JPWO2015141719A1 - 感放射線樹脂組成物及び電子部品 - Google Patents
感放射線樹脂組成物及び電子部品 Download PDFInfo
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- JPWO2015141719A1 JPWO2015141719A1 JP2016508760A JP2016508760A JPWO2015141719A1 JP WO2015141719 A1 JPWO2015141719 A1 JP WO2015141719A1 JP 2016508760 A JP2016508760 A JP 2016508760A JP 2016508760 A JP2016508760 A JP 2016508760A JP WO2015141719 A1 JPWO2015141719 A1 JP WO2015141719A1
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- SRPWOOOHEPICQU-UHFFFAOYSA-N trimellitic anhydride Chemical compound OC(=O)C1=CC=C2C(=O)OC(=O)C2=C1 SRPWOOOHEPICQU-UHFFFAOYSA-N 0.000 description 1
- JLGNHOJUQFHYEZ-UHFFFAOYSA-N trimethoxy(3,3,3-trifluoropropyl)silane Chemical compound CO[Si](OC)(OC)CCC(F)(F)F JLGNHOJUQFHYEZ-UHFFFAOYSA-N 0.000 description 1
- ZNOCGWVLWPVKAO-UHFFFAOYSA-N trimethoxy(phenyl)silane Chemical compound CO[Si](OC)(OC)C1=CC=CC=C1 ZNOCGWVLWPVKAO-UHFFFAOYSA-N 0.000 description 1
- HQYALQRYBUJWDH-UHFFFAOYSA-N trimethoxy(propyl)silane Chemical compound CCC[Si](OC)(OC)OC HQYALQRYBUJWDH-UHFFFAOYSA-N 0.000 description 1
- ORVBHOQTQDOUIW-UHFFFAOYSA-N trimethoxy(trifluoromethyl)silane Chemical compound CO[Si](OC)(OC)C(F)(F)F ORVBHOQTQDOUIW-UHFFFAOYSA-N 0.000 description 1
- 125000002948 undecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- NQPDZGIKBAWPEJ-UHFFFAOYSA-N valeric acid Chemical compound CCCCC(O)=O NQPDZGIKBAWPEJ-UHFFFAOYSA-N 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Classifications
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- G—PHYSICS
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- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/075—Silicon-containing compounds
- G03F7/0751—Silicon-containing compounds used as adhesion-promoting additives or as means to improve adhesion
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- C08K5/544—Silicon-containing compounds containing nitrogen
