JPWO2017009922A1 - Wiring forming method and wiring forming apparatus - Google Patents

Abstract

In the wiring forming apparatus and method of the present invention, the first wiring 150 is formed on the circuit board 70 by the metal-containing liquid, and the resin layer 156 having the via hole 152 through which a part of the wiring is exposed is formed on the circuit board. Formed on top. In addition, a conductive metal lump 96 is placed in the via hole. Then, the second wiring 160 is formed on the resin layer with the metal-containing liquid. Thus, in the wiring formation method of the present invention, the first wiring and the second wiring are electrically connected by placing the conductive metal block in the via hole. On the other hand, in the conventional wiring forming method, the first wiring and the second wiring are electrically connected by laminating a metal thin film inside the via hole by firing the metal-containing liquid. That is, according to the wiring forming method of the present invention, it is not necessary to stack metal thin films, and it is possible to improve throughput and prevent deterioration of the resin layer.

Description

  The present invention relates to a wiring forming method and a wiring forming apparatus for forming a wiring with a metal-containing liquid containing metal fine particles.

  In recent years, as described in the following patent documents, there is a technique for forming a multilayer circuit pattern by discharging a metal-containing liquid containing metal fine particles and firing the discharged metal-containing liquid. Has been developed.

JP 2012-222143 A

  According to the technique described in the above-mentioned patent document, it becomes possible to form a multilayer circuit pattern appropriately to some extent. However, there is still room for improvement in the method of forming a multilayer circuit pattern using a metal-containing liquid, and a method for forming a circuit pattern using a metal-containing liquid by making various improvements. It is considered that the practicality of is improved. The present invention has been made in view of such a situation, and an object thereof is to provide a circuit pattern forming method and apparatus having high practicality.

  In order to solve the above-described problems, a wiring forming method of the present invention includes a first wiring forming step of forming a first wiring with a metal-containing liquid containing metal fine particles on a base material, A resin layer forming step for forming a resin layer having an opening partly exposed on the first wiring, and a second wiring for forming a second wiring with the metal-containing liquid on the resin layer A step of forming and an electrical connection step of electrically connecting the first wiring and the second wiring by placing a conductive metal mass in the opening. .

  In order to solve the above problems, a wiring forming apparatus of the present invention includes a first discharge device that discharges a metal-containing liquid containing metal fine particles, a second discharge device that discharges a curable resin, and a conductive metal lump. And a control device that controls the operation of each of the first discharge device, the second discharge device, and the holding device, and the control device has the first discharge on a substrate. By discharging the metal-containing liquid by an apparatus, a first wiring forming part for forming a first wiring, and by discharging a curable resin by the second discharging apparatus on the first wiring, A resin layer forming portion for forming a resin layer having an opening from which a part of the first wiring is exposed, and discharging the metal-containing liquid onto the resin layer by the first discharge device, thereby providing a second A second wiring forming portion for forming the wiring, and holding the metal block By placing the opening by location, and having an electrical connection portion that connects the first wiring and the second wiring electrically.

  In the conventional wiring forming method and wiring forming apparatus, for example, the resin layer having the opening in which the first wiring is formed on the base material by the metal-containing liquid and a part of the first wiring is exposed is formed on the base. Formed on the material. A second wiring is formed on the resin layer with a metal-containing liquid. And the 1st wiring and the 2nd wiring are electrically connected by laminating the metal thin film by the metal content liquid inside the opening. For this reason, in the conventional wiring formation method and wiring formation apparatus, it is necessary to laminate | stack a metal thin film in a via hole, and a throughput falls. In addition, the metal-containing liquid is fired when the metal thin film is formed, but the resin layer may be deteriorated due to the firing of the metal-containing liquid when a plurality of layers of the metal thin film are formed. On the other hand, in the wiring forming method and the wiring forming apparatus of the present invention, the first wiring and the second wiring are electrically connected by placing the conductive metal block in the opening. This eliminates the need for laminating metal thin films, improving throughput and preventing deterioration of the resin layer.

