酸発生剤とを含んでいてもよい。(A)樹脂と、(B)光酸発生剤とは、処理液に完全に溶解しているのが好ましい。
処理液が、不溶物を含む場合、表面処理時に、被処理体の表面に不溶物が付着する場合がある。この場合、表面処理された被処理体の表面を、後述するような方法でリンスすることにより、被処理体の表面に付着する不溶物を除去することができる。[(C) Solvent]
(C) A solvent will not be specifically limited if (A) resin and (B) photo-acid generator are soluble. If a predetermined amount of (A) resin and (B) photoacid generator is dissolved in the treatment liquid, the treatment liquid is not dissolved in (A) resin and (B) photoacid. It may contain a generating agent. It is preferable that (A) resin and (B) photoacid generator are completely dissolved in the treatment liquid.
When the treatment liquid contains insoluble matter, the insoluble matter may adhere to the surface of the object to be treated during the surface treatment. In this case, the insoluble matter adhering to the surface of the object to be processed can be removed by rinsing the surface of the object to be processed by a method described later.
(C)溶媒は、水であっても、有機溶媒であっても、有機溶媒の水溶液であってもよい。 (C) The solvent may be water, an organic solvent, or an aqueous solution of an organic solvent.
(C)溶媒として使用される有機溶媒の具体例としては、
メタノール、エタノール、n−プロパノール、イソプロパノール、n−ブチルアルコール、sec−ブチルアルコール、イソブチルアルコール、tert−ブチルアルコール、n−ペンチルアルコール、sec−ペンチルアルコール、イソペンチルアルコール、tert−ペンチルアルコール等のC1−C5のアルカノール類;
ジメチルスルホキシド等のスルホキシド類;
ジメチルスルホン、ジエチルスルホン、ビス(2−ヒドロキシエチル)スルホン、テトラメチレンスルホン等のスルホン類;
N,N−ジメチルホルムアミド、N−メチルホルムアミド、N,N−ジメチルアセトアミド、N−メチルアセトアミド、N,N−ジエチルアセトアミド等のアミド類;
N−メチル−2−ピロリドン、N−エチル−2−ピロリドン、N−プロピル−2−ピロリドン、N−ヒドロキシメチル−2−ピロリドン、N−ヒドロキシエチル−2−ピロリドン等のラクタム類;
1,3−ジメチル−2−イミダゾリジノン、1,3−ジエチル−2−イミダゾリジノン、1,3−ジイソプロピル−2−イミダゾリジノン等のイミダゾリジノン類;
ジメチルグリコール、ジメチルジグリコール、ジメチルトリグリコール、メチルエチルジグリコール、ジエチルグリコール、トリエチレングリコールブチルメチルエーテル等のジアルキルグリコールエーテル類;
エチレングリコールモノメチルエーテル、エチレングリコールモノエチルエーテル、エチレングリコールモノ−n−プロピルエーテル、エチレングリコールモノ−n−ブチルエーテル、ジエチレングリコールモノメチルエーテル、ジエチレングリコールモノエチルエーテル、ジエチレングリコールモノ−n−プロピルエーテル、ジエチレングリコールモノ−n−ブチルエーテル、トリエチレングリコールモノメチルエーテル、トリエチレングリコールモノエチルエーテル、プロピレングリコールモノメチルエーテル、プロピレングリコールモノエチルエーテル、プロピレングリコールモノ−n−プロピルエーテル、プロピレングリコールモノ−n−ブチルエーテル、ジプロピレングリコールモノメチルエーテル、ジプロピレングリコールモノエチルエーテル、ジプロピレングリコールモノ−n−プロピルエーテル、ジプロピレングリコールモノ−n−ブチルエーテル、トリプロピレングリコールモノメチルエーテル、トリプロピレングリコールモノエチルエーテル等の(ポリ)アルキレングリコールモノアルキルエーテル類;
エチレングリコールモノメチルエーテルアセテート、エチレングリコールモノエチルエーテルアセテート、ジエチレングリコールモノメチルエーテルアセテート、ジエチレングリコールモノエチルエーテルアセテート、プロピレングリコールモノメチルエーテルアセテート、プロピレングリコールモノエチルエーテルアセテート等の(ポリ)アルキレングリコールモノアルキルエーテルアセテート類;
ジメチルエーテル、ジエチルエーテル、メチルエチルエーテル、ジプロピルエーテル、ジイソプロピルエーテル、ジブチルエーテル、ジイソアミルエーテル、ジエチレングリコールジメチルエーテル、ジエチレングリコールメチルエチルエーテル、ジエチレングリコールジエチルエーテル、テトラヒドロフラン等の他のエーテル類;
メチルエチルケトン、シクロヘキサノン、2−ヘプタノン、3−ヘプタノン等のケトン類;
2−ヒドロキシプロピオン酸メチル、2−ヒドロキシプロピオン酸エチル等の乳酸アルキルエステル類;2−ヒドロキシ−2−メチルプロピオン酸エチル、3−メトキシプロピオン酸メチル、3−メトキシプロピオン酸エチル、3−エトキシプロピオン酸メチル、3−エトキシプロピオン酸エチル、エトキシ酢酸エチル、ヒドロキシ酢酸エチル、2−ヒドロキシ−3−メチルブタン酸メチル、3−メチル−3−メトキシブチルアセテート、3−メチル−3−メトキシブチルプロピオネート、酢酸エチル、酢酸−n−プロピル、酢酸−i−プロピル、酢酸−n−ブチル、酢酸−i−ブチル、ぎ酸−n−ペンチル、酢酸−i−ペンチル、プロピオン酸−n−ブチル、酪酸エチル、酪酸−n−プロピル、酪酸−i−プロピル、酪酸−n−ブチル、ピルビン酸メチル、ピルビン酸エチル、ピルビン酸−n−プロピル、アセト酢酸メチル、アセト酢酸エチル、2−オキソブタン酸エチル等の他のエステル類;
β−プロピロラクトン、γ−ブチロラクトン、δ−ペンチロラクトン等のラクトン類;
n−ヘキサン、n−ヘプタン、n−オクタン、n−ノナン、メチルオクタン、n−デカン、n−ウンデカン、n−ドデカン、2,2,4,6,6−ペンタメチルヘプタン、2,2,4,4,6,8,8−ヘプタメチルノナン、シクロヘキサン、メチルシクロヘキサン等の直鎖状、分岐鎖状、又は環状の脂肪族炭化水素類;
ベンゼン、トルエン、キシレン、1,3,5−トリメチルベンゼン、ナフタレン等の芳香族炭化水素類;
p−メンタン、ジフェニルメンタン、リモネン、テルピネン、ボルナン、ノルボルナン、ピナン等のテルペン類;等が挙げられる。(C) As a specific example of the organic solvent used as a solvent,
C1- such as methanol, ethanol, n-propanol, isopropanol, n-butyl alcohol, sec-butyl alcohol, isobutyl alcohol, tert-butyl alcohol, n-pentyl alcohol, sec-pentyl alcohol, isopentyl alcohol, tert-pentyl alcohol, etc. C5 alkanols;
Sulfoxides such as dimethyl sulfoxide;
