JPWO2009130873A1 - Hydroalkanesulfonates and their uses - Google Patents
Hydroalkanesulfonates and their uses Download PDFInfo
- Publication number
- JPWO2009130873A1 JPWO2009130873A1 JP2010509069A JP2010509069A JPWO2009130873A1 JP WO2009130873 A1 JPWO2009130873 A1 JP WO2009130873A1 JP 2010509069 A JP2010509069 A JP 2010509069A JP 2010509069 A JP2010509069 A JP 2010509069A JP WO2009130873 A1 JPWO2009130873 A1 JP WO2009130873A1
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- Prior art keywords
- resin
- group
- organic polymer
- carbon atoms
- hydrofluoroalkanesulfonate
- Prior art date
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- 239000000203 mixture Substances 0.000 claims abstract description 39
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims abstract description 19
- 238000000465 moulding Methods 0.000 claims abstract description 15
- 150000001768 cations Chemical class 0.000 claims abstract description 14
- 229910052731 fluorine Inorganic materials 0.000 claims abstract description 14
- 125000001153 fluoro group Chemical group F* 0.000 claims abstract description 14
- 239000002216 antistatic agent Substances 0.000 claims abstract description 13
- 238000004519 manufacturing process Methods 0.000 claims abstract description 13
- 229920005992 thermoplastic resin Polymers 0.000 claims abstract description 8
- 229920005989 resin Polymers 0.000 claims description 41
- 239000011347 resin Substances 0.000 claims description 41
- 229920000620 organic polymer Polymers 0.000 claims description 36
- 125000004432 carbon atom Chemical group C* 0.000 claims description 33
- 125000000217 alkyl group Chemical group 0.000 claims description 28
- 238000000034 method Methods 0.000 claims description 14
- 229920000178 Acrylic resin Polymers 0.000 claims description 12
- 239000004925 Acrylic resin Substances 0.000 claims description 12
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 claims description 12
- 229920000058 polyacrylate Polymers 0.000 claims description 11
- 229920005749 polyurethane resin Polymers 0.000 claims description 11
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims description 10
- 239000002861 polymer material Substances 0.000 claims description 10
- 239000000178 monomer Substances 0.000 claims description 8
- 229920001225 polyester resin Polymers 0.000 claims description 6
- 239000004645 polyester resin Substances 0.000 claims description 6
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 claims description 5
- 239000000113 methacrylic resin Substances 0.000 claims description 5
- 125000001424 substituent group Chemical group 0.000 claims description 5
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 claims description 4
- 229930182556 Polyacetal Natural products 0.000 claims description 3
- 239000003822 epoxy resin Substances 0.000 claims description 3
- 229920000515 polycarbonate Polymers 0.000 claims description 3
- 239000004417 polycarbonate Substances 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- 230000000379 polymerizing effect Effects 0.000 claims description 3
- 229920005672 polyolefin resin Polymers 0.000 claims description 3
- 229920006324 polyoxymethylene Polymers 0.000 claims description 3
- 229920001955 polyphenylene ether Polymers 0.000 claims description 3
- -1 hydrofluoroalkane sulfonate Chemical class 0.000 abstract description 20
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 abstract description 5
- 150000003839 salts Chemical class 0.000 description 26
- 229940125904 compound 1 Drugs 0.000 description 20
- 150000001875 compounds Chemical class 0.000 description 19
- 229920005862 polyol Polymers 0.000 description 16
- 150000003077 polyols Chemical class 0.000 description 16
- 239000000047 product Substances 0.000 description 13
- 230000000052 comparative effect Effects 0.000 description 12
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 10
- 238000002156 mixing Methods 0.000 description 10
- 229920001228 polyisocyanate Polymers 0.000 description 10
- 239000005056 polyisocyanate Substances 0.000 description 10
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 9
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 9
- 239000007864 aqueous solution Substances 0.000 description 9
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 9
- 239000000706 filtrate Substances 0.000 description 9
- 239000000463 material Substances 0.000 description 9
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 9
- 125000003187 heptyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 7
- 229910017053 inorganic salt Inorganic materials 0.000 description 7
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 7
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 7
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 7
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 6
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 6
- 150000001450 anions Chemical class 0.000 description 6
- 229920001577 copolymer Polymers 0.000 description 6
- 239000011342 resin composition Substances 0.000 description 6
- 239000002904 solvent Substances 0.000 description 6
- KYQCOXFCLRTKLS-UHFFFAOYSA-N Pyrazine Chemical class C1=CN=CC=N1 KYQCOXFCLRTKLS-UHFFFAOYSA-N 0.000 description 5
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical class C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 238000004132 cross linking Methods 0.000 description 5
- 150000004693 imidazolium salts Chemical class 0.000 description 5
- 125000001453 quaternary ammonium group Chemical group 0.000 description 5
- 239000000243 solution Substances 0.000 description 5
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 4
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 4
- 239000004721 Polyphenylene oxide Substances 0.000 description 4
- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 4
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 4
- 229920001971 elastomer Polymers 0.000 description 4
- 230000005611 electricity Effects 0.000 description 4
- 239000011737 fluorine Substances 0.000 description 4
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 4
- 150000002596 lactones Chemical class 0.000 description 4
- 229910052757 nitrogen Inorganic materials 0.000 description 4
- 125000001400 nonyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 4
- 229920005906 polyester polyol Polymers 0.000 description 4
- 229920000570 polyether Polymers 0.000 description 4
- 238000006116 polymerization reaction Methods 0.000 description 4
- 230000003068 static effect Effects 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- PHCASOSWUQOQAG-UHFFFAOYSA-M 1-butyl-3-methylpyridin-1-ium;chloride Chemical compound [Cl-].CCCC[N+]1=CC=CC(C)=C1 PHCASOSWUQOQAG-UHFFFAOYSA-M 0.000 description 3
- RAYBAGDQJCPFJE-UHFFFAOYSA-M 1-butyl-3-octylimidazol-3-ium chloride Chemical compound [Cl-].C(CCC)[N+]1=CN(C=C1)CCCCCCCC RAYBAGDQJCPFJE-UHFFFAOYSA-M 0.000 description 3
- BMQZYMYBQZGEEY-UHFFFAOYSA-M 1-ethyl-3-methylimidazolium chloride Chemical compound [Cl-].CCN1C=C[N+](C)=C1 BMQZYMYBQZGEEY-UHFFFAOYSA-M 0.000 description 3
- LKAWQFHWVVSFTR-UHFFFAOYSA-N 2-(methylamino)ethanol;hydrochloride Chemical compound [Cl-].C[NH2+]CCO LKAWQFHWVVSFTR-UHFFFAOYSA-N 0.000 description 3
- GWZMWHWAWHPNHN-UHFFFAOYSA-N 2-hydroxypropyl prop-2-enoate Chemical compound CC(O)COC(=O)C=C GWZMWHWAWHPNHN-UHFFFAOYSA-N 0.000 description 3
- 229920002799 BoPET Polymers 0.000 description 3
- AWYRJBVXXYABAE-UHFFFAOYSA-M CCCCCCCC[N+]1=CC=CC(=C1)CCCC.[Cl-] Chemical compound CCCCCCCC[N+]1=CC=CC(=C1)CCCC.[Cl-] AWYRJBVXXYABAE-UHFFFAOYSA-M 0.000 description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 3
- RWRDLPDLKQPQOW-UHFFFAOYSA-N Pyrrolidine Chemical compound C1CCNC1 RWRDLPDLKQPQOW-UHFFFAOYSA-N 0.000 description 3
- BNRMFDFBRUITOG-UHFFFAOYSA-M [Br-].C(CCC)[N+]1=CC=NC=C1 Chemical compound [Br-].C(CCC)[N+]1=CC=NC=C1 BNRMFDFBRUITOG-UHFFFAOYSA-M 0.000 description 3
- 239000011230 binding agent Substances 0.000 description 3
- 229940125782 compound 2 Drugs 0.000 description 3
- 229940125898 compound 5 Drugs 0.000 description 3
- 239000000945 filler Substances 0.000 description 3
- 125000004433 nitrogen atom Chemical group N* 0.000 description 3
- 239000003505 polymerization initiator Substances 0.000 description 3
- HVLUSYMLLVVXGI-USGGBSEESA-M trimethyl-[(z)-octadec-9-enyl]azanium;chloride Chemical compound [Cl-].CCCCCCCC\C=C/CCCCCCCC[N+](C)(C)C HVLUSYMLLVVXGI-USGGBSEESA-M 0.000 description 3
- KZWJWYFPLXRYIL-UHFFFAOYSA-N 1,1,2,2-tetrafluoroethanesulfonic acid Chemical compound OS(=O)(=O)C(F)(F)C(F)F KZWJWYFPLXRYIL-UHFFFAOYSA-N 0.000 description 2
- CTEAXVWYCINNCA-UHFFFAOYSA-M 1-ethyl-3-methylimidazol-3-ium;1,1,2,2-tetrafluoroethanesulfonate Chemical compound CC[N+]=1C=CN(C)C=1.[O-]S(=O)(=O)C(F)(F)C(F)F CTEAXVWYCINNCA-UHFFFAOYSA-M 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonia chloride Chemical compound [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- UXVLXFQNOYZKOO-UHFFFAOYSA-M CCCCCCCCCCCC[N+](C)(C)C.C(C(F)(F)S(=O)(=O)[O-])(F)F Chemical compound CCCCCCCCCCCC[N+](C)(C)C.C(C(F)(F)S(=O)(=O)[O-])(F)F UXVLXFQNOYZKOO-UHFFFAOYSA-M 0.000 description 2
- IACCJTBGCQNLOS-UHFFFAOYSA-M CCCCCCCC[N+]1=CC=CC(=C1)CCCC.C(C(F)(F)S(=O)(=O)[O-])(F)F Chemical compound CCCCCCCC[N+]1=CC=CC(=C1)CCCC.C(C(F)(F)S(=O)(=O)[O-])(F)F IACCJTBGCQNLOS-UHFFFAOYSA-M 0.000 description 2
- OXIYAHHTZMPRCI-UHFFFAOYSA-M CCCCCCCC[N+]1=CN(C=C1)CCCC.C(C(F)(F)S(=O)(=O)[O-])(F)F Chemical compound CCCCCCCC[N+]1=CN(C=C1)CCCC.C(C(F)(F)S(=O)(=O)[O-])(F)F OXIYAHHTZMPRCI-UHFFFAOYSA-M 0.000 description 2
- OFBIJYGXESSCLY-UHFFFAOYSA-M CCCC[N+]1=CC=CC(=C1)C.C(C(F)(F)S(=O)(=O)[O-])(F)F Chemical compound CCCC[N+]1=CC=CC(=C1)C.C(C(F)(F)S(=O)(=O)[O-])(F)F OFBIJYGXESSCLY-UHFFFAOYSA-M 0.000 description 2
- CCFJITZEGASKBZ-UHFFFAOYSA-N CNCCO.OS(C(C(F)F)(F)F)(=O)=O Chemical compound CNCCO.OS(C(C(F)F)(F)F)(=O)=O CCFJITZEGASKBZ-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 2
- 239000005062 Polybutadiene Substances 0.000 description 2
- WCUXLLCKKVVCTQ-UHFFFAOYSA-M Potassium chloride Chemical compound [Cl-].[K+] WCUXLLCKKVVCTQ-UHFFFAOYSA-M 0.000 description 2
- XSTXAVWGXDQKEL-UHFFFAOYSA-N Trichloroethylene Chemical compound ClC=C(Cl)Cl XSTXAVWGXDQKEL-UHFFFAOYSA-N 0.000 description 2
- 239000003522 acrylic cement Substances 0.000 description 2
- 125000005907 alkyl ester group Chemical group 0.000 description 2
- 125000003277 amino group Chemical group 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 229940126214 compound 3 Drugs 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 239000003431 cross linking reagent Substances 0.000 description 2
- 150000002009 diols Chemical class 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000806 elastomer Substances 0.000 description 2
- 238000010292 electrical insulation Methods 0.000 description 2
- 229920001519 homopolymer Polymers 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 230000002209 hydrophobic effect Effects 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- 230000001771 impaired effect Effects 0.000 description 2
- 238000004898 kneading Methods 0.000 description 2
- 239000005022 packaging material Substances 0.000 description 2
- 229920002857 polybutadiene Polymers 0.000 description 2
- IOLCXVTUBQKXJR-UHFFFAOYSA-M potassium bromide Chemical compound [K+].[Br-] IOLCXVTUBQKXJR-UHFFFAOYSA-M 0.000 description 2