It is a figure which shows an electronic device manufacturing apparatus. It is a block diagram which shows a control apparatus. It is a schematic diagram for demonstrating the formation process of a circuit pattern. It is a schematic diagram for demonstrating the formation process of a circuit pattern. It is a schematic diagram for demonstrating the formation process of a circuit pattern. It is a schematic diagram for demonstrating the formation process of a circuit pattern. It is a schematic diagram for demonstrating the formation process of a circuit pattern. It is a schematic diagram for demonstrating the formation process of a circuit pattern. It is a schematic diagram for demonstrating the formation process of a circuit pattern. It is a schematic diagram for demonstrating the formation process of a circuit pattern. It is a schematic diagram for demonstrating the formation process of a circuit pattern. It is a schematic diagram for demonstrating the formation process of a circuit pattern. It is a schematic diagram for demonstrating the formation process of a circuit pattern. It is a schematic diagram for demonstrating the formation process of a circuit pattern. It is a schematic diagram for demonstrating the formation process of a circuit pattern.

  FIG. 1 shows an electronic device manufacturing apparatus 10. An electronic device manufacturing apparatus (hereinafter may be abbreviated as “manufacturing apparatus”) 10 includes a transport device 20, a first modeling unit 22, a second modeling unit 24, a mounting unit 26, and a control device (see FIG. 2). 27). The conveying device 20, the first modeling unit 22, the second modeling unit 24, and the mounting unit 26 are disposed on the base 28 of the manufacturing apparatus 10. The base 28 has a generally rectangular shape. In the following description, the longitudinal direction of the base 28 is orthogonal to the X-axis direction, and the short direction of the base 28 is orthogonal to both the Y-axis direction, the X-axis direction, and the Y-axis direction. The direction will be described as the Z-axis direction.

  The transport device 20 includes an X-axis slide mechanism 30 and a Y-axis slide mechanism 32. The X-axis slide mechanism 30 has an X-axis slide rail 34 and an X-axis slider 36. The X-axis slide rail 34 is disposed on the base 28 so as to extend in the X-axis direction. The X-axis slider 36 is held by an X-axis slide rail 34 so as to be slidable in the X-axis direction. Furthermore, the X-axis slide mechanism 30 has an electromagnetic motor (see FIG. 2) 38, and the X-axis slider 36 moves to an arbitrary position in the X-axis direction by driving the electromagnetic motor 38. The Y axis slide mechanism 32 includes a Y axis slide rail 50 and a stage 52. The Y-axis slide rail 50 is disposed on the base 28 so as to extend in the Y-axis direction, and is movable in the X-axis direction. One end of the Y-axis slide rail 50 is connected to the X-axis slider 36. A stage 52 is held on the Y-axis slide rail 50 so as to be slidable in the Y-axis direction. Furthermore, the Y-axis slide mechanism 32 has an electromagnetic motor (see FIG. 2) 56, and the stage 52 moves to an arbitrary position in the Y-axis direction by driving the electromagnetic motor 56. As a result, the stage 52 moves to an arbitrary position on the base 28 by driving the X-axis slide mechanism 30 and the Y-axis slide mechanism 32.

  The stage 52 includes a base 60, a holding device 62, and a lifting device 64. The base 60 is formed in a flat plate shape, and a circuit board or the like is placed on the upper surface. The holding device 62 is provided on both sides of the base 60 in the X-axis direction. Then, both edge portions in the X-axis direction of the circuit board or the like placed on the base 60 are sandwiched by the holding device 62, whereby the circuit board or the like is fixedly held. The lifting device 64 is disposed below the base 60 and lifts the base 60.

  The first modeling unit 22 is a unit that models the wiring (see FIG. 3) 80 on the circuit board (see FIG. 3) 70 placed on the base 60 of the stage 52. The first printing unit 72, And a firing section 74. The first printing unit 72 includes an inkjet head (see FIG. 2) 76 and ejects metal ink in a linear manner onto the circuit board 70 placed on the base 60. The metal ink is obtained by dispersing metal fine particles in a solvent. The inkjet head 76 discharges a conductive material from a plurality of nozzles by, for example, a piezo method using a piezoelectric element.

  The firing unit 74 includes a laser irradiation device (see FIG. 2) 78. The laser irradiation device 78 is a device that irradiates a metal ink discharged onto the circuit board 70 with a laser, and the metal ink irradiated with the laser is baked to form a wiring 80. The firing of the metal ink is a phenomenon in which, by applying energy, the solvent is vaporized, the metal particulate protective film is decomposed, etc., and the metal particulates are brought into contact with or fused to increase the conductivity. is there. And metal wiring 80 is formed by baking metal ink.