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- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
- G03F7/0226—Quinonediazides characterised by the non-macromolecular additives
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- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
- G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
- G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
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- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
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- G03F7/004—Photosensitive materials
- G03F7/075—Silicon-containing compounds
- G03F7/0755—Non-macromolecular compounds containing Si-O, Si-C or Si-N bonds
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Abstract
Description
〔1〕バインダー樹脂(A)、感放射線化合物(B)、架橋剤(C)、及び下記一般式(1)で表されるシランカップリング剤(D)を含有する感放射線樹脂組成物、
〔2〕前記バインダー樹脂(A)が、プロトン性極性基を有する環状オレフィン重合体である前記〔1〕に記載の感放射線樹脂組成物、
〔3〕前記架橋剤(C)が、エポキシ基を有するエポキシ化合物を含む前記〔1〕又は〔2〕に記載の感放射線樹脂組成物、
〔4〕前記エポキシ化合物の全塩素量が1500ppm以下である前記〔3〕に記載の感放射線樹脂組成物、
〔5〕前記架橋剤(C)が、アルコキシアルキル基を有する化合物をさらに含む前記〔3〕又は〔4〕に記載の感放射線樹脂組成物、
〔6〕前記架橋剤(C)の含有量が、前記バインダー樹脂(A)100重量部に対して、5〜80重量部である前記〔1〕〜〔5〕のいずれかに記載の感放射線樹脂組成物、
〔7〕前記シランカップリング剤(D)の含有量が、前記バインダー樹脂(A)100重量部に対して、0.01〜100重量部である前記〔1〕〜〔6〕のいずれかに記載の感放射線樹脂組成物、
〔8〕フェノール樹脂(E)をさらに含有する前記〔1〕〜〔7〕のいずれかに記載の感放射線樹脂組成物、ならびに、
〔9〕前記〔1〕〜〔8〕のいずれかに記載の感放射線樹脂組成物からなる樹脂膜を備える電子部品、
が提供される。
本発明で用いるバインダー樹脂(A)としては、特に限定されないが、プロトン性極性基を有する環状オレフィン重合体(A1)、アクリル樹脂(A2)、ポリイミド(A3)、カルド樹脂(A4)又はポリシロキサン(A5)であることが好ましく、これらの中でも、プロトン性極性基を有する環状オレフィン重合体(A1)が特に好ましい。
これらのバインダー樹脂(A)は、それぞれ単独で用いてもよく、又は2種以上を併用してもよい。
本発明において、プロトン性極性基を有する環状オレフィン樹脂に結合しているプロトン性極性基の数に特に限定はなく、また、相異なる種類のプロトン性極性基が含まれていてもよい。
これら単量体(b2)は、それぞれ単独で用いてもよく、2種以上を組み合わせて用いてもよい。
これら単量体(b3)は、それぞれ単独で用いてもよく、2種以上を組み合わせて用いてもよい。
プロトン性極性基を有しない重合体は、上述した単量体(b1)及び(b2)のうち少なくとも一種と、必要に応じて単量体(b3)とを任意に組み合わせて重合することによって得ることができる。