Sulfones such as dimethylsulfone, diethylsulfone, bis (2-hydroxyethyl) sulfone, tetramethylenesulfone;
Amides such as N, N-dimethylformamide, N-methylformamide, N, N-dimethylacetamide, N-methylacetamide, N, N-diethylacetamide;
Lactams such as N-methyl-2-pyrrolidone, N-ethyl-2-pyrrolidone, N-propyl-2-pyrrolidone, N-hydroxymethyl-2-pyrrolidone, N-hydroxyethyl-2-pyrrolidone;
Imidazolidinones such as 1,3-dimethyl-2-imidazolidinone, 1,3-diethyl-2-imidazolidinone, 1,3-diisopropyl-2-imidazolidinone;
Dialkyl glycol ethers such as dimethyl glycol, dimethyl diglycol, dimethyl triglycol, methyl ethyl diglycol, diethyl glycol, triethylene glycol butyl methyl ether;
Ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol mono-n-propyl ether, ethylene glycol mono-n-butyl ether, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol mono-n-propyl ether, diethylene glycol mono-n- Butyl ether, triethylene glycol monomethyl ether, triethylene glycol monoethyl ether, propylene glycol monomethyl ether, propylene glycol monoethyl ether, propylene glycol mono-n-propyl ether, propylene glycol mono-n-butyl ether, dipropylene glycol monomethyl ether, di Propylene glycol mono Chirueteru, dipropylene glycol mono -n- propyl ether, dipropylene glycol mono -n- butyl ether, tripropylene glycol monomethyl ether, tripropylene glycol monoethyl (poly) alkylene glycol monoalkyl ethers such as ether;
(Poly) alkylene glycol monoalkyl ether acetates such as ethylene glycol monomethyl ether acetate, ethylene glycol monoethyl ether acetate, diethylene glycol monomethyl ether acetate, diethylene glycol monoethyl ether acetate, propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate;
Other ethers such as dimethyl ether, diethyl ether, methyl ethyl ether, dipropyl ether, diisopropyl ether, dibutyl ether, diisoamyl ether, diethylene glycol dimethyl ether, diethylene glycol methyl ethyl ether, diethylene glycol diethyl ether, tetrahydrofuran;
Ketones such as methyl ethyl ketone, cyclohexanone, 2-heptanone, 3-heptanone;
Lactic acid alkyl esters such as methyl 2-hydroxypropionate and ethyl 2-hydroxypropionate; ethyl 2-hydroxy-2-methylpropionate, methyl 3-methoxypropionate, ethyl 3-methoxypropionate, 3-ethoxypropionic acid Methyl, ethyl 3-ethoxypropionate, ethyl ethoxyacetate, ethyl hydroxyacetate, methyl 2-hydroxy-3-methylbutanoate, 3-methyl-3-methoxybutyl acetate, 3-methyl-3-methoxybutylpropionate, acetic acid Ethyl, acetic acid-n-propyl, acetic acid-i-propyl, acetic acid-n-butyl, acetic acid-i-butyl, formic acid-n-pentyl, acetic acid-i-pentyl, propionic acid-n-butyl, ethyl butyrate, butyric acid -N-propyl, i-propyl butyrate, n-butyl butyrate, Methyl bottles, ethyl pyruvate, pyruvate -n- propyl, methyl acetoacetate, ethyl acetoacetate, other esters such as ethyl 2-oxobutanoate;
Lactones such as β-propyrolactone, γ-butyrolactone, δ-pentyrolactone;
n-hexane, n-heptane, n-octane, n-nonane, methyloctane, n-decane, n-undecane, n-dodecane, 2,2,4,6,6-pentamethylheptane, 2,2,4 , 4,6,8,8-heptamethylnonane, cyclohexane, methylcyclohexane and the like linear, branched or cyclic aliphatic hydrocarbons;
Aromatic hydrocarbons such as benzene, toluene, xylene, 1,3,5-trimethylbenzene, naphthalene;
and terpenes such as p-menthane, diphenylmenthane, limonene, terpinene, bornane, norbornane, and pinane;
(C)溶媒が、水と有機溶媒との混合溶媒である場合、(C)溶媒中の有機溶媒の含有量は10質量%以上が好ましく、20質量%以上がより好ましい。 When the (C) solvent is a mixed solvent of water and an organic solvent, the content of the organic solvent in the (C) solvent is preferably 10% by mass or more, and more preferably 20% by mass or more.