  The second modeling unit 24 is a unit that models a resin layer (see FIG. 4) 82 on the circuit board 70 placed on the base 60 of the stage 52, and includes a second printing unit 84 and a curing unit. 86. The second printing unit 84 includes an inkjet head (see FIG. 2) 88 and discharges an ultraviolet curable resin onto the circuit board 70 placed on the base 60. The ink jet head 88 may be, for example, a piezo method using a piezoelectric element, or a thermal method in which a resin is heated to generate bubbles and ejected from a nozzle.

  The curing unit 86 includes a flattening device (see FIG. 2) 90 and an irradiation device (see FIG. 2) 92. The flattening device 90 is for flattening the upper surface of the ultraviolet curable resin discharged onto the circuit board 70 by the ink jet head 88. For example, the surface of the ultraviolet curable resin is smoothed while the surface of the ultraviolet curable resin is leveled. Alternatively, the thickness of the ultraviolet curable resin is made uniform by scraping with a blade. The irradiation device 92 includes a mercury lamp or LED as a light source, and irradiates the ultraviolet curable resin discharged onto the circuit board 70 with ultraviolet rays. Thereby, the ultraviolet curable resin discharged onto the circuit board 70 is cured, and the resin layer 82 is formed.

  In addition, the mounting unit 26 has a metal block (see FIG. 6) 95, (see FIG. 9) 96, (see FIG. 11) 97, (see FIG. 14) on the circuit board 70 placed on the base 60 of the stage 52. Reference) is a unit for mounting 98, and has a discharge unit 100, a supply unit 102, and a mounting unit 104. The discharge unit 100 has an inkjet head (see FIG. 2) 110 and discharges a conductive adhesive onto the circuit board 70 placed on the base 60. A conductive adhesive is an adhesive that cures at room temperature. For example, by bonding two members with a conductive adhesive and curing the conductive adhesive, the two members are electrically connected. To do. The inkjet head 110 ejects a conductive material from a plurality of nozzles by, for example, a piezo method using a piezoelectric element. Moreover, the supply part 102 supplies the metal lump 95,96,97,98 in a supply position. The metal masses 95, 96, 97, and 98 are conductive metals, specifically, silver masses, and various shapes such as a spherical shape, a cylindrical shape, and a rivet shape are arbitrarily supplied.

  The mounting unit 104 has a mounting head (see FIG. 2) 112. The mounting head 112 has a suction nozzle (see FIG. 9 and the like) 114 for holding the metal blocks 95, 96, 97, and 98, and is mounted on the supply position of the supply unit 102 and the base 60. The mounting head 112 is moved between the circuit board 70 and the circuit board 70. As a result, in the mounting unit 104, the metal blocks 95, 96, 97, 98 supplied by the supply unit 102 are held by the suction nozzle 114, and the metal blocks 95, 96, 97, 98 held by the suction nozzle 114. Is mounted on the circuit board 70.

  Further, as shown in FIG. 2, the control device 27 includes a controller 120 and a plurality of drive circuits 122. The plurality of drive circuits 122 include the electromagnetic motors 38 and 56, the holding device 62, the lifting device 64, the inkjet head 76, the laser irradiation device 78, the inkjet head 88, the flattening device 90, the irradiation device 92, the supply unit 102, and the inkjet head. 110, connected to the mounting head 112. The controller 120 includes a CPU, a ROM, a RAM, and the like, is mainly a computer, and is connected to a plurality of drive circuits 122. Thereby, the operation of the transport device 20, the first modeling unit 22, the second modeling unit 24, and the mounting unit 26 is controlled by the controller 120.

<Operation of manufacturing equipment>
In the manufacturing apparatus 10, a multilayer circuit pattern is formed on the circuit board 70 with the above-described configuration. Specifically, the circuit board 70 is set on the base 60 of the stage 52, and the stage 52 is moved below the first modeling unit 22. In the first printing unit 72, the metal ink is ejected linearly on the circuit board 70 by the inkjet head 76 according to the circuit pattern. Next, in the firing unit 74, the laser is irradiated by the laser irradiation device 78 on the metal ink discharged onto the circuit board 70. Thereby, the metal ink is baked, and the wiring 80 is formed on the circuit board 70 as shown in FIG.