- BWHMMNNQKKPAPP-UHFFFAOYSA-L potassium carbonate Chemical compound [K+].[K+].[O-]C([O-])=O BWHMMNNQKKPAPP-UHFFFAOYSA-L 0.000 description 2
- 239000005060 rubber Substances 0.000 description 2
- 150000005846 sugar alcohols Polymers 0.000 description 2
- SZUVGFMDDVSKSI-WIFOCOSTSA-N (1s,2s,3s,5r)-1-(carboxymethyl)-3,5-bis[(4-phenoxyphenyl)methyl-propylcarbamoyl]cyclopentane-1,2-dicarboxylic acid Chemical compound O=C([C@@H]1[C@@H]([C@](CC(O)=O)([C@H](C(=O)N(CCC)CC=2C=CC(OC=3C=CC=CC=3)=CC=2)C1)C(O)=O)C(O)=O)N(CCC)CC(C=C1)=CC=C1OC1=CC=CC=C1 SZUVGFMDDVSKSI-WIFOCOSTSA-N 0.000 description 1
- GHYOCDFICYLMRF-UTIIJYGPSA-N (2S,3R)-N-[(2S)-3-(cyclopenten-1-yl)-1-[(2R)-2-methyloxiran-2-yl]-1-oxopropan-2-yl]-3-hydroxy-3-(4-methoxyphenyl)-2-[[(2S)-2-[(2-morpholin-4-ylacetyl)amino]propanoyl]amino]propanamide Chemical compound C1(=CCCC1)C[C@@H](C(=O)[C@@]1(OC1)C)NC([C@H]([C@@H](C1=CC=C(C=C1)OC)O)NC([C@H](C)NC(CN1CCOCC1)=O)=O)=O GHYOCDFICYLMRF-UTIIJYGPSA-N 0.000 description 1
- QFLWZFQWSBQYPS-AWRAUJHKSA-N (3S)-3-[[(2S)-2-[[(2S)-2-[5-[(3aS,6aR)-2-oxo-1,3,3a,4,6,6a-hexahydrothieno[3,4-d]imidazol-4-yl]pentanoylamino]-3-methylbutanoyl]amino]-3-(4-hydroxyphenyl)propanoyl]amino]-4-[1-bis(4-chlorophenoxy)phosphorylbutylamino]-4-oxobutanoic acid Chemical compound CCCC(NC(=O)[C@H](CC(O)=O)NC(=O)[C@H](Cc1ccc(O)cc1)NC(=O)[C@@H](NC(=O)CCCCC1SC[C@@H]2NC(=O)N[C@H]12)C(C)C)P(=O)(Oc1ccc(Cl)cc1)Oc1ccc(Cl)cc1 QFLWZFQWSBQYPS-AWRAUJHKSA-N 0.000 description 1
- RTTZISZSHSCFRH-UHFFFAOYSA-N 1,3-bis(isocyanatomethyl)benzene Chemical compound O=C=NCC1=CC=CC(CN=C=O)=C1 RTTZISZSHSCFRH-UHFFFAOYSA-N 0.000 description 1
- KJDRSWPQXHESDQ-UHFFFAOYSA-N 1,4-dichlorobutane Chemical compound ClCCCCCl KJDRSWPQXHESDQ-UHFFFAOYSA-N 0.000 description 1
- ALQLPWJFHRMHIU-UHFFFAOYSA-N 1,4-diisocyanatobenzene Chemical compound O=C=NC1=CC=C(N=C=O)C=C1 ALQLPWJFHRMHIU-UHFFFAOYSA-N 0.000 description 1
- CDMDQYCEEKCBGR-UHFFFAOYSA-N 1,4-diisocyanatocyclohexane Chemical compound O=C=NC1CCC(N=C=O)CC1 CDMDQYCEEKCBGR-UHFFFAOYSA-N 0.000 description 1
- ATOUXIOKEJWULN-UHFFFAOYSA-N 1,6-diisocyanato-2,2,4-trimethylhexane Chemical compound O=C=NCCC(C)CC(C)(C)CN=C=O ATOUXIOKEJWULN-UHFFFAOYSA-N 0.000 description 1
- 229940008841 1,6-hexamethylene diisocyanate Drugs 0.000 description 1
- UNILWMWFPHPYOR-KXEYIPSPSA-M 1-[6-[2-[3-[3-[3-[2-[2-[3-[[2-[2-[[(2r)-1-[[2-[[(2r)-1-[3-[2-[2-[3-[[2-(2-amino-2-oxoethoxy)acetyl]amino]propoxy]ethoxy]ethoxy]propylamino]-3-hydroxy-1-oxopropan-2-yl]amino]-2-oxoethyl]amino]-3-[(2r)-2,3-di(hexadecanoyloxy)propyl]sulfanyl-1-oxopropan-2-yl Chemical compound O=C1C(SCCC(=O)NCCCOCCOCCOCCCNC(=O)COCC(=O)N[C@@H](CSC[C@@H](COC(=O)CCCCCCCCCCCCCCC)OC(=O)CCCCCCCCCCCCCCC)C(=O)NCC(=O)N[C@H](CO)C(=O)NCCCOCCOCCOCCCNC(=O)COCC(N)=O)CC(=O)N1CCNC(=O)CCCCCN\1C2=CC=C(S([O-])(=O)=O)C=C2CC/1=C/C=C/C=C/C1=[N+](CC)C2=CC=C(S([O-])(=O)=O)C=C2C1 UNILWMWFPHPYOR-KXEYIPSPSA-M 0.000 description 1
- MPPPKRYCTPRNTB-UHFFFAOYSA-N 1-bromobutane Chemical compound CCCCBr MPPPKRYCTPRNTB-UHFFFAOYSA-N 0.000 description 1
- SZBRISJDXSIRRE-UHFFFAOYSA-M 1-butyl-3-methylpyridin-1-ium;trifluoromethanesulfonate Chemical group [O-]S(=O)(=O)C(F)(F)F.CCCC[N+]1=CC=CC(C)=C1 SZBRISJDXSIRRE-UHFFFAOYSA-M 0.000 description 1
- ZPTRYWVRCNOTAS-UHFFFAOYSA-M 1-ethyl-3-methylimidazol-3-ium;trifluoromethanesulfonate Chemical compound CC[N+]=1C=CN(C)C=1.[O-]S(=O)(=O)C(F)(F)F ZPTRYWVRCNOTAS-UHFFFAOYSA-M 0.000 description 1
- LFSYUSUFCBOHGU-UHFFFAOYSA-N 1-isocyanato-2-[(4-isocyanatophenyl)methyl]benzene Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=CC=C1N=C=O LFSYUSUFCBOHGU-UHFFFAOYSA-N 0.000 description 1
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2,2'-azo-bis-isobutyronitrile Substances N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 description 1
- INUUEPXJEZMUSV-UHFFFAOYSA-N 2-hydroxyethyl(methyl)azanium trifluoromethanesulfonate Chemical compound CNCCO.OS(=O)(=O)C(F)(F)F INUUEPXJEZMUSV-UHFFFAOYSA-N 0.000 description 1
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
- 125000001494 2-propynyl group Chemical group [H]C#CC([H])([H])* 0.000 description 1
- QZWKEPYTBWZJJA-UHFFFAOYSA-N 3,3'-Dimethoxybenzidine-4,4'-diisocyanate Chemical compound C1=C(N=C=O)C(OC)=CC(C=2C=C(OC)C(N=C=O)=CC=2)=C1 QZWKEPYTBWZJJA-UHFFFAOYSA-N 0.000 description 1
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 1
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 description 1
- CPELXLSAUQHCOX-UHFFFAOYSA-M Bromide Chemical compound [Br-] CPELXLSAUQHCOX-UHFFFAOYSA-M 0.000 description 1
- MBCUNESSWNAVFL-UHFFFAOYSA-N C=C.C=C.C=C.N=C=O.N=C=O Chemical compound C=C.C=C.C=C.N=C=O.N=C=O MBCUNESSWNAVFL-UHFFFAOYSA-N 0.000 description 1
- IBTUSDOQQHBZCT-UHFFFAOYSA-M CCCCCCCC[N+]1=CC=CC(=C1)CCCC.C(F)(F)(F)S(=O)(=O)[O-] Chemical compound CCCCCCCC[N+]1=CC=CC(=C1)CCCC.C(F)(F)(F)S(=O)(=O)[O-] IBTUSDOQQHBZCT-UHFFFAOYSA-M 0.000 description 1
- GQQVPUSMYBVGAO-UHFFFAOYSA-M CCCCCCCC[N+]1=CN(C=C1)CCCC.C(F)(F)(F)S(=O)(=O)[O-] Chemical compound CCCCCCCC[N+]1=CN(C=C1)CCCC.C(F)(F)(F)S(=O)(=O)[O-] GQQVPUSMYBVGAO-UHFFFAOYSA-M 0.000 description 1
- MCYUQMBRDXOAEF-UHFFFAOYSA-M CCCC[N+]1=CC=NC=C1.C(C(F)(F)S(=O)(=O)[O-])(F)F Chemical compound CCCC[N+]1=CC=NC=C1.C(C(F)(F)S(=O)(=O)[O-])(F)F MCYUQMBRDXOAEF-UHFFFAOYSA-M 0.000 description 1
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 1
- DCDFDUXHHRNAAE-UHFFFAOYSA-N FCC(F)(F)F.[K] Chemical compound FCC(F)(F)F.[K] DCDFDUXHHRNAAE-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 239000005058 Isophorone diisocyanate Substances 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- 229920002319 Poly(methyl acrylate) Polymers 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 229920000265 Polyparaphenylene Polymers 0.000 description 1
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 1
- 229920002125 Sokalan® Polymers 0.000 description 1
- UKLDJPRMSDWDSL-UHFFFAOYSA-L [dibutyl(dodecanoyloxy)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCC)(CCCC)OC(=O)CCCCCCCCCCC UKLDJPRMSDWDSL-UHFFFAOYSA-L 0.000 description 1
- 125000002777 acetyl group Chemical group [H]C([H])([H])C(*)=O 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 229920001893 acrylonitrile styrene Polymers 0.000 description 1
- 229920001898 acrylonitrile–EPDM–styrene Polymers 0.000 description 1
- 125000002252 acyl group Chemical group 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 125000003342 alkenyl group Chemical group 0.000 description 1
- 125000003545 alkoxy group Chemical group 0.000 description 1
- 125000004453 alkoxycarbonyl group Chemical group 0.000 description 1
- 125000000304 alkynyl group Chemical group 0.000 description 1
- 125000003368 amide group Chemical group 0.000 description 1
- 125000004202 aminomethyl group Chemical group [H]N([H])C([H])([H])* 0.000 description 1
- 235000019270 ammonium chloride Nutrition 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 125000003236 benzoyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C(*)=O 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- 238000006065 biodegradation reaction Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000000740 bleeding effect Effects 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000013065 commercial product Substances 0.000 description 1
- 229940125773 compound 10 Drugs 0.000 description 1
- 229940125797 compound 12 Drugs 0.000 description 1
- 229940126543 compound 14 Drugs 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 239000012975 dibutyltin dilaurate Substances 0.000 description 1
- 125000005442 diisocyanate group Chemical group 0.000 description 1
- KQLUKPKJBOHSOV-UHFFFAOYSA-M dodecyl(trimethyl)azanium;trifluoromethanesulfonate Chemical compound [O-]S(=O)(=O)C(F)(F)F.CCCCCCCCCCCC[N+](C)(C)C KQLUKPKJBOHSOV-UHFFFAOYSA-M 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 125000001301 ethoxy group Chemical group [H]C([H])([H])C([H])([H])O* 0.000 description 1
- 125000003754 ethoxycarbonyl group Chemical group C(=O)(OCC)* 0.000 description 1
- 125000005745 ethoxymethyl group Chemical group [H]C([H])([H])C([H])([H])OC([H])([H])* 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 125000004216 fluoromethyl group Chemical group [H]C([H])(F)* 0.000 description 1
- 125000002485 formyl group Chemical group [H]C(*)=O 0.000 description 1
- 235000011187 glycerol Nutrition 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 1
- 125000004836 hexamethylene group Chemical group [H]C([H])([*:2])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[*:1] 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 1
- ZLVXBBHTMQJRSX-VMGNSXQWSA-N jdtic Chemical compound C1([C@]2(C)CCN(C[C@@H]2C)C[C@H](C(C)C)NC(=O)[C@@H]2NCC3=CC(O)=CC=C3C2)=CC=CC(O)=C1 ZLVXBBHTMQJRSX-VMGNSXQWSA-N 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 1
- 125000004184 methoxymethyl group Chemical group [H]C([H])([H])OC([H])([H])* 0.000 description 1
- AYLRODJJLADBOB-QMMMGPOBSA-N methyl (2s)-2,6-diisocyanatohexanoate Chemical compound COC(=O)[C@@H](N=C=O)CCCCN=C=O AYLRODJJLADBOB-QMMMGPOBSA-N 0.000 description 1
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000001624 naphthyl group Chemical group 0.000 description 1
- 150000002891 organic anions Chemical class 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920001490 poly(butyl methacrylate) polymer Polymers 0.000 description 1
- 229920001483 poly(ethyl methacrylate) polymer Polymers 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920000120 polyethyl acrylate Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920001195 polyisoprene Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920002959 polymer blend Polymers 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 229910000027 potassium carbonate Inorganic materials 0.000 description 1
- 239000001103 potassium chloride Substances 0.000 description 1
- 235000011164 potassium chloride Nutrition 0.000 description 1
- IKGXNKJBJMBJRA-UHFFFAOYSA-N potassium;1,1,2,2-tetrafluoroethanesulfonic acid Chemical compound [K].OS(=O)(=O)C(F)(F)C(F)F IKGXNKJBJMBJRA-UHFFFAOYSA-N 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- SCUZVMOVTVSBLE-UHFFFAOYSA-N prop-2-enenitrile;styrene Chemical compound C=CC#N.C=CC1=CC=CC=C1 SCUZVMOVTVSBLE-UHFFFAOYSA-N 0.000 description 1
- 125000004368 propenyl group Chemical group C(=CC)* 0.000 description 1
- 125000001501 propionyl group Chemical group O=C([*])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000002568 propynyl group Chemical group [*]C#CC([H])([H])[H] 0.000 description 1
- 150000003242 quaternary ammonium salts Chemical class 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000007151 ring opening polymerisation reaction Methods 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 125000003003 spiro group Chemical group 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000012719 thermal polymerization Methods 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 1
- RUELTTOHQODFPA-UHFFFAOYSA-N toluene 2,6-diisocyanate Chemical compound CC1=C(N=C=O)C=CC=C1N=C=O RUELTTOHQODFPA-UHFFFAOYSA-N 0.000 description 1
- 238000013519 translation Methods 0.000 description 1
- ITMCEJHCFYSIIV-UHFFFAOYSA-N triflic acid Chemical compound OS(=O)(=O)C(F)(F)F ITMCEJHCFYSIIV-UHFFFAOYSA-N 0.000 description 1
- 125000002023 trifluoromethyl group Chemical group FC(F)(F)* 0.000 description 1
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07D—HETEROCYCLIC COMPOUNDS