<その他の成分>
処理液は、本発明の目的を阻害しない範囲で、(A)樹脂、(B)光酸発生剤、及び(C)溶媒以外の種々の成分を含んでいてもよい。その他の成分としては、例えば、着色剤、界面活性剤、消泡剤、粘度調整剤等が挙げられる。<Other ingredients>
The treatment liquid may contain various components other than (A) a resin, (B) a photoacid generator, and (C) a solvent as long as the object of the present invention is not impaired. Examples of other components include colorants, surfactants, antifoaming agents, viscosity modifiers, and the like.
<処理液の調製方法>
処理液を調製する方法は特に限定されない。処理液は、典型的には、それぞれ所定量の(A)樹脂と、(B)光酸発生剤と、(C)溶媒と、必要に応じてその他の成分を、均一に混合することにより調製される。<Method for preparing treatment liquid>
The method for preparing the treatment liquid is not particularly limited. The treatment liquid is typically prepared by uniformly mixing a predetermined amount of (A) resin, (B) photoacid generator, (C) solvent, and other components as necessary. Is done.
<塗布膜形成工程>
以上説明した表面処理液を、被処理体の表面に塗布して塗布膜を形成する。
表面処理液の塗布方法は特に限定されない。塗布方法の具体例としては、スピンコート法、スプレー法、ローラーコート法、浸漬法等が挙げられる。被処理体が基板である場合、表面処理液を均一に塗布することで、基板表面を均一に親水化又は疎水化できることから、塗布方法としてスピンコート法が好ましい。<Coating film formation process>
The surface treatment liquid described above is applied to the surface of the object to be processed to form a coating film.
The method for applying the surface treatment liquid is not particularly limited. Specific examples of the coating method include spin coating, spraying, roller coating, and dipping. When the object to be processed is a substrate, the surface of the substrate can be uniformly hydrophilized or hydrophobized by uniformly applying the surface treatment liquid. Therefore, the spin coating method is preferable as the coating method.
被処理体の表面処理液が塗布される面の材質は特に限定されず、有機材料であっても、無機材料であってもよい。
有機材料としては、PET樹脂やPBT樹脂等のポリエステル樹脂、各種ナイロン、ポリイミド樹脂、ポリアミドイミド樹脂、ポリエチレンやポリプロピレン等のポリオレフィン、ポリスチレン、(メタ)アクリル樹脂等、種々の樹脂材料が挙げられる。
また、種々のレジスト材料に含まれる感光性の樹脂成分や、アルカリ可溶性の樹脂成分も有機材料として好ましい。
無機材料としては、ガラス、シリコンや、銅、アルミニウム、鉄、タングステン等の種々の金属が挙げられる。金属は、合金であってもよい。The material of the surface to which the surface treatment liquid is applied is not particularly limited, and may be an organic material or an inorganic material.
Examples of the organic material include various resin materials such as polyester resins such as PET resin and PBT resin, various nylons, polyimide resins, polyamideimide resins, polyolefins such as polyethylene and polypropylene, polystyrene, and (meth) acrylic resins.
Photosensitive resin components and alkali-soluble resin components contained in various resist materials are also preferable as the organic material.
Examples of the inorganic material include various metals such as glass, silicon, copper, aluminum, iron, and tungsten. The metal may be an alloy.
前述の表面処理液により表面処理される面の材質は特に限定されないが、表面処理液が塗布される面の材質が有機材料である場合は、官能基Iとして水酸基及び/又はカルボキシ基を有する(A)樹脂を含む表面処理液を用いるのが好ましい。
表面処理液が塗布される面の材質が無機材料である場合は、(A)樹脂が有する官能基Iとしては、水酸基、カルボキシ基、及びシアノ基のいずれも好ましい。The material of the surface to be surface-treated with the above-mentioned surface treatment liquid is not particularly limited. However, when the material of the surface to which the surface treatment liquid is applied is an organic material, the functional group I has a hydroxyl group and / or a carboxy group ( A) It is preferable to use a surface treatment liquid containing a resin.
When the material of the surface to which the surface treatment liquid is applied is an inorganic material, (A) the functional group I of the resin is preferably any of a hydroxyl group, a carboxy group, and a cyano group.