  When the wiring 80 is formed on the circuit board 70, a resin layer 82 is formed on the circuit board 70 so as to cover the wiring 80 as shown in FIG. The resin layer 82 has a via hole 130 for exposing a part of the wiring 80. The resin layer 82 discharges ultraviolet curable resin from the inkjet head 88, and irradiates ultraviolet rays from the irradiation device 92 to the discharged ultraviolet curable resin. It is formed by repeating irradiation. Specifically, the stage 52 is moved below the second modeling unit 24, and in the second printing unit 84, an ultraviolet curable resin is formed into a thin film on the circuit board 70 so that the inkjet head 88 covers the wiring 80. Discharge. However, the ultraviolet curable resin is discharged to a portion excluding a circular portion centering on a part of the wiring 80. That is, the inkjet head 88 discharges the ultraviolet curable resin in a thin film shape on the circuit board 70 so that a part of the wiring 80 is exposed in a circular shape and the wiring 80 other than the part is covered. When the ultraviolet curable resin is discharged in the form of a thin film, the ultraviolet curable resin is flattened by the flattening device 90 so that the film thickness becomes uniform. In the curing unit 86, the irradiation device 92 irradiates the thin film-shaped ultraviolet curable resin with ultraviolet rays. As a result, a thin resin layer is formed on the circuit board 70.

  Subsequently, the inkjet head 88 discharges the ultraviolet curable resin into a thin film only on the upper part of the thin resin layer. That is, the inkjet head 88 discharges the ultraviolet curable resin in a thin film shape on the thin resin layer so that a part of the wiring 80 is exposed in a circular shape. Then, the thin film ultraviolet curable resin is flattened by the flattening device 90, and the irradiation device 92 irradiates the ultraviolet curable resin discharged in the thin film shape with ultraviolet rays, so that a thin film is formed on the thin film resin layer. -Like resin layers are laminated. As described above, the discharge of the ultraviolet curable resin onto the thin resin layer excluding the portion where the part of the wiring 80 is exposed in a circular shape and the irradiation with the ultraviolet rays are repeated, whereby the via hole 130 is formed. A resin layer 82 having the above is formed.

  When the resin layer 82 is formed by the above-described procedure, the wiring 80 formed on the circuit board 70 needs to be conducted to the upper surface side of the resin layer 82 in order to stack the circuit patterns. At this time, in the conventional method, the discharge of the metal ink into the via hole 130 and the laser irradiation to the metal ink are repeated, so that the conductor 132 is placed inside the via hole 130 as shown in FIG. Is formed, and the wirings 80 formed on the circuit board 70 are electrically connected to the upper surface side of the resin layer 82 by the conductor 132. Specifically, when the resin layer 82 is formed on the circuit board 70, the inkjet head 76 ejects metal ink into the via hole 130 in a thin film shape in the first printing unit 72 of the first modeling unit 22. . Next, in the baking part 74, the laser irradiation apparatus 78 irradiates a laser to the metal ink discharged by the thin film form. As a result, a metal thin film is formed inside the via hole 130. Then, by repeating the discharge of the metal ink into the via hole 130 and the laser irradiation of the discharged metal ink, a metal thin film is laminated inside the via hole 130 to form the conductor 132. Is done.

  As described above, in the conventional method, the metal thin film is laminated inside the via hole 130, whereby the wiring 80 formed on the circuit board 70 is conducted to the upper surface side of the resin layer 82. However, according to this method, it is necessary to repeat the discharge of the metal ink into the via hole 130 and the laser irradiation of the discharged metal ink a plurality of times, so that the throughput is lowered. Further, there is a possibility that the resin layer 82 is deteriorated by the laser irradiation into the via hole 130 a plurality of times.

  In view of the above, in the manufacturing apparatus 10, as shown in FIG. 6, a plurality of metal masses 95 are placed inside the via holes 130, and the plurality of metal masses 95 are melted. As a result, the metal mass 95 is deformed into a conductor (see FIG. 7) 136 having a shape corresponding to the via hole 130, and the wiring 80 formed on the circuit board 70 is conducted to the upper surface side of the resin layer 82. . Specifically, when the resin layer 82 is formed on the circuit board 70, the stage 52 is moved below the mounting unit 26. In the mounting unit 26, the spherical metal mass 95 is supplied by the supply unit 102, and the metal mass 95 is held by the suction nozzle 114 of the mounting head 112. Subsequently, the metal mass 95 held by the suction nozzle 114 is placed inside the via hole 130 of the resin layer 82. The holding of the metal mass 95 by the suction nozzle 114 and the placement of the metal mass 95 inside the via hole 130 are repeated, so that a plurality of metal masses are placed inside the via hole 130 as shown in FIG. 95 is placed. A number of metal blocks 95 corresponding to the internal capacity of the via hole 130 are placed inside the via hole 130.