- C07D213/00—Heterocyclic compounds containing six-membered rings, not condensed with other rings, with one nitrogen atom as the only ring hetero atom and three or more double bonds between ring members or between ring members and non-ring members
- C07D213/02—Heterocyclic compounds containing six-membered rings, not condensed with other rings, with one nitrogen atom as the only ring hetero atom and three or more double bonds between ring members or between ring members and non-ring members having three double bonds between ring members or between ring members and non-ring members
- C07D213/04—Heterocyclic compounds containing six-membered rings, not condensed with other rings, with one nitrogen atom as the only ring hetero atom and three or more double bonds between ring members or between ring members and non-ring members having three double bonds between ring members or between ring members and non-ring members having no bond between the ring nitrogen atom and a non-ring member or having only hydrogen or carbon atoms directly attached to the ring nitrogen atom
- C07D213/24—Heterocyclic compounds containing six-membered rings, not condensed with other rings, with one nitrogen atom as the only ring hetero atom and three or more double bonds between ring members or between ring members and non-ring members having three double bonds between ring members or between ring members and non-ring members having no bond between the ring nitrogen atom and a non-ring member or having only hydrogen or carbon atoms directly attached to the ring nitrogen atom with substituted hydrocarbon radicals attached to ring carbon atoms
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- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C211/00—Compounds containing amino groups bound to a carbon skeleton
- C07C211/62—Quaternary ammonium compounds
- C07C211/63—Quaternary ammonium compounds having quaternised nitrogen atoms bound to acyclic carbon atoms
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- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C215/00—Compounds containing amino and hydroxy groups bound to the same carbon skeleton
- C07C215/02—Compounds containing amino and hydroxy groups bound to the same carbon skeleton having hydroxy groups and amino groups bound to acyclic carbon atoms of the same carbon skeleton
- C07C215/40—Compounds containing amino and hydroxy groups bound to the same carbon skeleton having hydroxy groups and amino groups bound to acyclic carbon atoms of the same carbon skeleton with quaternised nitrogen atoms bound to carbon atoms of the carbon skeleton
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- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C309/00—Sulfonic acids; Halides, esters, or anhydrides thereof
- C07C309/01—Sulfonic acids
- C07C309/02—Sulfonic acids having sulfo groups bound to acyclic carbon atoms
- C07C309/03—Sulfonic acids having sulfo groups bound to acyclic carbon atoms of an acyclic saturated carbon skeleton
- C07C309/06—Sulfonic acids having sulfo groups bound to acyclic carbon atoms of an acyclic saturated carbon skeleton containing halogen atoms, or nitro or nitroso groups bound to the carbon skeleton
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- C07—ORGANIC CHEMISTRY
- C07D—HETEROCYCLIC COMPOUNDS
- C07D233/00—Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, not condensed with other rings
- C07D233/54—Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, not condensed with other rings having two double bonds between ring members or between ring members and non-ring members
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- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07D—HETEROCYCLIC COMPOUNDS
- C07D241/00—Heterocyclic compounds containing 1,4-diazine or hydrogenated 1,4-diazine rings
- C07D241/02—Heterocyclic compounds containing 1,4-diazine or hydrogenated 1,4-diazine rings not condensed with other rings
- C07D241/10—Heterocyclic compounds containing 1,4-diazine or hydrogenated 1,4-diazine rings not condensed with other rings having three double bonds between ring members or between ring members and non-ring members
- C07D241/12—Heterocyclic compounds containing 1,4-diazine or hydrogenated 1,4-diazine rings not condensed with other rings having three double bonds between ring members or between ring members and non-ring members with only hydrogen atoms, hydrocarbon or substituted hydrocarbon radicals, directly attached to ring carbon atoms
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- C07—ORGANIC CHEMISTRY
- C07D—HETEROCYCLIC COMPOUNDS
- C07D487/00—Heterocyclic compounds containing nitrogen atoms as the only ring hetero atoms in the condensed system, not provided for by groups C07D451/00 - C07D477/00
- C07D487/02—Heterocyclic compounds containing nitrogen atoms as the only ring hetero atoms in the condensed system, not provided for by groups C07D451/00 - C07D477/00 in which the condensed system contains two hetero rings
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- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/06—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances
- H01B1/12—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances organic substances
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Abstract
本発明の課題は、導電性が良好であって生分解性に優れたハイドロフルオロアルカンスルホネート、該ハイドロアルカンスルホネートを含む導電性組成物、および該導電性組成物からなる帯電防止剤、ならびに、該ハイドロアルカンスルホネートを用いる熱可塑性樹脂成型物の製造方法を提供することである。本発明では、一般式、ＣＸ２Ｈ−ＣＸ２−ＳＯ３Ｍ（式中、４つのＸは各々独立に水素原子またはフッ素原子であって、少なくとも１つのＸはフッ素原子を示し、Ｍはカチオンを示す。）で表されるハイドロフルオロアルカンスルホネートが提供される。本発明によれば、該ハイドロフルオロアルカンスルホネートを含む導電性組成物、および該導電性組成物からなる帯電防止剤、ならびに、該ハイドロアルカンスルホネートを用いる熱可塑性樹脂成型物の製造方法が提供される。An object of the present invention is to provide a hydrofluoroalkane sulfonate having good conductivity and excellent biodegradability, a conductive composition containing the hydroalkane sulfonate, an antistatic agent comprising the conductive composition, and the It is providing the manufacturing method of the thermoplastic resin molding using a hydroalkanesulfonate. In the present invention, in the general formula, CX2H-CX2-SO3M (wherein, four Xs are each independently a hydrogen atom or a fluorine atom, at least one X represents a fluorine atom, and M represents a cation). The represented hydrofluoroalkanesulfonates are provided. According to the present invention, there are provided a conductive composition containing the hydrofluoroalkanesulfonate, an antistatic agent comprising the conductive composition, and a method for producing a thermoplastic resin molded article using the hydroalkanesulfonate. .
Description
本発明は新規なハイドロフルオロアルカンスルホネートおよびその用途に関する。本発明のハイドロフルオロアルカンスルホネートは導電性が良好でありかつ生分解性に優れ、その用途として、導電性組成物、帯電防止剤、および樹脂成型物の製造方法が挙げられる。 The present invention relates to a novel hydrofluoroalkanesulfonate and its use. The hydrofluoroalkanesulfonate of the present invention has good conductivity and is excellent in biodegradability, and its use includes a conductive composition, an antistatic agent, and a method for producing a resin molded product.
一般に、樹脂材料は電気絶縁性に優れているため、絶縁体等の電気絶縁性を必要とする用途には極めて有用である。その反面、樹脂材料の表面は静電気を帯びやすく、電子機器などの包装材料として用いる場合には、静電気により電子部品を損傷させる恐れがある。こういった用途向けの包装材料には、導電性を付与させた導電性樹脂が用いられている。 In general, since a resin material is excellent in electrical insulation, it is extremely useful for applications that require electrical insulation such as an insulator. On the other hand, the surface of the resin material is easily charged with static electricity, and when used as a packaging material for electronic devices or the like, there is a risk of damage to electronic components due to static electricity. A conductive resin imparted with conductivity is used for such a packaging material.
また、導電性樹脂は、各種メーター類の窓、テレビのブラウン管、クリーンルームの窓、携帯電話等の液晶表示パネル、電磁波遮断壁等のように透明性を必要とする用途においても需要が高まっている。 In addition, there is an increasing demand for conductive resins in applications that require transparency, such as various meter windows, television cathode-ray tubes, clean room windows, liquid crystal display panels such as mobile phones, and electromagnetic shielding walls. .
従来から、絶縁性の樹脂に導電性を付与させるには、樹脂原料に帯電防止剤をあらかじめ添加、混練させるか、または、樹脂の形成体表面に帯電防止塗膜を被覆させる方法が知られている。 Conventionally, in order to impart conductivity to an insulating resin, a method of adding an antistatic agent to a resin raw material in advance and kneading or coating an antistatic coating on the surface of the resin is known. Yes.
帯電防止の方法としては、金属酸化物やカーボンブラックなどのフィラーを樹脂に添加する方法が最も良く用いられる方法である。しかし、これらのフィラーは有色であるため、フィラーを添加すると樹脂が着色してしまい、透明性が損なわれていた。 As an antistatic method, a method of adding a filler such as a metal oxide or carbon black to a resin is the most commonly used method. However, since these fillers are colored, when the filler is added, the resin is colored, and transparency is impaired.
特許文献１では非ポリマー窒素オニウムカチオンと、弱配位性含フッ素有機アニオンからなるイオン塩、特許文献２ではパーフルオロアルキルスルホン酸の第四級アンモニウム塩と、熱可塑性プラスチックとから製造される成形用組成物が開示されている。 In Patent Document 1, an ion salt composed of a non-polymeric nitrogen onium cation and a weakly coordinating fluorine-containing organic anion, and in Patent Document 2, a quaternary ammonium salt of perfluoroalkylsulfonic acid and a thermoplastic plastic are used. A composition for use is disclosed.
過フッ素化されたアニオンは、樹脂や粘着剤などといった有機ポリマーに加えることで良好な帯電防止能が得られるが、難分解性物質に該当してしまい使用が避けられる事態が散見されている。これらは環境に長く残存してしまう欠点があり、最近では廃棄処分に対する環境への配慮、特に生分解性の悪さなどの観点から該塩類の使用が敬遠されるようになり、環境にやさしい帯電防止剤が望まれている。 Although a perfluorinated anion can be added to an organic polymer such as a resin or a pressure-sensitive adhesive to obtain a good antistatic ability, it is a rarely decomposable substance and can be avoided. These have the disadvantage that they remain in the environment for a long time. Recently, the use of these salts has been avoided from the viewpoint of environmental considerations, especially poor biodegradability, and environmentally friendly antistatic measures. An agent is desired.
このような事情にかんがみて、本発明が解決しようとする課題は、導電性が良好であって生分解性に優れたハイドロフルオロアルカンスルホネート、ならびに、該ハイドロアルカンスルホネートを含む導電性組成物、および該組成物からなる帯電防止剤を提供し、さらに、該ハイドロアルカンスルホネートを用いる樹脂成型物の製造方法を提供することである。 In view of such circumstances, the problem to be solved by the present invention is a hydrofluoroalkane sulfonate having good conductivity and excellent biodegradability, and a conductive composition containing the hydroalkane sulfonate, and It is to provide an antistatic agent comprising the composition, and further to provide a method for producing a resin molded product using the hydroalkanesulfonate.
本発明者らは、鋭意検討を重ねた結果、導電性を付与する導電材料のアニオンとして含フッ素アニオンが帯電防止剤として有用であること、特に水素を含有する含フッ素アニオンが極めて有用であることを見出した。本発明者らは、更に検討を重ねた結果、テトラフルオロエタンスルホン酸アニオンが導電性に優れ、且つ、生分解の起点となる水素原子を構造上に残していることから、生分解性にも優れることを見出し、本発明を完成するに至った。 As a result of intensive studies, the present inventors have found that a fluorine-containing anion is useful as an antistatic agent as an anion of a conductive material imparting conductivity, and particularly that a fluorine-containing anion containing hydrogen is extremely useful. I found. As a result of further investigations, the present inventors have found that the tetrafluoroethanesulfonate anion has excellent conductivity and leaves a hydrogen atom that is the starting point of biodegradation in the structure. The present invention has been found to be excellent, and the present invention has been completed.