被処理体の形状は特に限定されない。被処理体は平坦な基板であってもよく、例えば、球状や、柱状等の立体形状であってもよい。また、被処理体の表面は、平滑であっても、規則的又は不規則な凹凸を有していてもよい。 The shape of the object to be processed is not particularly limited. The object to be processed may be a flat substrate, and may be, for example, a spherical shape or a three-dimensional shape such as a column shape. Further, the surface of the object to be processed may be smooth, or may have regular or irregular irregularities.
表面処理液を、被処理体の表面に塗布した後は、必要に応じて塗布膜を加熱して(C)溶媒の少なくとも一部を除去してもよい。 After the surface treatment liquid is applied to the surface of the object to be processed, at least a part of the solvent (C) may be removed by heating the coating film as necessary.
<露光工程>
以上のようにして形成された塗布膜に対して、例えば波長が300〜500nmの紫外線又は可視光線を照射して露光が行われる。露光は、親水化又は疎水化を行いたい箇所に対して行われる。
塗布膜が形成された箇所全体を高度に親水化又は疎水化したい場合には、塗布膜全面に対して露光が行われる。塗布膜が形成された箇所の一部を高度に親水化又は疎水化し、他の箇所における親水化又は疎水化の程度を低くしたい場合には、高度に親水化又は疎水化したい場所のみに位置選択的に露光が行われる。
位置選択的な露光を行う方法は特に限定されないが、通常、フォトマスクを介して行われる。<Exposure process>
The coating film formed as described above is exposed by, for example, irradiating ultraviolet rays or visible rays having a wavelength of 300 to 500 nm. The exposure is performed on a portion where hydrophilicity or hydrophobicity is desired.
When it is desired to highly hydrophilize or hydrophobize the entire portion where the coating film is formed, the entire surface of the coating film is exposed. If you want to highly hydrophilize or hydrophobize a part of the part where the coating film is formed and reduce the degree of hydrophilization or hydrophobization in other parts, select only the location where you want to make it highly hydrophobized or hydrophobized. Exposure is performed.
A method for performing position-selective exposure is not particularly limited, but is usually performed through a photomask.
放射線の線源としては、低圧水銀灯、高圧水銀灯、超高圧水銀灯、メタルハライドランプ、アルゴンガスレーザー等を用いることができる。また、放射線には、マイクロ波、赤外線、可視光線、紫外線、X線、γ線、電子線、陽子線、中性子線、イオン線等が含まれる。放射線照射量(露光量)は、典型的には、例えば超高圧水銀灯使用の場合、100〜10000mJ/cm2である。As a radiation source, a low-pressure mercury lamp, a high-pressure mercury lamp, an ultrahigh-pressure mercury lamp, a metal halide lamp, an argon gas laser, or the like can be used. The radiation includes microwaves, infrared rays, visible rays, ultraviolet rays, X-rays, γ rays, electron beams, proton beams, neutron beams, ion beams, and the like. The radiation dose (exposure dose) is typically 100 to 10,000 mJ / cm 2 in the case of using an ultrahigh pressure mercury lamp, for example.
<ベーク工程>
次いて、露光された塗布膜をベークする。ベーク温度は、典型的には、40〜200℃が好ましく、60〜150℃がより好ましい。ベーク時間は、10〜6000秒が好ましく、10〜300秒がより好ましい。<Bake process>
Next, the exposed coating film is baked. Typically, the baking temperature is preferably 40 to 200 ° C, more preferably 60 to 150 ° C. The baking time is preferably 10 to 6000 seconds, and more preferably 10 to 300 seconds.
<リンス工程>
ベークされた塗布膜は、リンスされる。
前述の通り、所定の官能基を有する(A)樹脂と、(B)光酸発生剤とを含む表面処理液を被処理体の表面に塗布した後露光を行うと、(B)光酸発生剤から発生した強酸の作用によって、被処理体の表面に(A)樹脂が良好に付着又は結合する。
ところが、被処理体の表面、特に未露光部には、当該表面に付着又は結合していない(A)樹脂もある程度の量存在している。
しかし、塗布膜がリンスされることにより、被処理体の表面に付着していない(A)樹脂等が洗い流される。
その結果、リンスにより、被処理体の表面の露光された箇所に膜厚10nm以下の薄膜が形成される。
薄膜の膜厚は、分光エリプソメトリーを用いて測定することができる。<Rinse process>
The baked coating film is rinsed.
As described above, when a surface treatment liquid containing (A) a resin having a predetermined functional group and (B) a photoacid generator is applied to the surface of the object to be processed and then exposed to light, (B) photoacid generation is performed. By the action of the strong acid generated from the agent, the (A) resin adheres or binds well to the surface of the object to be treated.
However, a certain amount of (A) resin that is not attached or bonded to the surface is present on the surface of the object to be processed, particularly the unexposed portion.
However, by rinsing the coating film, the resin (A) not attached to the surface of the object to be processed is washed away.
As a result, a thin film having a thickness of 10 nm or less is formed on the exposed portion of the surface of the object by rinsing.
The film thickness of the thin film can be measured using spectroscopic ellipsometry.