  When the placement of the metal mass 95 inside the via hole 130 is completed, the stage 52 is moved below the first modeling unit 22. In the first modeling unit 22, the laser irradiation device 78 irradiates the laser toward the plurality of metal blocks 95 placed inside the via hole 130. As a result, the plurality of metal masses 95 are melted and transformed into a conductor (see FIG. 7) 136 having a shape corresponding to the via hole 130. As described above, in the manufacturing apparatus 10, the metal mass 95 placed in the via hole 130 is melted to form the conductor 136 in the via hole 130, and the wiring 80 formed on the circuit board 70 is replaced with the wiring 80. The resin layer 82 is electrically connected to the upper surface side. This eliminates the need to repeat the discharge of metal ink and laser irradiation a plurality of times as in the conventional method, thereby improving throughput and reducing damage to the resin layer 82 due to laser irradiation. Become.

  When the conductor 136 is formed by melting the metal lump 95, as shown in FIG. 7, in the first modeling unit 22, a wiring 138 is formed on the resin layer 82, and the wiring 138 and the circuit board are formed. Wiring 80 formed on 70 is electrically connected by a conductor 136. Specifically, when the conductor 136 is formed by melting the metal lump 95, the metal ink is applied to the upper surface of the resin layer 82 so that the inkjet head 76 intersects the upper surface of the conductor 136 in the first printing unit 72. Discharge linearly. Then, in the firing unit 74, the laser irradiation device 78 irradiates the metal ink ejected on the resin layer 82 with a laser, so that the metal ink is fired, and as shown in FIG. In addition, a wiring 138 intersecting with the upper surface of the conductor 136 is formed. As a result, the wiring 138 formed on the resin layer 82 and the wiring 80 formed on the circuit board 70 are electrically connected by the conductor 136, and a multilayer circuit pattern is formed on the circuit board 70. Is formed.

  Moreover, in the manufacturing apparatus 10, it is possible to electrically connect the wiring formed on the resin layer and the wiring formed on the circuit board 70 without melting the metal block. Specifically, first, as shown in FIG. 8, the wiring 150 is formed on the circuit board 70, and a part of the wiring 150 is exposed through the via hole 152. A resin layer 156 is formed. Since the method for forming the wiring 150 and the resin layer 156 is the same as the method for forming the wiring 80 and the resin layer 82, description thereof is omitted. The via hole 152 of the resin layer 156 has a cylindrical shape.

  When the wiring 150 and the resin layer 156 are formed on the circuit board 70, the stage 52 is moved to the mounting unit 26. In the ejection unit 100, the inkjet head 110 ejects a conductive adhesive (see FIG. 9) 158 onto the wiring 150 exposed from the via hole 152. Moreover, in the supply part 102, the metal lump (refer FIG. 9) 96 is supplied in a supply position. The metal mass 96 is generally cylindrical and has a shape corresponding to the shape of the via hole 152. Specifically, the metal block 96 has a cylindrical shape having a height substantially the same as the depth of the via hole 152, and the outer diameter of the metal block 96 is slightly smaller than the inner diameter of the via hole 152. Then, the metal mass 96 is held by the suction nozzle 114 of the mounting head 112 as shown in FIG.