本発明は以下のとおりである。
［１］下記一般式（１）、
ＣＸ２Ｈ−ＣＸ２−ＳＯ３Ｍ （１）
（式中、４つのＸは各々独立に水素原子またはフッ素原子であって、少なくとも１つのＸはフッ素原子を示し、Ｍはカチオンを示す。）
で表されるハイドロフルオロアルカンスルホネート。
［２］上記４つのＸが全てフッ素原子である［１］記載のハイドロフルオロアルカンスルホネート。
［３］ 上記Ｍが下記一般式（２）、（３）、（４）および（５）からなる群から選択されるカチオンである、［１］または［２］記載のハイドロフルオロアルカンスルホネート。
［４］［１］〜［３］のいずれかに記載の少なくとも１種のハイドロフルオロアルカンスルホネートを含有する導電性組成物。
［５］有機ポリマーと、［１］〜［３］のいずれかに記載の少なくとも１種のハイドロフルオロアルカンスルホネートと、を含有する導電性組成物。
［６］有機ポリマーが熱可塑性樹脂である［５］記載の導電性組成物。
［７］有機ポリマーが、ポリオレフィン系樹脂、ポリアセタール、ポリフェニレンエーテル、ポリエステル樹脂、ポリカーボネート、ポリウレタン樹脂、塩化ビニル樹脂、アクリロニトリル−ブタジエン−スチレン（ＡＢＳ）樹脂、アクリル樹脂、メタクリル樹脂、アクリル系ポリマーからなる群から選択される少なくとも１種の樹脂である、［５］または［６］記載の導電性組成物。
［８］有機ポリマーが樹脂又は粘着剤であり、前記樹脂又は粘着剤１００質量部に対し、上記ハイドロフルオロアルカンスルホネートを０．０１〜２０質量部含有する［５］〜［７］のいずれかに記載の導電性組成物。
［９］［４］〜［８］のいずれかに記載の導電性組成物からなる帯電防止剤。
［１０］［１］〜［３］のいずれかに記載のハイドロフルオロアルカンスルホネートの少なくとも１種を有機ポリマー材料あるいは有機ポリマーのモノマーまたはオリゴマーに添加する工程（Ａ）、ならびに、
工程（Ａ）にて有機ポリマー材料を用いた場合には有機ポリマー材料を成型する工程（Ｂ１）を、
工程（Ａ）にてモノマーまたはオリゴマーを用いた場合には該モノマーまたはオリゴマーを高分子化して成型する工程（Ｂ２）を、
有する樹脂成型物の製造方法。
［１１］上記有機ポリマーが熱可塑性樹脂である［１０］記載の製造方法。
［１２］上記有機ポリマーが、アクリル樹脂、ポリエステル樹脂、ポリウレタン樹脂、塩化ビニル樹脂、エポキシ樹脂、アクリル系ポリマーからなる群から選択される少なくとも１種の樹脂である［１０］または［１１］記載の製造方法。The present invention is as follows.
[1] The following general formula (1),
CX 2 H-CX 2 -SO 3 M (1)
(In the formula, four Xs are each independently a hydrogen atom or a fluorine atom, and at least one X represents a fluorine atom, and M represents a cation.)
Hydrofluoroalkanesulfonate represented by:
[2] The hydrofluoroalkanesulfonate according to [1], wherein all four Xs are fluorine atoms.
[3] The hydrofluoroalkanesulfonate according to [1] or [2], wherein M is a cation selected from the group consisting of the following general formulas (2), (3), (4) and (5).
[4] A conductive composition containing at least one hydrofluoroalkanesulfonate according to any one of [1] to [3].
[5] A conductive composition containing an organic polymer and at least one hydrofluoroalkanesulfonate according to any one of [1] to [3].
[6] The conductive composition according to [5], wherein the organic polymer is a thermoplastic resin.
[7] The organic polymer is a group consisting of polyolefin resin, polyacetal, polyphenylene ether, polyester resin, polycarbonate, polyurethane resin, vinyl chloride resin, acrylonitrile-butadiene-styrene (ABS) resin, acrylic resin, methacrylic resin, acrylic polymer. The conductive composition according to [5] or [6], which is at least one resin selected from the group consisting of:
[8] The organic polymer is a resin or an adhesive, and contains 0.01 to 20 parts by mass of the hydrofluoroalkanesulfonate with respect to 100 parts by mass of the resin or the adhesive. The electroconductive composition as described.
[9] An antistatic agent comprising the conductive composition according to any one of [4] to [8].
[10] Step (A) of adding at least one hydrofluoroalkanesulfonate according to any one of [1] to [3] to an organic polymer material or an organic polymer monomer or oligomer; and
When the organic polymer material is used in the step (A), the step (B1) of molding the organic polymer material is performed.
In the case where a monomer or oligomer is used in the step (A), a step (B2) of polymerizing and molding the monomer or oligomer,
The manufacturing method of the resin molding which has.
[11] The production method of [10], wherein the organic polymer is a thermoplastic resin.
[12] The organic polymer according to [10] or [11], wherein the organic polymer is at least one resin selected from the group consisting of acrylic resins, polyester resins, polyurethane resins, vinyl chloride resins, epoxy resins, and acrylic polymers. Production method.
本発明のハイドロフルオロアルカンスルホネートは、フッ素原子および水素原子が結合してなる化学構造をもつアニオンであるため、導電性を有し、帯電防止性、生分解性に優れる。また、本発明の好適態様では、ハイドロフルオロアルカンスルホネートの対カチオンとして、ピリジニウム誘導体、イミダゾリウム誘導体、第四級アンモニウム誘導体、ピラジニウム誘導体を用いることによって、耐熱性、帯電防止性がさらに優れる。 Since the hydrofluoroalkanesulfonate of the present invention is an anion having a chemical structure formed by bonding a fluorine atom and a hydrogen atom, it has conductivity and is excellent in antistatic property and biodegradability. In a preferred embodiment of the present invention, heat resistance and antistatic properties are further improved by using a pyridinium derivative, an imidazolium derivative, a quaternary ammonium derivative, or a pyrazinium derivative as a counter cation of hydrofluoroalkanesulfonate.
以下、本発明のハイドロアルカンスルホネート、それを用いた導電性組成物、該導電性組成物からなる帯電防止剤、及び樹脂成型物の製造方法について、詳細に説明する。 Hereinafter, the hydroalkane sulfonate of the present invention, a conductive composition using the same, an antistatic agent comprising the conductive composition, and a method for producing a resin molded product will be described in detail.
本発明のハイドロアルカンスルホネートは、上記一般式（１）で表される。式（１）中、４つのＸは各々独立に水素原子またはフッ素原子から選択され、且つ、Ｘの少なくとも１つはフッ素原子である。式（１）において、Ｍはカチオンを示す。 The hydroalkanesulfonate of the present invention is represented by the above general formula (1). In the formula (1), four Xs are each independently selected from a hydrogen atom or a fluorine atom, and at least one of X is a fluorine atom. In the formula (1), M represents a cation.
耐熱性、導電性および生分解性に優れる面から、上記一般式（１）中の４つのＸが全てフッ素原子であることが好ましい。すなわち、本発明のハイドロアルカンスルホネートは、好ましくは、テトラフルオロエタンスルホン酸アニオン（ＴＦＥＳ−）を有するハイドロアルカンスルホネート（ＣＦ２Ｈ−ＣＦ２−ＳＯ３Ｍ）である。From the viewpoint of excellent heat resistance, conductivity and biodegradability, it is preferable that all four Xs in the general formula (1) are fluorine atoms. That is, the hydroalkanesulfonate of the present invention is preferably a hydroalkanesulfonate (CF 2 H—CF 2 —SO 3 M) having a tetrafluoroethanesulfonate anion (TFES − ).
本発明によれば、上記一般式（１）中のＭは、好ましくは、上記一般式（２）のピリジニウム誘導体、一般式（３）のイミダゾリウム誘導体、一般式（４）の第四級アンモニウム誘導体、一般式（５）のピラジニウム誘導体から選択されるカチオンである。 According to the present invention, M in the general formula (1) is preferably a pyridinium derivative of the general formula (2), an imidazolium derivative of the general formula (3), or a quaternary ammonium of the general formula (4). Derivatives, cations selected from pyrazinium derivatives of general formula (5).
本発明のハイドロアルカンスルホネートは、より好ましくは、上記一般式（１）の４つのＸが全てフッ素原子であるテトラフルオロエタンスルホン酸アニオン（ＴＦＥＳ−）を有し、かつ、Ｍが上記一般式（２）〜（５）から選ばれるカチオンを有するハイドロアルカンスルホネートである。More preferably, the hydroalkanesulfonate of the present invention has a tetrafluoroethanesulfonate anion (TFES − ) in which all four Xs in the general formula (1) are fluorine atoms, and M is the above general formula ( It is a hydroalkanesulfonate having a cation selected from 2) to (5).
上記一般式（２）のピリジニウム誘導体からなるカチオンにおいて、Ｒ１は炭素数２〜１８、好ましくは炭素数２〜１４のアルキル基であり、具体的には、エチル基、プロピル基、ブチル基、ペンチル基、ヘプチル基、オクチル基、ノニル基、デシル基、ドデシル基などが挙げられる。Ｒ２〜Ｒ６はそれぞれ同一であってもよいし、異なっていてもよい。Ｒ２〜Ｒ６は、水素原子または炭素数１〜８、好ましくは炭素数１〜６、より好ましくは炭素数１〜４のアルキル基を示し、具体的には、水素原子、メチル基、エチル基、プロピル基、ブチル基、ペンチル基、ヘキシル基、ヘプチル基、オクチル基などが挙げられる。 In the cation composed of the pyridinium derivative of the general formula (2), R1 is an alkyl group having 2 to 18 carbon atoms, preferably 2 to 14 carbon atoms, specifically, an ethyl group, a propyl group, a butyl group, or pentyl. Group, heptyl group, octyl group, nonyl group, decyl group, dodecyl group and the like. R2 to R6 may be the same or different. R2 to R6 represent a hydrogen atom or an alkyl group having 1 to 8 carbon atoms, preferably 1 to 6 carbon atoms, more preferably 1 to 4 carbon atoms, specifically a hydrogen atom, a methyl group, an ethyl group, Examples include propyl group, butyl group, pentyl group, hexyl group, heptyl group, octyl group and the like.
上記一般式（３）で表されるイミダゾリウム誘導体からなるカチオンにおいて、Ｒ７およびＲ１０はそれぞれ同一であってもよいし、異なっていてもよい。Ｒ７およびＲ１０は、炭素数２〜１８、好ましくは炭素数２〜１４のアルキル基であり、具体的にはエチル基、プロピル基、ブチル基、ペンチル基、ヘプチル基、オクチル基、ノニル基、デシル基、ドデシル基などが挙げられる。Ｒ８、Ｒ９およびＲ１１はそれぞれ同一であってもよいし、異なっていてもよい。Ｒ８、Ｒ９およびＲ１１は、水素原子、または炭素数１〜８、好ましくは炭素数１〜６、より好ましくは炭素数１〜４のアルキル基を示し、具体的には、水素原子、メチル基、エチル基、プロピル基、ブチル基、ペンチル基、ヘキシル基、ヘプチル基、オクチル基などが挙げられる。 In the cation composed of the imidazolium derivative represented by the general formula (3), R7 and R10 may be the same or different. R7 and R10 are alkyl groups having 2 to 18 carbon atoms, preferably 2 to 14 carbon atoms, specifically, ethyl group, propyl group, butyl group, pentyl group, heptyl group, octyl group, nonyl group, decyl group. Group, dodecyl group and the like. R8, R9 and R11 may be the same or different. R8, R9 and R11 each represent a hydrogen atom or an alkyl group having 1 to 8, preferably 1 to 6 carbon atoms, more preferably 1 to 4 carbon atoms, specifically a hydrogen atom, a methyl group, Examples thereof include an ethyl group, a propyl group, a butyl group, a pentyl group, a hexyl group, a heptyl group, and an octyl group.
上記一般式（４）で表される第四級アンモニウム誘導体からなるカチオンにおいて、Ｒ１２〜Ｒ１５はそれぞれ同一であってもよいし、異なっていてもよい。Ｒ１２〜Ｒ１５は、炭素数１〜１８のアルキル基であり、前記アルキル基は置換基を有してもよい。そのようなアルキル基としては、メチル基、エチル基、プロピル基、ブチル基、ペンチル基、ヘプチル基、オクチル基、ノニル基、デシル基、ドデシル基などが挙げられる。前記アルキル基が有していてもよい置換基としては、例えば、メトキシ基、エトキシ基等のアルコキシ基；フッ素原子等のハロゲン原子；アセチル基、プロピオニル基、ベンゾイル基等のアシル基；メトキシカルボニル基、エトキシカルボニル基等のアルコキシカルボニル基；フェニル基、ナフチル基等のアリール基；エテニル基、プロペニル基等のアルケニル基；プロピニル基等のアルキニル基；ホルミル基；カルボキシ基；アミノ基；ヒドロキシ基；等が挙げられる。かかる置換基で置換されたアルキル基の具体例としては、フルオロメチル基、トリフルオロメチル基、メトキシメチル基、エトキシメチル基、３−オキソブチル基、メトキシエチル基、メトキシカルボニルメチル基、ベンジル基、アリル基、２−プロピニル基、アミノメチル基、１−カルボキシブチル、ヒドロキシエチル基などが挙げられる。好ましくは、Ｒ１２〜Ｒ１５のうちの一つ（例えばＲ１２）は炭素数６〜１４のアルキル基であり、その他の三つ（例えばＲ１３〜Ｒ１５）は各々独立にヒドロキシエチル基または炭素数１〜６のアルキル基、特に好ましくは炭素数１〜４のアルキル基である。 In the cation composed of the quaternary ammonium derivative represented by the general formula (4), R12 to R15 may be the same or different. R12 to R15 are alkyl groups having 1 to 18 carbon atoms, and the alkyl group may have a substituent. Examples of such an alkyl group include a methyl group, an ethyl group, a propyl group, a butyl group, a pentyl group, a heptyl group, an octyl group, a nonyl group, a decyl group, and a dodecyl group. Examples of the substituent that the alkyl group may have include, for example, an alkoxy group such as a methoxy group or an ethoxy group; a halogen atom such as a fluorine atom; an acyl group such as an acetyl group, a propionyl group, or a benzoyl group; An alkoxycarbonyl group such as ethoxycarbonyl group; an aryl group such as phenyl group or naphthyl group; an alkenyl group such as ethenyl group or propenyl group; an alkynyl group such as propynyl group; a formyl group; a carboxy group; an amino group; Is mentioned. Specific examples of the alkyl group substituted with such a substituent include a fluoromethyl group, a trifluoromethyl group, a methoxymethyl group, an ethoxymethyl group, a 3-oxobutyl group, a methoxyethyl group, a methoxycarbonylmethyl group, a benzyl group, and an allyl group. Group, 2-propynyl group, aminomethyl group, 1-carboxybutyl, hydroxyethyl group and the like. Preferably, one of R12 to R15 (for example, R12) is an alkyl group having 6 to 14 carbon atoms, and the other three (for example, R13 to R15) are each independently a hydroxyethyl group or 1 to 6 carbon atoms. And particularly preferably an alkyl group having 1 to 4 carbon atoms.