官能基IIとして親水性基を有する(A)樹脂を含む表面処理液を用いる場合、水によりリンスを行うのが好ましい。また、官能基IIとして疎水性基を有する(A)樹脂を含む表面処理液を用いる場合、有機溶媒によりリンスを行うのが好ましい。有機溶媒は、表面処理液に(C)溶媒として含まれる有機溶媒であるのが好ましい。 When using the surface treatment liquid containing (A) resin having a hydrophilic group as the functional group II, it is preferable to rinse with water. Moreover, when using the surface treatment liquid containing (A) resin which has a hydrophobic group as the functional group II, it is preferable to perform rinsing with an organic solvent. The organic solvent is preferably an organic solvent contained as a (C) solvent in the surface treatment liquid.
リンス後に、被処理体の表面を乾燥させることにより、良好に親水化又は疎水化された物品が得られる。 After rinsing, the surface of the object to be treated is dried to obtain an article that is well hydrophilized or hydrophobized.
以上説明した方法により表面処理された種々の物品は、必要な個所のみを高度に親水化又は疎水化できる一方で、その他の箇所の親水化又は疎水化の程度を低くできる。かかる表面処理を施された物品として、例えば、細胞培養器具や、細胞等の生体試料を含む液体を流通させるマイクロ流路デバイス等が好適である。表面処理により、種々の物品に対して、防汚性や防曇性等が付与される。 Various articles surface-treated by the method described above can highly hydrophilize or hydrophobize only necessary portions, while reducing the degree of hydrophilization or hydrophobization of other portions. As the article subjected to such a surface treatment, for example, a cell culture instrument, a microchannel device for circulating a liquid containing a biological sample such as a cell, and the like are suitable. By the surface treatment, antifouling property, antifogging property and the like are imparted to various articles.
以下、本発明を実施例によりさらに詳細に説明するが、本発明はこれらの実施例に限定されるものではない。 EXAMPLES Hereinafter, although an Example demonstrates this invention further in detail, this invention is not limited to these Examples.
〔実施例1〜10、及び比較例1〜4〕
各実施例及び比較例において、(A)樹脂として、表1に記載の樹脂を用いた。
表1に記載の構成単位A−1a〜A−6aは、(A)樹脂に親水性基又は疎水性基を与える構成単位である。A−6aを表す式において、nは括弧内の単位の繰り返し数である。
表1に記載の構成単位A−1b〜A−3bは、(A)樹脂に、水酸基、シアノ基、又はカルボキシ基を与える単位である。
表1に記載の構成単位A−1c及びA−2cは、親水性基、疎水性基、水酸基、シアノ基、及びカルボキシ基のいずれも有さない構成単位である。
表1に記載の化合物1〜4は、それぞれ下記構造のオルガノシロキサン化合物である。化合物1〜4を表す式において、n、n1及びn2はそれぞれの括弧内の単位の繰り返し数である。[Examples 1 to 10 and Comparative Examples 1 to 4]
In each Example and Comparative Example, the resin described in Table 1 was used as the (A) resin.
Structural units A-1a to A-6a described in Table 1 are structural units that impart a hydrophilic group or a hydrophobic group to the resin (A). In the formula representing A-6a, n is the number of repeating units in parentheses.
The structural units A-1b to A-3b described in Table 1 are units that give a hydroxyl group, a cyano group, or a carboxy group to the (A) resin.
Structural units A-1c and A-2c described in Table 1 are structural units that do not have any of a hydrophilic group, a hydrophobic group, a hydroxyl group, a cyano group, and a carboxy group.
Compounds 1 to 4 listed in Table 1 are organosiloxane compounds having the following structures, respectively. In the formulas representing compounds 1 to 4, n, n1 and n2 are the number of repeating units in each parenthesis.
以下のシロキサン化合物について、化合物1の水酸基量は、58mgKOH/molであり、化合物3のカルボキシ基量は4000g/molであり、化合物4のケイ素原子に直接結合する水素原子量は60g/molである。
実施例及び比較例において、以下の光酸発生剤B1〜B3を用いた。B1及びB2は、pKaが1以下の強酸を発生させる光酸発生剤であり、B3はpKaが1超の酸を発生させる光酸発生剤である。
表1に記載の種類の(A)樹脂10質量部と、表2に記載の種類及び量の(B)光酸発生剤とを、表2に記載の種類及び量の(C)溶媒に均一に混合させて、各実施例及び比較例の表面処理液を得た。
表2中のPGMEは、プロピレングリコールモノメチルエーテルであり、PGMEAはプロピレングリコールモノメチルエーテルアセテートである。10 parts by mass of the resin (A) of the type shown in Table 1 and (B) the photoacid generator of the type and amount shown in Table 2 are uniform in the solvent (C) of the type and amount shown in Table 2. The surface treatment liquids of the examples and comparative examples were obtained.
PGME in Table 2 is propylene glycol monomethyl ether, and PGMEA is propylene glycol monomethyl ether acetate.
得られた表面処理液を、ガラス基板上に1000rpm30秒の条件でスピンコートした後、100℃60秒の乾燥を行って塗布膜を得た。
得られた塗布膜に対して、マスクを介して、HMW−532D(ORC社製)を用いて露光量1000mJ/cm2にて露光を行った。
露光された塗布膜を、100℃で60秒ベークした後、リンスして、表面処理されたガラス基板を得た。
親水性基を有する樹脂を用いた、実施例1〜3、実施例7、比較例1、比較例2、及び比較例4では、水でリンスを行った。その他の実施例、及び比較例では、PGMEAでリンスを行った。The obtained surface treatment solution was spin-coated on a glass substrate at 1000 rpm for 30 seconds, and then dried at 100 ° C. for 60 seconds to obtain a coating film.