このような化合物の具体例としては、アクリル酸、メタクリル酸、アンゲリカ酸、チグリン酸、オレイン酸、エライジン酸、エルカ酸、ブラシジン酸、マレイン酸、フマル酸、シトラコン酸、メサコン酸、イタコン酸、アトロパ酸、ケイ皮酸等の不飽和カルボン酸;アリルアルコール、メチルビニルメタノール、クロチルアルコール、メタリルアルコール、1−フェニルエテン−1−オール、2−プロペン−1−オール、3−ブテン−1−オール、3−ブテン−2−オール、3−メチル−3−ブテン−1−オール、3−メチル−2−ブテン−1−オール、2−メチル−3−ブテン−2−オール、2−メチル−3−ブテン−1−オール、4−ペンテン−1−オール、4−メチル−4−ぺンテン−1−オール、2−ヘキセン−1−オール等の不飽和アルコール;等が挙げられる。
これら変性剤を用いた重合体の変性反応は、常法に従えばよく、通常、ラジカル発生剤の存在下で行われる。
アクリル基を有するカルボン酸無水物の具体例としては、無水マレイン酸、シトラコン酸無水物等が挙げられる。
エポキシ基含有アクリレート化合物の具体例としては、アクリル酸グリシジル、メタクリル酸グリシジル、α−エチルアクリル酸グリシジル、α−n−プロピルアクリル酸グリシジル、α−n−ブチルアクリル酸グリシジル、アクリル酸−3,4−エポキシブチル、メタクリル酸−3,4−エポキシブチル、アクリル酸−6,7−エポキシヘプチル、メタクリル酸−6,7−エポキシヘプチル、α−エチルアクリル酸−6,7−エポキシヘプチル、アクリル酸−3,4−エポキシシクロヘキシルメチル、メタクリル酸−3,4−エポキシシクロヘキシルメチル等が挙げられる。
オキセタン基含有アクリレート化合物の具体例としては、(メタ)アクリル酸(3−メチルオキセタン−3−イル)メチル、(メタ)アクリル酸(3−エチルオキセタン−3−イル)メチル、(メタ)アクリル酸(3−メチルオキセタン−3−イル)エチル、(メタ)アクリル酸(3−エチルオキセタン−3−イル)エチル、(メタ)アクリル酸(3−クロロメチルオキセタン−3−イル)メチル、(メタ)アクリル酸(オキセタン−2−イル)メチル、(メタ)アクリル酸(2−メチルオキセタン−2−イル)メチル、(メタ)アクリル酸(2−エチルオキセタン−2−イル)メチル、(1−メチル−1−オキセタニル−2−フェニル)−3−(メタ)アクリレート、(1−メチル−1−オキセタニル)−2−トリフロロメチル−3−(メタ)アクリレート、及び(1−メチル−1−オキセタニル)−4−トリフロロメチル−2−(メタ)アクリレート等が挙げられる。
これらのうち、(メタ)アクリル酸、無水マレイン酸、(メタ)アクリル酸グリシジル、メタクリル酸−6,7−エポキシヘプチル等が好ましい。
これらのなかでも、メチル(メタ)アクリレート、ブチル(メタ)アクリレート、シクロヘキシル(メタ)アクリレート、2−メチルシクロヘキシル(メタ)アクリレート、ベンジル(メタ)アクリレート、トリシクロ[5.2.1.0 2 , 6 ]デカン−8−イル(メタ)アクリレート、N−フェニルマレイミド及びN−シクロヘキシルマレイミド等が好ましい。
これらの化合物は、それぞれ単独で用いてもよく、2種以上を組み合わせて用いてもよい。
上記単量体の重合方法は、常法に従えばよく、例えば、懸濁重合法,乳化重合法,溶液重合法等が採用される。
環状構造を構成している4級炭素原子に二つの環状構造が結合した骨格構造の具体例としては、フルオレン骨格、ビスフェノールフルオレン骨格、ビスアミノフェニルフルオレン骨格、エポキシ基を有するフルオレン骨格、アクリル基を有するフルオレン骨格等が挙げられる。
本発明で用いるカルド樹脂(A4)は、このカルド構造を有する骨格がそれに結合している官能基間の反応等により重合して形成される。カルド樹脂(A4)は、主鎖と嵩高い側鎖が一つの元素で繋がれた構造(カルド構造)をもち、主鎖に対してほぼ垂直方向に環状構造を有している。
カルド樹脂(A4)は、カルド構造を有する単量体を重合して得られる重合体であるが、その他の共重合可能な単量体との共重合体であってもよい。
上記単量体の重合方法は、常法に従えばよく、例えば、開環重合法や付加重合法等が採用される。
(R14)p−Si−(OR15)4−p (5)
これらのオルガノシランのうち、得られる樹脂膜の耐クラック性や硬度の点から3官能性シランが好ましく用いられる。これらのオルガノシランは単独で使用しても、2種以上を組み合わせて使用してもよい。
また、バインダー樹脂(A)の分子量分布は、重量平均分子量/数平均分子量(Mw/Mn)比で、通常、4以下、好ましくは3以下、より好ましくは2.5以下である。