Ｒ１２とＲ１３とが連結して、中心の窒素原子を含む環を形成してもよい。Ｒ１４とＲ１５とが連結して、中心の窒素原子を含む環を形成してもよい。環の形成は上記一般式（４）において一つであっても二つであってもよい。中心の窒素原子を含む環は、好ましくは３〜８員環であり、より好ましくは５〜６員環である。 R12 and R13 may be linked to form a ring containing a central nitrogen atom. R14 and R15 may be linked to form a ring containing a central nitrogen atom. One or two rings may be formed in the general formula (4). The ring containing the central nitrogen atom is preferably a 3- to 8-membered ring, more preferably a 5- to 6-membered ring.
上記一般式（５）のピラジニウム誘導体からなるカチオンにおいて、Ｒ１６は炭素数２〜１８、好ましくは炭素数２〜１４のアルキル基であり、具体的には、エチル基、プロピル基、ブチル基、ペンチル基、ヘプチル基、オクチル基、ノニル基、デシル基、ドデシル基などが挙げられる。Ｒ１７〜Ｒ２０はそれぞれ同一であってもよいし、異なっていてもよい。Ｒ１７〜Ｒ２０は、水素原子または炭素数１〜８、好ましくは炭素数１〜６、より好ましくは炭素数１〜４のアルキル基を示し、具体的には、水素原子、メチル基、エチル基、プロピル基、ブチル基、ペンチル基、ヘキシル基、ヘプチル基、オクチル基などが挙げられる。 In the cation composed of the pyrazinium derivative of the general formula (5), R16 is an alkyl group having 2 to 18 carbon atoms, preferably 2 to 14 carbon atoms, specifically, an ethyl group, a propyl group, a butyl group, or pentyl. Group, heptyl group, octyl group, nonyl group, decyl group, dodecyl group and the like. R17 to R20 may be the same or different. R17 to R20 each represents a hydrogen atom or an alkyl group having 1 to 8 carbon atoms, preferably 1 to 6 carbon atoms, more preferably 1 to 4 carbon atoms, specifically, a hydrogen atom, a methyl group, an ethyl group, Examples include propyl group, butyl group, pentyl group, hexyl group, heptyl group, octyl group and the like.
本発明のハイロドアルカンスルホネートの具体例としては、１−エチル−３−メチルイミダゾリウム−テトラフルオロエタンスルホン酸、１−オクチル−３−ブチルイミダゾリウム−テトラフルオロエタンスルホン酸、ラウリルトリメチルアンモニウム−テトラフルオロエタンスルホン酸、オクチルビス（２−ヒドロキシエチル）メチルアンモニウム−テトラフルオロエタンスルホン酸、Ｎ−ブチル−３−メチルピリジニウム−テトラフルオロエタンスルホン酸、Ｎ−オクチル−３−ブチルピリジニウム−テトラフルオロエタンスルホン酸などが非限定的に挙げられる。
本発明のハイドロアルカンスルホネートは、一種のみを用いてもよいし、あるいは二種以上を組み合わせて用いてもよい。Specific examples of the hydroalkane sulfonate of the present invention include 1-ethyl-3-methylimidazolium-tetrafluoroethanesulfonic acid, 1-octyl-3-butylimidazolium-tetrafluoroethanesulfonic acid, lauryltrimethylammonium-tetra Fluoroethanesulfonic acid, octylbis (2-hydroxyethyl) methylammonium-tetrafluoroethanesulfonic acid, N-butyl-3-methylpyridinium-tetrafluoroethanesulfonic acid, N-octyl-3-butylpyridinium-tetrafluoroethanesulfonic acid Non-limiting examples.
Only one kind of the hydroalkanesulfonate of the present invention may be used, or two or more kinds may be used in combination.
本発明のハイドロアルカンスルホネート、例えば、テトラフルオロエタンスルホン酸アニオン（ＴＦＥＳ−）と、ピリジニウム誘導体、イミダゾリウム誘導体、第四級アンモニウム誘導体、ピラジニウム誘導体との塩は以下の方法によって得ることができる。すなわち、生成する塩化カリウム、又は臭化カリウムの貧溶媒となるアセトンなどを用い、ピリジニウム誘導体、またはイミダゾリウム誘導体、または第四級アンモニウム誘導体、またはピラジニウム誘導体の塩化物又は臭化物と、カリウムテトラフルオロエタンスルホン酸（ＫＴＦＥＳ）を当モルで反応させ、無機塩を濾別し、ろ液を濃縮させて得ることができる。なお、ＫＴＦＥＳは、１，１，２，２−テトラフルオロエタンスルホン酸（以下、「ＴＦＥＳ−Ｈ」と略記する。）とＫＯＨとを水溶液中で等モル混合して、その後減圧濃縮することなどによって得ることができる。ＴＦＥＳ−Ｈとしては、ＴＦＥＳＡなる商品名の市販品（デュポン社製）などを適宜用いることができる。A salt of the hydroalkanesulfonate of the present invention, for example, a tetrafluoroethanesulfonate anion (TFES − ), a pyridinium derivative, an imidazolium derivative, a quaternary ammonium derivative, or a pyrazinium derivative can be obtained by the following method. That is, using potassium chloride or acetone as a poor solvent for potassium bromide, a chloride or bromide of a pyridinium derivative, an imidazolium derivative, a quaternary ammonium derivative, or a pyrazinium derivative, and potassium tetrafluoroethane It can be obtained by reacting sulfonic acid (KTFES) in an equimolar amount, filtering off inorganic salts, and concentrating the filtrate. KTFES is prepared by equimolar mixing of 1,1,2,2-tetrafluoroethanesulfonic acid (hereinafter abbreviated as “TFES-H”) and KOH in an aqueous solution, and then concentrated under reduced pressure. Can be obtained by: As TFES-H, a commercial product (manufactured by DuPont) having a trade name of TFESA can be used as appropriate.
本発明で提供する導電性組成物は、上記一般式（１）で表される上述の本発明のハイドロアルカンスルホネートを必須に含む。本発明の導電性組成物は、上述の本発明のハイドロアルカンスルホネートのみからなるものでもよいし、溶剤やバインダー等の付加成分を含んでいてもよい。本発明において、導電性組成物とは、ゴム、エラストマーや樹脂材料などのように、導電性が無いか極めて小さい材料に添加する用途の組成物である。導電性組成物が添加された材料は、導電性を呈するため、帯電ローラーなどへの各種用途へ応用可能となり、用時において不所望な静電気を帯びにくくなるという利点もある。 The conductive composition provided by the present invention essentially contains the above-described hydroalkanesulfonate of the present invention represented by the general formula (1). The conductive composition of the present invention may be composed of only the above-described hydroalkanesulfonate of the present invention, and may contain additional components such as a solvent and a binder. In the present invention, the conductive composition is a composition for use added to a material having no electrical conductivity or extremely small, such as rubber, elastomer and resin material. Since the material to which the conductive composition is added exhibits conductivity, it can be applied to various uses such as a charging roller and has an advantage that it is difficult to be charged with undesired static electricity during use.
本発明の導電性組成物は、有機ポリマーと、上記一般式（１）で表されるハイドロアルカンスルホネートの少なくとも１種とを含有することが好ましい。有機ポリマーが樹脂又は粘着剤である場合には、本発明の導電性組成物は、樹脂又は粘着剤１００質量部に対し、上記ハイドロアルカンスルホネートの少なくとも１種を、好ましくは０．０１〜２０質量部、より好ましくは０．１〜１０重量部、さらに好ましくは１〜１０重量部含有する。ハイドロアルカンスルホネートの含有量が上記範囲内であれば、良好な導電性が発現するとともに、当該導電性組成物からなる成型物の表面にブリーディングが生じにくくなり、結果として、良好な物性を呈する成型物を得やすくなる。 The conductive composition of the present invention preferably contains an organic polymer and at least one hydroalkanesulfonate represented by the above general formula (1). When the organic polymer is a resin or a pressure-sensitive adhesive, the conductive composition of the present invention contains at least one of the above hydroalkanesulfonates, preferably 0.01 to 20 masses per 100 parts by mass of the resin or the pressure-sensitive adhesive. Parts, more preferably 0.1 to 10 parts by weight, still more preferably 1 to 10 parts by weight. If the content of the hydroalkanesulfonate is within the above range, good conductivity is exhibited, and bleeding is hardly generated on the surface of the molded product made of the conductive composition, and as a result, molding that exhibits good physical properties. It becomes easy to get things.
本発明に用いられる有機ポリマーとしては特に限定はなく、一般的に樹脂、粘着剤と呼ばれるものを広く包含する。有機ポリマーは熱可塑性樹脂、熱硬化性樹脂などであってもよく、具体的には、例えば、ポリオレフィン系樹脂、ポリアセタール、ポリフェニレンエーテル、ポリエステル樹脂、ポリカーボネート、ポリウレタン樹脂、ポリアミド樹脂、ポリ塩化ビニル樹脂、アクリロニトリル−ブタジエン−スチレン（ＡＢＳ）樹脂、アクリロニトリル−スチレン樹脂、アクリロニトリル−ＥＰＤＭ−スチレン樹脂、アクリル樹脂、メタクリル樹脂等が挙げられる。好ましくは、得られる導電性材料の導電性に優れる点から、有機ポリマーは、ＡＢＳ樹脂、アクリル樹脂、メタクリル樹脂、ポリウレタン樹脂である。
本発明に用いられる粘着剤としては特に限定はなく、例えば、アクリル系粘着剤が挙げられる。There is no limitation in particular as an organic polymer used for this invention, Generally what is called resin and an adhesive is included widely. The organic polymer may be a thermoplastic resin, a thermosetting resin, or the like. Specifically, for example, polyolefin resin, polyacetal, polyphenylene ether, polyester resin, polycarbonate, polyurethane resin, polyamide resin, polyvinyl chloride resin, Examples include acrylonitrile-butadiene-styrene (ABS) resin, acrylonitrile-styrene resin, acrylonitrile-EPDM-styrene resin, acrylic resin, and methacrylic resin. Preferably, the organic polymer is an ABS resin, an acrylic resin, a methacrylic resin, or a polyurethane resin from the viewpoint of excellent conductivity of the obtained conductive material.
There is no limitation in particular as an adhesive used for this invention, For example, an acrylic adhesive is mentioned.
アクリロニトリル−ブタジエン−スチレン（ＡＢＳ）樹脂としては、グラフト法、ポリマーブレンド法により製造した従来公知のものが挙げられ、特に限定されるものではない。 Examples of the acrylonitrile-butadiene-styrene (ABS) resin include, but are not limited to, conventionally known resins produced by a graft method or a polymer blend method.
アクリル樹脂、メタクリル樹脂としては、従来公知のものが挙げられ、特に限定されず、具体的にはポリメタクリル酸メチル、ポリメタクリル酸エチル、ポリメタクリル酸プロピル、ポリメタクリル酸ブチル、ポリアクリル酸メチル、ポリアクリル酸エチル、メタアクリル酸メチル−アクリル酸メチル共重合体、メタクリル酸メチル−メタクリル酸エチル共重合体、メタクリル酸メチル−メタクリル酸ブチル共重合体、メタクリル酸メチル−アクリル酸エチル共重合体、アクリル酸のメチル、エチル、プロピル、ブチル等のアルキルエステル化合物の単独重合あるいは共重合体、メタアクリル酸のメチル、エチル、プロピル、ブチル等のアルキルエステル化合物の単独重合体あるいは共重合体が挙げられる。 Examples of the acrylic resin and methacrylic resin include conventionally known ones, and are not particularly limited. Specifically, polymethyl methacrylate, polyethyl methacrylate, polypropyl methacrylate, polybutyl methacrylate, polymethyl acrylate, Polyethyl acrylate, methyl methacrylate-methyl acrylate copolymer, methyl methacrylate-ethyl methacrylate copolymer, methyl methacrylate-butyl methacrylate copolymer, methyl methacrylate-ethyl acrylate copolymer, Examples include homopolymers or copolymers of alkyl ester compounds such as methyl, ethyl, propyl, and butyl of acrylic acid, and homopolymers or copolymers of alkyl ester compounds such as methyl, ethyl, propyl, and butyl of methacrylic acid. .