  Next, the metal block 96 held by the suction nozzle 114 is placed inside the via hole 152 of the resin layer 156. At this time, the bottom surface of the metal lump 96 is in close contact with the conductive adhesive 158 discharged onto the wiring 150, and the metal lump 96 is bonded to the wiring 150 by the conductive adhesive 158. As a result, the metal block 96 is electrically connected to the wiring 150. When the metal block 96 is placed inside the via hole 152, in the first printing unit 72, the metal ink is linearly applied to the upper surface of the resin layer 156 so that the inkjet head 76 intersects the upper surface of the metal block 96. To discharge. Then, in the firing unit 74, the laser irradiation device 78 irradiates the metal ink discharged onto the resin layer 156 with laser, whereby the metal ink is fired. As a result, as shown in FIG. 10, the wiring 160 intersecting with the upper surface of the metal lump 96 is formed on the resin layer 156. Thus, in the manufacturing apparatus 10, the metal lump 96 is bonded to the wiring 150 with the conductive adhesive 158, thereby forming the wiring 160 formed on the resin layer 156 and the circuit board 70. The wiring 150 is electrically connected, and a multilayer circuit pattern is formed on the circuit board 70.

  Moreover, in the manufacturing apparatus 10, it is possible to electrically connect the wiring formed on the resin layer and the wiring formed on the circuit board without using the conductive adhesive 158. Specifically, as shown in FIG. 8, a wiring 150 is formed on the circuit board 70, and a resin is formed on the circuit board 70 so that a part of the wiring 150 is exposed through the via hole 152. Layer 156 is formed.

  When the wiring 150 and the resin layer 156 are formed on the circuit board 70, the stage 52 is moved to the mounting unit 26. In the supply unit 102 of the mounting unit 26, a metal lump (see FIG. 11) 97 is supplied at the supply position. The metal block 97 is composed of a cylindrical portion 170 and a conical portion 172. The cylindrical portion 170 has a columnar shape having a height substantially the same as the depth of the via hole 152, and the outer diameter of the cylindrical portion 170 is slightly smaller than the inner diameter of the via hole 152. The conical portion 172 is formed on the bottom surface of the cylindrical portion 170 with the conical tip facing downward. Then, the metal mass 97 is held by the suction nozzle 114 of the mounting head 112 as shown in FIG.

  Next, the metal block 97 held by the suction nozzle 114 is placed inside the via hole 152 of the resin layer 156. At this time, the metal block 97 is pressed inside the via hole 152. As a result, the conical portion 172 of the metal mass 97 penetrates the wiring 150 in the via hole 152, and the metal mass 97 is electrically connected to the wiring 150. When the metal block 97 is placed inside the via hole 152, the first printing unit 72 forms a line of metal ink on the upper surface of the resin layer 156 so that the inkjet head 76 intersects the upper surface of the metal block 97. To discharge. Then, in the firing unit 74, the laser irradiation device 78 irradiates the metal ink discharged onto the resin layer 156 with laser, whereby the metal ink is fired. As a result, as shown in FIG. 12, the wiring 178 intersecting with the upper surface of the metal block 97 is formed on the resin layer 156. As described above, in the manufacturing apparatus 10, the conical portion 172 of the metal lump 97 penetrates the wiring 150, so that the wiring 178 formed on the resin layer 156 and the wiring 150 formed on the circuit board 70 Are electrically connected, and a multilayer circuit pattern is formed on the circuit board 70.

  Moreover, in the manufacturing apparatus 10, it is possible to electrically connect the wiring formed on the resin layer and the wiring formed on the circuit board using a rivet-shaped metal lump. Specifically, as shown in FIG. 8, a wiring 150 is formed on the circuit board 70, and a resin is formed on the circuit board 70 so that a part of the wiring 150 is exposed through the via hole 152. Layer 156 is formed.

  When the wiring 150 and the resin layer 156 are formed on the circuit board 70, in the first printing unit 72, the ink jet head 76 lines the metal ink on the upper surface of the resin layer 156 so as to reach the edge of the via hole 152. To be discharged. Then, in the firing unit 74, the laser irradiation device 78 irradiates the metal ink discharged onto the resin layer 156 with laser, whereby the metal ink is fired. As a result, as shown in FIG. 13, the wiring 180 reaching the edge of the via hole 152 is formed on the resin layer 156. Next, the stage 52 is moved to the mounting unit 26. In the ejection unit 100, the inkjet head 110 ejects a conductive adhesive (see FIG. 14) 182 onto the wiring 150 exposed from the via hole 152. Further, the inkjet head 110 discharges a conductive adhesive (see FIG. 14) 184 on the end portion of the wiring 180 near the edge of the via hole 152.