バインダー樹脂(A)の重量平均分子量(Mw)や分子量分布(Mw/Mn)は、テトラヒドロフラン等の溶媒を溶離液としたゲル・パーミエーション・クロマトグラフィー(GPC)により、ポリスチレン換算値として求められる値である。
感放射線化合物(B)は、紫外線や電子線等の放射線の照射により、化学反応を引き起こすことのできる化合物である。本発明において感放射線化合物(B)は、感放射線樹脂組成物から形成されてなる樹脂膜のアルカリ溶解性を制御できるものが好ましく、特に、光酸発生剤を使用することが好ましい。
これらの感放射線化合物は、それぞれ単独で、又は2種以上を組み合わせて用いることができる。
本発明の感放射線樹脂組成物は、上述したバインダー樹脂(A)及び感放射線化合物(B)に加えて、架橋剤(C)を含有する。
本発明で用いるエポキシ化合物の全塩素量は1500ppm以下が好ましく、より好ましくは800ppm以下、さらに好ましくは300ppm以下である。全塩素量が前記範囲であるエポキシ化合物を用いた場合には、配線の腐食やマイグレーションが低減されるという点で優れた効果がある。
また、本発明の感放射線樹脂組成物は、上述したバインダー樹脂(A)、感放射線化合物(B)、及び架橋剤(C)に加えて、下記一般式(1)で表されるシランカップリング剤(D)を含有する。
また、本発明の感放射線樹脂組成物は、上述した各成分に加えて、フェノール樹脂(E)をさらに含有していてもよい。フェノール樹脂(E)は、本発明の感放射線樹脂組成物から形成される樹脂膜の現像密着性をより向上させるために用いられる。
また、本発明の感放射線樹脂組成物には、さらに、溶剤が含有されていてもよい。溶剤としては、特に限定されず、樹脂組成物の溶剤として公知のもの、例えばアセトン、メチルエチルケトン、シクロペンタノン、2−ヘキサノン、3−ヘキサノン、2−ヘプタノン、3−ヘプタノン、4−ヘプタノン、2−オクタノン、3−オクタノン、4−オクタノンなどの直鎖のケトン類;n−プロピルアルコール、イソプロピルアルコール、n−ブチルアルコール、シクロヘキサノールなどのアルコール類;エチレングリコールジメチルエーテル、エチレングリコールジエチルエーテル、ジオキサンなどのエーテル類;エチレングリコールモノメチルエーテル、エチレングリコールモノエチルエーテルなどのアルコールエーテル類;ギ酸プロピル、ギ酸ブチル、酢酸プロピル、酢酸ブチル、プロピオン酸メチル、プロピオン酸エチル、酪酸メチル、酪酸エチル、乳酸メチル、乳酸エチルなどのエステル類;セロソルブアセテート、メチルセロソルブアセテート、エチルセロソルブアセテート、プロピルセロソルブアセテート、ブチルセロソルブアセテートなどのセロソルブエステル類;プロピレングリコール、プロピレングリコールモノメチルエーテル、プロピレングリコールモノメチルエーテルアセテート、プロピレングリコールモノエチルエーテルアセテート、プロピレングリコールモノブチルエーテルなどのプロピレングリコール類;ジエチレングリコールモノメチルエーテル、ジエチレングリコールモノエチルエーテル、ジエチレングリコールジメチルエーテル、ジエチレングリコールジエチルエーテル、ジエチレングリコールメチルエチルエーテルなどのジエチレングリコール類;γ−ブチロラクトン、γ−バレロラクトン、γ−カプロラクトン、γ−カプリロラクトンなどの飽和γ−ラクトン類;トリクロロエチレンなどのハロゲン化炭化水素類;トルエン、キシレンなどの芳香族炭化水素類;ジメチルアセトアミド、ジメチルホルムアミド、N−メチルアセトアミドなどの極性溶媒などが挙げられる。これらの溶剤は、単独でも2種以上を組み合わせて用いてもよい。溶剤の含有量は、バインダー樹脂(A)100重量部に対して、好ましくは10〜10000重量部、より好ましくは50〜5000重量部、さらに好ましくは100〜1000重量部の範囲である。なお、樹脂組成物に溶剤を含有させる場合には、溶剤は、通常、硬化膜形成後に除去されることとなる。
混合の方法は特に限定されないが、感放射線樹脂組成物を構成する各成分を溶剤に溶解又は分散して得られる溶液又は分散液を混合するのが好ましい。これにより、感放射線樹脂組成物は、溶液又は分散液の形態で得られる。
次いで、本発明の電子部品について、説明する。本発明の電子部品は、上述した本発明の感放射線樹脂組成物からなる樹脂膜を有する。