ポリウレタン樹脂としては熱可塑性ポリウレタン樹脂、ポリオールとポリイソシアネートからなるポリウレタン樹脂などが挙げられる。ポリオールとしては、例えばポリエーテルポリオール、ポリエステルポリオール、疎水性ポリオールなどが挙げられる。ポリエーテルポリオールとしては、例えばグリセリンなどの多価アルコールにエチレンオキシドやプロピレンオキシドを付加させて得られたポリオール、ポリテトラメチレングリコール、ポリエチレングリコール、ポリプロピレングリコール、ポリブタンジオールなどが好ましく挙げられる。ポリエステルポリオールとしては、例えばジカルボン酸とジオールやトリオールなどとの縮合により得られる縮合系ポリエステルポリオール、ジオールやトリオールの存在下にラクトンを開環重合して得られるラクトン系ポリエステルポリオール、ポリエーテルポリオールの末端をラクトンでエステル変性したエステル変性ポリオールなどが好ましく挙げられ、疎水性ポリオールとしては、例えばポリイソプレンポリオール、ポリブタジエンポリオール，水素添加ポリブタジエンポリオールなどが好ましく挙げられる。 Examples of the polyurethane resin include thermoplastic polyurethane resins and polyurethane resins composed of polyol and polyisocyanate. Examples of the polyol include polyether polyol, polyester polyol, and hydrophobic polyol. Preferred examples of the polyether polyol include polyols obtained by adding ethylene oxide or propylene oxide to polyhydric alcohols such as glycerin, polytetramethylene glycol, polyethylene glycol, polypropylene glycol, and polybutanediol. Examples of the polyester polyol include a condensed polyester polyol obtained by condensation of a dicarboxylic acid and a diol or triol, a lactone polyester polyol obtained by ring-opening polymerization of a lactone in the presence of a diol or triol, or a terminal end of a polyether polyol. Preferred examples include ester-modified polyols obtained by ester-modifying lactone with lactone, and preferred examples of hydrophobic polyols include polyisoprene polyols, polybutadiene polyols, and hydrogenated polybutadiene polyols.
ポリイソシアネートとしては、脂肪族、脂環族および芳香族ポリイソシアネートが挙げられ、具体的には、２，４−トリレンジイソシアネート、２，６−トリレンジイソシアネート、４，４’−ジフェニルメタンジイソシアネート、２，４’−ジフェニルメタンジイソシアネート、２，２’−ジフェニルメタンジイソシアネート、ポリフェニレンポリメチレンポリイソシアネート、１，６−ヘキサメチレンジイソシアネート、２，２，４−トリメチルヘキサメチレンジイソシアネート、ｐ−フェニレンジイソシアネート、４，４’−ジシクロメタンジイソシアネート、３，３’−ジメチル−４，４’−ジフェニルメタンジイソシアネート、ジアニシジンジイソシアネート、ｍ−キシリレンジイソシアネート、イソフォロンジイソシアネート、１，５−ナフタレンジイソシアネート、１，４−シクロヘキサンジイソシアネート、リジンジイソシアネートなどが挙げられる。 Polyisocyanates include aliphatic, alicyclic and aromatic polyisocyanates, specifically 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, 4,4′-diphenylmethane diisocyanate, 2 , 4'-diphenylmethane diisocyanate, 2,2'-diphenylmethane diisocyanate, polyphenylene polymethylene polyisocyanate, 1,6-hexamethylene diisocyanate, 2,2,4-trimethylhexamethylene diisocyanate, p-phenylene diisocyanate, 4,4'- Dicyclomethane diisocyanate, 3,3′-dimethyl-4,4′-diphenylmethane diisocyanate, dianisidine diisocyanate, m-xylylene diisocyanate, isophorone diisocyanate, , 5-naphthalene diisocyanate, 1,4-cyclohexane diisocyanate, and lysine diisocyanate.
アクリル系粘着剤としては、好ましくは炭素数１〜１４のアルキル基を有するアクリレート又はメタクリレートを主成分とするアクリル系ポリマーを含有したものが挙げられ、例えば、メチル（メタ）アクリレート、エチル（メタ）アクリレート、ｎ−ブチル（メタ）アクリレート、ｔ−ブチル（メタ）アクリレート、イソブチル（メタ）アクリレート、ヘキシル（メタ）アクリレート、２−エチルヘキシル（メタ）アクリレート、ｎ−オクチル（メタ）アクリレートなどが挙げられる。 Examples of the acrylic pressure-sensitive adhesive include those containing an acrylic polymer mainly composed of an acrylate or methacrylate having an alkyl group having 1 to 14 carbon atoms. For example, methyl (meth) acrylate, ethyl (meth) Examples include acrylate, n-butyl (meth) acrylate, t-butyl (meth) acrylate, isobutyl (meth) acrylate, hexyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, and n-octyl (meth) acrylate.
本発明の導電性組成物は、本発明の効果を損なわない範囲で、バインダー樹脂、界面活性剤、酸化防止剤、紫外線吸収剤、易滑剤等を併用することもできる。 The conductive composition of the present invention can be used in combination with a binder resin, a surfactant, an antioxidant, an ultraviolet absorber, a lubricant, and the like as long as the effects of the present invention are not impaired.
本発明の導電性組成物は、帯電防止剤として用いることもできる。帯電防止剤は、ゴム、エラストマーや樹脂材料などのように、導電性が無いか極めて小さい材料へと添加する用途の組成物である。帯電防止剤が添加された材料は、添加前に比べて導電性が高くなることが一般的であるため、帯電ローラーなどへの各種用途へ応用可能となり、用時において不所望な静電気を帯びにくくなるという利点がある。本発明の帯電防止剤は、上述の本発明のハイドロアルカンスルホネートのみからなるものでもよいし、溶剤やバインダー等の付加成分を含んでいてもよい。 The conductive composition of the present invention can also be used as an antistatic agent. Antistatic agents are compositions for applications that are added to materials that are not conductive or very small, such as rubber, elastomers, and resin materials. In general, materials with antistatic agents added have higher conductivity than before addition, so they can be applied to various applications such as charging rollers, and are less likely to have undesired static electricity during use. There is an advantage of becoming. The antistatic agent of this invention may consist only of the above-mentioned hydroalkane sulfonate of this invention, and may contain additional components, such as a solvent and a binder.
本発明によれば、樹脂成型物の好適な製造方法として、有機ポリマーのモノマーまたはオリゴマーに上述のハイドロフルオロアルカンスルホネートを添加する工程（Ａ）と、前記モノマーまたはオリゴマーを高分子化して成型する工程（Ｂ２）を有する製造方法が挙げられる。ここで、高分子化とは、有機ポリマーの種類などに応じて架橋反応や重合反応などを適宜採り入れることをいう。重合反応を用いる場合には、重合開始剤として、光、熱重合に用いられる重合開始剤を用いることもできる。また、成型は、必要に応じて適切な処理を施すことによって何らかの形状を付与することを広く包含する概念であり、フィルムまたはシート状の成型物を得るための成膜であってもよいし、中空または中実の棒状体やその他の立体形状を実現する形状付与であってもよい。 According to the present invention, as a preferable method for producing a resin molded product, a step (A) of adding the above-mentioned hydrofluoroalkanesulfonate to a monomer or oligomer of an organic polymer, and a step of polymerizing and molding the monomer or oligomer The manufacturing method which has (B2) is mentioned. Here, “polymerization” means that a crosslinking reaction, a polymerization reaction, or the like is appropriately adopted depending on the type of the organic polymer. When a polymerization reaction is used, a polymerization initiator used for light or thermal polymerization can also be used as a polymerization initiator. Further, the molding is a concept that broadly includes giving a certain shape by performing an appropriate treatment as necessary, and may be a film formation for obtaining a film or a sheet-like molded product, It may be provided with a shape that realizes a hollow or solid rod-like body or other three-dimensional shape.
有機ポリマーとして粘着剤、就中、アクリル系ポリマーを含む粘着剤を用いる場合、アクリル系ポリマー等を適宜架橋することで、耐熱性に優れた粘着シート類が得られる。架橋方法の具体的手段としてはポリイソシアネート化合物、エポキシ化合物、アジリジン化合物などのアクリル系ポリマーに適宜架橋化基点として含ませたヒドロキシル基、アミノ基、アミド基などと反応しうる基を有する化合物を添加し反応させるいわゆる架橋剤を用いる方法がある。中でも、ポリイソシアネート化合物やエポキシ化合物が特に好ましく用いられる。 In the case of using a pressure-sensitive adhesive as an organic polymer, and in particular, a pressure-sensitive adhesive containing an acrylic polymer, pressure-sensitive adhesive sheets excellent in heat resistance can be obtained by appropriately crosslinking the acrylic polymer or the like. As a specific means of the crosslinking method, a compound having a group capable of reacting with a hydroxyl group, an amino group, an amide group or the like appropriately included as a crosslinking base point in an acrylic polymer such as a polyisocyanate compound, an epoxy compound or an aziridine compound is added. There is a method using a so-called cross-linking agent that is reacted. Of these, polyisocyanate compounds and epoxy compounds are particularly preferably used.
別の好適態様によれば、有機ポリマー材料、特に樹脂材料に、上記一般式（１）で表されるハイドロフルオロアルカンスルホネートの少なくとも１種を添加する工程（Ａ）と、該工程（Ａ）の後に前記熱可塑性樹脂を成型する成型する工程（Ｂ１）とを有する樹脂成型物の製造方法が提案される。有機ポリマー材料は成型可能であれば形態は特に限定はなく、例えば、粉末状であってもよいし、溶媒等の媒体に溶解または分散した形態であってもよい。上述のハイドロフルオロアルカンスルホネートを添加した後の有機ポリマー材料の成型は、必要に応じて適切な処理を施すことによって何らかの形状を付与することを広く包含する概念であり、例えば、加熱して軟化・流動化させた状態での所望の形状への加工や、適宜なコーターを用いたシート成型などといった成型方法を適宜採り入れることができる。 According to another preferred embodiment, the step (A) of adding at least one hydrofluoroalkanesulfonate represented by the general formula (1) to an organic polymer material, particularly a resin material, and the step (A) The manufacturing method of the resin molding which has the process (B1) which shape | molds the said thermoplastic resin later is proposed. The form of the organic polymer material is not particularly limited as long as it can be molded. For example, the organic polymer material may be in the form of powder, or may be dissolved or dispersed in a medium such as a solvent. Molding of the organic polymer material after adding the above-mentioned hydrofluoroalkanesulfonate is a concept that broadly includes imparting some shape by applying an appropriate treatment as necessary. A molding method such as processing into a desired shape in a fluidized state or sheet molding using an appropriate coater can be adopted as appropriate.
本発明の製造方法において用いられる有機ポリマーは好ましくは樹脂又は粘着剤である。具体的な有機ポリマーとしては、アクリル樹脂、ポリエステル樹脂、ポリウレタン樹脂、塩化ビニル樹脂、エポキシ樹脂、アクリル系ポリマーなどが好ましく挙げられるが、これらに限定されるわけではない。 The organic polymer used in the production method of the present invention is preferably a resin or an adhesive. Specific examples of the organic polymer include, but are not limited to, an acrylic resin, a polyester resin, a polyurethane resin, a vinyl chloride resin, an epoxy resin, and an acrylic polymer.
以下、本発明を実施例に基づき詳細に説明する。なお、本発明は実施例により何ら限定されるものではない。なお、実施例中、「部」は「質量部」を表す。 Hereinafter, the present invention will be described in detail based on examples. In addition, this invention is not limited at all by the Example. In the examples, “part” represents “part by mass”.
以下の各実施例、及び、比較例において、ＡＢＳ樹脂、アクリル樹脂、ポリウレタン樹脂（ポリオール、ポリイソシアネート）は下記のものを用いた。
ＡＢＳ樹脂（東レ社製）、アクリル樹脂はＭ−４５Ｃ（綜研社製）、ポリオールは、Ｎ１２４４（第一工業製薬社製）：ポリエーテルポリオール（分子量１１６５、１分子のＯＨ基数２）、ポリイソシアネートは、コロネートＬ（日本ポリウレタン工業社製）：トリエチレンジイソシアネートをベースに多価アルコールを付加したポリイソシアネート（ＮＣＯ含有率１２．７〜１３．７％）、２−ヒドロキシプロピルアクリレート（共栄社化学社製、ライトエステルＨＯＰ−Ａ）を用いた。In the following examples and comparative examples, the following were used as ABS resin, acrylic resin, and polyurethane resin (polyol, polyisocyanate).
ABS resin (manufactured by Toray Industries Inc.), acrylic resin is M-45C (manufactured by Soken), polyol is N1244 (manufactured by Daiichi Kogyo Seiyaku Co., Ltd.): polyether polyol (molecular weight 1165, number of OH groups of one molecule 2), polyisocyanate Coronate L (manufactured by Nippon Polyurethane Industry Co., Ltd.): polyisocyanate (NCO content 12.7 to 13.7%) added with polyhydric alcohol based on triethylene diisocyanate, 2-hydroxypropyl acrylate (manufactured by Kyoeisha Chemical Co. Light ester HOP-A) was used.