The obtained coating film was exposed at an exposure amount of 1000 mJ / cm 2 using a HMW-532D (manufactured by ORC) through a mask.
The exposed coating film was baked at 100 ° C. for 60 seconds and then rinsed to obtain a surface-treated glass substrate.
In Examples 1 to 3, Example 7, Comparative Example 1, Comparative Example 2, and Comparative Example 4 using a resin having a hydrophilic group, rinsing was performed with water. In other examples and comparative examples, rinsing was performed with PGMEA.
リンスされたガラス基板を乾燥させた後、露光部と、未露光部とそれぞれについて、ガラス基板の水の接触角を測定した。水の接触角の測定は、Dropmaster700(協和界面科学株式会社製)を用い表面処理された基板の表面に純水液滴(2.0μL)を滴下して、滴下10秒後における接触角として測定した。水の接触角の測定結果を表2に記す。
なお、乾燥後の基板について、露光された箇所を分光エリプソメトリーで確認したが、実施例では膜厚10nm以下の薄膜の存在が観察され、比較例では薄膜の存在が観察されなかった。After the rinsed glass substrate was dried, the contact angle of water on the glass substrate was measured for each of the exposed part and the unexposed part. The contact angle of water is measured by dropping a pure water droplet (2.0 μL) on the surface of the surface-treated substrate using Dropmaster 700 (manufactured by Kyowa Interface Science Co., Ltd.) and measuring the contact angle 10 seconds after the dropping. did. The measurement results of the water contact angle are shown in Table 2.
In addition, about the board | substrate after drying, although the exposed location was confirmed by spectroscopic ellipsometry, presence of the thin film with a film thickness of 10 nm or less was observed in the Example, and presence of the thin film was not observed in the comparative example.
実施例によれば、水酸基、シアノ基、及びカルボキシ基からなる群より選択される1以上の基である官能基Iと、官能基I以外の親水性基又は疎水性基である官能基IIとを有する(A)樹脂と、pKaが1以下の強酸を発生させる(B)光酸発生剤を含む表面処理液を用いる場合、表面処理液からなる塗布膜を露光した後、ベーク及びリンスを施すことで、基板上の露光された箇所のみを良好に親水化又は疎水化できることが分かる。 According to the examples, the functional group I is one or more groups selected from the group consisting of a hydroxyl group, a cyano group, and a carboxy group, and a functional group II that is a hydrophilic group or a hydrophobic group other than the functional group I; When a surface treatment liquid containing (A) a resin having a pKa of 1 or less and (B) a photoacid generator is used, the coating film made of the surface treatment liquid is exposed and then baked and rinsed. Thus, it can be seen that only the exposed portion on the substrate can be made hydrophilic or hydrophobic.
比較例1〜3によれば、(A)樹脂が、水酸基、シアノ基、及びカルボキシ基のいずれも有さない場合、表面処理液がpKaが1以下の強酸を発生させる(B)光酸発生剤を含んでいても、露光部を良好に親水化又は疎水化できないことが分かる。 According to Comparative Examples 1 to 3, when the (A) resin does not have any of a hydroxyl group, a cyano group, and a carboxy group, the surface treatment liquid generates a strong acid having a pKa of 1 or less. (B) Photoacid generation It can be seen that even if an agent is included, the exposed area cannot be made hydrophilic or hydrophobic.
比較例4によれば、(A)樹脂が、カルボキシ基である官能基Iと、親水性基である官能基IIとを有していても、表面処理液がpKaが1超の酸を発生させる(B)光酸発生剤を含む場合には、露光部を良好に親水化又は疎水化できないことが分かる。 According to Comparative Example 4, even though the resin (A) has a functional group I that is a carboxy group and a functional group II that is a hydrophilic group, the surface treatment solution generates an acid having a pKa of more than 1. It can be seen that when the (B) photoacid generator is included, the exposed portion cannot be made hydrophilic or hydrophobic.
〔実施例11〜15〕
実施例11では、(A)樹脂10質量部と、(B)光酸発生剤0.1質量部と、PGMEA1000質量部とを均一に混合して得られた表面処理液を用いた。
実施例11の表面処理液に含まれる樹脂は、前述のA−4a単位とA−2b単位とを、モル比95:5(A−4a:A−2b)で含む樹脂である。
また、実施例11の表面処理液に含まれる(B)光酸発生剤は、前述のB2の化合物である。
それぞれ、表3に記載の種類の表面処理液を用いることと、基板の種類を表3に記載の種類に変更することと、露光を塗布膜全面に対して行ったこととを除いて、実施例1と同様にして、表面処理後の水の接触角を測定した。測定結果を表1に記す。なお、PETフィルム、シリコンウエハーは、未処理の状態の水の接触角は、PETフィルムが約70°、シリコンウエハーは約10°である。[Examples 11 to 15]
In Example 11, a surface treatment liquid obtained by uniformly mixing (A) 10 parts by mass of a resin, (B) 0.1 parts by mass of a photoacid generator, and 1000 parts by mass of PGMEA was used.
The resin contained in the surface treatment liquid of Example 11 is a resin containing the aforementioned A-4a unit and A-2b unit at a molar ratio of 95: 5 (A-4a: A-2b).