潜像パターンを有する樹脂膜に現像液を接触させる方法としては、例えば、パドル法、スプレー法、ディッピング法等の方法が用いられる。現像は、通常、0〜100℃、好ましくは5〜55℃、より好ましくは10〜30℃の範囲で、通常、30〜180秒間の範囲で適宜選択される。
さらに、必要に応じて、感放射線樹脂組成物に含有させた感放射線化合物(B)を失活させるために、電子部品全面に、活性放射線を照射することもできる。活性放射線の照射には、上記潜像パターンの形成に例示した方法を利用できる。照射と同時に、又は照射後に樹脂膜を加熱してもよい。加熱方法としては、例えば、電子部品をホットプレートやオーブン内で加熱する方法が挙げられる。温度は、通常、80〜300℃、好ましくは100〜200℃の範囲である。
このようにして、パターン化された樹脂膜を備える電子部品は製造することができる。
なお、各特性の定義及び評価方法は、以下のとおりである。
各実施例及び各比較例において作製した感放射線樹脂組成物を、ポリエチレン製容器に入れ、振とう機にて振とうを3時間行った後、目視で感放射線樹脂組成物の状態を観察し、以下の基準で保存安定性を評価した。
A:感放射線樹脂組成物を構成する各成分が完全に溶解していた。
C:白濁や沈殿が生じていた。
シリコン基板上に、各実施例及び各比較例において作製した感放射線性樹脂組成物をスピンコート法により塗布し、ホットプレートを用いて120 ℃ で2分間加熱乾燥(プリベーク)して、膜厚3.0μmの樹脂膜を形成した。次いで、樹脂膜をパターニングするために、3.0μmのコンタクトホールを形成可能なマスクを用いて、50 mJ/cm2から350mJ/cm2まで露光量を変化させることにより、露光工程を行った。露光工程では、g線(436nm)、h線(405nm)、i線(365nm)の波長の光を発する高圧水銀ランプを用いた。次いで、2.38重量%テトラメチルアンモニウムヒドロキシド水溶液を用いて、25 ℃で100秒間、現像処理を行ったのち、超純水で30秒間リンスすることにより、コンタクトホールを有する樹脂膜と、シリコン基板とからなる積層体を得た。そして、光学顕微鏡を用いて、得られた積層体のコンタクトホール部分を観察し、各露光量で露光された部分の樹脂膜のコンタクトホール径の長さをそれぞれ測定した。次いで、各露光量と、対応する露光量において形成された樹脂膜のコンタクトホール径の関係から近似曲線を作成し、コンタクトホールが3.0μmとなる時の露光量を算出し、その露光量を露光感度として算出した。
A:ラインの浮きや剥がれが無かった。
C:ラインの浮きや剥がれが観察された。
シリコンウエハ上に、各実施例及び各比較例において作製した感放射線樹脂組成物をスピンコートした後、ホットプレートを用いて120℃で2分間プリベークして、樹脂膜を形成した。次いで、窒素中において230℃で1時間加熱することにより、厚さ3μmの樹脂膜が形成された樹脂膜付きシリコンウエハを得た。そして、得られた樹脂膜付きシリコンウエハを、高度加速寿命試験装置(HAST装置)に入れ、130℃、98%RHの環境下に200時間放置した。
吸水量=高度加速寿命試験後の樹脂膜の水分量−高度加速寿命試験前の樹脂膜の水分量
<環状オレフィン重合体(A−1)の調製>
N−フェニル−ビシクロ[2.2.1]ヘプト−5−エン−2,3−ジカルボキシイミド(NBPI)40モル%、及び4−ヒドロキシカルボニルテトラシクロ[6.2.1.13,6.02,7]ドデカ−9−エン(TCDC)60モル%からなる単量体混合物100部、1,5−ヘキサジエン2.0部、(1,3−ジメシチルイミダゾリン−2−イリデン)(トリシクロヘキシルホスフィン)ベンジリデンルテニウムジクロリド(Org.Lett.,第1巻,953頁,1999年 に記載された方法で合成した)0.02部、及びジエチレングリコールエチルメチルエーテル200部を、窒素置換したガラス製耐圧反応器に仕込み、攪拌しつつ80℃にて4時間反応させて重合反応液を得た。