（実施例１）
Ｎ−ブチル−３−メチルピリジニウム−テトラフルオロエタンスルホン酸（以下「化合物１」と略記する。）は、Ｎ−ブチル−３−メチルピリジニウム−クロライドを塩交換によりＴＦＥＳ塩にすることで得た。具体的には、カリウムテトラフルオロエタンスルホン酸（ＫＴＦＥＳ）とＮ−ブチル−３−メチルピリジニウム−クロライドとを水溶液中で等モル混合することによって反応させ、無機塩を濾別し、ろ液を濃縮して化合物１を得た。Example 1
N-butyl-3-methylpyridinium-tetrafluoroethanesulfonic acid (hereinafter abbreviated as “Compound 1”) was obtained by converting N-butyl-3-methylpyridinium-chloride into a TFES salt by salt exchange. Specifically, potassium tetrafluoroethanesulfonic acid (KTFES) and N-butyl-3-methylpyridinium chloride are reacted by equimolar mixing in an aqueous solution, inorganic salts are filtered off, and the filtrate is concentrated. Thus, Compound 1 was obtained.
（１）ＡＢＳ樹脂１００部に対し、「ハイドロアルカンスルホネート１（化合物１）」を３又は５部加えて、Ｃｕｓｔｏｍ Ｓｃｉｅｎｔｉｆｉｃ Ｉｎｓｔｒｕｍｅｎｔｓ社製の混練押出機ＣＳＩ−ＭＡＸ ＭＩＸＩＮＧ ＥＸＴＲＵＤＥＲ ＣＳ−１９４（一軸）を用い、（温度２２０℃、スクリュー回転数１２０ｒｐｍ）混練し、ＡＢＳ樹脂中にハイドロアルカンスルホネート１（化合物１）が分散してなる樹脂組成物（導電性組成物）を得た。次いで、ホットプレス機を用い、成形温度１９０℃、圧力０．２ＭＰａで成形して、この樹脂組成物からなる０．５ｍｍ厚の平板状の成型物を得た。 (1) 3 or 5 parts of “hydroalkanesulfonate 1 (compound 1)” is added to 100 parts of ABS resin, and a kneading extruder CSI-MAX MIXING EXTRUDER CS-194 (uniaxial) manufactured by Custom Scientific Instruments is used. (Temperature 220 ° C., screw rotation speed 120 rpm) was kneaded to obtain a resin composition (conductive composition) in which hydroalkanesulfonate 1 (compound 1) was dispersed in ABS resin. Subsequently, it was molded at a molding temperature of 190 ° C. and a pressure of 0.2 MPa using a hot press machine to obtain a 0.5 mm-thick flat plate-like molded product made of this resin composition.
（２）化合物１をアクリル樹脂１００部に対し３又は５部、メチルエチルケトン（ＭＥＫ）を１００部加えて、ＹＡＭＡＴＯ社製のＳＨＡＫＥＲ ＳＡ３００を用いて２０分混合し、アクリル樹脂中に化合物１が分散してなる樹脂組成物（導電性組成物）を得た。得られた樹脂組成物を、市販のＰＥＴフィルム（５０μｍ厚）上に、ＴＥＳＴＥＲ ＳＡＮＧＹＯ社製のＰＩ−１２１０ ＦＩＬＭＣＯＡＴＥＲを用いて、室温にてバーコーター＃２０を用いて塗工し、送風乾燥機にて、１２０℃５分で乾燥させることによって、導電性フィルム（成型物）を得た。 (2) Add 3 or 5 parts of Compound 1 to 100 parts of acrylic resin and 100 parts of methyl ethyl ketone (MEK), mix for 20 minutes using SHAMAT SA300 manufactured by YAMATO, and disperse Compound 1 in the acrylic resin. A resin composition (conductive composition) was obtained. The obtained resin composition was coated on a commercially available PET film (50 μm thickness) using a PI-1210 FILMCOATER manufactured by TESTER SANGYO, using a bar coater # 20 at room temperature, and then applied to a blower dryer. Then, a conductive film (molded product) was obtained by drying at 120 ° C. for 5 minutes.
（３）化合物１をポリオール１００部に対し３又は５部、ポリイソシアネート９２〜９５部、酢酸エチル１２０部加えて、ＹＡＭＡＴＯ社製のＳＨＡＫＥＲ・ＳＡ３００を用いて２０分混合し、ポリウレタン樹脂中に化合物１が分散してなる樹脂組成物（導電性組成物）を得た。得られた樹脂組成物を、市販のＰＥＴフィルム（５０μｍ厚）上に、ＴＥＳＴＥＲ ＳＡＮＧＹＯ社製のＰＩ−１２１０ ＦＩＬＭＣＯＡＴＥＲを用いて、室温にてバーコーター＃２０を用いて塗工し、送風乾燥機にて、１２０℃１００分で重合させて、導電性フィルム（成型物）を形成させた。 (3) Add 3 or 5 parts of compound 1 to 100 parts of polyol, 92 to 95 parts of polyisocyanate, 120 parts of ethyl acetate, and mix for 20 minutes using SHAKER SA300 manufactured by YAMATO, and compound into polyurethane resin A resin composition (conductive composition) obtained by dispersing 1 was obtained. The obtained resin composition was coated on a commercially available PET film (50 μm thickness) using a PI-1210 FILMCOATER manufactured by TESTER SANGYO, using a bar coater # 20 at room temperature, and then applied to a blower dryer. Then, polymerization was carried out at 120 ° C. for 100 minutes to form a conductive film (molded product).
（４）２−エチルヘキシルアクリレート２００部、２ヒドロキシプロピルアクリレート８部、重合開始剤として２，２−アゾビスイソブチロニトリル０．４部、酢酸エチル３８６．４部を加え、６０℃５時間反応させ、アクリル系ポリマー溶液を得た。
化合物１を得られたアクリル系ポリマー溶液１００部に対し３部、架橋剤としてヘキサメチレンジイソシアヌネート０．４部、架橋触媒としてジラウリン酸ジブチルスズ（１％酢酸エチル溶液）０．４部加えてアクリル系粘着剤溶液を調整した。得られたアクリル系粘着剤溶液を市販のＰＥＴフィルム（５０μｍ厚）上に、ＴＥＳＴＥＲ ＳＡＮＧＹＯ社製のＰＩ−１２１０ ＦＩＬＭＣＯＡＴＥＲを用いて、室温にてバーコーター＃２０を用いて塗工し、送風乾燥機にて、１２０℃５分で乾燥させることによって、導電性フィルム（成型物）を得た。(4) 200 parts of 2-ethylhexyl acrylate, 8 parts of 2hydroxypropyl acrylate, 0.4 part of 2,2-azobisisobutyronitrile and 386.4 parts of ethyl acetate as a polymerization initiator were added, and the reaction was performed at 60 ° C. for 5 hours. To obtain an acrylic polymer solution.
3 parts to 100 parts of the resulting acrylic polymer solution, 0.4 parts of hexamethylene diisocyanurate as a crosslinking agent, and 0.4 parts of dibutyltin dilaurate (1% ethyl acetate solution) as a crosslinking catalyst were added. An acrylic adhesive solution was prepared. The obtained acrylic pressure-sensitive adhesive solution was coated on a commercially available PET film (50 μm thickness) using a PI-1210 FILMCOATER manufactured by TESTER SANGYO, using a bar coater # 20 at room temperature, and an air dryer. Then, a conductive film (molded product) was obtained by drying at 120 ° C. for 5 minutes.
（実施例２）
Ｎ−オクチル−３−ブチルピリジニウム−テトラフルオロエタンスルホン酸（以下「化合物２」と略記する。）を、Ｎ−オクチル−３−ブチルピリジニウム−クロライドを塩交換によりＴＦＥＳ塩にすることで得た。具体的には、ＫＴＦＥＳとＮ−オクチル−３−ブチルピリジニウム−クロライドとを水溶液中で等モル混合することによって反応させ、無機塩を濾別し、ろ液を濃縮して化合物２を得た。
実施例１で用いた「化合物１」の代わりに「化合物２」を用いたことの他は実施例１と同様にして各種成型物を得た。(Example 2)
N-octyl-3-butylpyridinium-tetrafluoroethanesulfonic acid (hereinafter abbreviated as “Compound 2”) was obtained by converting N-octyl-3-butylpyridinium-chloride into a TFES salt by salt exchange. Specifically, KTFES and N-octyl-3-butylpyridinium chloride were reacted by equimolar mixing in an aqueous solution, the inorganic salt was filtered off, and the filtrate was concentrated to obtain Compound 2.
Various molded articles were obtained in the same manner as in Example 1 except that “Compound 2” was used instead of “Compound 1” used in Example 1.
（実施例３）
１−エチル−３−メチルイミダゾリウム−テトラフルオロエタンスルホン酸（以下「ハイドロアルカンスルホネート３」と略記する。）を、１−エチル−３−メチルイミダゾリウム−クロライドを塩交換によりＴＦＥＳ塩にすることで得た。具体的には、ＫＴＦＥＳと１−エチル−３−メチルイミダゾリウム−クロライドとを水溶液中で等モル混合することによって反応させ、無機塩を濾別し、ろ液を濃縮して化合物３を得た。
実施例１で用いた「化合物１」の代わりに「化合物３」を用いたことの他は実施例１と同様にして各種成型物を得た。(Example 3)
1-ethyl-3-methylimidazolium-tetrafluoroethanesulfonic acid (hereinafter abbreviated as “hydroalkanesulfonate 3”) is converted to TFES salt by salt exchange of 1-ethyl-3-methylimidazolium chloride. Got in. Specifically, KTFES and 1-ethyl-3-methylimidazolium chloride were reacted by equimolar mixing in an aqueous solution, the inorganic salt was filtered off, and the filtrate was concentrated to obtain Compound 3. .
Various molded articles were obtained in the same manner as in Example 1 except that “Compound 3” was used instead of “Compound 1” used in Example 1.
（実施例４）
１−オクチル−３−ブチルイミダゾリウム−テトラフルオロエタンスルホン酸（以下「化合物４」と略記する。）を、１−オクチル−３−ブチルイミダゾリウム−クロライドを塩交換によりＴＦＥＳ塩にすることで得た。具体的には、ＫＴＦＥＳと１−オクチル−３−ブチルイミダゾリウム−クロライドとを水溶液中で等モル混合することによって反応させ、無機塩を濾別し、ろ液を濃縮してハイドロアルカンスルホネート４（化合物４）を得た。
実施例１で用いた「化合物１」の代わりに「化合物４」を用いたことの他は実施例１と同様にして各種成型物を得た。Example 4
1-octyl-3-butylimidazolium-tetrafluoroethanesulfonic acid (hereinafter abbreviated as “compound 4”) is obtained by converting 1-octyl-3-butylimidazolium chloride to a TFES salt by salt exchange. It was. Specifically, KTFES and 1-octyl-3-butylimidazolium chloride are reacted by equimolar mixing in an aqueous solution, the inorganic salt is filtered off, the filtrate is concentrated, and the hydroalkanesulfonate 4 ( Compound 4) was obtained.
Various molded articles were obtained in the same manner as in Example 1 except that “Compound 4” was used instead of “Compound 1” used in Example 1.
（実施例５）
ラウリルトリメチルアンモニウム−テトラフルオロエタンスルホン酸（以下「化合物５」と略記する。）を、オレイルトリメチルアンモニウム−クロライドを塩交換によりＴＦＥＳ塩にすることで得た。具体的には、ＫＴＦＥＳとオレイルトリメチルアンモニウム−クロライドとを水溶液中で等モル混合することによって反応させ、無機塩を濾別し、ろ液を濃縮してハイドロアルカンスルホネート５（化合物５）を得た。
実施例１で用いた「化合物１」の代わりに「化合物５」を用いたことの他は実施例１と同様にして各種成型物を得た。(Example 5)
Lauryltrimethylammonium tetrafluoroethanesulfonic acid (hereinafter abbreviated as “Compound 5”) was obtained by converting oleyltrimethylammonium chloride to a TFES salt by salt exchange. Specifically, KTFES and oleyltrimethylammonium chloride were reacted by equimolar mixing in an aqueous solution, the inorganic salt was filtered off, and the filtrate was concentrated to obtain hydroalkanesulfonate 5 (Compound 5). .
Various molded articles were obtained in the same manner as in Example 1 except that “Compound 5” was used instead of “Compound 1” used in Example 1.
（実施例６）
オクチルビス（２−ヒドロキシエチル）メチルアンモニウム−テトラフルオロエタンスルホン酸（以下「化合物６」と略記する。）を、オクチルビス（２−ヒドロキシエチル）メチルアンモニウム−クロライドを塩交換によりＴＦＥＳ塩にすることで得た。具体的には、ＫＴＦＥＳとオクチルビス（２−ヒドロキシエチル）メチルアンモニウム−クロライドとを水溶液中で等モル混合することによって反応させ、無機塩を濾別し、ろ液を濃縮して化合物６を得た。
実施例１で用いた「化合物１」の代わりに「化合物６」を用いたことの他は実施例１と同様にして各種成型物を得た。(Example 6)
Octylbis (2-hydroxyethyl) methylammonium-tetrafluoroethanesulfonic acid (hereinafter abbreviated as “Compound 6”) is obtained by converting octylbis (2-hydroxyethyl) methylammonium chloride to a TFES salt by salt exchange. It was. Specifically, KTFES and octylbis (2-hydroxyethyl) methylammonium chloride were reacted by equimolar mixing in an aqueous solution, the inorganic salt was filtered off, and the filtrate was concentrated to obtain Compound 6. .