  And in the supply part 102, the metal lump (refer FIG. 14) 98 is supplied in a supply position. The metal lump 98 has a rivet shape and includes a cylindrical portion 186 and a flange portion 188. The cylindrical portion 186 has a cylindrical shape having a height substantially the same as the depth of the via hole 152, and the outer diameter of the cylindrical portion 186 is slightly smaller than the inner diameter of the via hole 152. The flange portion 188 protrudes in a disk shape in the radial direction at the upper end of the columnar portion 186. Then, the metal mass 98 is held by the suction nozzle 114 of the mounting head 112 as shown in FIG.

  Next, the metal lump 98 held by the suction nozzle 114 is placed inside the via hole 152 of the resin layer 156, as shown in FIG. At this time, the bottom surface of the cylindrical portion 186 of the metal lump 98 is in close contact with the conductive adhesive 182 discharged onto the wiring 150, and the cylindrical portion 186 is bonded to the wiring 150 by the conductive adhesive 182. Thereby, the metal lump 96 and the wiring 150 are electrically connected. Further, the flange portion 188 of the metal lump 98 is in close contact with the conductive adhesive 184 discharged onto the wiring 180, and the flange portion 188 is bonded to the wiring 180 by the conductive adhesive 184. Thereby, the metal lump 98 and the wiring 180 are electrically connected. As described above, in the manufacturing apparatus 10, the rivet-shaped metal lump 98 is placed in the via hole 152, whereby the wiring 180 formed on the resin layer 156 and the wiring formed on the circuit board 70. 150 is electrically connected, and a multilayer circuit pattern is formed on the circuit board 70.

  As described above, in the manufacturing apparatus 10, the metal masses 95, 96, 97, and 98 are placed in the via holes 130 and 152, and the wiring and the metal mass are electrically connected by melting, penetration, adhesion, or the like. This eliminates the need to repeat the discharge of the metal ink and the laser irradiation a plurality of times as in the conventional method, thereby improving the throughput and reducing the damage to the resin layers 82 and 156 due to the laser irradiation. It becomes possible.

  As shown in FIG. 2, the controller 120 of the control device 27 includes a first wiring forming unit 200, a resin layer forming unit 202, a second wiring forming unit 204, and an electrical connection unit 206. Yes. The first wiring forming unit 200 is a functional unit for forming the wiring 80 on the circuit board 70. The resin layer forming unit 202 is a functional unit for forming the resin layers 82 and 156 on the circuit board 70. The second wiring forming unit 204 is a functional unit for forming the wirings 138, 160, 178 and 180 on the resin layers 82 and 156. The electrical connection portion 206 is formed on the wiring 80 and the resin layers 82 and 156 formed on the circuit board 70 by placing the metal blocks 95, 96, 97 and 98 in the via holes 130 and 152. This is a functional unit for electrically connecting the wirings 138, 160, 178, and 180.

  Incidentally, in the said Example, the manufacturing apparatus 10 is an example of a wiring formation apparatus. The control device 27 is an example of a control device. The circuit board 70 is an example of a base material. The inkjet head 76 is an example of a first discharge device. The wiring 80 is an example of a first wiring. The resin layers 82 and 156 are examples of resin layers. The inkjet head 88 is an example of a second ejection device. The metal blocks 95, 96, 97, and 98 are examples of metal blocks. The mounting head 112 is an example of a holding device. The via holes 130 and 152 are examples of openings. The wirings 138, 160, 178, and 180 are examples of the second wiring. The conductive adhesives 158, 182, and 184 are examples of conductive viscous fluids. The cylindrical portions 170 and 186 are examples of the main body portion. The conical part 172 is an example of a convex part. The flange portion 188 is an example of a flange portion. The metal ink is an example of a metal-containing liquid. The ultraviolet curable resin is an example of a curable resin. The first wiring formation unit 200 is an example of a first wiring formation unit. The resin layer forming unit 202 is an example of a resin layer forming unit. The second wiring formation unit 204 is an example of a second wiring formation unit. The electrical connection unit 206 is an example of an electrical connection unit. The process executed by the first wiring forming unit 200 is an example of a first wiring forming process. The process executed by the resin layer forming unit 202 is an example of a resin layer forming process. The process executed by the second wiring forming unit 204 is an example of a second wiring forming process. The process executed by the electrical connection unit 206 is an example of an electrical connection process.