バインダー樹脂(A)として、合成例1で得られた環状オレフィン重合体(A−1)の重合体溶液291部(環状オレフィン重合体(A−1)として100部)、感放射線化合物(B)として、4,4’−[1−[4−[1−[4−ヒドロキシフェニル]−1−メチルエチル]フェニル]エチリデン]ビスフェノール(1.0モル)と1,2−ナフトキノンジアジド−5−スルホン酸クロライド(2.5モル)との縮合物)35部、架橋剤(C)として、2,2−ビス(ヒドロキシメチル)1−ブタノールの1,2−エポキシ−4−(2−オキシラニル)シクロヘキサン付加物(シクロヘキサン骨格及び末端エポキシ基を有する15官能性の脂環式エポキシ樹脂、商品名「EHPE3150」、ダイセル化学工業社製、全塩素量25ppm以下)30部、シランカップリング剤(D)として、N−フェニル−3−アミノプロピルトリメトキシシラン(商品名「KBM−573」、信越化学工業社製)1部、及び、溶剤として、エチレングリコールジメチルエーテル160部を混合し、溶解させた後、孔径0.45μmのポリテトラフルオロエチレン製フィルターでろ過して感放射線樹脂組成物を調製した。
実施例1において、架橋剤(C)として、2,2−ビス(ヒドロキシメチル)1−ブタノールの1,2−エポキシ−4−(2−オキシラニル)シクロヘキサン付加物30部の代わりに、エポキシ化ブタンテトラカルボン酸テトラキス(3−シクロヘキセニルメチル)修飾ε−カプロラクトン(脂肪族環状4官能性のエポキシ樹脂、商品名「エポリードGT401」、ダイセル化学工業社製 全塩素量25ppm以下)50部を使用するとともに、架橋剤(C)として、ヘキサメトキシメチルメラミン(商品名「ニカラックMW−100LM」、三和ケミカル社製)10部をさらに配合した以外は、実施例1と同様にして、感放射線樹脂組成物を調製し、同様に測定・評価を行った。結果を表1に示す。
実施例2において、N−フェニル−3−アミノプロピルトリメトキシシランの配合量を1部から0.5部に変更した以外は、実施例2と同様にして、感放射線樹脂組成物を調製し、同様に測定・評価を行った。結果を表1に示す。
実施例2において、N−フェニル−3−アミノプロピルトリメトキシシランの配合量を1部から5部に変更した以外は、実施例2と同様にして、感放射線樹脂組成物を調製し、同様に測定・評価を行った。結果を表1に示す。
実施例1において、ヘキサメトキシメチルメラミン(商品名「ニカラックMW−100LM」、三和ケミカル社製)15部、及びγ−グリシドキシプロピルトリメチルシラン(商品名「Z6040」、東レ・ダウコーニング社製)1部をさらに配合した以外は、実施例1と同様にして、感放射線樹脂組成物を調製し、同様に測定・評価を行った。結果を表1に示す。
実施例2において、エポキシ化ブタンテトラカルボン酸テトラキス(3−シクロヘキセニルメチル)修飾ε−カプロラクトンの配合量を50部から30部に、ヘキサメトキシメチルメラミンの配合量を10部から15部に、それぞれ変更した以外は、実施例2と同様にして、感放射線樹脂組成物を調製し、同様に測定・評価を行った。結果を表1に示す。
実施例6において、架橋剤(C)として、エポキシ化ブタンテトラカルボン酸テトラキス(3−シクロヘキセニルメチル)修飾ε−カプロラクトン30部の代わりに、1,6−ビス(2,3−エポキシプロパン−1−イルオキシ)ナフタレン(商品名「HP−4032D」、DIC社製、全塩素量520ppm)30部を使用した以外は、実施例6と同様にして、感放射線樹脂組成物を調製し、同様に測定・評価を行った。結果を表1に示す。
実施例6において、架橋剤(C)として、エポキシ化ブタンテトラカルボン酸テトラキス(3−シクロヘキセニルメチル)修飾ε−カプロラクトン30部の代わりに、ビスフェノールF型エポキシ化合物(商品名「jER YL983U」、三菱化学社製、全塩素量100ppm)30部を使用した以外は、実施例6と同様にして、感放射線樹脂組成物を調製し、同様に測定・評価を行った。結果を表1に示す。
実施例6において、架橋剤(C)として、エポキシ化ブタンテトラカルボン酸テトラキス(3−シクロヘキセニルメチル)修飾ε−カプロラクトン30部の代わりに、長鎖ビスフェノールA型エポキシ樹脂(商品名「EXA−4816」、DIC社製、全塩素量1100ppm)30部を使用するとともに、フェノール樹脂(E)として、ノボラック型フェノール樹脂(商品名「PAPS−PN2」、旭有機材工業社製)10部をさらに配合した以外は、実施例6と同様にして、感放射線樹脂組成物を調製し、同様に測定・評価を行った。結果を表1に示す。
実施例1において、ヘキサメトキシメチルメラミン(商品名「ニカラックMW−100LM」、三和ケミカル社製)15部、及びアラルキルフェノール樹脂(商品名「MEH−7800」、明和化成社製)30部をさらに配合した以外は、実施例1と同様にして、感放射線樹脂組成物を調製し、同様に測定・評価を行った。結果を表1に示す。