Various molded articles were obtained in the same manner as in Example 1 except that “Compound 6” was used instead of “Compound 1” used in Example 1.
（実施例７）
スピロアンモニウム−テトラフルオロエタンスルホン酸（以下「化合物７」と略記する。）をスピロアンモニウム−クロライドを塩交換によりＴＦＥＳ塩にすることで得た。具体的には、ピロリジンと１，４−ジクロロブタンと炭酸カリウムをメタノール溶媒中で反応させることでスピロアンモニウム−クロライドを得た。ＫＴＦＥＳとスピロアンモニウム−クロライドとを水溶液中で等モル混合することによって反応させ、無機塩を濾別し、ろ液を濃縮して化合物７を得た。
実施例１で用いた「化合物１」の代わりに「化合物７」を用いたことの他は実施例１と同様にして各種成型物を得た。(Example 7)
Spiroammonium-tetrafluoroethanesulfonic acid (hereinafter abbreviated as “Compound 7”) was obtained by converting spiroammonium chloride to a TFES salt by salt exchange. Specifically, spiro ammonium chloride was obtained by reacting pyrrolidine, 1,4-dichlorobutane and potassium carbonate in a methanol solvent. KTFES and spiroammonium chloride were reacted by equimolar mixing in an aqueous solution, the inorganic salt was filtered off, and the filtrate was concentrated to obtain compound 7.
Various molded articles were obtained in the same manner as in Example 1 except that “Compound 7” was used instead of “Compound 1” used in Example 1.
（実施例８）
Ｎ−ブチルピラジニウム−テトラフルオロエタンスルホン酸（以下「化合物８」と略記する。）をＮ−ブチルピラジニウム−ブロマイドを塩交換によりＴＦＥＳ塩にすることで得た。具体的には、１，４−ピラジンと臭化ブチルをメタノール溶媒中で反応させることで、Ｎ−ブチルピラジニウム−ブロマイドを得た。ＫＴＦＥＳとＮ−ブチルピラジニウム−ブロマイドとを水溶液中で等モル混合することによって反応させ、無機塩を濾別し、ろ液を濃縮して化合物８を得た。
実施例１で用いた「化合物１」の代わりに「化合物８」を用いたことの他は実施例１と同様にして各種成型物を得た。(Example 8)
N-butylpyrazinium-tetrafluoroethanesulfonic acid (hereinafter abbreviated as “Compound 8”) was obtained by converting N-butylpyrazinium-bromide into a TFES salt by salt exchange. Specifically, 1,4-pyrazine and butyl bromide were reacted in a methanol solvent to obtain N-butylpyrazinium-bromide. KTFES and N-butylpyrazinium-bromide were reacted by equimolar mixing in an aqueous solution, the inorganic salt was filtered off, and the filtrate was concentrated to obtain compound 8.
Various molded articles were obtained in the same manner as in Example 1 except that “Compound 8” was used instead of “Compound 1” used in Example 1.
（比較例１〜６）
比較例１〜６では、下記のハイドロアルカンスルホネートを用いることの他は実施例１と同様にして各種成型物を得た。
比較例１は、実施例１で用いた「化合物１」を、Ｎ−ブチル−３−メチルピリジニウム−トリフルオロメタンスルホン酸（Ｎ−ブチル−３−メチルピリジニウム−クロライドを塩交換し、トリフルオロメタンスルホン酸（Ｔｆ）塩にしたもの、以下「化合物９」と略記する。）に変更した。
比較例２は、実施例１で用いた「化合物１」を、Ｎ−オクチル−３−ブチルピリジニウム−トリフルオロメタンスルホン酸（Ｎ−オクチル−３−ブチルピリジニウム−クロライドを塩交換し、Ｔｆ塩にしたもの、以下「化合物１０」と略記する。）に変更した。
比較例３は、実施例１で用いた「化合物１」を、１−エチル−３−メチルイミダゾリウム−トリフルオロメタンスルホン酸（１−エチル−３−メチルイミダゾリウム−クロライドを塩交換し、Ｔｆ塩にしたもの、以下「化合物１１」と略記する。）に変更した。
比較例４は、実施例１で用いた「化合物１」を、１−オクチル−３−ブチルイミダゾリウム−トリフルオロメタンスルホン酸（１−オクチル−３−ブチルイミダゾリウム−クロライドを塩交換し、Ｔｆ塩にしたもの、以下「化合物１２」と略記する。）に変更した。
比較例５は、実施例１で用いた「化合物１」を、ラウリルトリメチルアンモニウム−トリフルオロメタンスルホン酸（オレイルトリメチルアンモニウム−クロライドを塩交換し、Ｔｆ塩にしたもの、以下「化合物１３」と略記する。）に変更した。
比較例６は、実施例１で用いた「化合物１」を、オクチルビス（２−ヒドロキシエチル）メチルアンモニウム−トリフルオロメタンスルホン酸（オクチルビス（２−ヒドロキシエチル）メチルアンモニウム−クロライドを塩交換し、Ｔｆ塩にしたもの、以下「化合物１４」と略記する。）に変更した。(Comparative Examples 1-6)
In Comparative Examples 1 to 6, various molded products were obtained in the same manner as in Example 1 except that the following hydroalkanesulfonate was used.
In Comparative Example 1, “Compound 1” used in Example 1 was replaced with N-butyl-3-methylpyridinium-trifluoromethanesulfonic acid (N-butyl-3-methylpyridinium-chloride was salt-exchanged to obtain trifluoromethanesulfonic acid). (Tf) salted, hereinafter abbreviated as “Compound 9”).
In Comparative Example 2, “Compound 1” used in Example 1 was subjected to salt exchange with N-octyl-3-butylpyridinium-trifluoromethanesulfonic acid (N-octyl-3-butylpyridinium chloride) to obtain a Tf salt. (Hereinafter abbreviated as “Compound 10”).
In Comparative Example 3, “Compound 1” used in Example 1 was salt-exchanged with 1-ethyl-3-methylimidazolium-trifluoromethanesulfonic acid (1-ethyl-3-methylimidazolium chloride) to obtain a Tf salt. (Hereinafter abbreviated as “Compound 11”).
In Comparative Example 4, “Compound 1” used in Example 1 was salt-exchanged with 1-octyl-3-butylimidazolium-trifluoromethanesulfonic acid (1-octyl-3-butylimidazolium chloride) to obtain a Tf salt. (Hereinafter abbreviated as “Compound 12”).
In Comparative Example 5, "Compound 1" used in Example 1 was converted to lauryltrimethylammonium-trifluoromethanesulfonic acid (oleyltrimethylammonium-chloride salt-exchanged to give a Tf salt, hereinafter abbreviated as "Compound 13". .)
In Comparative Example 6, “Compound 1” used in Example 1 was salt-exchanged with octylbis (2-hydroxyethyl) methylammonium-trifluoromethanesulfonic acid (octylbis (2-hydroxyethyl) methylammonium chloride) to obtain a Tf salt. (Hereinafter abbreviated as “Compound 14”).
（導電率の測定）
得られた平板状の成形物、及び導電性フィルム（成型物）の導電率を評価した。ＭＩＴＳＵＢＩＳＨＩ ＣＨＥＭＩＣＡＬ社製Ｈｉｒｅｓｔａ−ＵＰ ＭＣＰ−ＨＴ４５０を用いて２重リングプローブ法（ＪＩＳ−Ｋ６９１１準拠）で、温度２５℃で湿度４０％の条件下における導電率の測定を行なった。結果を表１に示す。(Measurement of conductivity)
The electrical conductivity of the obtained flat molded product and the conductive film (molded product) was evaluated. Conductivity was measured under conditions of a temperature of 25 ° C. and a humidity of 40% by a double ring probe method (based on JIS-K6911) using a HIRESTA-UP MCP-HT450 manufactured by MITSUBISHI CHEMICAL. The results are shown in Table 1.
（剥離耐電圧）
導電性フィルムを、除電しておいたアクリル板に貼り合わせ偏光板表面にハンドローラーにて圧着する。２３℃の環境で一日放置した後、自動取り巻き機に固定し、剥離角度１５０℃、剥離速度１０ｍ／ｍｉｎとなるように剥離する。このときに発生する偏光板表面の電位を所定の位置に固定してある電位測定機（春日電気社製ＫＳＤ−０１０３）にて測定した。(Peeling withstand voltage)
The conductive film is bonded to an acrylic plate that has been neutralized, and is pressure-bonded to the polarizing plate surface with a hand roller. After being left in an environment of 23 ° C. for one day, it is fixed to an automatic winder and peeled so that a peeling angle is 150 ° C. and a peeling speed is 10 m / min. The potential of the polarizing plate surface generated at this time was measured with a potential measuring device (KSD-0103 manufactured by Kasuga Electric Co., Ltd.) fixed at a predetermined position.
（生分解性）
導電性組成物の生分解性（ＯＥＣＤ化学品ガイドライン、３０１Ｃ：修正ＭＩＴＩ試験（Ｉ）に準拠）の結果を表１に示す。(Biodegradable)
Table 1 shows the results of biodegradability of the conductive composition (OECD chemical guideline, 301C: according to the modified MITI test (I)).
実施例では、比較例と同程度またはそれ以上の導電率、剥離耐電圧を呈し、とりわけ、ＡＢＳ樹脂を用いた場合では、比較例１〜６に対して実施例１〜８では１桁ほど導電率が向上した。このように、水素を含有する含フッ素アニオンを含むハイドロフルオロアルカンスルホネートを用いることでＡＢＳ樹脂においては特異的に導電率が向上し、その結果、高い帯電防止効果が得られることがわかった。
また、比較例１〜６では生分解性は難分解であったが、実施例１〜８では良好であり、生分解性に優れていることがわかった。In the examples, the conductivity and the withstand voltage of peeling are the same as or higher than those of the comparative examples, and in particular, in the case of using an ABS resin, the conductivity of the examples 1 to 8 is about one digit higher than that of the comparative examples 1 to 6. The rate has improved. Thus, it has been found that by using a hydrofluoroalkanesulfonate containing a fluorine-containing anion containing hydrogen, the conductivity is specifically improved in the ABS resin, and as a result, a high antistatic effect can be obtained.
Moreover, although biodegradability was hard decomposition in Comparative Examples 1-6, it turned out that Examples 1-8 are favorable and are excellent in biodegradability.
本発明のハイドロアルカンスルホネートを含有する高分子ポリマーは、導電率が良好で、生分解性に優れ、且つ、耐熱温度が高いため、導電性フィルム等、帯電防止が要求される各種用途に使用することができる。特にＡＢＳ樹脂の帯電防止用途に有用である。 The polymer containing the hydroalkanesulfonate of the present invention has good electrical conductivity, excellent biodegradability, and high heat resistance, so it is used for various applications requiring antistatic properties such as conductive films. be able to. It is particularly useful for the antistatic use of ABS resin.
本願は、日本で出願された特願2008-110633に基づいており、その全内容はここで参照することによって本明細書に包含される。 This application is based on Japanese Patent Application No. 2008-110633 filed in Japan, the entire contents of which are incorporated herein by reference.
Claims (12)
ＣＸ２Ｈ−ＣＸ２−ＳＯ３Ｍ （１）
（式中、４つのＸは各々独立に水素原子またはフッ素原子であって、少なくとも１つのＸはフッ素原子を示し、Ｍはカチオンを示す。）
で表されるハイドロフルオロアルカンスルホネート。The following general formula (1),
CX 2 H-CX 2 -SO 3 M (1)
(In the formula, four Xs are each independently a hydrogen atom or a fluorine atom, and at least one X represents a fluorine atom, and M represents a cation.)
Hydrofluoroalkanesulfonate represented by:
工程（Ａ）にて有機ポリマー材料を用いた場合には有機ポリマー材料を成型する工程（Ｂ１）を、
工程（Ａ）にてモノマーまたはオリゴマーを用いた場合には該モノマーまたはオリゴマーを高分子化して成型する工程（Ｂ２）を、
有する樹脂成型物の製造方法。A step (A) of adding at least one hydrofluoroalkanesulfonate according to any one of claims 1 to 3 to an organic polymer material or a monomer or oligomer of an organic polymer; and
When the organic polymer material is used in the step (A), the step (B1) of molding the organic polymer material is performed.
In the case where a monomer or oligomer is used in the step (A), a step (B2) of polymerizing and molding the monomer or oligomer,
The manufacturing method of the resin molding which has.
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| PCT/JP2009/001787 WO2009130873A1 (en) | 2008-04-21 | 2009-04-17 | Hydroalkane sulfonate and use thereof |
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| US20070066853A1 (en) * | 2005-09-22 | 2007-03-22 | Harmer Mark A | Preparation of poly(tetramethylene) glycol |
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| JP2003511505A (en) * | 1999-10-06 | 2003-03-25 | スリーエム イノベイティブ プロパティズ カンパニー | Antistatic composition |
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| US20070066853A1 (en) * | 2005-09-22 | 2007-03-22 | Harmer Mark A | Preparation of poly(tetramethylene) glycol |
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| WO2007038360A2 (en) * | 2005-09-22 | 2007-04-05 | E. I. Du Pont De Nemours And Company | Preparation of polytrimethylene ether glycol and copolymers thereof |
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