In addition, the (B) photoacid generator contained in the surface treatment liquid of Example 11 is the compound of B2 described above.
Implemented except for using the surface treatment liquid of the type shown in Table 3, changing the type of the substrate to the type shown in Table 3, and performing the exposure on the entire coating film, respectively. In the same manner as in Example 1, the contact angle of water after the surface treatment was measured. The measurement results are shown in Table 1. In addition, the PET film and the silicon wafer have an untreated water contact angle of about 70 ° for the PET film and about 10 ° for the silicon wafer.
実施例11によれば、表面処理液に含まれる樹脂(A)が官能基Iとして、シアノ基を有する場合、無機材料(シリコン)からなる基板の表面が良好に疎水化されることが分かる。
実施例12〜15によれば、表面処理液に含まれる樹脂(A)が官能基Iとして、水酸基又はカルボキシ基を有する場合、無機材料(シリコン)からなる基板の表面も、有機材料(PET)からなる基板の表面も、良好に疎水化されることが分かる。According to Example 11, when the resin (A) contained in the surface treatment liquid has a cyano group as the functional group I, it can be seen that the surface of the substrate made of an inorganic material (silicon) is hydrophobicized well.
According to Examples 12 to 15, when the resin (A) contained in the surface treatment liquid has a hydroxyl group or a carboxy group as the functional group I, the surface of the substrate made of an inorganic material (silicon) is also an organic material (PET). It can be seen that the surface of the substrate made of is also hydrophobicized well.
Claims (11)
被処理体の表面に前記感光性表面処理液を塗布して、塗布膜を形成することと、
前記塗布膜の少なくとも一部を露光することと、
露光された前記塗布膜をベークすることと、
ベークされた前記塗布膜をリンスして、前記被処理体の表面の露光された箇所に膜厚10nm以下の薄膜を形成することと、を含み、
前記感光性表面処理液が、(A)樹脂と、(B)光酸発生剤と、(C)溶媒とを含み、
前記(A)樹脂が、水酸基、シアノ基、及びカルボキシ基からなる群より選択される1以上の基である官能基Iと、前記官能基I以外の親水性基又は疎水性基である官能基IIとを有し、
前記(B)光酸発生剤が、pKaが1以下の強酸を発生させる、表面処理方法。A surface treatment method using a photosensitive surface treatment liquid,
Applying the photosensitive surface treatment liquid on the surface of the object to be processed to form a coating film;
Exposing at least a portion of the coating film;
Baking the exposed coating film;
Rinsing the baked coating film, and forming a thin film having a thickness of 10 nm or less on the exposed portion of the surface of the object to be processed,
The photosensitive surface treatment liquid contains (A) a resin, (B) a photoacid generator, and (C) a solvent,
The (A) resin is a functional group I that is one or more groups selected from the group consisting of a hydroxyl group, a cyano group, and a carboxy group, and a functional group that is a hydrophilic group or a hydrophobic group other than the functional group I. II,
(B) A surface treatment method in which the photoacid generator generates a strong acid having a pKa of 1 or less.
−NH−R1・・・(A1)
(式(A1)中、R1は、アミノ基、スルホン酸基、及び水酸基からなる群より選択される1以上の基で置換された炭素原子数1〜4のアルキル基、又は水素原子である。)
で表される基である、請求項1又は2に記載の表面処理方法。The hydrophilic group of the functional group II is represented by the following formula (A1):
-NH-R 1 (A1)
(In Formula (A1), R 1 is an alkyl group having 1 to 4 carbon atoms substituted with one or more groups selected from the group consisting of an amino group, a sulfonic acid group, and a hydroxyl group, or a hydrogen atom. .)
The surface treatment method of Claim 1 or 2 which is group represented by these.
CH2=CR2−(R3)a−CO−R4・・・(A2)
(式(A2)中、R2は水素原子又はメチル基であり、R3は2価の炭化水素基であり、aは0又は1であり、R4は、−OH、−O−R5、又は−NH−R5であり、R5は、水酸基、シアノ基、及びカルボキシ基からなる群より選択される1以上の官能基で置換された炭化水素基である。)
又は、下式(A2−1):
CH2=CR2−(R3)a−SO3X・・・(A2−1)
(式(A2−1)中、R2、R3、及びaは、式(A2)と同様であり、Xは、水素原子、又はアルカリ金属である。)
で表される単量体に由来する、請求項1〜3のいずれか1項に記載の表面処理方法。The functional group I is represented by the following formula (A2):
CH 2 = CR 2 - (R 3) a -CO-R 4 ··· (A2)
(In Formula (A2), R 2 is a hydrogen atom or a methyl group, R 3 is a divalent hydrocarbon group, a is 0 or 1, and R 4 is —OH, —O—R 5. Or —NH—R 5 , wherein R 5 is a hydrocarbon group substituted with one or more functional groups selected from the group consisting of a hydroxyl group, a cyano group, and a carboxy group.
Or the following formula (A2-1):
CH 2 = CR 2 - (R 3) a -SO 3 X ··· (A2-1)
(In Formula (A2-1), R 2 , R 3 , and a are the same as in Formula (A2), and X is a hydrogen atom or an alkali metal.)