実施例6において、アラルキルフェノール樹脂(商品名「GPH−65」、日本化薬社製、上記一般式(6)において、Xが、上記式(8)で表される化合物)30部、及びγ−グリシドキシプロピルトリメチルシラン1部をさらに配合した以外は、実施例6と同様にして、感放射線樹脂組成物を調製し、同様に測定・評価を行った。結果を表1に示す。
実施例1において、シランカップリング剤(D)としてのN−フェニル−3−アミノプロピルトリメトキシシラン1部の代わりに、γ−グリシドキシプロピルトリメチルシラン1部を使用した以外は、実施例1と同様にして、感放射線樹脂組成物を調製し、同様に測定・評価を行った。結果を表1に示す。
実施例6において、シランカップリング剤(D)としてのN−フェニル−3−アミノプロピルトリメトキシシラン1部の代わりに、γ−グリシドキシプロピルトリメチルシラン1部を使用した以外は、実施例6と同様にして、感放射線樹脂組成物を調製し、同様に測定・評価を行った。結果を表1に示す。
比較例2において、γ−グリシドキシプロピルトリメチルシラン1部の代わりに、N−2−アミノエチル−3−アミノプロピルトリメトキシシラン(商品名「KBM−603」、信越化学工業社製)1部を使用した以外は、比較例2と同様にして、感放射線樹脂組成物を調製し、同様に測定・評価を行った。結果を表1に示す。
比較例2において、エポキシ化ブタンテトラカルボン酸テトラキス(3−シクロヘキセニルメチル)修飾ε−カプロラクトンの配合量を30部から50部に変更し、かつ、γ−グリシドキシプロピルトリメチルシラン1部の代わりに、3−アミノプロピルトリメトキシシラン(商品名「KBM−903」、信越化学工業社製)1部を使用した以外は、比較例2と同様にして、感放射線樹脂組成物を調製し、同様に測定・評価を行った。結果を表1に示す。
また、本発明所定のシランカップリング剤(D)に代えて、N−2−アミノエチル−3−アミノプロピルトリメトキシシランや、3−アミノプロピルトリメトキシシランを用いた場合には、得られる感放射線樹脂組成物は保存安定性に極めて劣り、また、樹脂膜とした際に剥がれが著しく、現像密着性及び吸水量の測定をすることができないものであった(比較例3,4)。
Claims (9)
- 前記バインダー樹脂(A)が、プロトン性極性基を有する環状オレフィン重合体である請求項1に記載の感放射線樹脂組成物。
- 前記架橋剤(C)が、エポキシ基を有するエポキシ化合物を含む請求項1又は2に記載の感放射線樹脂組成物。
- 前記エポキシ化合物の全塩素量が1500ppm以下である請求項3に記載の感放射線樹脂組成物。
- 前記架橋剤(C)が、アルコキシアルキル基を有する化合物をさらに含む請求項3又は4に記載の感放射線樹脂組成物。
- 前記架橋剤(C)の含有量が、前記バインダー樹脂(A)100重量部に対して、5〜80重量部である請求項1〜5のいずれかに記載の感放射線樹脂組成物。
- 前記シランカップリング剤(D)の含有量が、前記バインダー樹脂(A)100重量部に対して、0.01〜100重量部である請求項1〜6のいずれかに記載の感放射線樹脂組成物。
- フェノール樹脂(E)をさらに含有する請求項1〜7のいずれかに記載の感放射線樹脂組成物。
- 請求項1〜8のいずれかに記載の感放射線樹脂組成物からなる樹脂膜を備える電子部品。
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EP3121652B1 (en) | 2019-09-04 |
TW201539140A (zh) | 2015-10-16 |
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WO2015141719A1 (ja) | 2015-09-24 |
US9880468B2 (en) | 2018-01-30 |
JP6524996B2 (ja) | 2019-06-05 |
CN106062631B (zh) | 2019-11-22 |
KR102377464B1 (ko) | 2022-03-21 |
EP3121652A4 (en) | 2017-10-18 |
CN106062631A (zh) | 2016-10-26 |
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