  In addition, this invention is not limited to the said Example, It is possible to implement in the various aspect which gave various change and improvement based on the knowledge of those skilled in the art. For example, in the above embodiment, a plurality of metal chunks 95 are placed in the via hole 130 and the plurality of metal chunks 95 are melted. However, one metal chunk is placed in the via hole 130 and the metal The mass may be melted. However, in such a case, it is necessary to employ a metal block having a size corresponding to the internal capacity of the via hole 130 as the metal block placed in the via hole 130.

  Further, in the above embodiment, the rivet-shaped metal block 98 is electrically connected to the wiring 150 by the conductive adhesive 182 on the bottom surface of the cylindrical portion 186, but a conical portion is formed on the lower surface of the cylindrical portion 186. The metal lump 98 and the wiring 150 may be electrically connected by penetrating the conical portion into the wiring 150.

  Further, in the above embodiment, the metal lump and the wiring are electrically connected by the conductive adhesive, but the metal lump and the wiring are electrically connected by a conductive viscous fluid such as metal ink or conductive paste. It is possible to connect.

  DESCRIPTION OF SYMBOLS 10: Manufacturing apparatus (wiring formation apparatus) 27: Control apparatus 70: Circuit board (base material) 76: Inkjet head (1st discharge apparatus) 80: Wiring (1st wiring) 82: Resin layer 88: Inkjet head (1st 95: Metal block 97: Metal block 98: Metal block 112: Mounting head (holding device) 130: Via hole (opening) 138: Wiring (second wiring) 152: Via hole ( 156: Resin layer 158: Conductive adhesive (conductive viscous fluid) 160: Wiring (second wiring) 170: Cylindrical part (main body) 172: Conical part (convex part) 178: Wiring (second) 180: Wiring (second wiring) 182: Conductive adhesive (conductive viscous fluid) 184: Conductive adhesive (conductive viscous fluid) 186: Cylinder (Main part) 188: Flange part 200: First wiring forming part (first wiring forming process) 202: Resin layer forming part (resin layer forming process) 204: Second wiring forming part (second wiring forming process) 206: Electrical connection (electrical connection process)

Claims (7)

A first wiring forming step of forming a first wiring with a metal-containing liquid containing metal fine particles on a substrate;
A resin layer forming step of forming a resin layer having an opening from which a part of the first wiring is exposed on the first wiring;
A second wiring forming step of forming a second wiring with the metal-containing liquid on the resin layer;
An electrical connection step of electrically connecting the first wiring and the second wiring by placing a conductive metal block in the opening. The electrical connection step includes
The wiring forming method according to claim 1, further comprising: melting the metal lump after placing the metal lump in the opening. The electrical connection step includes
Discharging the conductive viscous fluid onto the first wiring exposed from the opening, and placing the metal block corresponding to the shape of the opening on the conductive viscous fluid. The wiring formation method according to claim 1. The electrical connection step includes
The wiring forming method according to claim 3, further comprising a step of placing the metal block having a height corresponding to a thickness dimension of the resin layer on the conductive viscous fluid. The metal mass is
A main body according to the shape of the opening,
A convex portion projecting downward from the lower surface of the main body portion,
The electrical connection step includes
2. The wiring forming method according to claim 1, further comprising a step of penetrating the first wiring through the convex portion by pressing the metal block against the opening. The metal mass is
A main body according to the shape of the opening,
A flange formed on the upper end of the main body,
The electrical connection step includes
Discharging the conductive viscous fluid onto the second wiring, and placing the main body portion in the opening so that the conductive viscous fluid and the flange portion are in close contact with each other. The wiring formation method according to any one of claims 3 to 5. A first discharge device for discharging a metal-containing liquid containing metal fine particles;
A second discharge device for discharging a curable resin;
A holding device for holding a conductive metal mass;
A control device for controlling the operation of each of the first discharge device, the second discharge device, and the holding device;
The control device is
A first wiring forming part for forming a first wiring by discharging the metal-containing liquid on the substrate by the first discharging device;
A resin layer forming part that forms a resin layer having an opening through which a part of the first wiring is exposed by discharging a curable resin on the first wiring by the second discharge device;
A second wiring forming part for forming a second wiring by discharging the metal-containing liquid on the resin layer by the first discharging device;
An electrical connection portion that electrically connects the first wiring and the second wiring by placing the metal block on the opening by the holding device. apparatus.

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