The surface treatment method according to any one of claims 1 to 3, derived from a monomer represented by:
CH2=CR2−(CO−O)b−R6・・・(A3)
(式(A3)中、R2は水素原子又はメチル基であり、bは0又は1であり、R6は、フッ素化炭化水素基、又は下式(A4):
−SiR7R8−(−O−SiR7R8−)n−R9・・・(A4)
で表される基であり、R7、R8、及びR9は、それぞれ独立に炭素原子数1〜6の炭化水素基であり、nは0以上の整数である。)
で表される単量体に由来する、請求項1、2、4、及び5のいずれか1項に記載の表面処理方法。The functional group II is a hydrophobic group, and the following formula (A3):
CH 2 = CR 2 - (CO -O) b -R 6 ··· (A3)
(In formula (A3), R 2 is a hydrogen atom or a methyl group, b is 0 or 1, R 6 is a fluorinated hydrocarbon group, or the following formula (A4):
-SiR 7 R 8 - (- O -SiR 7 R 8 -) n -R 9 ··· (A4)
R 7 , R 8 , and R 9 are each independently a hydrocarbon group having 1 to 6 carbon atoms, and n is an integer of 0 or more. )
The surface treatment method of any one of Claims 1, 2, 4, and 5 derived from the monomer represented by these.
CH2=CR2−CO−NH−R1・・・(A5)
(式(A5)中、R1は、アミノ基、スルホン酸基、及び水酸基からなる群より選択される1以上の基で置換された炭素原子数1〜4のアルキル基、又は水素原子であり、R2は水素原子又はメチル基である。)
で表される単量体に由来する、請求項1〜4のいずれか1項に記載の表面処理方法。The functional group II is a hydrophilic group, and the following formula (A5):
CH 2 = CR 2 -CO-NH -R 1 ··· (A5)
(In Formula (A5), R 1 is an alkyl group having 1 to 4 carbon atoms substituted with one or more groups selected from the group consisting of an amino group, a sulfonic acid group, and a hydroxyl group, or a hydrogen atom. R 2 is a hydrogen atom or a methyl group.)
The surface treatment method of any one of Claims 1-4 which originates in the monomer represented by these.
前記(A)樹脂が、下記式(A6):
A1−SiR10R11−O−(−SiR10A2−O−)p−SiR10R11A3
・・・(A6)
(式(A6)中、R10及びR11は、それぞれ独立に炭素原子数1〜6の炭化水素基であり、A1、A2、及びA3は、それぞれ独立に、水酸基、シアノ基、カルボキシ基、又は炭素原子数1〜6の炭化水素基であり、A1、A2、及びA3の少なくとも1つは水酸基、シアノ基、又はカルボキシ基であり、pは0以上の整数である。)
で表されるシロキサン化合物である、請求項5に記載の表面処理方法。The hydrophobic group is the siloxane group;
The resin (A) is represented by the following formula (A6):
A 1 -SiR 10 R 11 -O - (- SiR 10 A 2 -O-) p -SiR 10 R 11 A 3
... (A6)
(In Formula (A6), R 10 and R 11 are each independently a hydrocarbon group having 1 to 6 carbon atoms, and A 1 , A 2 , and A 3 are each independently a hydroxyl group, a cyano group, A carboxy group or a hydrocarbon group having 1 to 6 carbon atoms, wherein at least one of A 1 , A 2 and A 3 is a hydroxyl group, a cyano group or a carboxy group, and p is an integer of 0 or more. .)
The surface treatment method of Claim 5 which is a siloxane compound represented by these.
(A)樹脂と、(B)光酸発生剤と、(C)溶媒とを含み、
前記(A)樹脂が、水酸基、シアノ基、及びカルボキシ基からなる群より選択される1以上の基である官能基Iと、前記官能基I以外の親水性基又は疎水性基である官能基IIとを有し、
前記(B)光酸発生剤が、pKaが1以下の強酸を発生させる、感光性表面処理液。It is the photosensitive surface treatment liquid used in the surface treatment method of any one of Claims 1-8,
(A) a resin, (B) a photoacid generator, and (C) a solvent,
The (A) resin is a functional group I that is one or more groups selected from the group consisting of a hydroxyl group, a cyano group, and a carboxy group, and a functional group that is a hydrophilic group or a hydrophobic group other than the functional group I. II,
The photosensitive surface treatment liquid in which the (B) photoacid generator generates a strong acid having a pKa of 1 or less.
前記(A)樹脂が、水酸基、シアノ基、及びカルボキシ基からなる群より選択される1以上の基である官能基Iと、前記官能基I以外の親水性基又は疎水性基である官能基IIとを有し、
前記(B)光酸発生剤が、pKaが1以下の強酸を発生させる、感光性表面処理液。(A) a resin, (B) a photoacid generator, and (C) a solvent,
The (A) resin is a functional group I that is one or more groups selected from the group consisting of a hydroxyl group, a cyano group, and a carboxy group, and a functional group that is a hydrophilic group or a hydrophobic group other than the functional group I. II,
The photosensitive surface treatment liquid in which the (B) photoacid generator generates a strong acid having a pKa of 1 or less.
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KR102391565B1 (en) | 2022-04-27 |
CN108885397B (en) | 2022-03-01 |
WO2017170167A1 (en) | 2017-10-05 |
JP6609370B2 (en) | 2019-11-20 |
KR20180129803A (en) | 2018-12-05 |
TW201807150A (en) | 2018-03-01 |
CN108885397A (en) | 2018-11-23 |
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